CN115881710A

CN115881710A - Miniaturized photoelectric coupler

Info

Publication number: CN115881710A
Application number: CN202211515312.7A
Authority: CN
Inventors: 张乐银; 郑文昭; 方岚; 李彪; 胡郅贤
Original assignee: No 214 Institute of China North Industries Group Corp
Current assignee: No 214 Institute of China North Industries Group Corp
Priority date: 2022-11-30
Filing date: 2022-11-30
Publication date: 2023-03-31

Abstract

The invention discloses a miniaturized photoelectric coupler which comprises a tube shell bottom plate and a tube shell cover cap, wherein a sealed cavity is formed between the tube shell bottom plate and the tube shell cover cap, a metalized area is arranged on the upper surface of the tube shell bottom plate, a light-emitting element, a light-receiving element, a conductive supporting block and a mounting substrate are arranged in the cavity, the light-receiving element is fixed on the upper surface of the tube shell bottom plate and is electrically connected with the corresponding metalized area, the metalized area is arranged on the mounting substrate, one end of the conductive supporting block is fixed on the upper surface of the tube shell bottom plate and is electrically connected with the corresponding metalized area, the other end of the conductive supporting block is fixed on the mounting substrate and is electrically connected with the corresponding metalized area, the mounting substrate is positioned above the tube shell bottom plate, the light-emitting element is fixed on the mounting substrate and is electrically connected with the corresponding metalized area, and the light-emitting element and the light-receiving element are arranged oppositely. The invention provides a stable supporting foundation for the light-emitting element, forms a correlation vertical structure, is beneficial to reducing the overall dimension of the whole tube shell, improves the stability of impact resistance and reduces the production cost.

Description

Miniaturized photoelectric coupler

Technical Field

The invention relates to the technical field of photoelectric devices, in particular to a miniaturized photoelectric coupler.

Background

The photocoupler transmits an electric signal using light as a medium. It has good isolation function to input and output electric signal, so it is widely used in various circuits. At present, the photoelectric device becomes one of the most various photoelectric devices with the most application. Photocouplers generally consist of three parts: light emission, light reception and signal amplification. The input electrical signal drives a Light Emitting Diode (LED) to emit light with a certain wavelength, the light emitting diode is received by a light detector to generate a photocurrent, and the photocurrent is further amplified and then output. This completes the electro-optic-electro conversion, thereby playing the role of input, output and isolation. The input and the output of the photoelectric coupler are isolated from each other, and the electric signal transmission has the characteristics of unidirectionality and the like, so that the photoelectric coupler has good electric insulation capacity and anti-interference capacity.

With the development of the weapon equipment toward intellectualization and miniaturization, the demand for miniaturization and high reliability of the photoelectric coupler is also increasing. The prior photoelectric coupler has two structures of a flat type and a correlation type,

chinese utility model patent with patent number CN210866221U discloses a ceramic optoelectronic coupler, including multilayer ceramic substrate and with locate on the ceramic substrate and with ceramic substrate's upper surface forms seal chamber's metal block, ceramic substrate's upper and lower surface is equipped with polylith metallization area respectively, the different metallization area of multilayer ceramic substrate upper surface is rather than the different metallization area electrical property intercommunication of the lower surface that corresponds, the metallization area of multilayer ceramic substrate upper surface is equipped with emitting diode and the phototriode rather than electrical property intercommunication. This structure is the tiling formula, assembles emitting diode and phototriode on same plane, on the light reflection through emitting diode arrived the phototriode, the tiling structure is high to the assembly precision requirement, and the performance index control degree of difficulty is great, and whole tube size is great.

The commonly used structures at present are all vertical structures of the correlation type. At present, the prior art can not realize the ultra-small size of the airtight package vertical structure, and the known minimum size of the tube shell of the conventional vertical structure is 4.5mm multiplied by 3mm, and can not be less than 3mm multiplied by 3 mm. Chinese utility model patent No. CN207966979U discloses a single-channel high-speed photoelectric coupler, which comprises a light receiving part and a light emitting part arranged in a tube seat, wherein a channel is arranged in the light receiving part, a metalized region is arranged in the channel, a light receiving element is connected to the metalized region of the light receiving part, a metalized region is arranged on the light emitting part, a driving element and a light emitting element are connected to the metalized region of the light emitting part, and the light emitting surface of the light emitting element and the light receiving surface of the light receiving element are arranged oppositely. Because the groove structure of tube holds light receiving part and illuminating part in this structure to light emitting part and light receiving part set up metallization region and metallization hole based on the tube shell seat and conduct the signal, cause the tube shell seat wall thickness thick, be unfavorable for the miniaturization of tube shell, simultaneously, improved the manufacturing cost of tube shell.

Disclosure of Invention

Aiming at the defects of the prior art, the invention provides a miniaturized photoelectric coupler which meets the requirements of miniaturization and high reliability of the photoelectric coupler.

The invention adopts the following technical scheme:

the utility model provides a miniaturized optoelectronic coupler, includes the tube bottom plate and locates the tube cap that tube bottom plate upper surface formed seal chamber, and tube bottom plate upper surface is equipped with a plurality of metallization regions, is equipped with light emitting component and photic element in the cavity, photic element fixed connection on tube bottom plate upper surface and with the metallization district electric connection that corresponds, its characterized in that: the light-emitting module is characterized in that a conductive supporting block and a mounting substrate are further arranged in the cavity, a plurality of metallization regions are arranged on the mounting substrate, one end of the conductive supporting block is fixedly connected to the upper surface of the tube shell bottom plate and forms electric connection with the corresponding metallization regions, the other end of the conductive supporting block is fixedly connected to the mounting substrate and forms electric connection with the corresponding metallization regions, the mounting substrate is located above the tube shell bottom plate, the light-emitting element is fixedly connected to the mounting substrate and is electrically connected with the corresponding metallization regions, and the light-emitting element and the light-receiving element are arranged oppositely.

Furthermore, the conductive supporting blocks are respectively arranged on two opposite sides of the mounting substrate.

Further, the edge of the upper surface of the tube shell bottom plate is provided with a metal sealing area, the tube shell cap is made of metal, and the tube shell cap is welded on the metal sealing area of the tube shell bottom plate in a sealing mode.

Furthermore, the conductive supporting block is a metal block, and the surface of the conductive supporting block is plated with a gold layer.

Furthermore, the lower surface of the bottom plate of the tube shell is provided with a plurality of metalized areas, and the metalized areas on the upper surface and the metalized areas on the lower surface are correspondingly communicated through metalized through holes.

Furthermore, notches for clamping and positioning are respectively arranged on two opposite side edges of the mounting substrate.

Further, the light emitting element is a light emitting diode, and the light receiving element is a photoelectric integrated chip.

Compared with the prior art, the invention has the beneficial effects that:

according to the scheme, the conductive supporting block is arranged, so that the mounting substrate connected with the light-emitting element is supported and fixed, and meanwhile, the conductive supporting block is also used as an electric signal transmission path of the light-emitting element, so that a stable supporting foundation is provided for the light-emitting element, a correlation vertical structure is formed, the overall dimension of the whole tube shell is favorably reduced, and the impact resistance stability is improved;

the tube shell bottom plate and the metalized area on the mounting substrate can be completed through a circuit printing process, the full automation of the surface mounting and wire bonding process can be realized, and the production cost is greatly reduced.

Drawings

FIG. 1 is a schematic structural diagram of a miniaturized photocoupler of the present invention;

FIG. 2 is a schematic structural view of the upper surface of the bottom plate of the package in an embodiment of a miniaturized photocoupler of the present invention;

FIG. 3 is a schematic view of the structure of the lower surface of a mounting substrate in an embodiment of a miniaturized photocoupler of the present invention.

Description of the reference numerals: 1. a bottom plate of the pipe shell; 11. a metal seal area; 12. a die bonding area; 13. a bonding region; 14. a first bonding area; 2. a pipe shell cover cap; 3. a cavity; 4. a light emitting element; 5. a light receiving element; 6. a conductive support block; 7. a mounting substrate; 71. a second bonding area; 72. and (4) a notch.

Detailed Description

In order to make the present invention more clear, a miniaturized photocoupler of the present invention is further described with reference to the attached drawings, and the embodiments described herein are only for explaining the present invention and are not intended to limit the present invention.

As shown in fig. 1 to 3, a miniaturized photocoupler includes a substrate 1 of a package, the substrate 1 of the package is a ceramic substrate, and a plurality of metalized areas are formed on the upper and lower surfaces of the substrate by printing metal conduction bands. The metallized area is set according to design requirements, and is divided into a bonding pad area 12, a bonding area 13 and a first welding area 14 according to functions. The number of the metal conduction bands of the bonding region 13 can be correspondingly designed according to the number of the chip leading-out ends required to be bonded; the size of a metal conduction band for wire bonding can be designed to be 180 mu m multiplied by 180 mu m at minimum; the metal conduction band of the bonding area 12 can be designed according to the size of the chip, and is preferably designed to have the unilateral size larger than the outline size of the chip by 0.05mm, so that the bonding position can be accurately controlled, and the accurate control of the bonding position can be ensured even if the bonding is carried out manually; the metallized area of the lower surface of the tube shell bottom plate 1 is a leading-out end, and the metallized area corresponding to the upper surface is correspondingly communicated through the metallized through hole so as to transmit an electric signal. Of course, the metalized area of the lower surface can be designed according to the customer use requirements, for example, the layer thickness of the metal conduction band is controlled between 0.65 μm and 5.3 μm.

An annular metal sealing area 11 is provided at the rim of the upper surface of the base plate 1 of the cartridge for the sealing connection of the cap 2 of the cartridge. The tube shell block 2 is made of metal, a gold-plated sealing area is arranged at the lower end of the tube shell block, and the tube shell block 2 and the tube shell bottom plate 1 form a sealed cavity 3 through welding of the two sealing areas. The cavity 3 is provided with a light emitting element 4, a light receiving element 5, a conductive supporting block 6, and a mounting substrate 7. Here, the light emitting element 4 is preferably a light emitting diode, and the light receiving element 5 is preferably a photo-integrated chip with a phototransistor.

The light receiving element 5 is fixedly connected with a bonding area 12 on the upper surface of the tube shell bottom plate 1, and the electrode of the light receiving element 5 is led out to a bonding area 13 of the tube shell bottom plate 1 by utilizing wire bonding to form electrical connection. The lower surface of the mounting substrate 7 is formed with metallized regions including a die attach region, a bonding region and a second bonding region 71 by printing a metal conductive tape. Semicircular notches 72 are respectively formed at opposite sides of the mounting substrate 7 to facilitate gripping and positioning of the mounting substrate 7. The light emitting element 4 is fixedly connected to the element bonding region on the lower surface of the mounting substrate 7, and the electrode of the light emitting element 4 is led out to the bonding region of the mounting substrate 7 by wire bonding to form electrical connection.

The light emitting element 4 is positioned directly above the light receiving element 5. One end face of the conductive supporting block 6 is fixedly connected with a first welding area 14 corresponding to the upper surface of the tube shell bottom plate 1 through conductive silver paste to form electrical conduction, and the other end face of the conductive supporting block passes through the conductive silver paste to be fixedly connected with a second welding area 71 corresponding to the lower surface of the mounting substrate 7 to form electrical conduction. The height of the conductive support block 6 can be made according to the performance requirements of the device. Preferably, the conductive supporting blocks 6 are respectively arranged on two opposite sides of the mounting substrate 7 to support the mounting substrate 7 to form a stable stressed structure, so that the impact resistance stability of the tube shell is improved. The conductive support block 6 is a metal block, which may be columbium alloy or a metal with a light material, and the surface of the conductive support block is plated with a gold layer. The conductive supporting block 6 serves as a supporting and fixing member and also serves as an electrical signal transmission path for the light emitting element 4.

In the embodiment, the conductive supporting block provides a supporting base for the light-emitting element to form a correlation vertical structure, so that the overall dimension of the shell of the photoelectric coupler is further reduced; in addition, because various metalized areas can be completed through a circuit printing process, the full automation of the processes of chip mounting and wire bonding can be realized, and the production cost is greatly reduced.

The above examples of the present invention are merely examples for clearly illustrating the present invention and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And such obvious changes and modifications which fall within the spirit of the invention are deemed to be covered by the present invention.

Claims

1. The utility model provides a miniaturized optoelectronic coupler, includes tube bottom plate (1) and locates tube block (2) that tube bottom plate (1) upper surface formed seal chamber (3), and tube bottom plate (1) upper surface is equipped with a plurality of metallization regions, is equipped with light emitting component (4) and light receiving element (5) in cavity (3), light receiving element (5) fixed connection on tube bottom plate (1) upper surface and with the metallization district electric connection that corresponds, its characterized in that: the light-emitting diode is characterized in that a conductive supporting block (6) and a mounting substrate (7) are further arranged in the cavity (3), a plurality of metalized areas are arranged on the mounting substrate (7), one end of the conductive supporting block (6) is fixedly connected to the upper surface of the tube shell bottom plate (1) and forms electric connection with the corresponding metalized area, the other end of the conductive supporting block is fixedly connected to the mounting substrate (7) and forms electric connection with the corresponding metalized area, the mounting substrate (7) is located above the tube shell bottom plate (1), the light-emitting element (4) is fixedly connected to the mounting substrate (7) and corresponds to the metalized area, and the light-emitting element (4) and the light-receiving element (5) are arranged oppositely.

2. A miniaturized photocoupler according to claim 1, wherein: the conductive supporting blocks (6) are respectively arranged on two opposite sides of the mounting substrate (7).

3. A miniaturized photocoupler as claimed in claim 2, wherein: the pipe shell bottom plate is characterized in that a metal sealing area is arranged on the edge of the upper surface of the pipe shell bottom plate (1), the pipe shell cap (2) is made of metal, and the pipe shell cap (2) is welded on the metal sealing area of the pipe shell bottom plate (1) in a sealing mode.

4. A miniaturized photocoupler as claimed in claim 3, wherein: the conductive supporting block (6) is a metal block, and the surface of the conductive supporting block is plated with a gold layer.

5. The miniaturized photocoupler according to claim 4, wherein: the lower surface of the tube shell bottom plate (1) is provided with a plurality of metalized areas, and the metalized areas on the upper surface and the metalized areas on the lower surface are correspondingly communicated through metalized through holes.

6. The miniaturized photocoupler according to claim 5, wherein: notches (72) for clamping and positioning are respectively arranged on two opposite side edges of the mounting base plate (7).

7. A miniaturized photocoupler according to claim 1 or 6, wherein: the light emitting element (4) is a light emitting diode, and the light receiving element (5) is a photoelectric integrated chip.