CN109680306B - FMM electroforming mother board manufacturing method based on mechanical punching - Google Patents
FMM electroforming mother board manufacturing method based on mechanical punching Download PDFInfo
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- CN109680306B CN109680306B CN201910127381.2A CN201910127381A CN109680306B CN 109680306 B CN109680306 B CN 109680306B CN 201910127381 A CN201910127381 A CN 201910127381A CN 109680306 B CN109680306 B CN 109680306B
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- electroforming
- electroformed
- fmm
- mother board
- cathode
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- 238000005323 electroforming Methods 0.000 title claims abstract description 38
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000004080 punching Methods 0.000 title claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 25
- 238000002791 soaking Methods 0.000 claims abstract description 15
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 9
- 238000005266 casting Methods 0.000 claims abstract description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 21
- 238000002161 passivation Methods 0.000 claims description 7
- CMMUKUYEPRGBFB-UHFFFAOYSA-L dichromic acid Chemical compound O[Cr](=O)(=O)O[Cr](O)(=O)=O CMMUKUYEPRGBFB-UHFFFAOYSA-L 0.000 claims description 2
- 238000001035 drying Methods 0.000 description 5
- 238000005406 washing Methods 0.000 description 4
- 229910001111 Fine metal Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910001374 Invar Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- JHWIEAWILPSRMU-UHFFFAOYSA-N 2-methyl-3-pyrimidin-4-ylpropanoic acid Chemical compound OC(=O)C(C)CC1=CC=NC=N1 JHWIEAWILPSRMU-UHFFFAOYSA-N 0.000 description 1
- 238000010146 3D printing Methods 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/10—Moulds; Masks; Masterforms
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/24—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing hexavalent chromium compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/78—Pretreatment of the material to be coated
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Printing Plates And Materials Therefor (AREA)
Abstract
The invention provides a method for manufacturing an FMM electroformed motherboard based on mechanical punching, which comprises the following steps: providing an electroformed cathode master; punching holes on the electroforming cathode mother board by adopting a mechanical punching mode to obtain a plurality of conical concave holes; and performing casting on the concave hole of the electroforming cathode mother board to obtain a convex board, and soaking the insulating photoresist at the top end of the convex board to obtain the electroforming mother board. The present invention can be used for mass production of mother plate in one step, and has unlimited times of casting, better dimensional stability than the yellow light process, no dry film required by the yellow light process, and no large part of process time, and greatly increased production speed and yield.
Description
Technical Field
The invention relates to the technical field of display, in particular to a method for manufacturing an FMM electroforming mother board based on mechanical punching.
Background
At present, the mainstream method for mass production of the AMO L ED panel used by the high-end mobile phone is vacuum evaporation, and the Fine Metal Mask FMM which must be used for vacuum evaporation is totally called Fine Metal Mask (Fine Metal Mask plate), and the material thereof is mainly iron Metal alloy of which the low expansion Metal generally uses invar Metal (invar) and the component is mainly 36% of nickel.
When the FMM is manufactured by using a general electroforming method, a yellow light process is required, which is performed by steps of film pressing, exposure, development, etc. to form a dry film (photoresist) on a mother substrate, and then the dry film is turned over and electroformed once, so that the original dry film (photoresist) will fall off after the FMM is taken out. However, in the yellow light process, the mother substrate has a tolerance in each development, the size is not stable enough, and therefore, the mother substrate cannot be reused many times, and the yellow light process has a long time and low production speed and yield.
Disclosure of Invention
The invention provides a method for manufacturing an FMM electroformed motherboard based on mechanical punching, which can solve the technical problems of low production speed and low yield in the prior art.
In order to solve the technical problems, the invention adopts the following technical scheme:
a FMM electroforming mother board manufacturing method based on mechanical punching comprises the following steps:
providing an electroformed cathode master;
punching holes on the electroforming cathode mother board by adopting a mechanical punching mode to obtain a plurality of conical concave holes;
casting the concave hole of the electroformed cathode mother board to obtain a convex board;
and soaking the top end of the convex plate in the insulating light resistor to obtain a finished product of the electroforming mother plate.
Preferably, in the method, the electroformed cathode master is an integrated plate-like structure.
Further, when electroforming, the electroforming cathode mother board needs to be subjected to surface passivation treatment on the mother board, and the surface passivation treatment specifically comprises the following steps:
1) placing the electroforming cathode mother board into 2-5% NaOH solution at 45-80 ℃ for soaking and washing;
2) when the temperature of the electroforming cathode mother board is 45-60 ℃, adding dichromic acid solution for soaking;
3) and placing the electroforming cathode mother plate in 2% -5% NaOH solution again, and soaking with anode weak current, so that the FMM mask plate after casting is easy to separate from the mother plate and is not easy to damage.
Preferably, the depth of the perforation is 30um to 50 um.
Preferably, in the method, the thickness of the insulating photoresist is 5um to 15 um.
According to the technical scheme, the mother plate can be cast for use infinitely in one-time mass production, the size stability is better than that of the yellow light process, a dry film required by the yellow light process can be omitted, most of the process time is saved, and the production speed and the yield are greatly improved.
Drawings
FIG. 1 is a schematic view of the structure of an electroformed cathode master of the present invention;
FIG. 2 is a schematic view showing the flow state of the method for manufacturing an FMM electroformed master according to the present invention.
Detailed Description
A preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings.
As shown in fig. 2, the method for manufacturing an FMM electroformed motherboard comprises the steps of machining tapered concave holes by using a mechanical punching mode, casting the motherboard (concave holes) into a convex plate once, and soaking an insulating photoresist at the top end of the convex plate, wherein the method is used for manufacturing the FMM electroformed motherboard and specifically comprises the following steps:
step one, providing an electroforming cathode mother board 1;
secondly, punching holes on the electroforming cathode mother board by adopting a mechanical punching mode to obtain a plurality of conical concave holes 2;
step three, performing casting on the concave hole of the electroforming cathode mother board to obtain a convex board 3;
and step four, soaking the insulating photoresist 4 at the top end of the convex plate to obtain an electroforming mother plate finished product 5.
As shown in fig. 1, the electroformed cathode master 1 is an integral plate-like structure, and is made of SUS, and is fabricated into a three-dimensional tapered column by CNC processing, so as to fabricate the openings and the spaces required by FMM. The SUS electroformed cathode master can also be fabricated by 3D printing.
The electroforming FMM is difficult to be directly taken down from an electroforming mother board, so that the electroforming cathode mother board needs to be subjected to surface passivation treatment during electroforming, and the speed of taking down the electroforming FMM can be increased by adopting 2% -5% NaOH solution in the embodiment.
In order to effectively passivate the freely processable stainless steel, a passivation process for neutralizing residual acid molecules is adopted, and the passivation method can be completed in less than 2 hours, and comprises the following specific steps:
after degreasing, placing the part into a sodium hydroxide solution with the temperature of 45-80 ℃ and specific concentration for soaking for 30 minutes; thoroughly washing with water; soaking the workpiece in a nitric acid solution with a specific concentration, in which a specific part of sodium dichromate is added, at a temperature of 45-60 ℃ for 30 minutes; thoroughly washing with water; then returning to the sodium hydroxide solution for soaking for 30 minutes; thoroughly washing with water, and finally drying.
In the second step, a mechanical punching mode is adopted to punch holes on the electroforming cathode mother board to obtain a plurality of conical concave holes, and the method specifically comprises the following steps:
preparing a mirror surface stainless steel plate as an electroforming cathode mother plate, wherein the size is as follows: 1000mm 1800 mm; and inputting the point distribution drawing file into a mechanical punching machine, punching the hole by a punching machine according to the drawing file mode, processing holes and intervals required by FMM, and controlling the punching depth to be 30-50 um.
The third and fourth steps comprise:
electroforming a conical hole-shaped stainless steel plate which is finished by mechanical punching, wherein the electroforming thickness is controlled between 0.25mm and 0.50 mm;
cleaning the electroformed convex plate to obtain a recast convex plate;
soaking the top end of the electroformed tapered hole convex plate in an insulation light resistor in a mechanical control Dip mode, wherein the thickness of the light resistor is controlled to be 5-15 um;
drying the convex plate after the Dip insulation photoresist, wherein the drying temperature is 50-80 ℃, and the drying time is as follows: 10-20 minutes.
And then electroforming by using the tapered convex plate after drying the insulating photoresist, wherein the electroforming thickness is controlled below the insulating layer at the top end and is 20-35 um, and thus the electroforming FMM finished product 6 with the tapered opening is finished.
The above-mentioned embodiments are merely illustrative of the preferred embodiments of the present invention, and do not limit the scope of the present invention, and various modifications and improvements made to the technical solution of the present invention by those skilled in the art without departing from the spirit of the present invention should fall within the protection scope defined by the claims of the present invention.
Claims (6)
1. A FMM electroforming mother board manufacturing method based on mechanical punching is characterized by comprising the following steps:
providing an electroformed cathode master;
punching holes on the electroforming cathode mother board by adopting a mechanical punching mode to obtain a plurality of conical concave holes;
casting the concave hole of the electroformed cathode mother board to obtain a convex board;
and soaking the top end of the convex plate in the insulating light resistor to obtain a finished product of the electroforming mother plate.
2. A method of making an FMM electroformed master as in claim 1, wherein the electroformed cathode master is a unitary plate-like structure.
3. A method of making an FMM electroformed master as in claim 1, wherein the electroformed cathode master is subjected to a surface passivation process on the master during electroforming.
4. A method of fabricating an FMM electroformed motherboard as in claim 3, wherein the surface passivation process comprises the steps of:
1) placing the electroforming cathode mother board into 2-5% NaOH solution at 45-80 ℃ for soaking;
2) when the temperature of the electroforming cathode mother board is 45-60 ℃, adding dichromic acid solution for soaking;
3) and placing the electroforming cathode mother board in 2-5% NaOH solution again, and soaking by using anode weak current.
5. A method of fabricating an FMM electroformed motherboard as recited in claim 1, wherein in the method, the depth of the perforation is 30 μm to 50 μm.
6. A method of fabricating an FMM electroformed master as claimed in claim 1, wherein the thickness of the insulating photoresist is 5 μm to 15 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910127381.2A CN109680306B (en) | 2019-02-20 | 2019-02-20 | FMM electroforming mother board manufacturing method based on mechanical punching |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910127381.2A CN109680306B (en) | 2019-02-20 | 2019-02-20 | FMM electroforming mother board manufacturing method based on mechanical punching |
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| Publication Number | Publication Date |
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| CN109680306A CN109680306A (en) | 2019-04-26 |
| CN109680306B true CN109680306B (en) | 2020-07-28 |
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| CN201910127381.2A Expired - Fee Related CN109680306B (en) | 2019-02-20 | 2019-02-20 | FMM electroforming mother board manufacturing method based on mechanical punching |
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Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85100323B (en) * | 1985-04-01 | 1988-04-13 | 大连手表工业公司 | Method of mould making for electroforming of micro-parts |
| CN1122601C (en) * | 2001-08-22 | 2003-10-01 | 魏志凌 | Preparation method of surface tiling and veneering technology form |
| CN1427093A (en) * | 2001-12-19 | 2003-07-02 | 精碟科技股份有限公司 | Metal template |
| KR100962778B1 (en) * | 2007-12-13 | 2010-06-09 | 현대자동차주식회사 | Mask making method for forming wood grain |
| JP4900349B2 (en) * | 2008-09-08 | 2012-03-21 | ソニー株式会社 | Mold manufacturing method, functional film manufacturing method, and functional film |
| CN101571606B (en) * | 2009-06-01 | 2011-05-04 | 浙江工业大学 | Large-size micro-prism type reflecting material die and preparation method thereof |
| CN102189633A (en) * | 2010-03-05 | 2011-09-21 | 北京同方光盘股份有限公司 | Method and system for manufacturing microfluidic chip |
| CN106637072A (en) * | 2015-10-30 | 2017-05-10 | 上海和辉光电有限公司 | High-precision metal mask device and manufacturing method thereof |
| CN107675214A (en) * | 2017-09-14 | 2018-02-09 | 昆山美微电子科技有限公司 | A kind of method that new electromolding alloy technique makes OLED evaporation covers FMM |
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| CN109680306A (en) | 2019-04-26 |
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Effective date of registration: 20191029 Address after: Room 406, building 2, 181 Lane 2498, Wanfeng Road, Fengjing town, Jinshan District, Shanghai 201611 Applicant after: Shanghai Yuanlin Enterprise Management Co.,Ltd. Address before: 230000 Northeast corner of the junction of Zhucheng Road and Yingzhou Road, Xinzhan District, Hefei City, Anhui Province Applicant before: HEFEI YONGQI ZHICAI TECHNOLOGY Co.,Ltd. |
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