CN109680306A - FMM electroforming motherboard production method based on mechanical punching - Google Patents
FMM electroforming motherboard production method based on mechanical punching Download PDFInfo
- Publication number
- CN109680306A CN109680306A CN201910127381.2A CN201910127381A CN109680306A CN 109680306 A CN109680306 A CN 109680306A CN 201910127381 A CN201910127381 A CN 201910127381A CN 109680306 A CN109680306 A CN 109680306A
- Authority
- CN
- China
- Prior art keywords
- electroforming
- motherboard
- fmm
- master plate
- production method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005323 electroforming Methods 0.000 title claims abstract description 62
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 238000004080 punching Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 21
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 11
- 238000009413 insulation Methods 0.000 claims abstract description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 21
- 238000005266 casting Methods 0.000 claims description 3
- 238000007654 immersion Methods 0.000 claims description 2
- KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- 238000012545 processing Methods 0.000 abstract description 5
- 238000005406 washing Methods 0.000 description 4
- 229910001111 Fine metal Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 229910001374 Invar Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- JHWIEAWILPSRMU-UHFFFAOYSA-N 2-methyl-3-pyrimidin-4-ylpropanoic acid Chemical compound OC(=O)C(C)CC1=CC=NC=N1 JHWIEAWILPSRMU-UHFFFAOYSA-N 0.000 description 1
- 238000010146 3D printing Methods 0.000 description 1
- 229920001621 AMOLED Polymers 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/10—Moulds; Masks; Masterforms
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/24—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing hexavalent chromium compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/78—Pretreatment of the material to be coated
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Printing Plates And Materials Therefor (AREA)
Abstract
The present invention provides a kind of FMM electroforming motherboard production method based on mechanical punching, comprising: provides an electroforming cathodic master plate；Using mechanical punching mode, is punched on the electroforming cathodic master plate, obtain the shrinkage pool of multiple tapers；The shrinkage pool of electroforming cathodic master plate is cast, insulation photoresist, as electroforming motherboard are impregnated into protrusive board top again after obtaining a protrusive board.The present invention processes a volume production motherboard, can cast use infinitely, dimensional stability is better than yellow light process, and can save dry film required for yellow light process, while eliminating most processing time, greatly improves speed of production and yield.
Description
Technical field
The present invention relates to field of display technology, and in particular to a kind of FMM electroforming motherboard production method based on mechanical punching.
Background technique
The main stream approach for AMOLED panel its volume production that high-order mobile phone uses at present is vacuum evaporation, and vacuum evaporation is necessary
Using fine metal cover FMM full name is Fine Metal Mask (fine metal mask plate), and material is mainly a kind of low swollen
Swollen metal generally uses invar metal (invar), and ingredient is mainly the iron dust alloy of 36% nickel.
When making FMM using general electroforming mode, needs to carry out processing procedure with yellow light, pass through press mold, exposure, development respectively
And etc., first set up on motherboard, afterwards turn over that electroforming is primary, and the dry film (photoresist) of script will because of take out after FMM with
Fall off.But yellow light process, motherboard have a little tolerance in development Shi Douhui every time, and size is not sufficiently stable, therefore cannot be multiple
It reuses, and the yellow light process time is longer, speed of production and yield be not high.
Summary of the invention
The present invention provides a kind of FMM electroforming motherboard production method based on mechanical punching, is able to solve and gives birth in the prior art
Produce speed and the not high technical problem of yield.
In order to solve the above technical problems, the present invention adopts the following technical scheme:
A kind of FMM electroforming motherboard production method based on mechanical punching, comprising:
One electroforming cathodic master plate is provided；
Using mechanical punching mode, is punched on the electroforming cathodic master plate, obtain the shrinkage pool of multiple tapers；
The shrinkage pool of electroforming cathodic master plate is cast, a protrusive board is obtained；
Insulation photoresist is impregnated on the protrusive board top, obtains electroforming motherboard finished product.
Preferably, in the method, the electroforming cathodic master plate is the plate structure of integral type.
Further, the electroforming cathodic master plate need to carry out surface passivating treatment, the surface in electroforming on motherboard
Specific step is as follows for Passivation Treatment:
1) soaking and water washing in the 2%~5%NaOH solution for being 45 DEG C~80 DEG C by electroforming cathodic master plate merging temperature；
2) it when electroforming cathodic master plate temperature is 45 DEG C~60 DEG C, adds in the solution of potassium bichromate and impregnates；
3) electroforming cathodic master plate is placed in 2%~5%NaOH solution again, using anode weak current immersion treatment, this
Purpose is hardly damaged to allow the FMM mask plate after casting can be easily separated with motherboard.
Preferably, punching depth is 30um~50um.
Preferably, in the method, the photoresist that insulate with a thickness of 5um~15um.
From the above technical scheme, the present invention processes a volume production motherboard, can cast use, dimensionally stable infinitely
Property is better than yellow light process, and can save dry film required for yellow light process, while eliminating most processing time, greatly
Improve speed of production and yield.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of electroforming cathodic master plate in the present invention；
Fig. 2 is the flow state schematic diagram of FMM electroforming motherboard production method of the present invention.
Specific embodiment
A kind of preferred embodiment of the invention is described in detail with reference to the accompanying drawing.
As shown in Fig. 2, the FMM electroforming motherboard production method, the shrinkage pool of cone cell is processed using mechanical punching mode, then
Its motherboard (shrinkage pool) is cast once at protrusive board, insulation photoresist then is impregnated on protrusive board top, is the electroforming for producing FMM
Motherboard specifically comprises the following steps:
Step 1: providing an electroforming cathodic master plate 1；
Step 2: being punched on the electroforming cathodic master plate using mechanical punching mode, obtaining the recessed of multiple tapers
Hole 2；
Step 3: the shrinkage pool of electroforming cathodic master plate is cast, a protrusive board 3 is obtained；
Step 4: insulation photoresist 4 is impregnated on the protrusive board top, electroforming motherboard finished product 5 is obtained.
As shown in Figure 1, the plate structure that the electroforming cathodic master plate 1 is integral type uses CNC numerical control using SUS material
Processing procedure processes taper column, processes aperture and spacing needed for FMM.SUS material electroforming cathodic master plate can also lead to
3D printing is crossed to complete.
It is very difficult that electroforming FMM is directly removed on electroforming motherboard, so need to be on electroforming cathodic master plate in electroforming
Surface passivating treatment is carried out, 2%~5%NaOH solution is used in the present embodiment, the speed for removing electroforming FMM can be increased.
In order to be effectively passivated can free processing stainless steel, using neutralize residual acid molecule passivation process, this passivation side
Method can just be completed within the time less than 2 hours, the specific steps are as follows:
After degreasing, part is embedded in temperature and is 45 DEG C~80 DEG C, impregnates 30 points in the sodium hydroxide solution of certain concentration
Clock；Thoroughly washing is clean；By workpiece temperature be 45 DEG C~60 DEG C, the certain concentration nitric acid for adding specific deal sodium dichromate is molten
It is impregnated 30 minutes in liquid；Thoroughly washing is clean；It returns in sodium hydroxide solution and impregnates 30 minutes；Thoroughly washing is clean, finally
It is dry.
In step 2, using mechanical punching mode, is punched on the electroforming cathodic master plate, obtain multiple tapers
Shrinkage pool specifically includes:
Prepare one block of mirror face stainless steel plate as electroforming cathodic master plate, size: 1000mm*1800mm；The map file that will layout is defeated
Enter mechanical punching machine, punching mechanical is allowed to be punched according to map file mode, processes aperture and spacing needed for FMM, punching
It is deep-controlled in 30um~50um.
The specific steps of step three and four include:
Carry out electroforming using the poroid stainless steel plate of taper that mechanical punching is completed, electroforming thickness control 0.25mm~
Between 0.50mm；
Protrusive board after cleaning electroforming obtains the protrusive board after casting；
By the top of the bellmouth protrusive board after electroforming, using Mechanical course Dip mode, insulation photoresist, light are impregnated into top
Thickness control is hindered in 5um~15um；
Protrusive board after Dip insulation photoresist is dried, 50~80 DEG C of drying temperature, drying time: 10~20 minutes.
Reuse insulation photoresist it is dry after taper protrusive board carry out electroforming, electroforming thickness control insulation layer of top end with
Under, electroforming thickness 20um~35um completes the electroforming FMM finished product 6 of taper size openings.
Embodiment described above is only that preferred embodiments of the present invention will be described, not to model of the invention
It encloses and is defined, without departing from the spirit of the design of the present invention, those of ordinary skill in the art are to technical side of the invention
The various changes and improvements that case is made, should fall within the scope of protection determined by the claims of the present invention.
Claims (6)
1. a kind of FMM electroforming motherboard production method based on mechanical punching characterized by comprising
One electroforming cathodic master plate is provided；
Using mechanical punching mode, is punched on the electroforming cathodic master plate, obtain the shrinkage pool of multiple tapers；
The shrinkage pool of electroforming cathodic master plate is cast, a protrusive board is obtained；
Insulation photoresist is impregnated on the protrusive board top, obtains electroforming motherboard finished product.
2. FMM electroforming motherboard production method according to claim 1, which is characterized in that in the method, the electroforming yin
Pole motherboard is the plate structure of integral type.
3. FMM electroforming motherboard production method according to claim 1, which is characterized in that the electroforming cathodic master plate is in electricity
Surface passivating treatment need to be carried out when casting on motherboard.
4. FMM electroforming motherboard production method according to claim 3, which is characterized in that the surface passivating treatment is specific
Steps are as follows:
1) it is impregnated in the 2%~5%NaOH solution for being 45 DEG C~80 DEG C by electroforming cathodic master plate merging temperature；
2) it when electroforming cathodic master plate temperature is 45 DEG C~60 DEG C, adds in the solution of potassium bichromate and impregnates；
3) electroforming cathodic master plate is placed in 2%~5%NaOH solution again, uses anode weak current immersion treatment.
5. FMM electroforming motherboard production method according to claim 1, which is characterized in that in the method, punching depth is
30um~50um.
6. FMM electroforming motherboard production method according to claim 1, which is characterized in that in the method, insulate photoresist
With a thickness of 5um~15um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910127381.2A CN109680306B (en) | 2019-02-20 | 2019-02-20 | FMM electroforming mother board manufacturing method based on mechanical punching |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910127381.2A CN109680306B (en) | 2019-02-20 | 2019-02-20 | FMM electroforming mother board manufacturing method based on mechanical punching |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109680306A true CN109680306A (en) | 2019-04-26 |
| CN109680306B CN109680306B (en) | 2020-07-28 |
Family
ID=66196612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910127381.2A Expired - Fee Related CN109680306B (en) | 2019-02-20 | 2019-02-20 | FMM electroforming mother board manufacturing method based on mechanical punching |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109680306B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85100323A (en) * | 1985-04-01 | 1986-08-06 | 大连手表工业公司 | The mould manufacturing process of production electroforming part |
| CN1341513A (en) * | 2001-08-22 | 2002-03-27 | 魏志凌 | Preparation method of surface tiling and veneering technology form |
| CN1427093A (en) * | 2001-12-19 | 2003-07-02 | 精碟科技股份有限公司 | Metal template |
| CN101456329A (en) * | 2007-12-13 | 2009-06-17 | 现代自动车株式会社 | Method of fabricating mask for forming wood grain patterns |
| CN101571606A (en) * | 2009-06-01 | 2009-11-04 | 浙江工业大学 | Large-size micro-prism type reflecting material die and preparation method thereof |
| CN101671837A (en) * | 2008-09-08 | 2010-03-17 | 索尼株式会社 | Die manufacturing method, functional film manufacturing method and functional film |
| CN102189633A (en) * | 2010-03-05 | 2011-09-21 | 北京同方光盘股份有限公司 | Method and system for manufacturing microfluidic chip |
| CN106637072A (en) * | 2015-10-30 | 2017-05-10 | 上海和辉光电有限公司 | High-precision metal mask device and manufacturing method thereof |
| CN107675214A (en) * | 2017-09-14 | 2018-02-09 | 昆山美微电子科技有限公司 | A kind of method that new electromolding alloy technique makes OLED evaporation covers FMM |
-
2019
- 2019-02-20 CN CN201910127381.2A patent/CN109680306B/en not_active Expired - Fee Related
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85100323A (en) * | 1985-04-01 | 1986-08-06 | 大连手表工业公司 | The mould manufacturing process of production electroforming part |
| CN1341513A (en) * | 2001-08-22 | 2002-03-27 | 魏志凌 | Preparation method of surface tiling and veneering technology form |
| CN1427093A (en) * | 2001-12-19 | 2003-07-02 | 精碟科技股份有限公司 | Metal template |
| CN101456329A (en) * | 2007-12-13 | 2009-06-17 | 现代自动车株式会社 | Method of fabricating mask for forming wood grain patterns |
| CN101671837A (en) * | 2008-09-08 | 2010-03-17 | 索尼株式会社 | Die manufacturing method, functional film manufacturing method and functional film |
| CN101571606A (en) * | 2009-06-01 | 2009-11-04 | 浙江工业大学 | Large-size micro-prism type reflecting material die and preparation method thereof |
| CN102189633A (en) * | 2010-03-05 | 2011-09-21 | 北京同方光盘股份有限公司 | Method and system for manufacturing microfluidic chip |
| CN106637072A (en) * | 2015-10-30 | 2017-05-10 | 上海和辉光电有限公司 | High-precision metal mask device and manufacturing method thereof |
| CN107675214A (en) * | 2017-09-14 | 2018-02-09 | 昆山美微电子科技有限公司 | A kind of method that new electromolding alloy technique makes OLED evaporation covers FMM |
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| Publication number | Publication date |
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| CN109680306B (en) | 2020-07-28 |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20191029 Address after: Room 406, building 2, 181 Lane 2498, Wanfeng Road, Fengjing town, Jinshan District, Shanghai 201611 Applicant after: Shanghai Yuanlin Enterprise Management Co.,Ltd. Address before: 230000 Northeast corner of the junction of Zhucheng Road and Yingzhou Road, Xinzhan District, Hefei City, Anhui Province Applicant before: HEFEI YONGQI ZHICAI TECHNOLOGY Co.,Ltd. |
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