CN106637072A - High-precision metal mask device and manufacturing method thereof - Google Patents
High-precision metal mask device and manufacturing method thereof Download PDFInfo
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- CN106637072A CN106637072A CN201510726941.8A CN201510726941A CN106637072A CN 106637072 A CN106637072 A CN 106637072A CN 201510726941 A CN201510726941 A CN 201510726941A CN 106637072 A CN106637072 A CN 106637072A
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- electroforming
- substrate
- main body
- peristome
- packing material
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Abstract
The invention discloses a high-precision metal mask device and a manufacturing method thereof. The high-precision mask device comprises an electroforming substrate and a mask body. The electroforming substrate comprises a substrate body and an open part which is arranged on the substrate body and penetrates the substrate body. The mask body is arranged on the electroforming substrate and located on the open part, and the edge of the mask body is connected with the electroforming substrate. According to the high-precision metal mask device, the percent of pass, the size precision and the position precision of the electroforming high-precision metal mask device can be improved.
Description
Technical field
The present invention relates in manufacture organic light emitting diode (Organic Light-Emitting Diode, letter
Claim OLED) during evaporation the high-precision metal mask device that uses with its manufacture method.
Background technology
Metal mask plate (mask) serves pivotal role as the important tool in AMOLED evaporations.
Metal mask plate generally includes mask main body and framework.The making of mask main body is usually in an electroforming substrate
On formed by way of electroforming.After the completion of mask main body electroforming, need mask main body and electroforming
Substrate separates the step such as subsequently thrown the net.
At present, mask main body is separated with electroforming substrate and can be separated and stripping machine separates two using manual
Kind of mode, but either which kind of mode is separated and all can there arises a problem that：
1) mask main body deforms；
2) residue is bonded on electroforming substrate, is difficult to process after electroforming, cause electroforming substrate to be scrapped,
Reusing is low；
3) positional precision that can cause mask main body when silk screen bonding is carried out during electroforming changes.
The problems referred to above can cause to reduce qualification rate, dimensional accuracy, the positional precision of finished product.
The content of the invention
For defect of the prior art, it is an object of the invention to provide a kind of high-precision metal mask
Device and its manufacture method, improve qualification rate, the size essence of the high-precision metal mask device of electroforming
Degree and positional precision.
A kind of high-precision metal mask device is provided according to an aspect of the present invention, it is characterised in that
Including：Electroforming substrate, the electroforming substrate includes：Base main body；Peristome, is arranged at described
In base main body, and through the base main body.Mask main body, is arranged on the electroforming substrate,
Positioned at the peristome, the edge of the mask main body is connected with the electroforming substrate.
Preferably, the length of the peristome is 200～220mm, and width is 220～260mm.
Preferably, the length of the base main body is 1000mm, and width is 600mm.
Preferably, the thickness of the base main body is 0.8～1.5mm.
According to another aspect of the present invention, a kind of manufacture of high-precision metal mask device is also provided
Method, it is characterised in that comprise the steps：Prepare electroforming substrate, the electroforming substrate has
One peristome；Packing material is filled in into the peristome；On the peristome of the electroforming substrate
Carry out electroforming and form mask main body；And remove the packing material from the peristome.
Preferably, the peristome on the electroforming substrate carry out electroforming formed the mask main body it
It is front also to comprise the steps：Dry film photoresistance is formed on the surface of the electroforming substrate.
Preferably, include the step of the surface of the electroforming substrate forms the dry film photoresistance as follows
Sub-step：The electroforming substrate and the packing material are cleaned；In the electroforming substrate and
The surface coating photoresistance of the packing material, and be exposed, develop, to form the dry film light
Resistance.
Preferably, electroforming is carried out on the peristome of the electroforming substrate and the mask main body is formed
Also comprise the steps before：Activation processing is carried out to the packing material.
Preferably, the step of carrying out activation processing to the packing material is in the packing material table
Face is coated with pallamine material.
Preferably, the packing material is made up of paraffin or Colophonium.
Preferably, by the packing material from the peristome remove the step of in also include following son
Step：The dry film photoresistance that the surface of the electroforming substrate and the packing material is coated with is removed；
High temperature distillation is carried out to the packing material.
The present invention high-precision metal mask device by arranging peristome on electroforming substrate, in electricity
Mask main body correspondence is located at peristome during casting, and peristome is full of by packing material, and electroforming is complete
Packing material is removed from peristome into after, so as to form high-precision metal mask device, the height
Precision metal mask device at least has the advantages that：
1) can electroforming go out thickness be below 30um mask main body；
2) carry out follow-up silk screen bonding and throw the net etc. to walk without the need for mask main body is peeled off from electroforming substrate
Suddenly, the high-precision metal mask device can be directly mounted to used in evaporated device；
3) the step of throwing the net is eliminated, therefore, what the positional precision of mask main body was not thrown the net controls；
4) solve the problems, such as because when mask body thickness is relatively thin difficult with frame welding；
5) it is cost-effective, improve the qualification rate of product.
Description of the drawings
By reading the detailed description made to non-limiting example with reference to the following drawings, the present invention
Other features, objects and advantages will become more apparent upon：
Fig. 1 is the vertical section structure schematic diagram of the high-precision metal mask device of the present invention；
Fig. 2 is the top view of the electroforming substrate of the present invention；
Fig. 3 is the vertical section structure schematic diagram of the electroforming substrate of the present invention；
Fig. 4 is the knot of the evaporated device being deposited with using the high-precision metal mask device of the present invention
Structure schematic diagram；
Fig. 5 is the flow chart of the high-precision metal mask device manufacture method of the present invention；
Fig. 6 is the longitudinal section of the bogey formed after the packing material filling of the present invention and peristome
Structural representation；
Fig. 7 is that the vertical section structure schematic diagram after mask main body is formed on the bogey of Fig. 6；
Fig. 8 is to be formed on the surface of electroforming substrate during high-precision metal mask device of the invention
The flow chart of the step of thin film；And
Fig. 9 is to remove packing material from opening during high-precision metal mask device of the invention
The step of flow chart.
Specific embodiment
The technology contents of the present invention are described further with reference to the accompanying drawings and examples.
Please also refer to Fig. 1 to Fig. 3, it is shown respectively the vertical of the high-precision metal mask device of the present invention
Cross section structure schematic diagram, the top view of electroforming substrate and vertical section structure schematic diagram.As shown in figure 1,
The high-precision metal mask device includes electroforming substrate 1 and mask main body 2.Electroforming substrate 1 includes：
Base main body 11 and peristome 12.
As shown in Fig. 2 in a preferred embodiment of the invention, base main body 11 is rectangular, its length
For 1000mm, width is 600mm.The thickness of base main body 11 is 0.8～1.5mm.It is highly preferred that
The thickness of base main body 11 is 1mm.Base main body 11 is preferably supported by stainless steel material, possesses strong
Degree height, calorific intensity height, good corrosion resistance, low temperature performance well, the spy such as chemism is big, heat conductive elastomeric is little
Point.
Peristome 12 is arranged in base main body 11, and through base main body 11.As shown in Fig. 2 excellent
Selection of land, peristome 12 is rectangular, and peristome 12 arranges the center with base main body 11.Peristome
12 length is 200～220mm, and width is 220～260mm.It is highly preferred that the length of peristome 12
Spend for 208mm, width is 240mm.Although disclosing a kind of chi of peristome 12 in above-described embodiment
It is very little, but it should be recognized that the size of peristome 12 is not limited to that, specifically, due to electricity
Casting substrate 1 is that, for making mask main body, peristome 12 is corresponding with the mask main body for needing to make,
Therefore, during the actual fabrication of peristome 12, its size need the size according to mask main body and
It is fixed, and mask main body is substantially applied to substrate (such as glass substrate) to be deposited, and then,
The size of peristome 12 is determined according to the size of substrate to be deposited.Similarly, peristome 12
Shape is also not limited to rectangle one kind, and it equally can be changed according to the shape of substrate to be deposited,
Such as circle etc..
Mask main body 2 is arranged on electroforming substrate 1, positioned at peristome 11, the edge of mask main body 2 with
Electroforming substrate 1 is connected.Mask main body 2 is used to block with this in base to be deposited substrate to be deposited
Rgb pixel point is defined and formed on plate, wherein, mask main body 2 is provided with multiple mask apertures.It is described
The quantity and arrangement mode of mask aperture can be adjusted according to the actual demand of product.Real shown in Fig. 3
In applying example, mask main body 2 is rectangular, and it is identical with the shape of peristome 12 of electroforming substrate 1, mask
More than the size of peristome 12, the edge of mask main body 2 is attached to peristome 12 to the size of main body 2
On edge.Preferably, mask main body 2 is made up of nickel or Ferro-nickel alloy material by way of electroforming growth.
It should be noted that the high-precision metal mask device of the present invention can directly apply evaporated device
In, electroforming substrate 1 instead of the framework of the mask device of prior art.Fig. 4 is referred to, be it illustrates
The structural representation of the evaporated device being deposited with using the high-precision metal mask device of the present invention.As schemed
Shown in 4, the evaporated device includes that evaporation chamber (not shown in Fig. 4), vapor deposition source 3, substrate are solid
Determine device 4 and mask fixing device 5.
As shown in figure 4, vapor deposition source 3 is arranged at the evaporation within the chamber.Apparatus for fixing substrate 4 is arranged at
The evaporation within the chamber, and positioned at the top of vapor deposition source 3, for fixing substrate to be deposited 6.Mask is consolidated
Determine device 5 and be arranged at the evaporation within the chamber, and between vapor deposition source 3 and apparatus for fixing substrate 4,
For fixing the high-precision metal mask device shown in above-mentioned Fig. 1.Wherein, the high-precision metal mask
The electroforming substrate 1 of device is placed in the top of mask fixing device 5, peristome 12 and mask main body 2
The top of vapor deposition source 3 is correspondingly located at, substrate to be deposited 6 is arranged in correspondence with the top of mask main body 2.
Vapor deposition source 3 sequentially passes through peristome 12 and mask main body 2 is deposited with to substrate to be deposited 6.
Please also refer to Fig. 5 to Fig. 9, it is shown respectively the high-precision metal mask device manufacture of the present invention
The structure of the high-precision metal mask device of each step of correspondence is shown in the flow chart and manufacture process of method
It is intended to.Specifically, the present invention also provides the high-precision metal mask device shown in a kind of above-mentioned Fig. 1
Manufacture method.As shown in figure 5, the manufacture method comprises the steps：
Step S100：Prepare the electroforming substrate 1 shown in Fig. 2 and Fig. 3, electroforming substrate 1 is with an opening
Portion 12.Electroforming substrate 1 can be made with carrying out the modes such as casting using mould.
Step S200：Packing material 7 is filled in into the peristome 12 of electroforming substrate 1, one is formed and is carried
Device (refers to Fig. 6).In a preferred embodiment of the invention, packing material 7 is by olefin material system
Into olefin material has high-melting-point and high rigidity, and good hardness can ensure that in mask main body electroforming
During it is indeformable.Additionally, olefin material is easily become by liquid turns to solid-state, therefore, it is described making
The olefin material of liquid can be cast in the peristome 2 of electroforming substrate 1 during bogey, when
Lead to overcooled mode when being filled up completely with full gate oral area 2 and the olefin material of liquid is changed into into solid-state, with this shape
Into the bogey shown in Fig. 6.Further, in some change case, packing material 7 can also be selected
With other materials, such as asphalt material, asphalt material is equally relatively easy to be changed into solid-state from liquid, therefore,
It is easy to the filling and molding of packing material 7, these change case to be achieved, will not be described here.
Step S300：Electroforming and mask main body 2 is formed on the peristome 12 of electroforming substrate 1, can be joined
See Fig. 7.Wherein, the process and mode of electroforming can for it is of the prior art any one, here is not superfluous
State.
Step S400：Packing material 7 is removed from peristome 12.
Further, as shown in figure 5, in a preferred embodiment of the invention, the manufacture method also
Including step S500：The high-precision metal mask device is cleaned, dried.
Further, in a preferred embodiment of the invention, the manufacture method is additionally included in electroforming substrate
Surface formed dry film photoresistance the step of.Specifically, as shown in figure 8, in the surface shape of electroforming substrate
Into the step of dry film photoresistance include following sub-step：
Step S601：The electroforming substrate 1 of the bogey and the surface smoothness of packing material 7 are checked,
If there is the situation of the two surface irregularity, using precision milling machine by packing material 7 and electroforming substrate 1
Milling makes the two smooth to same plane.
Step S602：The bogey is cleaned.
Step S603：Dry film photoresistance is coated with the surface of the bogey, and is exposed, is developed.
Further, as shown in figure 9, step S400 also includes following sub-step：
Step S401：The dry film photoresistance of the surface coating of bogey in step S603 before is removed.
Preferably, dry film photoresistance is the bogey and mask main body 2 by will be formed after the completion of step S300
It is soaked in sodium hydroxide or sprays sodium hydroxide and removes in the surface of bogey and mask main body 2
's.
Step S402：High temperature distillation is carried out to packing material 7.Remove and then formed after packing material 7 figure
High-precision metal mask device shown in 3.
Further, in a preferred embodiment of the invention, the manufacture method is also included to packing material
7 the step of carry out activation processing.Specifically, in a preferred embodiment of the invention, due to filling material
Material 7 selects olefin material, and olefin material is simultaneously non-conductive, therefore, in order that packing material during electroforming
7 surface conductance, the step is by the way that pallamine to be coated the surface of packing material 7 (i.e. palladium process)
The metal level (not shown) by made by palladium material of formation one, makes the surface conductance of packing material 7,
And then make the surface of whole bogey can be conductive.Further, if packing material 7 is from conductive
Material, then the step can omit.
To sum up, electroforming substrate of the invention and high-precision metal mask device on electroforming substrate by setting
Peristome is put, mask main body correspondence is located at peristome during electroforming, and peristome is filled by packing material
It is full, packing material is removed from peristome after the completion of electroforming, so as to form high-precision metal mask device.
The high-precision metal mask device at least have can electroforming go out thickness be below 30um mask master
Body；Carry out follow-up silk screen bonding and the step such as throw the net without the need for mask main body is peeled off from electroforming substrate, it is high-precision
Degree metal mask device can be directly mounted to used in evaporated device；The step of throwing the net is eliminated, therefore,
What the positional precision of mask main body was not thrown the net controls；Solve because when mask body thickness is relatively thin with framework
The problem of welding difficulty；It is cost-effective, improve the beneficial effects such as the qualification rate of product.
Although the present invention is disclosed as above with preferred embodiment, but it is not limited to the present invention.This
The technical staff of technical field that the present invention belongs to, it is without departing from the spirit and scope of the present invention, each when making
The change planted and modification.Therefore, protection scope of the present invention when regard scope that claims are defined as
It is accurate.
Claims (11)
1. a kind of high-precision metal mask device, it is characterised in that include：
Electroforming substrate, the electroforming substrate includes：
Base main body；
Peristome, is arranged in the base main body, and through the base main body.
Mask main body, is arranged on the electroforming substrate, positioned at the peristome, the mask main body
Edge is connected with the electroforming substrate.
2. high-precision metal mask device according to claim 1, it is characterised in that the opening
The length in portion is 200～220mm, and width is 220～260mm.
3. high-precision metal mask device according to claim 1, it is characterised in that the substrate
The length of main body is 1000mm, and width is 600mm.
4. high-precision metal mask device according to claim 1, it is characterised in that the substrate
The thickness of main body is 0.8～1.5mm.
5. a kind of manufacture method of high-precision metal mask device, it is characterised in that comprise the steps：
Prepare electroforming substrate, the electroforming substrate has a peristome；
Packing material is filled in into the peristome；
Electroforming is carried out on the peristome of the electroforming substrate and form mask main body；And
The packing material is removed from the peristome.
6. manufacture method according to claim 5, it is characterised in that on the electroforming substrate
Peristome carries out electroforming and is formed also to comprise the steps before the mask main body：
Dry film photoresistance is formed on the surface of the electroforming substrate.
7. manufacture method according to claim 6, it is characterised in that in the table of the electroforming substrate
The step of face forms the dry film photoresistance includes following sub-step：
The electroforming substrate and the packing material are cleaned；
Photoresistance is coated with the surface of the electroforming substrate and the packing material, and is exposed, is developed,
To form the dry film photoresistance.
8. manufacture method according to claim 5, it is characterised in that in opening for the electroforming substrate
Electroforming is carried out on oral area and is formed also to comprise the steps before the mask main body：
Activation processing is carried out to the packing material.
9. manufacture method according to claim 8, it is characterised in that the packing material is carried out
The step of activation processing is to be coated with pallamine material on the packing material surface.
10. manufacture method according to claim 8, it is characterised in that the packing material is by paraffin
Or Colophonium is made.
11. manufacture methods according to claim 6, it is characterised in that by the packing material from institute
Also include following sub-step in stating the step of peristome is removed：
The dry film photoresistance that the surface of the electroforming substrate and the packing material is coated with is removed；
High temperature distillation is carried out to the packing material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510726941.8A CN106637072A (en) | 2015-10-30 | 2015-10-30 | High-precision metal mask device and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510726941.8A CN106637072A (en) | 2015-10-30 | 2015-10-30 | High-precision metal mask device and manufacturing method thereof |
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| CN106637072A true CN106637072A (en) | 2017-05-10 |
Family
ID=58809303
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| CN201510726941.8A Pending CN106637072A (en) | 2015-10-30 | 2015-10-30 | High-precision metal mask device and manufacturing method thereof |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107130209A (en) * | 2017-06-30 | 2017-09-05 | 京东方科技集团股份有限公司 | Mask plate, the manufacture method of mask plate and evaporation coating device |
| CN109652759A (en) * | 2017-10-12 | 2019-04-19 | 上海和辉光电有限公司 | A kind of production method and metal mask plate of metal mask plate |
| CN109680306A (en) * | 2019-02-20 | 2019-04-26 | 合肥永淇智材科技有限公司 | FMM electroforming motherboard production method based on mechanical punching |
| CN110079761A (en) * | 2018-01-26 | 2019-08-02 | 张东晖 | The manufacturing method of thin metal vapor deposition mask |
| CN111398001A (en) * | 2020-04-01 | 2020-07-10 | 中国船舶重工集团公司第七二五研究所 | Method for preparing corrosion pit on metal material sample |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002313564A (en) * | 2001-04-17 | 2002-10-25 | Nec Corp | Shadow mask, method of manufacturing the shadow mask, and display |
| JP2008243916A (en) * | 2007-03-26 | 2008-10-09 | Toppan Printing Co Ltd | Manufacturing method for mask for charged-particle ray exposure and mask for charged-particle ray exposure |
| CN102023474A (en) * | 2009-09-22 | 2011-04-20 | 三星移动显示器株式会社 | Mask assembly, fabrication method of the same and deposition apparatus using the same for flat panel display device |
| JP4708735B2 (en) * | 2004-05-31 | 2011-06-22 | キヤノン株式会社 | Method for manufacturing mask structure |
| CN102569673A (en) * | 2010-12-20 | 2012-07-11 | 三星移动显示器株式会社 | Mask frame assembly, method of manufacturing the same, and method of manufacturing organic light-emitting display device using the mask frame assembly |
| CN103451598A (en) * | 2013-09-05 | 2013-12-18 | 中山新诺科技有限公司 | Novel fine metal mask plate for producing organic light emitting diode (OLED) display panel and fabrication method of novel fine metal mask plate |
| CN203559114U (en) * | 2013-09-05 | 2014-04-23 | 中山新诺科技有限公司 | Novel fine metal mask for producing OLED (Organic Light Emitting Diode) display panel |
| CN103866230A (en) * | 2014-03-20 | 2014-06-18 | 中山新诺科技股份有限公司 | Manufacturing method for novel shadow mask for producing OLED display panel |
-
2015
- 2015-10-30 CN CN201510726941.8A patent/CN106637072A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002313564A (en) * | 2001-04-17 | 2002-10-25 | Nec Corp | Shadow mask, method of manufacturing the shadow mask, and display |
| JP4708735B2 (en) * | 2004-05-31 | 2011-06-22 | キヤノン株式会社 | Method for manufacturing mask structure |
| JP2008243916A (en) * | 2007-03-26 | 2008-10-09 | Toppan Printing Co Ltd | Manufacturing method for mask for charged-particle ray exposure and mask for charged-particle ray exposure |
| CN102023474A (en) * | 2009-09-22 | 2011-04-20 | 三星移动显示器株式会社 | Mask assembly, fabrication method of the same and deposition apparatus using the same for flat panel display device |
| CN102569673A (en) * | 2010-12-20 | 2012-07-11 | 三星移动显示器株式会社 | Mask frame assembly, method of manufacturing the same, and method of manufacturing organic light-emitting display device using the mask frame assembly |
| CN103451598A (en) * | 2013-09-05 | 2013-12-18 | 中山新诺科技有限公司 | Novel fine metal mask plate for producing organic light emitting diode (OLED) display panel and fabrication method of novel fine metal mask plate |
| CN203559114U (en) * | 2013-09-05 | 2014-04-23 | 中山新诺科技有限公司 | Novel fine metal mask for producing OLED (Organic Light Emitting Diode) display panel |
| CN103866230A (en) * | 2014-03-20 | 2014-06-18 | 中山新诺科技股份有限公司 | Manufacturing method for novel shadow mask for producing OLED display panel |
Non-Patent Citations (1)
| Title |
|---|
| 王广春31: "《增材制造技术及应用实例》", 31 March 2014, 北京：机械工业出版社 * |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107130209A (en) * | 2017-06-30 | 2017-09-05 | 京东方科技集团股份有限公司 | Mask plate, the manufacture method of mask plate and evaporation coating device |
| CN109652759A (en) * | 2017-10-12 | 2019-04-19 | 上海和辉光电有限公司 | A kind of production method and metal mask plate of metal mask plate |
| CN109652759B (en) * | 2017-10-12 | 2021-04-27 | 上海和辉光电股份有限公司 | Manufacturing method of metal mask plate and metal mask plate |
| CN110079761A (en) * | 2018-01-26 | 2019-08-02 | 张东晖 | The manufacturing method of thin metal vapor deposition mask |
| CN109680306A (en) * | 2019-02-20 | 2019-04-26 | 合肥永淇智材科技有限公司 | FMM electroforming motherboard production method based on mechanical punching |
| CN111398001A (en) * | 2020-04-01 | 2020-07-10 | 中国船舶重工集团公司第七二五研究所 | Method for preparing corrosion pit on metal material sample |
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