CN111910220A

CN111910220A - Preparation method of metallic three-dimensional microstructure

Info

Publication number: CN111910220A
Application number: CN202010794373.6A
Authority: CN
Inventors: 钱双庆; 赵勇飞; 季峰; 吕慧琳; 刘岩; 韩蕾; 张华�
Original assignee: Nantong University
Current assignee: Nantong University
Priority date: 2020-08-10
Filing date: 2020-08-10
Publication date: 2020-11-10

Abstract

The invention provides a preparation method of a metallic three-dimensional microstructure, which comprises the following steps: s10, preparing a core mold with a microstructure; s20 performing a conductive treatment on the mandrel to form a first conductive layer, removing the first conductive layer on the top of the mandrel, and forming an electroformed cathode with the remaining first conductive layer and the mandrel; s30 electroforming a first electroformed layer on the electroformed cathode; s40, conducting treatment is carried out on the top of the first electroforming layer to obtain a second conducting layer, and electroforming is carried out on the second conducting layer to obtain a second electroforming layer; and S50 removing the mandrel to obtain the metallic three-dimensional microstructure. According to the preparation method of the metal three-dimensional microstructure, the metal three-dimensional microstructure is obtained by electroforming on the surface of the core mould by using a layered electroforming method, and the core mould is obtained by using a 3D printing technology.

Description

Preparation method of metallic three-dimensional microstructure

Technical Field

The invention relates to the technical field of electrochemical manufacturing, in particular to a preparation method of a metallic three-dimensional microstructure.

Background

Nowadays, the world economy has been shifted from industrialization to informatization, high and new technologies are developing towards miniaturization, integration and intellectualization, and the miniaturization manufacture becomes an inseparable part in the industrial manufacture field, and the essence of the miniaturization manufacture is around miniaturization. Microstructures play an important role in enabling objects to perform specific physical, chemical, etc. functions. Therefore, the metal microstructure is widely applied to the fields of aerospace, electronic instruments, communication equipment, biomedicine, optical equipment and the like. The characteristic dimension and the dimensional precision of the microstructure have a decisive influence on the performance of the part, and along with the increasing miniaturization of the dimension of the part, the processing requirement on the surface of the material is also higher and higher, and the preparation process of the microstructure becomes one of the leading edges and hot spots of the current scientific and technical research.

Surface microstructures are of a wide variety and can be classified according to dimension, scale size and implementation function. The structure can be divided into a one-dimensional linear structure, a two-dimensional surface structure and a three-dimensional structure according to dimensions; they can be classified into nano-microstructures, sub-micro structures and macro-microstructures according to the size of the microstructures. The microstructures with different shapes can realize different performances, such as signal transmission, resistance and friction reduction, heat energy exchange and the like. The corrugated microstructure in the feed source horn can realize transmission and reception of terahertz wave signals. The engine piston/cylinder liner surface is processed with the tiny pit array, so that the abrasion of the engine can be effectively reduced. The groove structure in the heat pipe can realize heat exchange.

Because the surface microstructure size is smaller, certain precision and forming quality are required to be met during processing, and strict requirements are also required on processing environment. The processing method of the surface microstructure mainly comprises a mechanical processing technology and a special processing technology. The mechanical processing technology mainly comprises spinning forming, micro plastic forming, micro cutting processing and the like. The special processing technology comprises electric spark processing, laser processing, electrolytic processing, electroforming process and the like. The spinning forming has large tool loss in the processing process; the micro-plastic forming process needs larger forming force, the die is greatly abraded, a workpiece can have larger residual stress, and a metal plate is easy to deform; the micro-cutting process has a low processing speed, cannot process materials with hardness higher than that of a cutter, and has large residual stress of a workpiece. The electric spark machining is to use high temperature to erode materials, which may cause the deformation of a workpiece and has the problems of low machining speed, electrode loss and the like; in the laser processing process, the quality of the processed surface is greatly restricted by oxidation phenomena and slag and molten substances which easily cover the processed surface; the localization of electrolytic machining is not high, and electrolytic products are difficult to be discharged from the machined area.

The traditional processing method for preparing the metal three-dimensional microstructure has the problems of low workpiece precision, poor uniformity, large residual stress and low depth-to-width ratio of the microstructure,

disclosure of Invention

In order to solve the problems, the invention provides a preparation method of a metallic three-dimensional microstructure, which comprises the steps of electroforming on the surface of a core mould by using a layered electroforming method to obtain the metallic three-dimensional microstructure, wherein the core mould is obtained by using a 3D printing technology.

In order to achieve the above purpose, the invention adopts a technical scheme that:

a preparation method of a metallic three-dimensional microstructure comprises the following steps: s10, preparing a core mold with a microstructure; s20 performing a conductive treatment on the mandrel to form a first conductive layer, removing the first conductive layer on the top of the mandrel, and forming an electroformed cathode with the remaining first conductive layer and the mandrel; s30 electroforming a first electroformed layer on the electroformed cathode; s40, conducting treatment is carried out on the top of the first electroforming layer to obtain a second conducting layer, and electroforming is carried out on the second conducting layer to obtain a second electroforming layer; and S50 removing the mandrel to obtain the metallic three-dimensional microstructure.

Further, the non-metal substrate with the microstructure is obtained by printing through a 3D printing technology.

Further, the core mold is made of a non-metal material.

Further, the first electroformed layer is in the same plane as the top of the electroformed cathode.

Compared with the prior art, the technical scheme of the invention has the following advantages:

(1) according to the preparation method of the metal three-dimensional microstructure, the metal three-dimensional microstructure is obtained by electroforming on the surface of the core mould by using a layered electroforming method, and the core mould is obtained by using a 3D printing technology;

(2) according to the preparation method of the metal three-dimensional microstructure, the electroforming layer is formed by stacking metal ions, so that the electroforming layer can be used for precisely copying the surface structure of the cathode and can theoretically achieve the ion-level processing precision, and the formed part can be used for precisely copying the shape of the cathode and the surface microstructure thereof and can be used for manufacturing special-shaped and complex precise parts;

(3) according to the preparation method of the metallic three-dimensional microstructure, impurity ions and pollution sources are not introduced in the preparation process, so that the environmental protection performance of the preparation process is improved.

Drawings

The technical solution and the advantages of the present invention will be apparent from the following detailed description of the embodiments of the present invention with reference to the accompanying drawings.

FIG. 1 is a flow chart of a method for fabricating a three-dimensional metallic microstructure according to an embodiment of the present invention;

FIGS. 2 to 8 are diagrams illustrating a process of manufacturing the metallic three-dimensional microstructure according to an embodiment of the present invention;

FIG. 9 is a pictorial view of a non-metallic substrate embodying the present invention;

FIG. 10 is an enlarged view of a non-metallic substrate object groove according to an embodiment of the present invention;

FIG. 11 is a diagram of a three-dimensional microstructure of a metal obtained by the method according to an embodiment of the present invention;

FIG. 12 is a cross-sectional view of a micro-groove of a three-dimensional microstructure of a metal according to an embodiment of the present invention;

FIG. 13 is a three-dimensional topography of a three-dimensional microstructure of a metallic material according to an embodiment of the invention.

Reference numbers in the figures:

1 mandrel, 2 first conductive layers, 3 electroforming cathodes, 4 first electroforming layers, 5 second conductive layers, 6 second electroforming layers and 7 metallic three-dimensional microstructures.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The embodiment provides a method for preparing a metallic three-dimensional microstructure, as shown in fig. 1, comprising the following steps: s10 preparing mandrel 1 having a microstructure. S20 is a step of forming a first conductive layer 2 by subjecting the mandrel 1 to a conductive treatment, removing the first conductive layer 2 on the top of the mandrel 1, and forming an electroformed cathode 3 by the remaining first conductive layer 2 and the mandrel 1. S30 electroforming on the electroformed cathode 3 to obtain a first electroformed layer 4. S40, performing a conductive treatment on the top of the first electroformed layer 4 to obtain a second conductive layer 5, and continuing electroforming on the second conductive layer 5 to obtain a second electroformed layer 6. And S50 removing the mandrel 1 to obtain a metallic three-dimensional microstructure.

Electroforming is a special processing method that metal ions are reduced and deposited on a cathode core mould by an electrodeposition method, and then the metal deposition layer is separated from the cathode core mould to obtain a part. Because the electroforming layer is formed by stacking metal ions, the electroforming layer can precisely copy the surface structure of the cathode and theoretically can achieve the ion-level processing precision. The formed part can accurately copy the shape of the cathode and the surface microstructure thereof, and can be used for manufacturing special-shaped and complex precision parts.

The non-metal substrate with the microstructure of S10 is obtained by printing through a 3D printing technology. The core mould 1 is made of non-metal materials. S20 the first electroformed layer 4 is in the same plane as the top of the electroformed cathode 3.

The preparation method of the present invention will be described by taking as an example the preparation of the metallic three-dimensional microstructure 7 shown in FIG. 2:

as shown in fig. 3, S10 prints to prepare the mandrel 1 having a microstructure by a 3D printing technique.

As shown in fig. 4, the mandrel 1 is subjected to a conductive treatment at S20 to form a first conductive layer 2, and as shown in fig. 5, the first conductive layer 2 on the top of the mandrel 1 is removed, and the remaining first conductive layer 2 and the mandrel 1 form an electroformed cathode 3.

As shown in FIG. 6, electroforming is performed on the electroformed cathode 3 as shown in FIG. S30 to obtain a first electroformed layer 4.

As shown in fig. 7, S40 obtains a second conductive layer 5 after conducting the conductive treatment on the top of the first electroformed layer 4, and as shown in fig. 8, the electroforming is continued on the second conductive layer 5 to obtain a second electroformed layer 6.

S50 removing the mandrel 1 to obtain the metallic three-dimensional microstructure 7.

As shown in FIGS. 9 to 13, the metallic three-dimensional microstructure 7 obtained by the method of the present invention has a depth of 547 μm and a width of 355 μm, and a depth of 600 μm and a width of 300 μm. The microstructure prepared by the preparation process has high replication precision, the cast layer prepared by adopting a layered electroforming mode has high uniformity, the phenomenon of uneven thickness is avoided, and the occurrence of cast layer cavities is avoided, so that the quality and the performance of the microstructure are improved.

The above description is only an exemplary embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent structures or equivalent processes that are transformed by the content of the present specification and the attached drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. A preparation method of a metallic three-dimensional microstructure is characterized by comprising the following steps:

s10, preparing a core mold with a microstructure;

s20 performing a conductive treatment on the mandrel to form a first conductive layer, removing the first conductive layer on the top of the mandrel, and forming an electroformed cathode with the remaining first conductive layer and the mandrel;

s30 electroforming a first electroformed layer on the electroformed cathode;

s40, conducting treatment is carried out on the top of the first electroforming layer to obtain a second conducting layer, and electroforming is carried out on the second conducting layer to obtain a second electroforming layer; and

s50, removing the mandrel to obtain the metallic three-dimensional microstructure.

2. The method of claim 1, wherein the non-metallic substrate with a microstructure is obtained by printing with 3D printing technology.

3. The method of claim 1, wherein the mandrel is made of a non-metallic material.

4. The method of claim 1, wherein the first electroformed layer is in the same plane as a top portion of the electroformed cathode.