CN111910220A - Preparation method of metallic three-dimensional microstructure - Google Patents

Abstract

The invention provides a preparation method of a metallic three-dimensional microstructure, which comprises the following steps: s10, preparing a core mold with a microstructure; s20 performing a conductive treatment on the mandrel to form a first conductive layer, removing the first conductive layer on the top of the mandrel, and forming an electroformed cathode with the remaining first conductive layer and the mandrel; s30 electroforming a first electroformed layer on the electroformed cathode; s40, conducting treatment is carried out on the top of the first electroforming layer to obtain a second conducting layer, and electroforming is carried out on the second conducting layer to obtain a second electroforming layer; and S50 removing the mandrel to obtain the metallic three-dimensional microstructure. According to the preparation method of the metal three-dimensional microstructure, the metal three-dimensional microstructure is obtained by electroforming on the surface of the core mould by using a layered electroforming method, and the core mould is obtained by using a 3D printing technology.

Description

A kind of preparation method of metallic three-dimensional microstructure

technical field

The invention relates to the technical field of electrochemical manufacturing, in particular to a preparation method of a metallic three-dimensional microstructure.

Background technique

Today, the world economy has shifted from industrialization to informatization. High-tech is developing towards miniaturization, integration, and intelligence. In the field of industrial manufacturing, miniaturization has become an inseparable part of its essence. "Miniaturization". Microstructure plays an important role in it, enabling objects to achieve specific physical, chemical and other functions. Therefore, metal microstructures are widely used in aerospace, electronic instruments, communication equipment, biomedicine, optical equipment and other fields. The characteristic size and dimensional accuracy of the microstructure have a decisive impact on the performance of the part. As the size of the part becomes more and more miniaturized, the processing requirements for the surface of the material are also getting higher and higher, and its preparation process has become the focus of current scientific and technological research. One of the front and hot spots.

There are a wide variety of surface microstructures, which can be classified according to dimensionality, scale size, and implementation function. According to the dimension, it can be divided into one-dimensional linear structure, two-dimensional surface structure and three-dimensional structure; according to the scale of microstructure, it can be divided into nano-micro structure, sub-micro structure and macro-micro structure. Microstructures with different morphologies can achieve different performances, such as signal transmission, drag reduction and friction reduction, and heat energy exchange. The corrugated microstructure in the feed horn can transmit and receive terahertz wave signals. The surface of the engine piston/cylinder liner is processed with an array of tiny pits, which can effectively reduce the wear of the engine. The groove structure in the heat pipe can realize the heat exchange.

Due to the small size of the surface microstructure, not only a certain precision and forming quality must be met during processing, but also strict requirements on the processing environment. The processing methods of surface microstructure are mainly divided into mechanical processing technology and special processing technology. Machining technology is mainly composed of spinning forming, microplastic forming, micro-cutting and so on. Special machining technologies include EDM, laser machining, electrolytic machining, electroforming, etc. Spinning has a large tool loss during processing; the microplastic forming process requires a large forming force, the mold wear is large, the workpiece will have a large residual stress, and the metal sheet is prone to deformation; the micro-cutting process has a slow processing speed and cannot be processed. The hardness of the material is higher than that of the tool, and the residual stress of the workpiece is large. EDM uses high temperature to remove materials, which may cause deformation of the workpiece, and there are problems such as slow processing speed and electrode loss; during laser processing, oxidation and slag and molten substances that easily cover the machined surface greatly restrict The quality of the machined surface is improved; the localization of electrolytic machining is not high, and the electrolytic products are difficult to discharge from the machining area.

Using traditional processing methods to prepare metal three-dimensional microstructures has the problems of low workpiece precision, poor uniformity, large residual stress and low aspect ratio of microstructures.

SUMMARY OF THE INVENTION

In order to solve the above problems, the present invention provides a method for preparing a metallic three-dimensional microstructure. The metal three-dimensional microstructure is obtained by electroforming on the surface of a core mold by using a layered electroforming method, and the core mold is obtained by 3D printing technology. Compared with the traditional preparation method, the preparation precision is high and the uniformity of the electroformed layer is good, and it can be used to prepare a metallic three-dimensional microstructure with a large aspect ratio.

In order to realize the above purpose, a kind of technical scheme that the present invention adopts is:

A method for preparing a metallic three-dimensional microstructure, comprising the steps of: S10 preparing a core mold with a microstructure; S20 conducting conductive treatment on the core mold to form a first conductive layer, and placing the core mold on the top of the core mold The first conductive layer is removed, and the remaining first conductive layer and the core mold form an electroforming cathode; S30, perform electroforming on the electroforming cathode to obtain a first electroforming layer; S40, perform electroforming on the first electroforming cathode. The top of the cast layer is subjected to conductive treatment to obtain a second conductive layer, and electroforming is continued on the second conductive layer to obtain a second electroformed layer; and S50, the core mold is removed to obtain a metallic three-dimensional microstructure.

Further, the non-metallic substrate with microstructure is obtained by printing with 3D printing technology.

Further, the core mold is made of non-metallic material.

Further, the first electroformed layer and the top of the electroformed cathode are in the same plane.

The above-mentioned technical scheme of the present invention has the following advantages compared with the prior art:

(1) In a method for preparing a metallic three-dimensional microstructure of the present invention, a metal three-dimensional microstructure is obtained by electroforming on the surface of a core mold by using a layered electroforming method. Compared with the method, the preparation precision is high and the electroformed layer uniformity is good, and it can be used to prepare a metallic three-dimensional microstructure with a large aspect ratio;

(2) In a method for preparing a metallic three-dimensional microstructure of the present invention, since the electroformed layer is formed by the accumulation of metal ions, it can precisely replicate the surface structure of the cathode, and theoretically achieve ion-level machining accuracy. The parts can accurately replicate the cathode shape and its surface microstructure, and can be used to make special-shaped and complex precision parts;

(3) The preparation method of a metallic three-dimensional microstructure of the present invention does not introduce impurity ions and pollution sources in the preparation process, thereby improving the environmental protection performance of the preparation process.

Description of drawings

The technical solutions of the present invention and its beneficial effects will be apparent through the detailed description of the specific embodiments of the present invention below in conjunction with the accompanying drawings.

1 is a flow chart of a method for preparing a metallic three-dimensional microstructure according to an embodiment of the present invention;

2 to 8 are diagrams illustrating the preparation process of the metallic three-dimensional microstructure according to an embodiment of the present invention;

FIG. 9 shows a physical diagram of a non-metallic substrate according to an embodiment of the present invention;

FIG. 10 is an enlarged view of a real trench of a non-metallic substrate according to an embodiment of the present invention;

FIG. 11 shows a physical diagram of obtaining a metallic three-dimensional microstructure by this method according to an embodiment of the present invention;

12 is a cross-sectional view of a microgroove measured by a scanning electron microscope of a metallic three-dimensional microstructure according to an embodiment of the present invention;

FIG. 13 is a three-dimensional topography diagram of a metallic three-dimensional microstructure according to an embodiment of the present invention.

Reference numbers in the figure:

1 core mold, 2 first conductive layer, 3 electroformed cathode, 4 first electroformed layer, 5 second conductive layer, 6 second electroformed layer, 7 metallic three-dimensional microstructure.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of the present invention.

This embodiment provides a method for preparing a metallic three-dimensional microstructure, as shown in FIG. 1 , including the following steps: S10 , preparing a core mold 1 having a microstructure. S20 Conducting conductive treatment on the core mold 1 to form a first conductive layer 2, removing the first conductive layer 2 on the top of the core mold 1, and the remaining first conductive layer 2 and the core mold 1 An electroformed cathode 3 is formed. S30 Perform electroforming on the electroforming cathode 3 to obtain a first electroforming layer 4 . S40 , a second conductive layer 5 is obtained after conducting conductive treatment on the top of the first electroformed layer 4 , and a second electroformed layer 6 is obtained by continuing electroforming on the second conductive layer 5 . and S50 to remove the core mold 1 to obtain a metallic three-dimensional microstructure.

Electroforming is a special processing method that uses electrodeposition to reduce and deposit metal ions on the cathode core mold, and then separate the metal deposition layer from the cathode core mold to obtain parts. Since the electroformed layer is formed by the accumulation of metal ions, it can precisely replicate the surface structure of the cathode, and theoretically it can achieve ion-level machining accuracy. The formed parts can accurately replicate the cathode shape and its surface microstructure, and can be used to make special-shaped and complex precision parts.

The non-metallic substrate with microstructure described in S10 is obtained by printing with 3D printing technology. The core mold 1 is made of non-metallic material. In S20, the first electroformed layer 4 and the top of the electroformed cathode 3 are in the same plane.

Taking the preparation of the metallic three-dimensional microstructure 7 as shown in FIG. 2 as an example, the preparation method of the present invention will be described:

As shown in Figure 3, S10 prints a core mold 1 with a microstructure by 3D printing technology.

As shown in FIG. 4 , S20 conducts conductive treatment on the core mold 1 to form a first conductive layer 2 . As shown in FIG. 5 , the first conductive layer 2 on the top of the core mold 1 is removed, and the remaining The first conductive layer 2 and the core mold 1 form an electroforming cathode 3 .

As shown in FIG. 6 , electroforming is performed on the electroforming cathode 3 as shown in FIG. S30 to obtain the first electroforming layer 4 .

As shown in FIG. 7 , in S40 , a second conductive layer 5 is obtained after conducting conductive treatment on the top of the first electroforming layer 4 . As shown in FIG. 8 , electroforming is continued on the second conductive layer 5 to obtain a second conductive layer 5 . Electroformed layer 6.

S50 , the core mold 1 is removed to obtain a metallic three-dimensional microstructure 7 .

As shown in FIGS. 9 to 13 , a metallic three-dimensional microstructure 7 is obtained by using the method for preparing a metallic three-dimensional microstructure of the present invention. The depth of the microgrooves is 547 μm and the width is 355 μm, while the microgrooves on the front cathode template are replicated. The depth is 600 μm and the width is 300 μm. The microstructure prepared by this preparation process has high replication accuracy, and the cast layer prepared by layered electroforming has better uniformity, and there is no phenomenon of uneven thickness, which avoids the appearance of voids in the cast layer, thereby improving the microstructure. quality and performance.

The above descriptions are only exemplary embodiments of the present invention, and are not intended to limit the scope of patent protection of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present invention, or directly or indirectly applied to other related The technical field of the present invention is similarly included in the scope of patent protection of the present invention.

Claims (4)

1. a preparation method of metallic three-dimensional microstructure, is characterized in that, comprises the steps: S10 prepares a mandrel with a microstructure; S20 Conducting conductive treatment on the core mold to form a first conductive layer, removing the first conductive layer on the top of the core mold, and forming an electroforming cathode with the remaining first conductive layer and the core mold ; S30, performing electroforming on the electroforming cathode to obtain a first electroforming layer; S40 after conducting conductive treatment on the top of the first electroforming layer to obtain a second conductive layer, and continuing electroforming on the second conductive layer to obtain a second electroforming layer; and S50 removes the core mold to obtain a metallic three-dimensional microstructure. 2 . The method for preparing a metallic three-dimensional microstructure according to claim 1 , wherein the non-metallic substrate with the microstructure is obtained by printing with a 3D printing technology. 3 . 3 . The method for preparing a metallic three-dimensional microstructure according to claim 1 , wherein the core mold is made of a non-metallic material. 4 . 4 . The method for preparing a metallic three-dimensional microstructure according to claim 1 , wherein the first electroformed layer and the top of the electroformed cathode are in the same plane. 5 .

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