CN105108251B - A kind of combined machining method of micro-mould - Google Patents
A kind of combined machining method of micro-mould Download PDFInfo
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- CN105108251B CN105108251B CN201510526489.0A CN201510526489A CN105108251B CN 105108251 B CN105108251 B CN 105108251B CN 201510526489 A CN201510526489 A CN 201510526489A CN 105108251 B CN105108251 B CN 105108251B
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Abstract
The present invention relates to a kind of combined machining method of micro-mould, this method using machine cut processing mode, removes excess stock, defines graphics field profile, realize the finished surface of high quality for the outer peripheral areas of micro-mould figure；For micro-mould graphics field, the tungsten tool-electrode prepared using plasma etching technology, using micro EDM mode, the accurate transfer of figure is realized, ensures machining accuracy and efficiency.The present invention combines the technical advantage of precision optical machinery processing and micro EDM, micro-mould graphics peripheral excess stock is removed using machine cut processing mode, the machining area of follow-up fine electric spark can be reduced, gathering for excessive galvanic corrosion product is avoided, improves the stability of discharge process, ensures the dimensional accuracy and surface quality of micro EDM, machining area reduces simultaneously, the micro EDM time can be shortened, processing efficiency is improved, meet quick market respond.
Description
Technical field
The invention belongs to Micrometer-Nanometer Processing Technology field, and in particular to a kind of combined machining method of micro-mould.
Background technology
With the development of modern science and technology, microminaturization has turned into the main trend of production development.At present, semiconductor work
The fields such as industry, fiber optic communication, Aero-Space, bioengineering and medical industry are increasing for the demand of microminiature product,
Complexity and reliability requirement for its 26S Proteasome Structure and Function also more and more higher.Therefore, made by Micrometer-Nanometer Processing Technology micro-
Mould, then minor items are prepared by micro-mould shaping, there is the advantages that batch production, economic and reliable, be prepare on a large scale it is small
The important development direction of type product.
Wherein, micro-mould is the core of technology, and its surface roughness and machining accuracy directly determine the quality of forming part,
And the production cost and service life of micro-mould are also to influence its key factor produced in enormous quantities.The preparation side of micro-mould at present
Method has following several：
1. plasma etching, using MEMS technology, the preparation of micro-nano structure is realized by photoetching and plasma etching,
With advantages such as high accuracy, mass.Silicon substrate can be divided into according to the difference of base material and be prepared by non-silicon-based micro-mould, for silicon
For base micro-mould, silicon is a kind of hard brittle material, easily fatigue damage occurs and causes breakage, and this can have a strong impact on that silicon substrate is micro-
The mold use life-span；And non-silicon-based micro-mould is using tungsten as representative, its hardness is high, and intensity is big, is suitable as micro-mould material
Material, but in tungsten etching process, sidewall profile is influenceed very big by etching parameters, and when etching deeper, bottom surface is coarse
Degree is difficult to ensure that these all govern application of the plasma etching technology in micro-mould preparation.
2. LIGA-like technology, because synchronous X ray is very expensive used in LIGA techniques, LIGA-like technology uses laser
Or ultraviolet exposure, micro-mould is obtained by electroforming after development, its advantage is can to prepare the complicated shape of high-aspect-ratio.But
It is to be limited by electroforming material, micro-mould material prepared by this method is based on copper and mickel, simultaneously because electroforming process itself
Limitation and electric field non-uniform Distribution, the structure that electroforming obtains is more loose compared to hot worked metallic body materials and difficult
The defects of to avoid cavity.
3. precision optical machinery is processed, the finished surface that can obtain high quality is processed in machine cut, and its roughness can reach
Several nanometers, but compared with plasma etching and LIGA-like technology based on photoetching process, precision machined feature
Size is limited, and the price of processing micron level characteristic size lathe is extremely expensive, while processing efficiency is very low.In addition, by knife
The limitation of tool, there can be R angles in the bending place of graphics processing, sharp transition (shown in accompanying drawing 8), its least radius can not be formed
It can only achieve four or five ten microns, it is impossible to meet the requirement of microfabrication.
4. Micro-EDM Machining Technology, using the pulse feature spark discharge between tool-electrode and workpiece come ablation material
Material, realize complementary transfer of the figure from electrode to workpiece, suitable for various high rigidity, the difficult processing of high-wearing feature and corrosion resistance
Material (such as mould steel, hard alloy etc.).Wherein, the preparation of micro tool electrode is crucial, it was reported that etches electrode based on tungsten
Micro-EDM Machining Technology can prepare the micro-mould of complicated shape, meanwhile, this method can solve precision optical machinery and add
The characteristic size limitation occurred in work and R angles problem, micron order is reduced to by R angular radius, but due to micro EDM table
Face is made up of countless galvanic corrosion small ruts, and its surface roughness minimum can only achieve hundred nano-scale, for subsequently using the mould
The product of shaping, for micro-fluidic chip, higher surface roughness will have a strong impact on the bonding sealing-in and detection of product.
The content of the invention
For any of the above problem, the present invention proposes a kind of combined machining method of micro-mould, and this method can prepare tool
There is the micro-mould of high-quality surface.
The technical solution adopted by the present invention is as follows：
A kind of combined machining method of micro-mould, its step include：
1) for the outer peripheral areas of micro-mould figure, using machine cut processing mode, excess stock is removed, and define figure
Shape region contour, realize the finished surface of high quality；
2) for micro-mould graphics field, using tungsten tool-electrode, using micro EDM mode, figure is realized
Accurate transfer, ensures machining accuracy and efficiency.
Further, step 1) quickly removes the excess stock of micro-mould graphics peripheral first with mechanical Milling Process,
Then mechanical grinding processing is carried out to improve surface quality.
Further, step 1) carry out machine cut processing while, using plasma etching technology prepare with it is micro-
The complementary tungsten micro-electrode of mold graph, by machine cut processing and tungsten micro-electrode preparation technology while carry out micro- to shorten
The manufacturing cycle of mould.
Further, step 2) using plasma lithographic technique prepares the tungsten tool-electrode, and its step is as follows：
A) hard mask is sputtered in tungsten substrate surface；
B) photoresist is coated on hard mask, and photoresist is exposed and developed, completes the graphical of photoresist；
C) using photoresist as mask, dry etching is carried out to hard mask, realizes the transfer of mask pattern；
D) photoresist on hard mask is removed, using plasma deep etching method (DRIE) carries out the deep of tungsten electrode
Erosion；
E) hard mask is removed, obtains tungsten micro-electrode.
Further, step 2) improves fine electricity fire using the mode of grinding after micro EDM is carried out
The surface quality of flower machining area.
Compared with prior art, beneficial effects of the present invention are as follows：
1. the technology combination precision optical machinery is processed and the technical advantage of micro EDM, adding for high quality can be obtained
Work surface, micron-sized complex micro structure can be prepared again, and reduce R angular radius (as shown in Figure 8), so as to realize high quality
The preparation of micro-mould.
2. the combined machining method can any high rigidity of parallel fabrication, the conductive material of high-wearing feature, such as mould steel, hard
Alloy etc., these materials can greatly improve the service life of micro-mould, reduce the cost of mass production.
3. due to the own characteristic of micro EDM, positive rake is presented in its micro-mould structure prepared, so as to be formed
Good draft angle, be advantageous to the knockout course in subsequent forming processing (as being molded, impressing etc.).
4. mechanical processing process and MEMS technology prepare tungsten electrode and separated, intersect caused by avoiding two kinds of techniques incompatible dirty
Dye, influences micro-mould crudy.In addition, two kinds of techniques are carried out simultaneously, the manufacturing cycle of micro-mould can be shortened, improve production effect
Rate.
5. removing micro-mould graphics peripheral excess stock using machine cut processing mode, follow-up fine electricity fire can be reduced
Colored machining area, gathering for excessive galvanic corrosion product is avoided, improve the stability of discharge process, ensure micro EDM
Dimensional accuracy and surface quality, while machining area reduces, and can shorten the micro EDM time, improves processing efficiency,
Meet quick market respond.
Brief description of the drawings
The mould steel workpiece schematic diagram of Fig. 1 surfaces polishing；
Micro-mould schematic diagram after Fig. 2 machinery Milling Process；
Micro-mould schematic diagram after the processing of Fig. 3 mechanical grindings；
Fig. 4 tungsten fine electric spark tool-electrode schematic diagrames；
Fig. 5 instruments and the alignment schematic diagram in piece pole microchannel region；
Fig. 6 micro EDM process schematics；
Fig. 7 Micro-fluidic chip die schematic diagrames；
The schematic top plan view at Fig. 8 precision optical machineries processing R angles.
Explanation：The size marked in figure is only to illustrate, and because each size has big difference, is not drawn to scale.
Embodiment
In order to facilitate the understanding of the purposes, features and advantages of the present invention, below by specific embodiment and
Accompanying drawing, the present invention will be further described.
By taking Micro-fluidic chip die as an example, it by microchannel is basic network that micro-fluidic chip, which is, connection Micropump, micro- liquid storage
Pond, microelectrode, micro- detecting element etc. have the component of light, electrically and fluidically conveying function, to greatest extent sampling, dilution,
The functions such as reaction, separation and detection are integrated on a microchip, have print consumption small, biological respinse is rapidly and efficiently etc. excellent
Gesture, it is widely used in the fields such as biomedical research, clinical diagnosis, judicial diagnosis.For micro-fluidic chip, microchannel
Width and depth are micron order, and chip is typically sized to Centimeter Level, and the present invention realized using following combined machining method
The preparation of high quality Micro-fluidic chip die, wherein, micro-fluidic chip is designed as (see Fig. 6, Fig. 7, because each size differed
Greatly, it is not drawn to scale)：Appearance and size is long 10cm, and wide 3cm, microchannel depth is 40 μm, and width is 20 μm.
1. workpiece material selects the mould steel (as shown in Figure 1) of surface polishing, first according to the border in microchannel region, profit
Peripheral excess stock is quickly removed with mechanical Milling Process, defines microchannel region contour, as shown in Figure 2.Specifically, utilize
CNC milling machine, according to the requirement of machining accuracy and surface roughness, the speed of mainshaft, feed speed and back engagement of the cutting edge are determined, processed
Surplus should be less than 0.5mm, here by taking 0.3mm as an example.
2. because the surface quality of mechanical Milling Process is not high, mechanical grinding processing is then carried out, according to micro-fluidic chip
The requirement of surface roughness, determines abrasive type, abrasive particle size and grinding speed, and then obtains low roughness, high quality
Finished surface, as shown in figure 3, the depth after grinding should be consistent with the depth of microchannel.
3. while mechanical milling and grinding, prepared and microchannel pattern complementary using plasma etching technology
Tungsten micro-electrode, as shown in figure 4, appearance and size is consistent with mould steel workpiece.
After 4., tungsten micro-electrode is fixed on the main shaft of Micro-EDM Machine, horizontal alignment, then adjusts main shaft
X and Y-direction displacement so that tungsten tool-electrode and the alignment of mould steel edge of work profile, and then realize pair in microchannel region
Standard, as shown in Figure 5.Then, according to the surface roughness and depth requirements of Micro-fluidic chip die, appropriate processing is selected to join
Number, micro EDM is carried out, as shown in fig. 6, finally obtaining Micro-fluidic chip die, as shown in Figure 7.Due to microchannel area
The ratio that domain accounts for the micro-fluidic chip gross area is very small, thus the surface roughness of this part micro EDM do not influence it is micro-
The integral surface quality of fluidic chip mould.In addition it is also possible to improve micro EDM region using the mode of grinding
Surface quality.
The above method combines the technical advantage of precision optical machinery processing and micro EDM, can obtain high quality
Finished surface, micron-sized complex micro structure can be prepared again, and reduce R angular radius, as shown in Figure 8.
As described in previous step 3, the present invention is using tungsten as fine electrospark electrode.The fusing point of tungsten up to 3422 DEG C,
It is fusing point highest metal, its elevated temperature strength is also highest in common metal.In addition, in common electrode material, metal
The wear resistant coefficient of tungsten is also highest.Therefore, in micro EDM, loss and deformation all very littles of tungsten electrode, it is
Preferable Tool-electrode material.In the present invention, tungsten electrode can utilize DRIE techniques to prepare, and its method is：
1) hard mask is sputtered in tungsten substrate surface, hard mask can use the hard of the materials such as Al, AlN, Cr, Ni, Cu, Ti to cover
Film；
2) photoresist is coated on hard mask, and photoresist is exposed and developed, completes the graphical of photoresist；
3) using photoresist as mask, dry etching is carried out to hard mask, realizes the transfer of mask pattern；
4) photoresist on hard mask, using plasma deep etching method (DRIE, Deep Reactive Ion are removed
Etching, also referred to as " deep reaction ion etching ") carry out tungsten electrode deep etching；
5) hard mask is removed, obtains tungsten micro-electrode.
The above embodiments are merely illustrative of the technical solutions of the present invention rather than is limited, the ordinary skill of this area
Technical scheme can be modified by personnel or equivalent substitution, without departing from the spirit and scope of the present invention, this
The protection domain of invention should be to be defined described in claims.
Claims (7)
1. a kind of combined machining method of the micro-mould with great surface quality, it is characterised in that comprise the following steps：
1) for the outer peripheral areas of micro-mould figure, excess stock is removed using machine cut processing mode, it is follow-up micro- to reduce
The machining area of thin electrical discharge machining, and define the graphics field profile of micro-mould；It is described to be gone using machine cut processing mode
Except excess stock, the excess stock of micro-mould graphics peripheral is quickly removed first with mechanical Milling Process, then carries out machinery
Grinding is to improve surface quality；
2) for micro-mould graphics field, micro EDM is carried out using tungsten tool-electrode, realizes the essence of micro-mould figure
Really transfer.
2. the combined machining method of the micro-mould with great surface quality as claimed in claim 1, it is characterised in that in step
1) while carrying out machine cut processing, the fine electricity of tungsten with micro-mould pattern complementary is prepared using plasma etching technology
Pole, carried out simultaneously to shorten the manufacturing cycle of micro-mould by machine cut processing and tungsten micro-electrode preparation technology.
3. the combined machining method of the micro-mould with great surface quality as claimed in claim 1, it is characterised in that step 2)
Prepared by the tungsten tool-electrode using plasma lithographic technique, its step is as follows：
A) hard mask is sputtered in tungsten substrate surface；
B) photoresist is coated on hard mask, and photoresist is exposed and developed, completes the graphical of photoresist；
C) using photoresist as mask, dry etching is carried out to hard mask, realizes the transfer of mask pattern；
D) photoresist on hard mask is removed, using plasma lithographic method carries out the deep etching of tungsten electrode；
E) hard mask is removed, obtains tungsten micro-electrode.
4. the combined machining method of the micro-mould with great surface quality as claimed in claim 3, it is characterised in that step a)
The material of the hard mask is one kind in Al, AlN, Cr, Ni, Cu, Ti.
5. the combined machining method of the micro-mould with great surface quality as claimed in claim 1, it is characterised in that step 2)
After micro EDM is carried out, the surface quality in micro EDM region is improved using the mode of grinding.
6. the combined machining method of the micro-mould with great surface quality as claimed in claim 1, it is characterised in that described micro-
The material of mould is metal or alloy material, including mould steel or hard alloy.
7. according to any one of claim 1~6 prepared by the combined machining method of the micro-mould with great surface quality
Micro-mould.
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| CN109228053A (en) * | 2018-08-28 | 2019-01-18 | 清华大学天津高端装备研究院 | A kind of combined machining method of micro-fluidic chip injection mold mold core |
| CN109848649B (en) * | 2019-01-28 | 2021-01-08 | 昆山明佰精密模塑有限公司 | Finish machining method for plastic mold |
| CN110191399A (en) * | 2019-05-23 | 2019-08-30 | 深圳市伊声声学科技有限公司 | Waterproof ventilated membrane and its mold and manufacturing method and loudspeaker |
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| EP0909611B1 (en) * | 1997-10-14 | 2002-01-30 | Agathon A.G. Maschinenfabrik | Method for grinding the surfaces of workpieces and apparatus for carrying out the method |
| CN1114718C (en) * | 1999-07-16 | 2003-07-16 | 清华大学 | Method of electromolding tridimensional metal structure directly on silicon substrate and the special fixture thereof |
| CN102825349B (en) * | 2012-08-20 | 2015-02-11 | 四川科思精密模具有限公司 | Method for processing precise small dies with electric spark multipoint electrode |
| CN104475887B (en) * | 2014-11-18 | 2016-09-14 | 上海交通大学 | The EDM Grinding method of Low rigidity taper seat rod member |
| CN104803344A (en) * | 2015-03-05 | 2015-07-29 | 苏州含光微纳科技有限公司 | Parallel micro-EDM (electrical discharge machining) method based on metal tungsten electrode |
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Effective date of registration: 20230925 Address after: 100871, Peking University, 5 the Summer Palace Road, Beijing, Haidian District Patentee after: Peking University Address before: Room A7-504, Bionano Park, No. 218 Xinghu Street, Industrial Park, Suzhou City, Jiangsu Province, 215125 Patentee before: HICOMP MICROTECH(SUZHOU) CO.,LTD. |