CN109661126A - A kind of via hole whole plate Electrocoppering method of flexible circuit board - Google Patents
A kind of via hole whole plate Electrocoppering method of flexible circuit board Download PDFInfo
- Publication number
- CN109661126A CN109661126A CN201811540191.5A CN201811540191A CN109661126A CN 109661126 A CN109661126 A CN 109661126A CN 201811540191 A CN201811540191 A CN 201811540191A CN 109661126 A CN109661126 A CN 109661126A
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- Prior art keywords
- copper
- via hole
- layers
- coppering
- electro
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The present invention provides a kind of via hole whole plate Electrocoppering method of flexible circuit board, comprising the following steps: (1) radium-shine via hole；(2) organic matter is removed；(3) chemical scavenging；(4) whole plate electro-coppering.The present invention does not need hole metallization processing procedure, effectively reduces sewage discharge and reduces costs.
Description
Technical field
The present invention relates to a kind of via hole whole plate Electrocoppering methods of flexible circuit board.
Background technique
FPC is thin, the light-weight, wiring with thickness with a kind of flexible circuit board made of the flexible parent metals such as polyimides
Density height and it is bent the advantages that, meet the market demand that electronic product is light, thin, short, small.In recent years in smart phone etc.
Under growth driving, FPC remains every year to be increased at high speed, is promoted the development of national economy and is created more employment machines
Meeting.But a large amount of chemicals has been used during the entire manufacturing of FPC, the sewage of discharge causes pollution to environment, with
Reinforcement of the country to the sewage discharge intensity of review of FPC industry in recent years, many FPC enterprises are suspended business to bring up to standard, so, how
It reduces the sewage discharge of FPC industry and realizes that the sustainable development of FPC industry becomes related practitioner and must solve the problems, such as.
The double-deck FPC plate and multi-layer FPC plate currently on the market all uses hole metallization processing procedure and electro-coppering to thicken to realize
The conducting of upper and lower layer substrate metal copper.Hole metallization processing procedure is formed after laser drilling on the polyimide base material at hole wall
One layer of metalization layer that can be conductive, copper electroplating layer is deposited in metalization layer during subsequent electro-coppering, thus on realizing,
The conducting of lower substrate metal copper.Metallization process includes the side such as electroless copper, shadow, black wood charcoal and conductive polymer polymer at present
Method, but all of above metallization process method all employs a large amount of chemicals, and sewage discharge is larger to the pollution of environment.Plating
Copper wiring is divided into parcel plating copper (or graphic plating) and whole plate electro-coppering, and parcel plating copper refers in conducting hole site electro-coppering
Realize the conducting of upper and lower substrate metal layers of copper, other positions are capped；Whole plate electro-coppering refers to all plating upper one of entire plate face
Layer copper, including conducting hole site, realize the conducting of upper and lower substrate layers of copper after the plating of conducting hole site.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of via hole whole plate Electrocoppering methods of flexible circuit board, are not required to
Hole metallization processing procedure is wanted, sewage discharge is effectively reduced and is reduced costs.
In order to solve the above technical problems, the technical scheme is that
A kind of via hole whole plate Electrocoppering method of flexible circuit board, comprising the following steps:
(1) radium-shine via hole: upper layers of copper is set in the upper surface of polyimides middle layer, under polyimides middle layer
Substrate is made after lower layers of copper is arranged in surface, is successively formed from the upper surface of upper layers of copper, radium-shine to the lower layers of copper of polyimides middle layer
Upper via hole successively forms lower via hole from the lower surface of lower layers of copper, the radium-shine supreme layers of copper of polyimides middle layer；
(2) organic matter is removed: the organic matter of upper and lower via hole margin residual is removed；
(3) chemical scavenging: the oxide of the aperture of upper and lower via hole and hole bottom surface is removed；
(4) whole plate electro-coppering: the electro-coppering since the bottom hole of upper and lower via hole, and by the upper surface of upper layers of copper and lower copper
The lower surface electro-coppering of layer, until the conducting of upper and lower layers of copper.
Further, in the step (1), the thickness of upper layers of copper and lower layers of copper is 0.1-30 microns.
Further, in the step (1), upper and lower via hole is the blind hole without orifice ring.
Further, in the step (4), the liquid medicine that electro-coppering uses is filling perforation electro-coppering liquid medicine, copper post electro-coppering medicine
Water or pulse plating copper liquid medicine.
Further, in the step (4), the power supply that electro-coppering uses is DC power supply or reverse impulse power supply.
Compared with prior art, the invention has the following advantages:
The present invention direct whole plate electro-coppering after radium-shine via hole is supreme, lower layer's layers of copper is connected, and does not need hole metallization system
Journey effectively reduces sewage discharge and reduces costs, and is able to achieve the conducting of dual platen and the upper and lower layers of copper of multi-layer board.
Detailed description of the invention
The drawings described herein are used to provide a further understanding of the present invention, constitutes part of this application, not
Inappropriate limitation of the present invention is constituted, in the accompanying drawings:
Fig. 1 is the structural schematic diagram of substrate of the present invention；
Fig. 2 is the structural schematic diagram of step of the present invention (1)；
Fig. 3 is the structural schematic diagram of step of the present invention (4).
Specific embodiment
Below in conjunction with specific embodiment, the present invention will be described in detail, herein illustrative examples and explanation of the invention
For explaining the present invention, but it is not as a limitation of the invention.
Embodiment 1
It is as shown in Figure 1 to Figure 3 a kind of implementation of the via hole whole plate Electrocoppering method of flexible circuit board of the present invention
Example 1, comprising the following steps:
(1) radium-shine via hole: upper layers of copper 2 is set in the upper surface of polyimides middle layer 1, in polyimides middle layer 1
Lower surface lower layers of copper 3 is set after substrate is made, successively from upper layers of copper 2, radium-shine to the lower layers of copper 3 of polyimides middle layer 1 it is upper
Surface forms via hole 4, is successively formed down and is led from the lower surface of lower layers of copper 3, the radium-shine supreme layers of copper 2 of polyimides middle layer 1
Through-hole 5；
(2) organic matter is removed: the organic matter of upper via hole 4,5 margin residual of lower via hole is removed；
(3) chemical scavenging: the oxide of upper via hole 4, the aperture of lower via hole 5 and hole bottom surface is removed；
(4) whole plate electro-coppering: since upper via hole 4, lower via hole 5 bottom hole electro-coppering, and by the upper table of upper layers of copper 2
The lower surface electro-coppering in face and lower layers of copper 3, until upper layers of copper 2, lower layers of copper 3 are connected.
In step (1), the thickness of upper layers of copper 2 and lower layers of copper 3 is 0.5 micron；The liquid medicine that electro-coppering uses is filling perforation electricity
Copper facing liquid medicine, copper post electro-coppering liquid medicine or pulse plating copper liquid medicine, the power supply that electro-coppering uses are DC power supply or reverse impulse
Power supply.
Embodiment 2
Unlike the first embodiment: in step (1), the thickness of upper layers of copper 2 and lower layers of copper 3 is 1 micron.
Embodiment 3
Unlike the first embodiment: in step (1), the thickness of upper layers of copper 2 and lower layers of copper 3 is 2 microns.
Embodiment 4
Unlike the first embodiment: in step (1), the thickness of upper layers of copper 2 and lower layers of copper 3 is 3 microns.
Embodiment 5
Unlike the first embodiment: in step (1), the thickness of upper layers of copper 2 and lower layers of copper 3 is 0.1 micron.
Embodiment 6
Unlike the first embodiment: in step (1), the thickness of upper layers of copper 2 and lower layers of copper 3 is 30 microns.
The principle of the present invention and effect is only illustrated in above-described embodiment, and is not intended to limit the present invention.It is any ripe
The personage for knowing this technology all without departing from the spirit and scope of the present invention, carries out modifications and changes to above-described embodiment.Cause
This, institute is complete without departing from the spirit and technical ideas disclosed in the present invention by those of ordinary skill in the art such as
At all equivalent modifications or change, should be covered by the claims of the present invention.
Claims (5)
1. a kind of via hole whole plate Electrocoppering method of flexible circuit board, it is characterised in that: the following steps are included:
(1) radium-shine via hole: upper layers of copper is set in the upper surface of polyimides middle layer, in the lower surface of polyimides middle layer
Substrate is made after lower layers of copper is set, is successively formed and is led from the upper surface of upper layers of copper, radium-shine to the lower layers of copper of polyimides middle layer
Through-hole successively forms lower via hole from the lower surface of lower layers of copper, the radium-shine supreme layers of copper of polyimides middle layer；
(2) organic matter is removed: the organic matter of upper and lower via hole margin residual is removed；
(3) chemical scavenging: the oxide of the aperture of upper and lower via hole and hole bottom surface is removed；
(4) whole plate electro-coppering: the electro-coppering since the bottom hole of upper and lower via hole, and by the upper surface of upper layers of copper and lower layers of copper
Lower surface electro-coppering, until the conducting of upper and lower layers of copper.
2. the via hole whole plate Electrocoppering method of flexible circuit board according to claim 1, it is characterised in that: the step
(1) in, the thickness of upper layers of copper and lower layers of copper is 0.1-30 microns.
3. the via hole whole plate Electrocoppering method of flexible circuit board according to claim 1, it is characterised in that: the step
(1) in, upper and lower via hole is the blind hole without orifice ring.
4. the via hole whole plate Electrocoppering method of flexible circuit board according to claim 1, it is characterised in that: the step
(4) in, the liquid medicine that electro-coppering uses is filling perforation electro-coppering liquid medicine, copper post electro-coppering liquid medicine or pulse plating copper liquid medicine.
5. the via hole whole plate Electrocoppering method of flexible circuit board according to claim 1, it is characterised in that: the step
(4) in, the power supply that electro-coppering uses is DC power supply or reverse impulse power supply.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811540191.5A CN109661126A (en) | 2018-12-17 | 2018-12-17 | A kind of via hole whole plate Electrocoppering method of flexible circuit board |
| PCT/CN2019/088652 WO2020124956A1 (en) | 2018-12-17 | 2019-05-27 | Via hole entire-board copper electroplating method for flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811540191.5A CN109661126A (en) | 2018-12-17 | 2018-12-17 | A kind of via hole whole plate Electrocoppering method of flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109661126A true CN109661126A (en) | 2019-04-19 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811540191.5A Pending CN109661126A (en) | 2018-12-17 | 2018-12-17 | A kind of via hole whole plate Electrocoppering method of flexible circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109661126A (en) |
| WO (1) | WO2020124956A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020124956A1 (en) * | 2018-12-17 | 2020-06-25 | 盐城维信电子有限公司 | Via hole entire-board copper electroplating method for flexible circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100170088A1 (en) * | 2007-06-21 | 2010-07-08 | Chien-Wei Chang | Method Of Fabricating Board Having High Density Core Layer And Structure Thereof |
| CN105210462A (en) * | 2013-05-14 | 2015-12-30 | 名幸电子有限公司 | Method for manufacturing component-embedded substrate, and component-embedded substrate |
| CN106686881A (en) * | 2017-03-02 | 2017-05-17 | 东莞市五株电子科技有限公司 | Flexible and rigid combined printed circuit board and manufacturing method thereof |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5313202B2 (en) * | 2010-04-30 | 2013-10-09 | 日本メクトロン株式会社 | Build-up type multilayer printed wiring board and manufacturing method thereof |
| CN104752234B (en) * | 2014-12-17 | 2017-07-14 | 安捷利电子科技（苏州）有限公司 | A kind of Microvia preparation method of flexible encapsulating substrate |
| CN104661450B (en) * | 2015-02-16 | 2018-05-04 | 珠海元盛电子科技股份有限公司 | A kind of method based on laser drill DIRECT HOLE METALLIZATION TECHNIQUE IN |
| CN105873371B (en) * | 2015-11-06 | 2019-11-01 | 武汉光谷创元电子有限公司 | Substrate and its manufacturing method |
| CN106793494A (en) * | 2017-03-02 | 2017-05-31 | 东莞市五株电子科技有限公司 | Soft or hard combination printed circuit board (PCB) and preparation method thereof |
| CN206674305U (en) * | 2017-03-02 | 2017-11-24 | 东莞市五株电子科技有限公司 | Soft or hard combination printed circuit board (PCB) |
| CN206674293U (en) * | 2017-03-02 | 2017-11-24 | 东莞市五株电子科技有限公司 | A kind of soft or hard combination printed circuit board (PCB) |
| CN109661126A (en) * | 2018-12-17 | 2019-04-19 | 盐城维信电子有限公司 | A kind of via hole whole plate Electrocoppering method of flexible circuit board |
-
2018
- 2018-12-17 CN CN201811540191.5A patent/CN109661126A/en active Pending
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2019
- 2019-05-27 WO PCT/CN2019/088652 patent/WO2020124956A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100170088A1 (en) * | 2007-06-21 | 2010-07-08 | Chien-Wei Chang | Method Of Fabricating Board Having High Density Core Layer And Structure Thereof |
| CN105210462A (en) * | 2013-05-14 | 2015-12-30 | 名幸电子有限公司 | Method for manufacturing component-embedded substrate, and component-embedded substrate |
| CN106686881A (en) * | 2017-03-02 | 2017-05-17 | 东莞市五株电子科技有限公司 | Flexible and rigid combined printed circuit board and manufacturing method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020124956A1 (en) * | 2018-12-17 | 2020-06-25 | 盐城维信电子有限公司 | Via hole entire-board copper electroplating method for flexible circuit board |
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| Publication number | Publication date |
|---|---|
| WO2020124956A1 (en) | 2020-06-25 |
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Application publication date: 20190419 |