CN109642340B - 类晶片衬底加工方法、设备及其用途 - Google Patents

类晶片衬底加工方法、设备及其用途 Download PDF

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CN109642340B
CN109642340B CN201780051326.9A CN201780051326A CN109642340B CN 109642340 B CN109642340 B CN 109642340B CN 201780051326 A CN201780051326 A CN 201780051326A CN 109642340 B CN109642340 B CN 109642340B
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substrate
processing
wafer
gripper
contact
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CN109642340A (zh
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R·荣恩伯斯奇
T·布塞纽斯
D·布赫贝格尔
R·维恩豪
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Atotech Deutschland GmbH and Co KG
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Abstract

本发明涉及使用接触式夹持器及非接触式夹持器来加工类晶片衬底的方法。此外，本发明涉及用于加工类晶片衬底的含有接触式夹持器及非接触式夹持器的设备。另外，本发明涉及使用发明设备加工类晶片衬底。

Description

类晶片衬底加工方法、设备及其用途
技术领域
本发明涉及用于加工类晶片衬底的方法及设备。所述方法及设备尤其适合于在加工期间安全就地运输类晶片衬底。
背景技术
所属领域技术中已知使用夹持器运输类晶片衬底。本文中，使用不同种类的夹持器。过去尤其已使用接触所述衬底的表面或边缘的夹持器。然而，还已完全确立尤其是使用伯努利夹具的非接触式夹持器的使用。本文中，两种类型的夹持器提供特定益处，但针对敏感衬底，同时提供特定错配是成问题的。
接触衬底表面的夹持器通常提供非常准确地处理衬底的可能性。然而，所运输衬底趋于在接触点处对其表面造成损伤。
不接触所述表面的夹持器基于无常备接触点，通常将避免此类局部损伤。然而，此类夹持器更为复杂，且虽然所述衬底是固定的，但所述衬底可在某种程度上移动。一方面，基于移动期间的惯性效应，衬底可移动到侧边上。使用限制边缘以防止此类移动将导致衬底与限制边缘碰撞的可能性，从而可损伤衬底边缘或甚至可损伤全部衬底。此外，所运输衬底的移动及震动将提供在安放衬底时损伤衬底的风险。将此类衬底安放于复杂结构(例如，如WO 2016/096946 A1中所揭露的衬底固持器)中将对此过程带来更大负担。
发明目的
因此，需要提供用于类晶片衬底的经改进加工方法及用于实现所述方法以在运输期间安全就地处理所述衬底的设备。
发明内容
前述问题通过如独立技术方案及描述中所揭露的发明来解决。提供额外益处的进一步修改包含于独立技术方案及下列描述中。然而，即使是本文中未明确陈述但可从本文中所讨论的联系中直接推论或识别的进一步益处还由本发明及本文中所揭露的本发明及其实施例来解决。
本发明涉及用于加工类晶片衬底的方法，其包括下列步骤：
i)在装载装置中提供衬底；
ii)使用非接触式夹持器或接触式夹持器将所述衬底从所述装载装置运输到对准装置；
iii)在所述对准装置中对准所述衬底；
iv)使用接触式夹持器将经对准衬底运输到连接装置，其中所述连接装置提供衬底固持器；
v)将所述经对准衬底紧固于所述连接装置中的衬底固持器中；
vi)使用接触式夹持器将包括经对准衬底的衬底固持器进一步运输到处理装置；
vii)在所述处理装置中处理仍紧固于相应衬底固持器中的衬底；
viii)将包括经处理衬底的衬底固持器运输到所述连接装置，其中从所述相应衬底固持器解开所述经处理衬底；
ix)使用非接触式夹持器将经处理衬底进一步运输到后处理装置；
x)在所述后处理装置中后处理所述衬底；
xi)使用非接触式夹持器将经后处理衬底从后处理装置运输到储存装置或使用非接触式夹持器将其运回到装载装置。
此外，本发明涉及用于加工类晶片衬底的设备，其具有装载装置、对准装置、连接装置、处理装置、后处理装置、储存装置及接触式夹持器与非接触式夹持器，所述接触式夹持器与所述非接触式夹持器两者均可以下列方式运输衬底：
-非接触式夹持器或接触式夹持器可将所述衬底从所述装载装置运输到可对准所述衬底的对准装置；
-接触式夹持器可将经对准衬底从所述对准装置运输到连接装置，所述连接装置可将经对准衬底紧固于衬底固持器中且将经处理衬底解开到衬底固持器外；
-接触式夹持器可将所述衬底固持器从所述连接装置运输到可处理所述衬底的处理装置且将其运回到所述连接装置；
-接触式夹持器可将经处理衬底从所述连接装置运输到所述后处理装置；
-非接触式夹持器可将经后处理衬底从所述后处理装置运输到所述储存装置或运回到所述装载装置。
此外，本发明涉及将本发明方法或发明设备用于加工提供类框架结构的类晶片衬底。通常，应预期接触式夹持器及非接触式夹持器的错配累积且提供较坏的结果。然而，令人惊讶的是，注意到，在后处理时夹持器类型的此改变导致极大减小对非常敏感的测试衬底的损坏。
如本文中所使用的术语“非接触式夹持器”是指可在不与所述衬底表面接触的情况下处理衬底的夹持器。然而，通常，此类非接触式夹持器优选进一步提供至少一个限制边缘。如果所述衬底远离所述非接触式夹持器的居中位置而移动，那么此限制边缘可接触所述衬底边缘。因此，此限制边缘通常对在基于(例如)所述衬底的惯性的移动期间防止损失所述衬底非常有用。
如本文中所使用的术语“接触式夹持器”是指可在接触对象时处置所述对象的夹持器。此接触式夹持器的实例是可在接触衬底表面时运输衬底的接触式夹持器。优选地，此接触式夹持器选择性地在所述衬底的外部分(如表示所述衬底表面的最外10％的区域(基于所述衬底表面的表面积))处接触所述衬底。所述接触式夹持器的另一实例是可运输衬底固持器的夹持器。可运输衬底固持器的此夹持器(例如)附接到所述衬底固持器的某些悬挂元件以可逆地连接到所述衬底固持器。本文中，可运输衬底固持器的此夹持器优选机械附接到所述衬底固持器。然而，其还可使用所属领域的技术人员已知的任何其它方式来将其本身附接到此衬底固持器(如使用真空吸取)。提供此类悬挂元件的衬底固持器的实例可从(例如WO 2016/096946 A1)获得。所述发明方法及设备似乎尤其适合于提供用于紧固及电接触所述衬底的方式的此类衬底固持器。
如果组件或构件由术语“可…”或“可提供…”来限定，那么视为通过称为拟执行的功能来将这些术语限制于此类经限定组件或构件的范围内。换句话说，所述组件或构件经特别修改或构形以完成所述指定功能。
附图说明
为更完整理解本发明，参考结合所附图式而考虑的下文具体实施方式，在所述图式中：
图1展示发明设备的部分的示意性立体图。
图2展示如图1中所展示的发明设备的部分的示意性侧视图。
图3展示如图1中所展示的发明设备的部分的示意性前视图。
图4展示如图1中所展示的发明设备的部分的示意性俯视图。
图5展示从如图1中所展示的发明设备的部分的背面的示意性横截面。
图6展示如图1中所展示的发明设备的示意性立体图的剪切图。
图7展示接触式夹持器4的示意性立体图，所述接触式夹持器可在接触如图1中所展示的发明设备中所使用的衬底表面时运输所述衬底。
图8展示如图1中所展示的发明设备中所使用的非接触式夹持器3的示意性立体图。
具体实施方式
根据方面，本发明涉及用于加工类晶片衬底的方法，其包括下列步骤：
i)在装载装置中提供衬底；
ii)使用非接触式夹持器或接触式夹持器将所述衬底从所述装载装置运输到对准装置；
iii)在所述对准装置中对准所述衬底；
iv)使用接触式夹持器将经对准衬底运输到连接装置，其中所述连接装置提供衬底固持器；
v)将所述经对准衬底紧固于所述连接装置中的衬底固持器中；
vi)使用接触式夹持器将包括经对准衬底的衬底固持器进一步运输到处理装置；
vii)在所述处理装置中处理仍紧固于相应衬底固持器中的衬底；
viii)将包括经处理衬底的衬底固持器运输到所述连接装置，其中从所述相应衬底固持器解开所述经处理衬底；
ix)使用非接触式夹持器将经处理衬底进一步运输到后处理装置；
x)在所述后处理装置中后处理所述衬底；
xi)使用非接触式夹持器将经后处理衬底从所述后处理装置运输到储存装置或使用非接触式夹持器将其运回到所述装载装置。
本文中，须注意，(例如)步骤ii)可包含未明确提及的进一步步骤。例如，在将类晶片衬底运输到对准装置之前对其进行某些检验以检测缺陷。
本文中，应了解，前述方法可利用多种装载装置、对准装置、处理装置等等。前述方法经证明对加工尤其敏感的类晶片衬底尤其有用。本文中，前述方法步骤的组合提供类晶片衬底的安全加工且大幅降低损坏风险。
本文中所使用的优选类型的非接触式夹持器是伯努利夹持器。此伯努利夹持器利用基于气流的伯努利夹具来对所述衬底提供粘着力，同时避免所述衬底表面与伯努利夹持器的接触。
本发明中可使用的处理装置的实例是用于湿处理的处理装置，优选为a)化学或电解金属沉积、b)化学或电解蚀刻、及/或c)化学或电解清洗，更优选为电解金属沉积、化学蚀刻及/或化学清洗。本发明方法经证明对用于化学或电解金属沉积(电解金属沉积更优选)的处理装置尤其有用。本文中所使用的尤其优选类型的处理装置是用于电解铜沉积的处理装置(优选为用于垂直电解铜沉积的处理装置)。
优选类型的接触式夹持器(尤其是如步骤iv)及ix)中所使用的可在接触衬底表面时运输所述衬底的接触式夹持器)是使用真空吸取的夹持器。
在本发明的优选实施例中，所述接触式夹持器(尤其是可在接触衬底表面时运输所述衬底的接触式夹持器)是使用真空吸取的夹持器，且所述非接触式夹持器是伯努利型夹持器。此类夹持器经证明对运输许多种类型的衬底尤其有用且可靠。
可在接触所述衬底表面时运输所述衬底的特定优选类型的接触式夹持器是提供可使用真空可逆地附接衬底的至少3个(优选为至少4个，更优选为至少6个)喷嘴的接触式夹持器。这些接触式夹持器经证明对将先前经对准的衬底运输到特定位置非常高效。优选地，所述喷嘴经定位于所述接触式夹持器的表面的隆起处，以将所述接触式夹持器与所述衬底的接触面积减小到最小值。
如本文中所使用的术语“连接装置”是指用于将所述衬底紧固到衬底固持器的装置。优选地，此连接装置是所述设备内的稳固附接装置。本文中，例如，将衬底固持器引入到所述连接装置中且将其打开。此后，将衬底安放于打开的衬底固持器中。接着，关闭所述衬底固持器且将其从所述连接装置移除。或者(例如)将所述衬底固持器的第一部分引入到所述连接装置中。在将所述衬底安放于所述衬底固持器的所述第一部分上之后，将所述衬底固持器的第二部分可逆地紧固到所述第一衬底固持器部分。优选地，关闭所述衬底固持器或可逆地坚固此第二衬底固持器部分是基于集成于如WO 2016/096946 A1中所揭露的衬底固持器中的机制。
此外，所述衬底的对准优选导致用于所述处理装置中的后续处理的经精确对准的衬底。此精确对准提供将衬底精确地定位于用于(例如)电解金属沉积的衬底固持器中以确保安全电接触的可能性。此对准装置的实例是来自奥地利机电系统技术GmbH(MechatronicSystemtechnik GmbH,Austria)的预对准器1207。
通常，所述衬底包括拟处理的至少一个表面，例如，两个表面。在处理及预处理所述衬底期间，拟处理的表面变得越来越敏感，且因此，越来越易于在加工所述衬底期间(尤其是运输期间)损坏。所述接触式夹持器或所述非接触式夹持器优选可在运输期间在拟处理的衬底表面上抓紧所述衬底。经证明，如果步骤ii)、iv)、ix)及xi)的接触式夹持器或非接触式夹持器能够如此进行将尤其有用。
应注意，使用经配置固定到一或多个接触式夹持器及非接触式夹持器或可逆地附接到一或多个接触式夹持器或非接触式夹持器的多功能机械臂可尤其节省空间地实践所述发明方法及所述设备。优选地，多功能机械臂经可逆地附接到接触式夹持器或非接触式夹持器，其中步骤ii)、iv)、ix)及xi)的接触式夹持器及非接触式夹持器经可逆地附接到此机械臂。例如，如果使用此多功能机械臂，那么可通过用于步骤xi)中的非接触式夹持器来轻易地替代步骤ix)中所使用的接触式夹持器，其中相同机械臂可用于两个步骤。
在本发明的进一步实施例中，多功能机械臂经可逆地附接到接触式夹持器或非接触式夹持器，其中步骤ii)、iv)、ix)、vi)及xi)的接触式夹持器及非接触式夹持器经可逆地附接到此机械臂。
此外，在本发明的进一步实施例中，步骤vii)的衬底处理优选是处理所述衬底的两个表面。经证明，如果所述处理包含在所述衬底的两侧上的金属沉积(优选为电解金属沉积)，那么此类型的处理尤其有用。此类衬底似乎将提供经增大的稳定性，从而允许(例如)较快移动显然对惯性效应较不敏感的此衬底且因此允许进一步提供加工时间的进一步缩减。
在本发明的优选实施例中，所述后处理包含干燥所述衬底。在此干燥过程之后使用非接触式夹持器将极大减少对所述衬底表面的损坏。在所述干燥过程之后，所述衬底的经处理表面似乎尤其敏感，而在所述干燥过程之前，处理之后的衬底似乎对表面损伤的敏感程度远不及此。可使用的干燥方法的实例是马兰戈尼干燥法。
此外，所述后处理装置中优选包含至少一个进一步后处理，例如冲洗。例如，经证明，所述后处理包含冲洗及干燥所述衬底通常是有益的。将所述两个步骤组合于所述后处理装置中将允许避免当将所述衬底紧固到所述衬底固持器时对所述衬底的冲洗步骤，所述冲洗步骤需要(例如)明显更大数量的清洗液体。本文中所使用的术语“冲洗”是指可清洗所述衬底表面的任何清洗过程。
虽然每一步骤中可使用不同类型的接触式夹持器或非接触式夹持器，但通常，优选在步骤iv)及ix)中使用相同接触式夹持器。将相同接触式夹持器用于此步骤允许减小组件数目且简化所需要的装置及维护。在本发明的一些实施例中，如果在步骤ii)中使用接触式夹持器，那么相同接触式夹持器将用于步骤ii)、iv)及ix)中。
另外，在步骤ii)中利用非接触式夹持器通常是有益的。虽然此时所述衬底表面似乎较不敏感，但使用此非接触式夹持器似乎仍将为许多衬底提供一些进一步改进。
通常可使用步骤ii)及xi)中的相同非接触式夹持器来实现组件数目的进一步减小及所述装置及维护的简化。应注意，在方法的两个步骤中可有利地使用相同类型的非接触式夹持器。
此外，经证明，使用如上文所解释的非接触式夹持器或接触式夹持器(优选为可在接触所述衬底表面时运输所述衬底的接触式夹持器)是更有利的，其中所述非接触式夹持器或接触式夹持器是可在所述双面夹持器的每一面上运输衬底的双面夹持器。经证明，在从由步骤ii)、iv)、ix)组成的群组选择(更优选从由步骤iv)或ix)组成的群组选择)的至少一个步骤中利用此非接触式夹持器或接触式夹持器尤其有用。尤其地，优选在步骤iv)及ix)中使用接触式夹持器(优选为相同接触式夹持器)。应注意，使用此非接触式夹持器或接触式夹持器(优选为可在接触所述衬底表面时运输衬底的接触式夹持器)允许进一步缩短所述衬底的加工时间，这是因为此允许同时可逆地附接两个衬底且同时组合加工多个衬底的步骤。例如，当所述机械臂移动到所述连接装置以从所述衬底固持器获得经处理衬底时，附接到其接触式夹持器可已携带另一经对准(经处理或未经处理)衬底且替代所述衬底固持器中所含有的衬底。
本文中所揭露的发明方法经证明对类晶片衬底(如晶片)非常有用。本文中，应注意，所述发明方法对加工提供类框架结构的晶片尤其有用。本文中所使用的词组“类框架结构”是指其中较薄内部分由较厚外部分包围的结构。优选地，所述较厚外部分经定位于所述类框架结构的边缘处以提供稳定框架，从而导致所述晶片的稳定。可(例如)通过磨蚀所述晶片的内部分以留出所述晶片的框架区域来产生此类晶片。此“类框架结构”的实例是太鼓(Taiko)晶片。
所述装载装置通常用于将所述衬底引入到所述设备中且将经处理衬底取出所述设备。本文中，经证明，所述装载装置包括可储存至少一个衬底的匣是有益的。(例如)如果应加工不同类型的衬底以评估其不同，那么使用可含有一个衬底的匣是有益的。然而，通常，所述匣优选可含有多个衬底，如至少五个(更优选为至少十个)衬底。使用此类匣将提供多个衬底可经引入且经自动加工，从而极大减小所需要的手动互动的数量的益处。更优选地，以将未处理衬底储存于匣中而将经处理衬底储存于另一匣中的方式使用不同匣。
令人惊讶的是，使用所述发明方法还将允许自动加工自动提供类框架结构的多个晶片。通常，其中加工储存于装载装置中的多个衬底的发明方法优选重复至少两次(更优选至少五次)。
所述储存装置可(例如)为经稳固附接的或可移除的匣，其中所述储存装置可用于暂时收集至少一个衬底。此储存装置可用作所述发明方法之后的过程的起始点。例如，经处理衬底可经受一些后续的光致抗蚀剂剥离过程，其发生于所述发明设备的不同部分中。
根据所述发明方法的尤其优选实施例，所述衬底处理包含如电解铜或镍沉积的电解金属沉积，且后处理所述衬底包含干燥所述衬底(更优选包含冲洗及干燥所述衬底)。据推测，将所述衬底精确安放于所述衬底固持器中以提供清楚界定的电接触与作为后处理过程的此干燥步骤之后令人惊讶地极大减小表面损坏的可能性的组合是导致经处理衬底的质量极大提高的主要原因。
应注意，所述发明方法尤其适合于用作洁净室过程。本文中，基本上减少引入拟加工的衬底及取出经加工衬底的手动互动的高程度自动化似乎将极大减小损坏及污染的风险。本文中，通常，在表示此洁净室内的特定设备的封闭空间中实施所述发明方法更佳。使用所述发明方法可在仅需要较小数量的空间的情况下组合这些步骤。
根据另一方面，本发明涉及用于加工类晶片衬底的设备，其具有装载装置、对准装置、连接装置、处理装置、后处理装置、储存装置及接触式夹持器及非接触式夹持器，所述接触式夹持器与所述非接触式夹持器两者均可以下列方式运输衬底：
-非接触式夹持器或接触式夹持器可将所述衬底从所述装载装置运输到可对准所述衬底的对准装置；
-接触式夹持器可将经对准衬底从所述对准装置运输到连接装置，所述连接装置可将经对准衬底紧固于衬底固持器中且从衬底固持器解开经处理衬底；
-接触式夹持器可将所述衬底固持器从所述连接装置运输到可处理所述衬底的处理装置且将其运回到所述连接装置；
-接触式夹持器可将经处理衬底从所述连接装置运输到所述后处理装置；
-非接触式夹持器可将经后处理衬底从所述后处理装置运输到所述储存装置或运回到所述装载装置。
通常，所述设备更优选含有上文就所述方法来说所指定的组件。
此外，所述处理装置优选是用于湿处理，优选为a)化学或电解金属沉积、b)化学或电解蚀刻、及/或c)化学或电解清洗，更优选为电解金属沉积、化学蚀刻及/或化学清洗。本发明方法经证明对用于化学或电解金属沉积(电解金属沉积更优选)的处理装置尤其有用。本文中所使用的尤其优选类型的处理装置是用于电解铜沉积的处理装置(优选为用于电解铜沉积的垂直处理装置)。
根据另一方面，本发明涉及将所述发明方法或所述发明设备用于处理类晶片衬底的用途，其中所述类晶片衬底是提供类框架结构的晶片。应注意，所述发明方法及设备尤其适合于处理此类类型的晶片。
通常，所述设备优选提供将包括提供至少一个衬底的匣的装载装置引入到所述设备中或将所述装载装置从所述设备取出的至少一个开口。本文中，所述至少一个开口优选是可手动操作的。尤其当将匣用作所述装载装置的部分(其中所述匣可提供多个衬底)时，此开口允许简单且高效地引入将拟处理的衬底且移除经处理衬底。
应注意，所述发明设备经证明对垂直电镀尤其有用。此过程可(例如)用于将如铜或镍的金属电沉积到半导体晶片的表面上。
提供下列非限制性实例以说明本发明的优选实施例且促进理解本发明，但所述实例不意在限制由所附于本文中的技术方案所界定的本发明的范围。
图1展示发明设备的部分的示意性立体图。本文中，所述设备提供装载装置1，其包括左侧上含有多个类晶片衬底的匣，其中所述类晶片衬底是提供类框架结构的晶片。使用非接触式夹持器3将这些衬底从装载装置1运输到对准装置2，所述非接触式夹持器是可逆地附接到机械臂7的伯努利型夹持器。基于对准装置2的大小，图中未展示所述设备的细节(如用于固持及对准所述衬底的臂)。对准装置2对准所述衬底，从而在使用接触式夹持器将衬底运输到连接装置5之前提供经精确对准的衬底。本文中，所述接触式夹持器是经可逆地附接到机械臂7的真空吸取夹持器。通过所述衬底固持器将所述衬底紧固到衬底固持器(未展示)。
此后，使用接触式夹持器将所述衬底固持器运输到所述处理装置(未展示)。在处理所述衬底(所述衬底的两侧上包含电解金属沉积)之后，将含有所述衬底的衬底固持器运输到连接装置5。此处，从所述衬底固持器解开所述衬底。
使用接触式夹持器将所述经解开且经处理衬底运输到后处理装置6，所述接触式夹持器是经可逆地附接到机械臂7的真空吸取夹持器。在后处理装置6中发生包含干燥所述衬底之后处理。此后，使用非接触式夹持器3将所述衬底运输到装载装置1，所述非接触式夹持器是经可逆地附接到机械臂7的伯努利夹持器。
图2展示如图1中所展示的发明设备的部分的示意性侧图。本文中，所述侧视图展示用于引入包括提供所述衬底的匣的装载装置的开口的盖10。
图3展示如图1中所展示的发明设备的部分的示意性前视图且图4展示其示意性俯视图。
图5展示从如图1中所展示的发明设备的部分的背面的示意性横截面。本文中，展示含有包括所述匣的装载装置1的开口的盖10。此外，展示用于将所述衬底(例如)从对准装置2运输到连接装置5的机械臂7的背面。
图6展示如图1中所展示的发明设备的示意性立体图的细节。本文中，展示非接触式夹持器3经附接于其机械臂7的部分。在左侧上展示对准装置2的部分，其中可见用于固持及对准所述衬底的所述壁的部分。
图7展示接触式夹持器4的示意性立体图，所述接触式夹持器可在接触如图1中所展示的发明设备中所使用的衬底表面时运输所述衬底。本文中，标记包含于所述接触式夹持器4中的八个喷嘴9中的三者。所述喷嘴9提供接触式夹持器4的表面的隆起以最小化接触式夹持器4在所述衬底表面上的接触面积。
图8展示如图1中所展示的发明设备中所使用的非接触式夹持器3的示意性立体图。本文中，图中未展示位于非接触式夹持器3的中间的提供伯努利效应的开口。非接触式夹持器3的平面中心区域由四个限制边缘8包围以防止所述衬底离开非接触式夹持器3的中心。
元件符号
1：装载装置
2：对准装置
3：非接触式夹持器
4：接触式夹持器
5：连接装置
6：后处理装置
7：机械臂
8：限制边缘
9：喷嘴
10：引入装载装置的开口的盖

Claims (19)

1.一种用于加工类晶片衬底的方法，其包括下列步骤：
i)在装载装置(1)中提供所述衬底；
ii)使用非接触式夹持器(3)或接触式夹持器(4)将所述衬底从所述装载装置(1)运输到对准装置(2)；
iii)在所述对准装置(2)中对准所述衬底；
iv)使用接触式夹持器(4)将所述经对准衬底运输到连接装置(5)，其中所述连接装置(5)提供衬底固持器；
v)将所述经对准衬底紧固于所述连接装置(5)中的所述衬底固持器中；
vi)使用接触式夹持器将包括所述经对准衬底的所述衬底固持器进一步运输到处理装置；
vii)在所述处理装置中处理仍紧固于所述相应衬底固持器中的所述衬底；
viii)将包括所述经处理衬底的所述衬底固持器运输到所述连接装置(5)，其中从所述相应衬底固持器解开所述经处理衬底；
ix)使用接触式夹持器(4)将所述经处理衬底进一步运输到后处理装置(6)；
x)在所述后处理装置(6)中后处理所述衬底；
xi)使用非接触式夹持器(3)将所述经后处理衬底从所述后处理装置(6)运输到储存装置或使用非接触式夹持器(3)将其运回到所述装载装置(1)。
2.根据权利要求1所述的用于加工类晶片衬底的方法，其中在用于湿处理的所述处理装置中处理所述衬底。
3.根据权利要求1或2所述的用于加工类晶片衬底的方法，其中所述接触式夹持器(4)是使用真空吸取的夹持器且所述非接触式夹持器(3)是伯努利型夹持器。
4.根据权利要求1或2所述的用于加工类晶片衬底的方法，其中所述衬底的所述对准导致用于所述处理装置中的后续处理的经精确对准衬底。
5.根据权利要求1或2所述的用于加工类晶片衬底的方法，其中所述衬底包括拟处理的至少一个表面且所述接触式夹持器(4)或所述非接触式夹持器(3)可在运输期间在拟处理的所述表面上抓紧所述衬底。
6.根据权利要求1或2所述的用于加工类晶片衬底的方法，其中使用机械臂，且步骤ii)、iv)、ix)及xi)的所述接触式夹持器(4)或非接触式夹持器(3)经可逆地附接到所述机械臂(7)。
7.根据权利要求1或2所述的用于加工类晶片衬底的方法，其中步骤vii)的所述衬底的所述处理是处理所述衬底的两个表面。
8.根据权利要求1或2所述的用于加工类晶片衬底的方法，其中所述后处理包含：干燥所述衬底。
9.根据权利要求1或2所述的用于加工类晶片衬底的方法，其中所述衬底是提供类框架结构的晶片。
10.根据权利要求1或2所述的用于加工类晶片衬底的方法，其中所述装载装置(1)包括可储存至少一个衬底的匣。
11.根据权利要求1或2所述的用于加工类晶片衬底的方法，其中步骤iv)及ix)中所使用的所述接触式夹持器是双面夹持器，其可在所述双面夹持器的每一面上运输衬底。
12.根据权利要求2所述的用于加工类晶片衬底的方法，其中所述湿处理为a)化学或电解金属沉积、b)化学或电解蚀刻，及/或c)化学或电解清洗。
13.根据权利要求2所述的用于加工类晶片衬底的方法，其中所述湿处理为电解金属沉积、化学蚀刻及/或化学清洗。
14.一种用于加工类晶片衬底的设备，其具有装载装置(1)、对准装置、连接装置(5)、处理装置、后处理装置(6)、储存装置及接触式夹持器(4)与非接触式夹持器，所述接触式夹持器(4)与所述非接触式夹持器两者均可以下列方式运输所述衬底：
-非接触式夹持器(3)或接触式夹持器(4)可将所述衬底从所述装载装置(1)运输到可对准所述衬底的所述对准装置(2)；
-接触式夹持器(4)可将经对准衬底从所述对准装置(2)运输到所述连接装置(5)，所述连接装置(5)可将所述经对准衬底紧固于衬底固持器中且从衬底固持器解开经处理衬底；
-接触式夹持器(4)可将所述衬底固持器从所述连接装置(5)运输到可处理所述衬底的所述处理装置且将其运回到所述连接装置(5)；
-接触式夹持器(4)可将所述经处理衬底从所述连接装置(5)运输到所述后处理装置(6)；
-非接触式夹持器(3)可将所述经后处理衬底从所述后处理装置(6)运输到所述储存装置或运回到所述装载装置(1)。
15.根据权利要求14所述的用于加工类晶片衬底的设备，其中所述处理装置是用于湿处理。
16.根据权利要求14到15中任一权利要求所述的用于加工类晶片衬底的设备，其中所述衬底包括拟处理的至少一个表面，且所述接触式夹持器(4)或所述非接触式夹持器(3)可在运输期间在所述衬底的拟处理表面上抓紧所述衬底。
17.根据权利要求15所述的用于加工类晶片衬底的方法，其中所述湿处理为a)化学或电解金属沉积、b)化学或电解蚀刻，及/或c)化学或电解清洗。
18.根据权利要求15所述的用于加工类晶片衬底的方法，其中所述湿处理为电解金属沉积、化学蚀刻及/或化学清洗。
19.一种根据权利要求1到13中任一权利要求所述的方法或根据权利要求14到18中任一权利要求所述的用于加工类晶片衬底的设备的用途，其中所述类晶片衬底是提供类框架结构的晶片。
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