CN109638122B - 一种采用超声驻波操纵Micro-LED巨量转移的方法 - Google Patents
一种采用超声驻波操纵Micro-LED巨量转移的方法 Download PDFInfo
- Publication number
- CN109638122B CN109638122B CN201811564866.XA CN201811564866A CN109638122B CN 109638122 B CN109638122 B CN 109638122B CN 201811564866 A CN201811564866 A CN 201811564866A CN 109638122 B CN109638122 B CN 109638122B
- Authority
- CN
- China
- Prior art keywords
- micro
- led
- base substrate
- face
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 27
- 239000000758 substrate Substances 0.000 claims abstract description 104
- 230000005855 radiation Effects 0.000 claims abstract description 22
- 230000005484 gravity Effects 0.000 claims abstract description 8
- 230000000694 effects Effects 0.000 claims abstract description 6
- 230000008569 process Effects 0.000 claims abstract description 6
- 238000002604 ultrasonography Methods 0.000 claims abstract description 6
- 230000008859 change Effects 0.000 claims abstract description 4
- 238000005339 levitation Methods 0.000 claims abstract description 3
- 238000004026 adhesive bonding Methods 0.000 claims description 9
- 230000002745 absorbent Effects 0.000 claims description 4
- 239000002250 absorbent Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 239000000725 suspension Substances 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 13
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004093 laser heating Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811564866.XA CN109638122B (zh) | 2018-12-20 | 2018-12-20 | 一种采用超声驻波操纵Micro-LED巨量转移的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811564866.XA CN109638122B (zh) | 2018-12-20 | 2018-12-20 | 一种采用超声驻波操纵Micro-LED巨量转移的方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109638122A CN109638122A (zh) | 2019-04-16 |
CN109638122B true CN109638122B (zh) | 2019-08-27 |
Family
ID=66075933
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811564866.XA Active CN109638122B (zh) | 2018-12-20 | 2018-12-20 | 一种采用超声驻波操纵Micro-LED巨量转移的方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109638122B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110289279B (zh) * | 2019-06-04 | 2021-09-24 | 上海天马微电子有限公司 | 一种转移方法、阵列基板、其制作方法及显示装置 |
CN110246755A (zh) * | 2019-06-25 | 2019-09-17 | 广东工业大学 | Micro-LED衬底的阵列排列转移方法、转移装置、显示装置 |
CN110265424B (zh) * | 2019-06-25 | 2022-06-10 | 京东方科技集团股份有限公司 | 一种显示面板、其制作方法及母板 |
CN110299317B (zh) * | 2019-07-03 | 2021-08-13 | 广东工业大学 | 一种基于超声操控和微流控的晶片转移系统及转移方法 |
CN115223888B (zh) * | 2021-04-20 | 2024-09-27 | 广东工业大学 | 一种等间距的芯片扩张及巨量转移方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006205064A (ja) * | 2005-01-28 | 2006-08-10 | Dainippon Printing Co Ltd | 乾燥装置 |
JP4900115B2 (ja) * | 2007-07-27 | 2012-03-21 | 株式会社Ihi | 搬送方向転換装置及び浮上搬送システム |
JP5125290B2 (ja) * | 2007-07-27 | 2013-01-23 | 株式会社Ihi | 浮上搬送装置及び処理搬送システム |
JP5869782B2 (ja) * | 2011-05-30 | 2016-02-24 | 東レエンジニアリング株式会社 | 浮上搬送加熱装置 |
CN102785940A (zh) * | 2012-08-15 | 2012-11-21 | 吉林大学 | 超声波/气浮混合式非接触自动运输装置 |
CN202935948U (zh) * | 2012-08-15 | 2013-05-15 | 吉林大学 | 超声波和气浮混合式非接触自动运输装置 |
CN104085691A (zh) * | 2014-07-30 | 2014-10-08 | 华东理工大学 | 超声波悬浮传输装置 |
KR20180029120A (ko) * | 2016-09-09 | 2018-03-20 | 주식회사 케이씨텍 | 기판 처리 장치 |
CN107818938B (zh) * | 2016-09-13 | 2021-07-30 | 台湾积体电路制造股份有限公司 | 运送系统及运送加工元件的方法 |
CN206608352U (zh) * | 2017-03-07 | 2017-11-03 | 安徽师范大学 | 一种风力悬浮控制装置 |
CN107547009A (zh) * | 2017-07-07 | 2018-01-05 | 乌鲁木齐爱思特专利转让服务有限责任公司 | 悬浮并能移动的智能装置及控制方法 |
CN207743199U (zh) * | 2017-12-27 | 2018-08-17 | 通威太阳能(成都)有限公司 | 一种太阳能电池片在线检测系统 |
-
2018
- 2018-12-20 CN CN201811564866.XA patent/CN109638122B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN109638122A (zh) | 2019-04-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN109638122B (zh) | 一种采用超声驻波操纵Micro-LED巨量转移的方法 | |
CN109671651B (zh) | 一种超声释放式Micro-LED巨量转移方法 | |
US10355166B2 (en) | Light-emitting diode structure, transfer assembly, and transfer method using the same | |
CN109661163A (zh) | 一种温控粘附式Micro-LED巨量转移方法 | |
CN102157630B (zh) | 单基板多芯片组大功率led封装一次键合方法 | |
CN109599463A (zh) | 一种用于Micro-LED巨量转移的拾取结构及转移方法 | |
CN104089217A (zh) | 背光源、背光模组和显示装置 | |
CN110718611B (zh) | 一种Micro LED巨量转移方法、装置及封装结构、显示装置 | |
CN101711434A (zh) | 发光二极管照明装置 | |
CN101619813B (zh) | 一种基于热声制冷技术大功率led光源 | |
CN105047793A (zh) | 发光二极管封装结构的制作方法 | |
CN203205418U (zh) | 前后两面发光的led | |
CN110491978B (zh) | 用于巨量转移的led芯片结构及其制备方法 | |
CN201462530U (zh) | 一种led光源日光灯 | |
CN203477930U (zh) | 光照射装置 | |
CN108258088B (zh) | 微发光装置的键合治具、键合设备及其键合方法 | |
CN101593801B (zh) | 倒装发光二极管的制备方法 | |
CN102347434B (zh) | 倒装结构的发光二极管芯片及制作方法 | |
MY160543A (en) | Light emitting device and manufacturing method thereof | |
CN109087986A (zh) | 一种柔性led器件及其制作方法、led灯丝 | |
CN214956885U (zh) | 一种驱动背板、显示面板及电子设备 | |
CN113394137B (zh) | 微发光器件的转印装置、转印方法及显示面板 | |
CN111739902B (zh) | 一种用于微型发光单元的转移装置及转移方法 | |
CN113130348B (zh) | Led芯片转移方法 | |
CN110299317A (zh) | 一种基于超声操控和微流控的晶片转移系统及转移方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230512 Address after: 237400 Huoqiu modern industrial park, Hefei high tech Zone, Huoqiu County, Lu'an City, Anhui Province Patentee after: Anhui Chuangyuan Photoelectric Technology Co.,Ltd. Address before: 510006 No. 100 West Ring Road, University of Guangdong, Guangzhou Patentee before: GUANGDONG University OF TECHNOLOGY Effective date of registration: 20230512 Address after: 710000 Room 31401, Unit 3, Unit 14, Jiatian International Building No. 1, 216 Taibai South Road, Yanta District, Xi'an City, Shaanxi Province Patentee after: Xi'an Crossing Photoelectric Technology Co.,Ltd. Address before: 237400 Huoqiu modern industrial park, Hefei high tech Zone, Huoqiu County, Lu'an City, Anhui Province Patentee before: Anhui Chuangyuan Photoelectric Technology Co.,Ltd. |