CN108258088B - 微发光装置的键合治具、键合设备及其键合方法 - Google Patents
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Abstract
本发明有关一种微发光装置的键合治具及其键合方法,其主要由若干块多孔板构成,各多孔板设有穿孔以容置依据待键合微发光装置待分离点设置的顶针,顶针两端凸伸出治具,其在待键合微发光装置端,为与待键合微发光装置的待分离点对应的接触端,而在针床端,则为与针床的弹簧针接触的接触端,各顶针依据待分离点具有适当的斜率,该针床端的多孔板穿孔外缘具有容设顶针端部的定位孔,且该定位孔深度依据所容置顶针的斜率大小而定,使待键合微发光装置端的顶针具有相同出针长度,具有提高键合治具的稳定性,避免微发光装置键合排列不齐的效果。
Description
技术领域
本发明涉及微发光装置封装领域,具体涉及微发光装置的键合技术。
背景技术
Micro LED为微型化LED数组结构,具有自发光显示特性,每一点划素(pixel)都能寻址化单独驱动发光,优点包括高亮度、低功耗、体积较小、超高分辨率与色彩饱和度等。相较于同为自发光显示的OLED技术,Micro LED不仅效率较高、寿命较长,材料不易受到环境影响而相对稳定,也能避免产生残影现象。
由于Micro LED芯粒之间的间距比较接近,造成封装固晶键合难度上升,现有的键合设备效率低,无法满足日趋增大的生产需求。
发明内容
为解决背景技术中的问题,本发明的主要目的在于提供一种微发光装置的键合治具能快速的完成微发光装置的键合。
为达到上述目的,本发明公开了一种微发光装置的键合治具,用于将复数个待键合微发光装置键合到封装基板上,包括若干块多孔板,多孔板设有穿孔以容置依据待键合微发光装置待分离点设置的顶针,顶针在待键合微发光装置端伸出治具,顶针在待键合微发光装置端为与待键合微发光装置的待分离点对应的接触端,各顶针依据待分离点具有适当的斜率。
顶针依据待分离点设置的斜率不同,在待分离点间距较小即微发光装置紧密排布的情况下,顶针相对于水平面的斜角可以小于90°,在待分离点间距较大即微发光装置排布较疏松的情况下,顶针相对于水平面的斜角可以大于90°。
根据本发明,优选的,远离接触端的多孔板穿孔外缘具有容设顶针端部的定位孔,顶针从定位孔伸出。
根据本发明,优选的,定位孔深度或位置依据所容置顶针的斜率大小而定,使待键合微发光装置端的顶针具有相同出针长度。
根据本发明,优选的,端部包括平面、曲面或球面。
为了满足生产需求,本发明还提供了一种微发光装置的键合设备,用于将复数个待键合微发光装置键合到封装基板上,包括了上述键合治具,键合治具至少由若干块多孔板组成,多孔板设有穿孔以容置依据待键合微发光装置待分离点设置的顶针,顶针在待键合微发光装置端伸出治具,顶针在待键合微发光装置端为与待键合微发光装置的待分离点对应的接触端,各顶针依据待分离点具有适当的斜率。
根据本发明,优选的,各顶针依据待分离点具有的斜率不同,则顶针具有不同的倾斜角度。
根据本发明,优选的,键合设备具有若干套键合治具,键合治具根据倾斜角度的不同,可以替换使用,替换下来的键合治具也可以再进行斜率调整。
根据本发明,优选的,远离接触端的多孔板穿孔外缘具有容设顶针端部的定位孔,顶针从定位孔伸出。
根据本发明,优选的,定位孔深度依据所容置顶针的斜率大小而定,使待键合微发光装置端的顶针具有相同出针长度。基于上述技术方案,本发明的技术效果之一,键合设备采用可以替换键合治具,用以满足不同间距的微发光装置与基板的键合需求,而不需要多套不同尺寸的键合设备,提高生产效率、降低生产成本。
在一些实施例中,远离接触端设置有针床,针床具有与顶针匹配的弹簧针。
根据本实施例,优选的,弹簧针与顶针匹配的一端设有外缘凸出、内部内陷的凹槽。
根据本实施例,优选的,端部包括平面、曲面或球面,主要为了有利于针床的弹簧针向顶针传递压力。
根据本实施例,优选的,待键合微发光装置键合前位于基架上。
根据本实施例,优选的,基架包括蓝膜、BCB胶、硅胶、树脂等利于固定微发光装置的材料。
在一些实施例中,为了加快微发光装置键合效率,提高微发光装置和封装基板的键合效果,本实施例在封装基板一侧设置有激光发生装置,激光发生装置对封装基板上微发光装置对应的待键合区域进行激光照射。
根据这些实施例,激光照射的作用包括改变封装基板物理态或化学态,从而利于微发光装置键合。
基于上述的键合治具及键合设备,本发明提供了一种微发光装置的键合方法,用于将复数个待键合微发光装置键合到封装基板上,包括以下步骤:
提供固定在基架上的复数个待键合微发光装置以及键合治具,键合治具至少由若干块多孔板组成,多孔板设有穿孔以容置依据待键合微发光装置待分离点设置的顶针,顶针在待键合微发光装置端伸出治具,顶针在待键合微发光装置端为与待键合微发光装置的待分离点对应的接触端,各顶针依据待分离点具有适当的斜率;
利于顶针的接触端与待键合微发光装置的待分离点接触,并向待键合微发光装置施加与基架的分离力以及键合到封装基板的键合力。
在该键合方法中,对微发光装置对应的封装基板待键合位置进行激光照射。
在一些实施方式中,键合方法通过设定顶针状态对若干规格的微发光装置进行选择性的键合。
根据该实施方式,设定顶针状态包括设定顶针数量、形状、间距、长度或者倾斜角度。
本发明的其它特征和优点将在随后的说明书中阐述,并且,部分地从说明书中变得显而易见,或者通过实施本发明而了解。本发明的目的和其他优点可通过在说明书、权利要求书以及附图中所特别指出的结构来实现和获得。
附图说明
附图用来提供对本发明的进一步理解,并且构成说明书的一部分,与本发明的实施例一起用于解释本发明,并不构成对本发明的限制。此外,附图数据是描述概要,不是按比例绘制。
图1~2为本发明的键合治具示意图;
图3~4为本发明的键合设备对排列较紧密的微发光装置进行键合的示意图;
图5为本发明的一种弹簧针的示意图;
图6为本发明弹簧针与顶针的配合示意图;
图7~图9为本发明的键合设备选择性地对微发光装置进行键合的示意图;
附图标示:100、多孔板,110、穿孔,120、定位孔,200、微发光装置,210、红光微发光装置,220、绿光微发光装置,230、蓝光微发光装置,300、顶针,310、端部,400、基架,410、待分离点,500、基板,600、针床,610、弹簧针。
具体实施方式
下面便结合附图对本发明若干具体实施例作进一步的详细说明。但以下关于实施例的描述及说明对本发明保护范围不构成任何限制。
应当理解,本发明所使用的术语仅出于描述具体实施方式的目的,而不是旨在限制本发明。进一步理解,当在本发明中使用术语“包含”、"包括"时,用于表明陈述的特征、整体、步骤、组件、和/或封装件的存在,而不排除一个或多个其他特征、整体、步骤、组件、封装件、和/或它们的组合的存在或增加。
除另有定义之外,本发明所使用的所有术语(包括技术术语和科学术语)具有与本发明所属领域的普通技术人员通常所理解的含义相同的含义。应进一步理解,本发明所使用的术语应被理解为具有与这些术语在本说明书的上下文和相关领域中的含义一致的含义,并且不应以理想化或过于正式的意义来理解,除本发明中明确如此定义之外。
由于微发光装置排布紧密,现有设备难以高效地对其进行键合工艺,本发明提供一种键合治具,主要用于将复数个待键合微发光装置键合到封装基板上,微发光装置主要是由微发光二极管组成的。
参看图1,包括若干块多孔板100,多孔板100设有穿孔110以容置依据待键合微发光装置200待分离点设置的顶针300,顶针300在待键合微发光装置端伸出治具,顶针300在待键合微发光装置端为与待键合微发光装置200的待分离点410对应的接触端,通过调整多孔板100的穿孔110位置设置以及多孔板100之间不同的间距,实现各顶针300依据待分离点410具有适当的斜率,即顶针具有斜角α。
在本发明中,远离接触端的多孔板穿孔110外缘具有容设顶针端部310的定位孔120,顶针300从定位孔120伸出,端部310起到承受压力的作用,通过端部310将压力传导给顶针300,再通过顶针300向微发光装置200提供与400基架分离的分离力。
定位孔120深度或位置皆可以依据所容置顶针300的斜率大小而定,使待键合微发光装置端的顶针300具有相同出针长度,相同出针长度,可以较佳地向同一水平面微发光装置200传递键合所需的作用力。
该键合治具的顶针端部310包括平面、曲面或球面等有利于稳定地接收、传递作用力的形状,本发明优选采用为球状端部。
在一些实施例中,本实施例在前述主要采取顶针300与多孔板100可分离设计的技术方案的基础上提出另一种变形方案,在本实施例中将所有顶针300的一端固定在多孔板100上,本实施例的键合治具仅通过多孔板100受力既可以向顶针300施加作用力,也可以避免部件过于零散导致的工作效率偏低。
参看图2,顶针300依据待分离点410设置的斜率不同,在待分离点410间距较小即微发光装置200紧密排布的情况下,顶针300相对于水平面的斜角α可以小于90°,而在待分离点410间距较大、微发光装置200排布较疏松的情况下,顶针300相对于水平面的斜角α可以大于90°,即本发明可以根据微发光装置200的排布情况,设置不同的顶针斜角。
本发明将上述键合治具应用到键合设备中,键合设备包括了上述键合治具,键合设备可以具有多套替换使用的键合治具,键合治具可以通过多孔板100固定在键合设备中,也可以通过其他常规技术手段与键合设备连接。
参看图3,键合治具至少由若干块多孔板100组成,多孔板100设有穿孔110以容置依据待键合微发光装置待分离点410设置的顶针,顶针在待键合微发光装置端伸出治具,顶针300在待键合微发光装置端为与待键合微发光装置的待分离点410对应的接触端,各顶针300依据待分离点410具有适当的斜率。
在该键合设备中,各顶针300依据待分离点410具有的斜率不同,则顶针300具有不同的倾斜斜角α。
键合设备具有的若干套键合治具,键合治具根据倾斜斜角α的不同,可以替换使用,替换下来的键合治具也可以再进行斜率调整。基于上述技术方案,作为本发明的技术效果之一,键合设备采用可以替换的键合治具,用以满足不同间距的微发光装置200与基板500的键合需求,在制作微发光装置过程中,不需要多套不同尺寸的键合设备,提高生产效率、降低生产成本。
在本发明的一些实施方式中,远离接触端的多孔板穿孔110外缘具有容设顶针端部的定位孔120,顶针300从定位孔120伸出。
定位孔120深度或位置依据所容置顶针的斜率大小而定,使待键合微发光装置端的顶针300具有相同出针长度。
在一些实施例中,远离接触端设置有针床600,针床600具有与顶针300匹配的弹簧针610,弹簧针610的设计起到一定的缓冲作用,避免与微发光装置200刚性碰撞,造成微发光装置200的损坏。
待键合微发光装置200键合前位于基架400上。基架400作为待键合微发光装置200的承载体,材料主要包括蓝膜、BCB胶、硅胶、树脂等利于固定微发光装置200的材料。
参看图4,本发明提出了一种实施例,在本实施例中,为了加快微发光装置键合效率,提高微发光装置200和封装基板500的键合效果,本实施例在封装基板500一侧设置有激光发生装置,激光发生装置对封装基板500上微发光装置200对应的待键合区域进行激光照射。激光照射的作用包括改变封装基板500的物理态或化学态,从而利于微发光装置200键合。根据该实施例也可以采用其他加热方式作为激光的替代手段。
基于上述的键合治具及键合设备,本发明提供了一种微发光装置的键合方法,用于将复数个待键合微发光装置200键合到封装基板500上,包括以下步骤:
首先,提供固定在基架400上的复数个待键合微发光装置200以及与基架400上待键合微发光装置200分布间距对应的键合治具,键合治具至少由若干块多孔板100组成,多孔板100设有穿孔110以容置依据待键合微发光装置待分离点410设置的顶针300,顶针300在待键合微发光装置端伸出治具,顶针300在待键合微发光装置端为与待键合微发光装置的待分离点410对应的接触端,各顶针依据待分离点具410有适当的斜率;
利于顶针300的接触端与待键合微发光装置的待分离点410接触,并向待键合微发光装置200施加与基架400的分离力以及键合到封装基板500的键合力。
在一些实施例中,这些实施例利用具有与顶针300匹配的弹簧针610的针床600向顶针300施加压力,弹簧针610与顶针300接触端端部具有对应设计,以更佳地传导压力,顶针300通过压力将微发光装置200从基架400上分离并键合到封装基板500上。当然根据实际情况,也可以选择其他压力机构对顶针300施加作用力。
参看图5和图6,端部310的形状包括平面、曲面或球面,主要为了有利于针床600的弹簧针610向顶针300传递压力。
在一些实施例中,弹簧针610与端部310匹配对应的弹簧针针头部分具有内陷的凹槽,在该些实施例的基础上,凹槽外缘设计为齿状或者其他凸状,以更好地与端部310进行匹配,保证无论顶针300的具有怎样大小倾斜斜角,都可以良好地与弹簧针610对接。
在上述的键合方法中,对微发光装置200对应的封装基板500待键合位置进行激光照射,激光照射主要起到快捷键合进程的作用,例如对微发光装置200的电极与封装基板的金属接触部进行激光加热,相对于其他加热方式更适合于微发光装置等的微器件键合工艺。
在显示器的微发光装置应用键合中,惯常需要分别将多种波长的微发光装置200分批次键合到封装基板500上,本发明的键合治具与键合设备提供解决上述需求的方案,可以通过在键合治具仅保留对应间距与数量的顶针300,或者也可以通过调整顶针角度,用以实现顶针300对目标批次的微发光装置200进行转移的目的。
参看图7~图9,再通过调整键合治具或多组键合治具配合的方式分批次将各波长的微发光装置键合到封装基板500上。在一种具体实例中,提供承载红光微发光装置210的基架400,利用键合设备先将基架400上全部或者部分依据目标间距选取的红光微发光装置210键合到封装基板500上、再利用键合设备依照类似方案分别将绿光微发光装置220和蓝光微发光装置230键合到封装基板500上,从而在封装基板500上键合RGB红绿蓝三元素组成的微发光装置矩阵。除了应用在具有波长变化的微发光装置组合,本发明的键合治具、键合设备也适合于其他选择性键合或者不同间距微发光装置键合的应用。
以上所述仅是本发明的优选实施方式,应当指出,对于本技术领域的技术人员,在不脱离本发明原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也应视为本发明的保护范围。
Claims (11)
1.微发光装置的键合设备,其特征在于,包括键合治具,键合治具至少由若干块多孔板组成,多孔板设有穿孔以容置依据待键合微发光装置待分离点设置的顶针,顶针在待键合微发光装置端伸出治具,顶针在待键合微发光装置端为与待键合微发光装置的待分离点对应的接触端,各顶针依据待分离点具有适当的斜率,顶针用于同时将复数个待键合微发光装置键合到封装基板上,远离接触端的多孔板穿孔外缘具有容设顶针端部的定位孔,顶针从定位孔伸出,远离接触端设置有针床,针床具有与顶针匹配的弹簧针,弹簧针与顶针匹配的一端设有外缘凸出、内部内陷的凹槽,所述顶针端部包括平面或曲面,各顶针依据待分离点具有的斜率不同,则顶针具有不同的倾斜角度。
2.根据权利要求1所述的微发光装置的键合设备,其特征在于:键合设备具有若干套键合治具。
3.根据权利要求1所述的微发光装置的键合设备,其特征在于:定位孔深度或位置依据所容置顶针的斜率大小而定,使待键合微发光装置端的顶针具有相同出针长度。
4.根据权利要求1所述的微发光装置的键合设备,其特征在于:待键合微发光装置键合前位于基架上。
5.根据权利要求4所述的微发光装置的键合设备,其特征在于:基架包括蓝膜、BCB胶、硅胶或者树脂。
6.根据权利要求1所述的微发光装置的键合设备,其特征在于:封装基板一侧设置有激光发生装置,激光发生装置对封装基板上微发光装置对应的待键合区域进行激光照射。
7.根据权利要求6所述的微发光装置的键合设备,其特征在于:激光照射的作用包括改变封装基板物理态或化学态,从而利于微发光装置键合。
8.一种微发光装置的键合方法,用于将复数个待键合微发光装置键合到封装基板上,包括以下步骤:
(1)提供固定在基架上的复数个待键合微发光装置以及键合治具,键合治具至少由若干块多孔板组成,多孔板设有穿孔以容置依据待键合微发光装置待分离点设置的顶针,顶针在待键合微发光装置端伸出治具,顶针在待键合微发光装置端为与待键合微发光装置的待分离点对应的接触端,各顶针依据待分离点具有适当的斜率;远离接触端的多孔板穿孔外缘具有容设顶针端部的定位孔,顶针从定位孔伸出,远离接触端设置有针床,针床具有与顶针匹配的弹簧针,弹簧针与顶针匹配的一端设有外缘凸出、内部内陷的凹槽,所述顶针端部包括平面或曲面;
(2)利于顶针的接触端与待键合微发光装置的待分离点接触,并向待键合微发光装置施加与基架的分离力以及键合到封装基板的键合力,顶针用于同时将复数个待键合微发光装置键合到封装基板上。
9.根据权利要求8所述的一种微发光装置的键合方法,其特征在于:在步骤(2)分离时,对微发光装置对应的封装基板待键合位置进行激光照射。
10.根据权利要求8所述的一种微发光装置的键合方法,其特征在于:键合方法通过设定顶针状态对若干规格的微发光装置进行选择性的键合。
11.根据权利要求10所述的一种微发光装置的键合方法,其特征在于:设定顶针状态包括设定顶针数量、形状、间距、长度或者倾斜角度。
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CN201251619Y (zh) * | 2008-08-18 | 2009-06-03 | 自然兴电通科技股份有限公司 | 印刷电路板测试治具改良结构 |
CN102064264A (zh) * | 2009-11-17 | 2011-05-18 | 亿光电子工业股份有限公司 | 发光二极管封装方法 |
CN104701282A (zh) * | 2013-12-10 | 2015-06-10 | 英飞凌科技股份有限公司 | 芯片、芯片封装和管芯 |
CN205845911U (zh) * | 2016-07-18 | 2016-12-28 | 厦门市三安光电科技有限公司 | 一种顶针座 |
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CN114447163B (zh) | 2024-05-03 |
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