CN109609073A - 粘接剂组合物和连接体 - Google Patents

粘接剂组合物和连接体 Download PDF

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Publication number
CN109609073A
CN109609073A CN201811479821.2A CN201811479821A CN109609073A CN 109609073 A CN109609073 A CN 109609073A CN 201811479821 A CN201811479821 A CN 201811479821A CN 109609073 A CN109609073 A CN 109609073A
Authority
CN
China
Prior art keywords
circuit
adhesive
film
methyl
adhesive composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811479821.2A
Other languages
English (en)
Chinese (zh)
Inventor
工藤直
藤绳贡
伊藤彰浩
森尻智树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of CN109609073A publication Critical patent/CN109609073A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Inorganic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN201811479821.2A 2013-10-16 2014-10-15 粘接剂组合物和连接体 Pending CN109609073A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013-215763 2013-10-16
JP2013215763 2013-10-16
CN201410546529.3A CN104559898A (zh) 2013-10-16 2014-10-15 粘接剂组合物和连接体

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201410546529.3A Division CN104559898A (zh) 2013-10-16 2014-10-15 粘接剂组合物和连接体

Publications (1)

Publication Number Publication Date
CN109609073A true CN109609073A (zh) 2019-04-12

Family

ID=53036679

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201811479821.2A Pending CN109609073A (zh) 2013-10-16 2014-10-15 粘接剂组合物和连接体
CN201410546529.3A Pending CN104559898A (zh) 2013-10-16 2014-10-15 粘接剂组合物和连接体

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201410546529.3A Pending CN104559898A (zh) 2013-10-16 2014-10-15 粘接剂组合物和连接体

Country Status (4)

Country Link
JP (3) JP2015098575A (enrdf_load_stackoverflow)
KR (2) KR102321167B1 (enrdf_load_stackoverflow)
CN (2) CN109609073A (enrdf_load_stackoverflow)
TW (1) TW201525096A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111334198A (zh) * 2020-03-27 2020-06-26 顺德职业技术学院 Uv双组份双固化型结构胶

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108291114A (zh) * 2015-11-25 2018-07-17 日立化成株式会社 电路连接用粘接剂组合物和结构体
TWI761477B (zh) * 2017-03-30 2022-04-21 日商太陽油墨製造股份有限公司 導電性接著劑、硬化物、電子零件及電子零件之製造方法
CN111286005B (zh) * 2020-04-13 2021-09-10 江苏和和新材料股份有限公司 一种功能性热塑性聚氨酯及其制备方法
JP7537218B2 (ja) * 2020-10-08 2024-08-21 株式会社レゾナック 回路接続用接着剤フィルム、回路接続構造体及びその製造方法
JP2023093842A (ja) * 2021-12-23 2023-07-05 東洋インキＳｃホールディングス株式会社 配線シート
WO2025089237A1 (ja) * 2023-10-24 2025-05-01 株式会社レゾナック 接着剤組成物、接続構造体、及び接続構造体の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008195852A (ja) * 2007-02-14 2008-08-28 Hitachi Chem Co Ltd フィルム状接着剤組成物及びこの組成物を用いた回路端子の接続構造体
WO2009057376A1 (ja) * 2007-10-29 2009-05-07 Hitachi Chemical Company, Ltd. 回路接続材料、接続構造体及びその製造方法
JP2010248455A (ja) * 2009-04-20 2010-11-04 Bridgestone Corp チオール基含有接着性樹脂組成物
CN102763283A (zh) * 2010-11-09 2012-10-31 索尼化学&信息部件株式会社 各向异性导电膜

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2610900B2 (ja) 1987-10-27 1997-05-14 ソニーケミカル 株式会社 熱硬化型異方性導電接着シート及びその製造方法
AU6520798A (en) 1997-03-31 1998-10-22 Hitachi Chemical Company, Ltd. Circuit connecting material, and structure and method of connecting circuit terminal
JP5140996B2 (ja) * 2006-08-29 2013-02-13 日立化成工業株式会社 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置
CN102199404B (zh) * 2007-05-09 2013-12-04 日立化成株式会社 膜状电路连接材料及电路部件的连接结构
JP2011057870A (ja) * 2009-09-10 2011-03-24 Aica Kogyo Co Ltd 樹脂組成物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008195852A (ja) * 2007-02-14 2008-08-28 Hitachi Chem Co Ltd フィルム状接着剤組成物及びこの組成物を用いた回路端子の接続構造体
WO2009057376A1 (ja) * 2007-10-29 2009-05-07 Hitachi Chemical Company, Ltd. 回路接続材料、接続構造体及びその製造方法
JP2010248455A (ja) * 2009-04-20 2010-11-04 Bridgestone Corp チオール基含有接着性樹脂組成物
CN102763283A (zh) * 2010-11-09 2012-10-31 索尼化学&信息部件株式会社 各向异性导电膜

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111334198A (zh) * 2020-03-27 2020-06-26 顺德职业技术学院 Uv双组份双固化型结构胶
CN111334198B (zh) * 2020-03-27 2021-10-15 顺德职业技术学院 Uv双组份双固化型结构胶

Also Published As

Publication number Publication date
KR102321167B1 (ko) 2021-11-02
JP2020109173A (ja) 2020-07-16
TW201525096A (zh) 2015-07-01
JP2019019333A (ja) 2019-02-07
CN104559898A (zh) 2015-04-29
JP2015098575A (ja) 2015-05-28
KR102478959B1 (ko) 2022-12-16
KR20150044403A (ko) 2015-04-24
KR20210134875A (ko) 2021-11-11
JP7014236B2 (ja) 2022-02-01

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Address after: Tokyo, Japan

Applicant after: Lishennoco Co.,Ltd.

Address before: Tokyo, Japan

Applicant before: HITACHI CHEMICAL Co.,Ltd.

RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20190412