CN109592472B - IC paper tape cutting mechanism - Google Patents

IC paper tape cutting mechanism Download PDF

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Publication number
CN109592472B
CN109592472B CN201811483880.7A CN201811483880A CN109592472B CN 109592472 B CN109592472 B CN 109592472B CN 201811483880 A CN201811483880 A CN 201811483880A CN 109592472 B CN109592472 B CN 109592472B
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CN
China
Prior art keywords
cylinder
paper tape
feeding
seat
tail end
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Active
Application number
CN201811483880.7A
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Chinese (zh)
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CN109592472A (en
Inventor
杨平
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Jiangsu Fenghesheng Intelligent Technology Co ltd
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Jiangsu Fenghesheng Intelligent Technology Co ltd
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Priority to CN201811483880.7A priority Critical patent/CN109592472B/en
Publication of CN109592472A publication Critical patent/CN109592472A/en
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H35/00Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
    • B65H35/04Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers from or with transverse cutters or perforators
    • B65H35/06Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers from or with transverse cutters or perforators from or with blade, e.g. shear-blade, cutters or perforators
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00Handled material; Storage means
    • B65H2701/10Handled articles or webs
    • B65H2701/11Dimensional aspect of article or web
    • B65H2701/113Size
    • B65H2701/1133Size of webs

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  • Making Paper Articles (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

The invention discloses an IC paper tape cutting mechanism, which comprises an IC paper tape feeding mechanism, an IC paper tape cutting die and an IC positioning mechanism, wherein the IC paper tape feeding mechanism is used for conveying an IC paper tape, the IC paper tape cutting die is used for cutting off the joint of an IC chip and the paper tape, and the IC positioning mechanism is used for clamping the IC chip; the IC paper tape feeding mechanism comprises a fixed seat, a paper tape guide plate is arranged above the fixed seat, a first cylinder is arranged outside the fixed seat, a first pair of linear guide rails is arranged at the tail part of the inner side of the fixed seat, the tail end of a second cylinder is connected with a feeding bolt for lifting the feeding bolt, the tail end of the first cylinder is connected with a feeding push block, and the feeding push block is fixed on a feeding bolt seat and used for pushing the feeding push block to drive the feeding bolt seat to reciprocate on the first pair of linear guide rails; the front part of the inner side of the fixed seat is provided with a positioning bolt seat, and the tail end of the third cylinder is connected with a positioning bolt. The invention is more compact, has good stability and strong compatibility.

Description

IC paper tape cutting mechanism
Technical Field
The invention relates to an IC paper tape cutting mechanism, and belongs to the technical field of chip automatic manufacturing equipment.
Background
At present, in the speed sensor automatic assembly production line, the qualification rate and the stability of an IC assembly station are important, and an IC paper tape cutting mechanism is a core part in the IC assembly station, so whether the IC paper tape cutting mechanism is reasonable is self-evident to the importance of the speed sensor automatic assembly production line.
The existing IC paper tape cutting mechanism is complex, has poor universality and cannot be compatible with the assembly of different sensors.
Disclosure of Invention
The purpose is as follows: in order to overcome the defects in the prior art, the invention provides an IC paper tape cutting mechanism.
The technical scheme is as follows: in order to solve the technical problems, the invention adopts the following technical scheme:
the IC paper tape cutting mechanism comprises an IC paper tape feeding mechanism, an IC paper tape cutting die and an IC positioning mechanism, wherein the IC paper tape feeding mechanism is used for conveying an IC paper tape, the IC paper tape cutting die is used for cutting off the joint of an IC chip and the paper tape, and the IC positioning mechanism is used for clamping the IC chip; the IC paper tape feeding mechanism comprises a fixed seat, a paper tape guide plate is arranged above the fixed seat, a first cylinder is arranged outside the fixed seat, a first pair of linear guide rails is arranged at the tail part of the inner side of the fixed seat, a feeding bolt seat is arranged on the first pair of linear guide rails, a second cylinder is arranged on the feeding bolt seat, the tail end of the second cylinder is connected with a feeding bolt for lifting the feeding bolt, the tail end of the first cylinder is connected with a feeding push block, and the feeding push block is fixed on the feeding bolt seat and used for pushing the feeding push block to drive the feeding bolt seat to reciprocate on the first pair of linear guide rails; a positioning bolt seat is arranged at the front part of the inner side of the fixed seat, a third cylinder is arranged on the positioning bolt seat, and the tail end of the third cylinder is connected with a positioning bolt; the top of the paper tape guide plate is detachably provided with a paper tape cover plate through a knob.
Preferably, the rear end of the paper tape guide plate is connected with a paper tape bracket.
As the preferred scheme, IC paper tape cutting die includes the mechanism base, is equipped with the mould bottom plate on the mechanism base, is equipped with the die holder on the mould bottom plate, and the die holder lower extreme is equipped with the lower cutting die, and the die holder upper end is equipped with the cutting die, and the die holder top is equipped with the fourth cylinder, and the fourth cylinder end is connected with the cutting die through floating joint, and the last cutting die end is provided with compression spring, and compression spring is connected with the briquetting, and the briquetting is connected with the cutting die through the briquetting apron.
As a preferred scheme, the IC positioning mechanism comprises a fifth cylinder fixing seat, a fifth cylinder is arranged on the fifth cylinder fixing seat, the tail end of the fifth cylinder is connected with a sixth cylinder fixing seat, a sixth cylinder is arranged on the sixth cylinder fixing seat, the tail end of the sixth cylinder is connected with one end of a cylinder head connecting piece, a chute seat is arranged at the top of the sixth cylinder fixing seat, a sliding block is arranged on the chute seat, and one end of the sliding block is connected with the other end of the cylinder head connecting piece; the sliding block is internally provided with a hook block, the tail end of the hook block is provided with a compression spring, and the top of the sliding block is provided with a cover plate; a seventh air cylinder connecting plate is arranged on the opposite side of the sixth air cylinder fixing seat and is connected with the tail end of an eighth air cylinder fixed on the eighth air cylinder fixing seat, a seventh air cylinder is arranged above the seventh air cylinder connecting plate, a finger air cylinder is arranged on the seventh air cylinder, clamping jaws are arranged at the tail end of the finger air cylinder, and a hook block is arranged between the clamping jaws.
Preferably, the rear end of the paper tape guide plate is provided with a proximity sensor for detecting whether the paper tape IC is provided with materials or not.
Preferably, a laser sensor 29 is disposed on one side of the die holder 21 for detecting whether the cutting position IC is a material.
The beneficial effects are that: the IC paper tape cutting mechanism provided by the invention can realize the process of automatic feeding and cutting of the IC paper tape. Economical, practical and reliable in performance. Compared with the prior art, the method is more compact, good in stability and strong in compatibility.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic diagram of an IC tape feed mechanism of the present invention;
FIG. 3 is a schematic diagram of an IC tape cutting die according to the present invention;
fig. 4 is a schematic structural view of the IC positioning mechanism of the present invention.
Detailed Description
The invention will be further described with reference to the accompanying drawings.
As shown in fig. 1, an IC paper tape feeding mechanism includes: an IC paper tape feeding mechanism 1, an IC paper tape cutting die 2 and an IC positioning mechanism 3.
As shown in fig. 2, the IC paper tape feeding mechanism 1 includes a fixing base 4, a paper tape guide plate 5, a paper tape cover plate 6, a paper tape bracket 7, a knob 8, a first cylinder 9, a feeding push block 10, a second cylinder 11, a feeding plug pin 12, a feeding plug pin seat 13, a first auxiliary linear guide rail 14, a third cylinder 15, a positioning plug pin 16 and a positioning plug pin seat 17, wherein the paper tape guide plate 5 is arranged above the fixing base 4, the paper tape cover plate 6 is arranged on the paper tape guide plate 5, the first cylinder 9 is arranged outside the fixing base 4, the first auxiliary linear guide rail 14 is arranged at the tail part of the inner side of the fixing base 4, the second cylinder 11 and the feeding plug pin seat 13 are arranged on the first auxiliary linear guide rail 14, the feeding plug pin 12 is arranged in the feeding plug pin seat 13, the first cylinder 9 and the feeding plug pin seat 13 are connected through the feeding push block 10, the positioning plug pin seat 17 is arranged at the front part of the inner side of the fixing base 4, and the third cylinder 15 and the positioning plug pin 16 are arranged on the positioning plug pin seat 17. The tail part of the IC paper tape feeding mechanism 1 is provided with a proximity sensor 18 for detecting whether the paper tape IC is fed or not.
As shown in fig. 3, the IC paper tape cutting die 2 includes a mechanism base 19, a die bottom plate 20, a die holder 21, a lower die 22, an upper die 23, a floating joint 24, a fourth air cylinder 25, a pressing block 26, a pressing block cover plate 27 and a compression spring 28, wherein the die bottom plate 20 is arranged on the mechanism base 19, the die holder 21 is arranged on the die bottom plate 20, the lower die 23 is arranged at the lower end of the die holder 21, the upper die 23 is arranged at the upper end of the die holder 21, the fourth air cylinder 25 is arranged at the top of the die holder 21, the upper die 22 and the fourth air cylinder 25 are connected through the floating joint 24, the pressing block 26 is arranged on the upper die 23, the pressing block cover plate 27 is arranged on the upper die 23 to press the pressing block 26, and the pressing block 26 is pressed by the spring 28 to realize floating; the fourth cylinder 25 is operated to realize the operation of the upper die 23, thereby cutting the IC paper tape. A laser sensor 29 is provided on one side of the die holder 21 to detect whether the cutting position IC is filled with material.
As shown in fig. 4, the IC positioning mechanism 3 includes a fifth cylinder 30, a fifth cylinder fixing seat 31, a sixth cylinder 32, a sixth cylinder fixing seat 33, a cylinder head connector 34, a slider 35, a chute seat 36, a hook block 37, a compression spring 38, a cover 39, a seventh cylinder 40, a clamping jaw 41, a seventh cylinder connecting plate 42, an eighth cylinder 43 and an eighth cylinder fixing seat 44, wherein the fifth cylinder 30 is arranged on the fifth cylinder fixing seat 31, the sixth cylinder fixing seat 33 is arranged on the fifth cylinder 30, the sixth cylinder 32 is arranged on the sixth cylinder fixing seat 33, the chute seat 36 is arranged on the sixth cylinder fixing seat 33, the slider 35 and the sixth cylinder 32 are connected through the cylinder head connector 34, the hook block 37 is arranged in the slider 35, the compression spring 38 is arranged between the hook block 37 and the slider 35, the cover 39 is arranged on the slider 35, the clamping jaw 41 is arranged on the seventh cylinder 40, the seventh cylinder 40 is arranged on the seventh cylinder fixing seat 42, the seventh cylinder connecting plate 42 is arranged on the eighth cylinder 43, and the eighth cylinder 43 is arranged on the eighth cylinder fixing seat 44; the sixth cylinder 32 and the seventh cylinder 40 are used in combination to realize positioning before cutting the IC.
The IC paper tape cutting mechanism comprises the following operation processes: firstly, the knob 8 is unscrewed manually, the paper tape cover plate 6 is taken down, the IC paper tape is placed on the paper tape guide plate 5, the paper tape cover plate 6 is covered, and the knob 8 is screwed. The proximity sensor 18 detects that the paper tape IC sends out a signal, the second cylinder 11 pushes the feeding plug 12 into the paper tape hole, the third cylinder 15 pushes the positioning plug 16 out of the paper tape, the first cylinder 9 pushes the upper cutter die 23 further before pushing the paper tape by the feeding push block 10, the third cylinder 15 pushes the positioning plug 16 into the paper tape hole, the second cylinder 11 pulls the feeding plug 12 out of the paper tape, the first cylinder 9 withdraws the feeding plug 12 by the feeding push block 10, the laser sensor 29 detects that the paper tape IC sends out a signal, the fifth cylinder 30 and the eighth cylinder 43 extend simultaneously, the IC positioning mechanism 3 is lifted, the seventh cylinder 40 clamps the clamping jaw 41 to fix the IC in the left-right direction, the sixth cylinder extends to clamp the IC by the hooking block 37, the IC is fixed in the front-back direction, the fourth cylinder 25 pushes the upper cutter die 23 to move downwards to cut off the IC (the pressing block 26 compresses the IC by the spring 28 before cutting the IC), the cut-off IC is taken out by the robot, the fourth cylinder 25 lifts the upper cutter die 23 back to the original position, the seventh cylinder 40 releases the clamping jaw 41, the sixth cylinder retracts the clamping jaw 37, and the fifth cylinder 30 and eighth cylinder 43 retracts simultaneously. This is repeated until the proximity sensor 18 detects no tape IC, the knob 8 is manually unscrewed, the tape cover 6 is removed, and the IC tape is removed and slid into the tape waste box.
The foregoing is only a preferred embodiment of the invention, it being noted that: it will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the principles of the present invention, and such modifications and adaptations are intended to be comprehended within the scope of the invention.

Claims (4)

1. An IC paper tape cutting mechanism, characterized in that: the IC paper tape cutting device comprises an IC paper tape feeding mechanism, an IC paper tape cutting die and an IC positioning mechanism, wherein the IC paper tape feeding mechanism is used for conveying an IC paper tape, the IC paper tape cutting die is used for cutting off the joint of an IC chip and the paper tape, and the IC positioning mechanism is used for clamping the IC chip; the IC paper tape feeding mechanism comprises a fixed seat, a paper tape guide plate is arranged above the fixed seat, a first cylinder is arranged outside the fixed seat, a first pair of linear guide rails is arranged at the tail part of the inner side of the fixed seat, a feeding bolt seat is arranged on the first pair of linear guide rails, a second cylinder is arranged on the feeding bolt seat, the tail end of the second cylinder is connected with a feeding bolt for lifting the feeding bolt, the tail end of the first cylinder is connected with a feeding push block, and the feeding push block is fixed on the feeding bolt seat and used for pushing the feeding push block to drive the feeding bolt seat to reciprocate on the first pair of linear guide rails; a positioning bolt seat is arranged at the front part of the inner side of the fixed seat, a third cylinder is arranged on the positioning bolt seat, and the tail end of the third cylinder is connected with a positioning bolt; the top of the paper tape guide plate is detachably provided with a paper tape cover plate through a knob;
the IC positioning mechanism comprises a fifth cylinder fixing seat, a fifth cylinder is arranged on the fifth cylinder fixing seat, the tail end of the fifth cylinder is connected with a sixth cylinder fixing seat, a sixth cylinder is arranged on the sixth cylinder fixing seat, the tail end of the sixth cylinder is connected with one end of a cylinder head connecting piece, a chute seat is arranged at the top of the sixth cylinder fixing seat, a sliding block is arranged on the chute seat, and one end of the sliding block is connected with the other end of the cylinder head connecting piece; the sliding block is internally provided with a hook block, the tail end of the hook block is provided with a compression spring, and the top of the sliding block is provided with a cover plate; a seventh cylinder connecting plate is arranged on the opposite side of the sixth cylinder fixing seat and is connected with the tail end of an eighth cylinder fixed on the eighth cylinder fixing seat, a seventh cylinder is arranged above the seventh cylinder connecting plate, a finger cylinder is arranged on the seventh cylinder, clamping jaws are arranged at the tail end of the finger cylinder, and a hook block is arranged between the clamping jaws;
and the rear end of the paper tape guide plate is provided with a proximity sensor for detecting whether the paper tape IC is provided with materials or not.
2. The IC tape cutting mechanism of claim 1, wherein: the rear end of the paper tape guide plate is connected with a paper tape bracket.
3. The IC tape cutting mechanism of claim 1, wherein: the IC paper tape cutting die comprises a mechanism base, a die bottom plate is arranged on the mechanism base, a die holder is arranged on the die bottom plate, a lower cutting die is arranged at the lower end of the die holder, an upper cutting die is arranged at the upper end of the die holder, a fourth cylinder is arranged at the top of the die holder, the tail end of the fourth cylinder is connected with the upper cutting die through a floating joint, a compression spring is arranged at the tail end of the upper cutting die, a pressing block is connected with the compression spring, and the pressing block is connected with the upper cutting die through a pressing block cover plate.
4. The IC tape cutting mechanism of claim 3, wherein: and one side of the die holder is provided with a laser sensor for detecting whether the IC at the cutting position is provided with materials or not.
CN201811483880.7A 2018-12-06 2018-12-06 IC paper tape cutting mechanism Active CN109592472B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811483880.7A CN109592472B (en) 2018-12-06 2018-12-06 IC paper tape cutting mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811483880.7A CN109592472B (en) 2018-12-06 2018-12-06 IC paper tape cutting mechanism

Publications (2)

Publication Number Publication Date
CN109592472A CN109592472A (en) 2019-04-09
CN109592472B true CN109592472B (en) 2024-02-27

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ID=65961156

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811483880.7A Active CN109592472B (en) 2018-12-06 2018-12-06 IC paper tape cutting mechanism

Country Status (1)

Country Link
CN (1) CN109592472B (en)

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB790362A (en) * 1954-06-11 1958-02-05 Tom Rowlands Improvements in sheet feeding mechanism
JP2008307602A (en) * 2007-05-15 2008-12-25 Amada Co Ltd Method and device for discharging product
CN201741976U (en) * 2010-06-10 2011-02-09 安费诺商用电子产品(成都)有限公司 Air cylinder mechanism for realizing clipping, cutting and inserting of two groups of terminals
JP2011025378A (en) * 2009-07-28 2011-02-10 Oji Paper Co Ltd Method for cutting paper with built-in ic chip
CN202695956U (en) * 2012-07-11 2013-01-23 成都宝利根科技有限公司 Movable accurate contact pin conveying mechanism of automatic contact pin machine
CN103480729A (en) * 2012-06-13 2014-01-01 昆山德盛精密模具有限公司 In-die riveting die of multi-position high-accuracy hardware bending piece
CN103552873A (en) * 2013-11-07 2014-02-05 昆山美连德电子科技有限公司 Automatic winding displacement fixed length cutting machine
CN103606795A (en) * 2013-11-04 2014-02-26 昆山博思达自动化设备科技有限公司 High-speed needle insertion apparatus
CN203589425U (en) * 2013-11-04 2014-05-07 昆山博思达自动化设备科技有限公司 High-speed contact pin device
CN104084499A (en) * 2014-06-25 2014-10-08 安徽飞翔电器有限公司 Automatic feeding and discharging control device
CN204182751U (en) * 2014-09-11 2015-03-04 昆山金群力精密模具有限公司 Sheet material cutting apparatus
CN205600004U (en) * 2016-05-11 2016-09-28 歌尔股份有限公司 Steel sheet cuts foresees garbage collection device
CN205675870U (en) * 2016-05-10 2016-11-09 苏州盟川自动化科技有限公司 A kind of automatic feeding of winding material
CN207952443U (en) * 2018-03-23 2018-10-12 苏州嘉东五金制品有限公司 Continuous feeding device in mould in being produced for knife net
CN209701959U (en) * 2018-12-06 2019-11-29 昆山市烽禾升精密机械有限公司 IC paper tape guillotine structure

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8371197B2 (en) * 2010-09-03 2013-02-12 Cheng Uei Precision Industry Co., Ltd. Cutting equipment

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB790362A (en) * 1954-06-11 1958-02-05 Tom Rowlands Improvements in sheet feeding mechanism
JP2008307602A (en) * 2007-05-15 2008-12-25 Amada Co Ltd Method and device for discharging product
JP2011025378A (en) * 2009-07-28 2011-02-10 Oji Paper Co Ltd Method for cutting paper with built-in ic chip
CN201741976U (en) * 2010-06-10 2011-02-09 安费诺商用电子产品(成都)有限公司 Air cylinder mechanism for realizing clipping, cutting and inserting of two groups of terminals
CN103480729A (en) * 2012-06-13 2014-01-01 昆山德盛精密模具有限公司 In-die riveting die of multi-position high-accuracy hardware bending piece
CN202695956U (en) * 2012-07-11 2013-01-23 成都宝利根科技有限公司 Movable accurate contact pin conveying mechanism of automatic contact pin machine
CN203589425U (en) * 2013-11-04 2014-05-07 昆山博思达自动化设备科技有限公司 High-speed contact pin device
CN103606795A (en) * 2013-11-04 2014-02-26 昆山博思达自动化设备科技有限公司 High-speed needle insertion apparatus
CN103552873A (en) * 2013-11-07 2014-02-05 昆山美连德电子科技有限公司 Automatic winding displacement fixed length cutting machine
CN104084499A (en) * 2014-06-25 2014-10-08 安徽飞翔电器有限公司 Automatic feeding and discharging control device
CN204182751U (en) * 2014-09-11 2015-03-04 昆山金群力精密模具有限公司 Sheet material cutting apparatus
CN205675870U (en) * 2016-05-10 2016-11-09 苏州盟川自动化科技有限公司 A kind of automatic feeding of winding material
CN205600004U (en) * 2016-05-11 2016-09-28 歌尔股份有限公司 Steel sheet cuts foresees garbage collection device
CN207952443U (en) * 2018-03-23 2018-10-12 苏州嘉东五金制品有限公司 Continuous feeding device in mould in being produced for knife net
CN209701959U (en) * 2018-12-06 2019-11-29 昆山市烽禾升精密机械有限公司 IC paper tape guillotine structure

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