CN109576666A - Substrate supporting tectosome and vacuum deposition apparatus and evaporation coating method including it - Google Patents
Substrate supporting tectosome and vacuum deposition apparatus and evaporation coating method including it Download PDFInfo
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- CN109576666A CN109576666A CN201810859502.8A CN201810859502A CN109576666A CN 109576666 A CN109576666 A CN 109576666A CN 201810859502 A CN201810859502 A CN 201810859502A CN 109576666 A CN109576666 A CN 109576666A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Physical Vapour Deposition (AREA)
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Abstract
The present invention provides substrate supporting tectosome and vacuum deposition apparatus and evaporation coating method including it.In the substrate supporting tectosome with a pair of of the supporting member configured opposite to each other across gap, above-mentioned a pair of supporting member is respectively provided with the 2nd supporting part that the 1st supporting part forms high with height than above-mentioned 1st supporting part.
Description
Technical field
It is filled the present invention relates to the substrate supporting tectosome of supporting substrates with the vacuum evaporation including the substrate supporting tectosome
It sets and evaporation coating method.
Background technique
Recently, organic electric field luminescent display (OLED) is shown up prominently as flat-panel monitor.Organic electric field luminescence is shown
Device has is formed with the base for causing luminous organic matter layer between two electrodes (cathode electrode, anode electrode) toward each other
The organic matter layer of this construction, organic electric field luminescent display is accommodated in evaporation source by making in the vacuum chamber of decompression state
Evaporation material evaporate and make evaporation material vapor deposition to vacuum chamber it is indoor as by the substrate of vapor deposition body to be formed.
In general, organic electric field luminescent display production line is made of multiple vapor deposition stations, make in these vapor deposition stations substrate according to
It is deposited while secondary mobile.It is provided between each vapor deposition station for flowing the substrate at the vapor deposition station from upstream side
The buffer chamber being temporarily detained before to the vapor deposition station in downstream side.For the replacement being masked and upkeep operation etc., cushion chamber
Room plays effect below, that is, the process for temporarily terminating in downstream side station, or the phase that vapor deposition process at downstream side station is carried out
Between, it temporarily stores from upstream side and the substrate that station transmitting comes is deposited.It can it is preferred that increasing as far as possible in the inside of buffer chamber
The number of the substrate of delay, ideal are preferably able to the number for being trapped in the substrate that each vapor deposition station is handled or more.
Fig. 6 is the figure for indicating the substrate supporting tectosome (box) of previous cushion chamber falls.Fig. 6 (a) is main view, Fig. 6
It (b) is top view, Fig. 6 (c) is the enlarged drawing for indicating the posture of supporting substrates.As shown, the box 1 of box-like is becoming substrate S
Entrance side box 1 front and back side, position in the same plane, from box side towards center be configured with opposite to each other
Support plate is to 2,3.In support plate to gap P between 2,3, is formed with, to prevent in the mechanical arm 4 as base plate transfer mechanism
Interference is generated when lifting.The elastic component 9 of height having the same is separately formed in multiple regions on each support plate.It is propping up
Board is vertically equipped with central branches on the setting component of the vertical direction lower part of support plate and consigns 8 to the gap area between 2,3,
Expose to the gap area on top.Central branches consign 8 vertical direction height with the substantially phase of elastic component 9 on support plate
With height formed, by the central branches consign each elastic component 9 on 8 and support plate be maintained in box 1 be detained in substrate
S。
Summary of the invention
Subject to be solved by the invention
In this way, as base plate transfer mechanism mechanical arm 4 lifting when interfere in order to prevent, support plate to 2,3 it
Between be formed with gap P.When substrate S is trapped in box, especially in the gap region P, substrate S generates flexure because of self weight,
It is thereby possible to apply excessive stress to substrate S.
In above-mentioned previous substrate supporting tectosome, in order to reduce flexure that such substrate is generated by self weight and
The stress for acting on substrate is additionally provided with central branches in the gap region P and consigns 8.But it consigns in order to which central branches are arranged, no
Not ensure other space, in this configuration, increasing the number of the substrate that can be detained in cushion chamber falls, there are the limit.This
Outside, in the discrepancy and lifting of mechanical arm 4, mechanical arm 4 and central branches are consigned 8 collisions, and central branches, which are consigned, 8 is also possible to breakage.
Even if the object of the present invention is to provide one kind in the gap region P in the center of substrate entrance side is not provided with
Fulcrum post 8 is entreated, the stress for being applied to substrate S can be also reduced within specified value, thereby, it is possible to increase the base that can be detained
The substrate supporting tectosome of the number of plate, evaporation coating device and evaporation coating method including the substrate supporting tectosome.
A technical solution to solve project
The substrate supporting tectosome of a technical solution of the invention has a pair of of the bearing structure configured opposite to each other across gap
Part, which is characterized in that above-mentioned a pair of supporting member is respectively provided with the 1st supporting part and height forms high than above-mentioned 1st supporting part
The 2nd supporting part.
The substrate supporting method of another technical solution of the invention, as using with one configured opposite to each other across gap
To the substrate supporting tectosome of supporting member, the branch in such a way that the opposite direction of above-mentioned a pair of of supporting member becomes the short side of substrate
Hold the substrate supporting method of aforesaid substrate, which is characterized in that above-mentioned a pair of supporting member is to approach the above-mentioned gap of aforesaid substrate
The part 2 mode higher than the part 1 in the above-mentioned gap of separate aforesaid substrate support aforesaid substrate.
The evaporation coating device of another technical solution of the invention, which is characterized in that the evaporation coating device includes: to carry out to substrate
The vapor deposition chamber of vapor deposition；And the chamber with aforesaid substrate supporting structure.
The manufacturing method of the organic illuminating element of another technical solution of the invention, which is characterized in that organic light emission member
The manufacturing method of part includes: a pair of of the supporting member for using and configuring opposite to each other across gap, opposite with above-mentioned a pair of of supporting member
The mode of the direction short side that becomes substrate keep the holding process of aforesaid substrate；And keeping above-mentioned by above-mentioned supporting member
When substrate or before and after keeping aforesaid substrate by above-mentioned supporting member, aforesaid substrate is deposited the vapor deposition process of organic material,
In above-mentioned holding process, above-mentioned supporting member with approach aforesaid substrate above-mentioned gap part 2 than separate aforesaid substrate
The mode that the part 1 in above-mentioned gap is high keeps aforesaid substrate.
The effect of invention
According to the present invention, it does not consign even if in addition central branches are not arranged in the gap area in the center of substrate entrance side,
The stress for being applied to substrate can be reduced within specified value, thus, be capable of increasing the number of the substrate that can be detained.
Detailed description of the invention
Fig. 1 is the skeleton diagram of organic electric field luminescent display production line.
Fig. 2 is the figure for indicating the structure of substrate supporting tectosome of one embodiment of the present invention, and Fig. 2 (a) is main view,
Fig. 2 (b) is top view, and Fig. 2 (c) is the construction and through this construction for indicating the supporting part being arranged in support plate (supporting member)
The enlarged drawing of the posture of supporting substrates.
Fig. 3 is the structure for indicating the substrate supporting tectosome of another embodiment of the present invention, is to indicate that setting is linking
The enlarged drawing of the posture of the construction of supporting part on component and through this construction supporting substrates.
Fig. 4 is the structure for indicating the substrate supporting tectosome of another embodiment of the present invention, and Fig. 4 (a) is main view, figure
4 (b) be top view, and Fig. 4 (c) is to indicate the construction for the supporting part being arranged in support plate (supporting member) and prop up through this construction
Hold the enlarged drawing of the posture of substrate.
Fig. 5 is the skeleton diagram of vapor deposition chamber used in organic electric field luminescent display production line.
Fig. 6 is the figure for indicating the structure of previous substrate supporting tectosome, and Fig. 6 (a) is main view, and Fig. 6 (b) is to overlook
Figure, Fig. 6 (c) is the enlarged drawing for indicating the posture of supporting substrates.
Specific embodiment
Hereinafter, explaining the embodiment of the present invention in detail referring to attached drawing.The present invention is able to carry out numerous variations, can have
There are many embodiments.Illustratively illustrate specific embodiment based on attached drawing, but the present invention is not limited to the specific embodiment,
It is construed as including all changes, equivalent and substitute that thought and protection scope of the invention are included.
Fig. 1 is the figure for being schematically indicated the structure of organic electric field luminescent display production line.Organic electric field luminescent display
Production line is made of multiple vapor deposition stations, and each vapor deposition station includes transfer chamber TR (TR；Transfer chamber), be linked to transfer
Multiple vapor deposition chamber EC of chamber TR, the mask storage chamber MC for being linked to transfer chamber TR and storing the mask before and after use.
Between each vapor deposition station, on the flow direction of substrate, it is provided with buffer chamber BC, turns to chamber (TC；turn chamber)
With path chamber (PC；Pass chamber) etc., buffer chamber BC receives substrate from the vapor deposition station of upstream side, in the case where flowing to
Substrate is temporarily stored before swimming the vapor deposition station of side, the downstream side of buffer chamber BC is arranged in steering chamber TC, for making
Substrate level rotation from buffer chamber BC, path chamber PC receive substrate from chamber TC is turned to, and are used for next vapor deposition
It stands and transmits substrate.According to production line difference, also it is not provided with turning to chamber TC and path chamber PC sometimes.
In buffer chamber BC, it is provided as the box of the substrate supporting tectosome for being temporarily detained (storage) substrate, by
Mechanical arm as base plate transfer mechanism moves in substrate from box of the upstream side vapor deposition station into buffer chamber BC, from buffer chamber BC
Interior box is downstream deposited station and moves out substrate.
Fig. 2 is the figure for indicating the structure of substrate supporting tectosome (box) of one embodiment of the present invention, and Fig. 2 (a) is main
View, Fig. 2 are (b) top views, and Fig. 2 (c) is to indicate the construction for the supporting part being arranged in support plate (supporting member) and pass through
The enlarged drawing of the posture of the construction supporting substrates.
As shown, the box 1 of the box-like of the substrate supporting tectosome as one embodiment of the present invention is becoming substrate S
Entrance side box 1 front and back side, position in the same plane configured opposite to each other from the side of box towards center
There is support plate to 2,3.In opposite support plate to gap P is formed between 2,3, to prevent the machine as base plate transfer mechanism
Interference is generated when tool arm 4 is gone up and down.On each support plate, along the length direction of support plate (from the side of box towards central portion
The direction in gap) multiple regions be separately formed with from the base portion of support plate with shape for lugs multiple supporting parts outstanding 5,6,
7.Also, the support plate of such the same shape is configured to multistage in the vertical direction of box 1, by the bearing for constituting each section
Substrate S is one by one temporarily detained, stores to (the prominent multiple supporting parts formed of Ji Congqi base portion) by plate.
It is capable of forming from the prominent each supporting part 5,6,7 formed of support plate as the cuboid with defined height and width
Shape, but the shape of supporting part is not limited to this.For example, each supporting part can be also round or oval with section it is spherical etc.
It is formed, in this case, the height or width of each supporting part can be defined as the diameter in the round or ellipse section.
It is preferred that the base portion of support plate 2,3 and formed from the prominent each supporting part 5,6,7 formed of the base portion with different materials,
Particularly preferred each supporting part 5,6,7 is formed by the elasticity elastic component bigger than the base portion of support plate 2,3.But the base of support plate
The material of portion and supporting part may not also be defined in this.Bearing is being formed by the elasticity elastic component bigger than the base portion of support plate 2,3
It in the case where portion 5,6,7, has the following advantages, that is, while can reduce the damage for giving supported substrate, also can
Enough prevent the skidding of substrate.
The substrate supporting tectosome of one embodiment of the present invention is not provided with the gap region P between 2,3 in support plate
Central branches are consigned.It replaces, the height of multiple supporting parts 5,6,7 on the base portion that support plate 2,3 is arranged in is set to that
This is different.Specifically, the multiple supporting parts 5,6,7 for being respectively arranged at a pair of of the support plate 2,3 configured in opposite directions include being located at far
The 1st supporting part and the gap P between above-mentioned 1st supporting part and above-mentioned support plate of position from the gap P between support plate
Between the 2nd supporting part, the height of the 2nd supporting part is formed as higher than the height of the 1st supporting part.The present embodiment the case where
Under, in a pair of of support plate 2,3, from box side towards the gap P between support plate 2,3, be separately formed respectively 3 supporting parts 5,6,
7, the supporting part 7 away from gap P nearest position will be located at and be set as the 2nd supporting part, will be located at than the 2nd supporting part far from gap
Remaining supporting part 5,6 of (positioned at the box side) of the position of P is set as the 1st supporting part, by the height h2 of the 2nd supporting part 7
It is set as the height h1 high than the 1st supporting part 5,6.That is, in the present embodiment, for being respectively arranged at the entrance of substrate S
Two pairs of support plates (4 support plates) of side (front of box and back side), by 4 of the gap P being disposed in proximity between support plate
The height h2 of 2nd supporting part of position is set to the height h1 of remaining the 1st supporting part 5,6 of the position than being located remotely from gap
It is high.
So, even if the gap region P between support plate is not provided with previous such central branches and consigns 8 (referring to figure
6) flexure that may be generated in the substrate S that the gap region P generates by self weight, can be also prevented, can reduce and act on substrate S
Stress.In addition, the previous central branches being arranged and bending by substrate in order to prevent and mitigating stress consign and are replaced by this
The bearing cage structure of the different height of embodiment has no need to ensure that the space consigned for central branches to be arranged correspondingly can
Reduce the interval D between 2,3 sections of support plate inside box, therefore, for the substrate that can be detained in cushion chamber falls can be increased
Number.Moreover, consigning because eliminating central branches, the central branches when mechanical arm 4 enters and leaves and goes up and down also fundamentally are prevented
A possibility that consigning with the collision of mechanical arm 4 and then breakage.
As Examples and Comparative Examples, relative to two kinds of substrates of following such condition, in the substrate of present embodiment
In the case where supporting structure, on the basis of the height of each supporting part on support plate is all identical, central branches is consigned and are set
(comparative example 1) and (comparative example in the case that central branches are consigned is not provided in the case where setting the gap area between support plate pair
2) stress for acting on supported substrate, is measured.
(condition of substrate)
Shape and size: the rectangle of 1500mm × 925mm
Material: glass substrate
Thickness: 500 μm and 400 μm
Specifically, being located remotely from support plate pair in the substrate supporting tectosome of the present embodiment as embodiment
Between above-mentioned 1st supporting part of position in gap formed with the supporting part of comparative example 1 and comparative example 2 with identical height, position
Formed high than the 1st supporting part in the height of above-mentioned 2nd supporting part of the position close to gap.Prepare by the 2nd supporting part with
The difference of the height of 1st supporting part is set to the embodiment (embodiment 1-1~1-5) of 2mm, 3.5mm, 4mm, 5mm, 6mm, implements
It tests compared with the stress of comparative example 1 and comparative example 2.
Table 1 and table 2 indicate its measurement result.Table 1 is the measurement result to the substrate of 500 μ m thicks, and table 2 is to 400 μm
The measurement result of the substrate of thickness.
[table 1]
[table 2]
As shown in table 1 and table 2, it is able to confirm that, the embodiment 1-1 of the substrate supporting tectosome as present embodiment~
Embodiment 1-5, by the way that the height of the supporting part on support plate is set to different from each other, compared with using central branches and consigning
1 equal extent of example alleviates the stress for acting on substrate to a greater degree.Furthermore it is possible to confirm, and merely rest on
It saves the comparative example 2 that central branches are consigned to compare, substantially alleviates the stress for acting on substrate.
Thus, it as embodiment 1-1~embodiment 1-5, is able to confirm that, for being formed in support plate to upper bearing
The height ratio in portion, the 2nd supporting part of the position by making the gap being located adjacent between support plate pair is located remotely from above-mentioned gap
The 1st supporting part of position formed high, consign even if being not provided with previous such central branches in gap area, also can reduce
It acts on the stress of substrate, and then consigns the space between correspondingly can also ensure that support plate section with central branches are eliminated, simultaneously
Also the effect for increasing the number for the substrate that can be detained can be obtained.The height h2 of 2nd supporting part such as embodiment 1-1~embodiment
1-5 is such, as long as the degree for being formed 2mm~6mm more slightly higher than the height h1 of the 1st supporting part, as long as more preferably being formed
Degree 3.5mm~4mm more slightly higher than the height h1 of the 1st supporting part.But the height of the 2nd supporting part and the 1st supporting part it
Difference may not be defined in this, can according to material of the size of the substrate supported, thickness, supporting part and substrate etc. different, energy
It is enough correspondingly to be suitably set with these conditions etc..
In present embodiment described above, a pair of of support plate 2,3 be separately formed respectively each 3 supporting parts 5,6,
7, the supporting part 7 for being located nearest to the position of gap P is set as the 2nd supporting part, remaining supporting part 5,6 is set as the 1st bearing
Their height is set to different from each other by portion, but the formation number of supporting part is not limited to this.For example, it is also possible to one
Each 2 supporting parts are respectively formed to support plate 2,3, the supporting part for being located at the position of close gap P is set as the 2nd supporting part, it will
Another is set as the 1st supporting part, and the 2nd supporting part is made to be formed high than the 1st supporting part.Alternatively, can also be in a pair of of support plate 2,3
Each 4 or more supporting parts are respectively formed, multiple (such as the 2) supporting parts for the position for being located adjacent to gap P are set as the 2nd
Bearing portion will be set as the 1st bearing positioned at remaining multiple (such as 2) supporting part than the 2nd position of the supporting part far from gap P
Portion makes the height of these the 2nd supporting parts be formed high than the 1st supporting part.
In addition, in addition to the support plate configured in opposite directions across gap P to be arranged in the entrance side as substrate S to 2,3
It, can also be along the length direction for the substrate S for being accommodated in box 1 (that is, in each support plate except the face side and back side of box 1
The 2nd direction that 1st direction of upper 1st and the 2nd supporting part arrangement intersects) multiple support plates are set to 2 ', 3 '.In this case,
It is preferred that dividually configuring multiple support plates to 2 ', 3 ' in the position that the mechanical arm 4 with lifting is not interfered.In addition, dividually matching
Standby each support plate is in the two sides position of box 1, (that is, in each support plate, the distance away from gap P is than the 1st supporting part remoter
Position), it can be interconnected by coupling member 10.Passing through coupling member 10 in this wise for multiple support plates to interconnected
In the case where, it can also be provided separately on multiple and each support plate on above-mentioned coupling member 10 along above-mentioned 2nd direction
The addition supporting part 11 of the identical height of 1st supporting part.Thereby, it is possible to the bearings of additionally assisting base plate.
In addition, in the structure for linking each support plate pair by coupling member 10, it is not necessary to above-mentioned multiple bearings be arranged
Plate is to 2 ', 3 '.That is, support plate only can also be respectively set to 2,3 in the face side and back side of box 1, pass through coupling member 10
Keep the support plate of these front and back sides interconnected to 2,3.In addition, coupling member 10 both can be with identical with support plate
Material is integrally formed, can also be formed with the material different from support plate.
In addition, for the length direction (direction intersected with support plate to the direction configured opposite to each other) along substrate S point
Multiple additional supporting parts 11 on coupling member 10 are set with opening, can also be set the height of supporting part with column direction along it
Determine at different from each other.That is, as shown in Fig. 3 (a), (b), it can also be in the multiple supporting parts being separately positioned on coupling member 10
In 11, the height for the supporting part 11a that the central part with column direction is set is made to be formed high than the supporting part 11b other than it
(h2 > h1).In this way, if the height for the supporting part 11 being arranged on coupling member 10 along the length direction of substrate S is set to
Difference then can further obtain effect described below.It is complete in the height of the supporting part 11 of the length direction configuration along substrate
In the identical situation in portion, the shape of the deformation of the substrate in the state of being positioned on supporting part sometimes for each substrate without
?.For example, the height of substrate exists in the height that length direction central location becomes highest or substrate sometimes as shown in Fig. 3 (c)
From center slightly offset from position become the shape of its most high deformation and generate variation for each substrate.On the other hand, exist
The corner of the length direction of substrate is usually formed for the alignment mark of aligned in position, but as described above in the deformation of substrate
In the case that shape is unstable, the height of substrate corners is changed also for each substrate, as a result, being likely to become makes alignment mark
Detection accuracy reduce the reason of.Here, in the present invention, as shown in Fig. 3 (b), by the way that coupling member will be separately positioned at
The height of supporting part 11a in multiple supporting parts 11 on 10, being configured near center is set as consciously than another
Bearing portion 11b high is deformed always with identical dimensionally stable when loading substrate, improve be configured at substrate corner to fiducial mark
The detection accuracy of note.The height setting structure of supporting part on such coupling member 10 had both been referred to Fig. 2 etc., and above-mentioned
The height setting structure of the supporting part 5,6,7 of substrate short side direction is used together, can also be with the supporting part 5,6,7 of short side direction
Structure dividually use.
Then, referring to Fig. 4, illustrate the substrate supporting tectosome of another embodiment of the present invention.
Substrate supporting tectosome involved in present embodiment by above-mentioned 1st supporting part being arranged on support plate 2,3 and
2nd supporting part is formed as one.That is, as shown in figure 4, will be separately located at respectively in the above-described embodiment far from support plate
The position in the gap between mutually interconnects in the present embodiment with the 1st supporting part of the position close to gap and the 2nd supporting part
It ties and is integrally formed.In addition, in present embodiment as integrally formed supporting part 23, the upper surface of the supporting part 23
With from the upper table of the part where the upper surface to the 2nd supporting part of the part where the 1st supporting part in above-mentioned embodiment
Until face, that is, from the position far from the gap P between support plate 2,3 until close to the position of gap P, height is gradually got higher
Mode, be formed as inclined surface (h2 > h1).
Substrate supporting tectosome of the present embodiment does not configure separately in the gap region P of the replacement between support plate 2,3
Outer central branches are consigned and are compared the height for the part that the supporting part 23 being arranged on support plate 2,3 is formed adjacent to gap P remote
The part for sowing discord gap P is high on this point, and basic purport is identical as above-mentioned embodiment.Thus, by involved by present embodiment
And substrate supporting tectosome, can also obtain effect identical with above-mentioned embodiment.
(manufacturer for having the organic illuminating element of vacuum deposition apparatus of substrate supporting tectosome of the invention is used
Method)
Hereinafter, referring to Fig.1 and Fig. 5, being made to the vacuum deposition apparatus for having substrate supporting tectosome of the invention is used
The method for making organic illuminating element is illustrated.
Referring to Fig.1, it as described above, organic illuminating element production line is made of multiple vapor deposition stations, is moved on one side at each vapor deposition station
Substrate is sent successively to carry out a series of vapor deposition process on one side.Have multiple vapor deposition chambers at each vapor deposition station, in the vapor deposition station into
Vapor deposition process of the row to multiple substrates.
Fig. 5 is the figure that outlined the structure for the vapor deposition chamber EC having in vapor deposition station.As shown in Fig. 5 (a), vapor deposition
Chamber EC includes the evaporation source unit 200 for evaporating evaporation material relative to substrate 40,50 and releasing.Source unit 200 is evaporated to wrap
The evaporation source that the receiving portion and the heating part etc. by evaporating it for heating evaporation material for including receiving evaporation material are constituted
210.Evaporation source 210 has the construction of multiple bleed holes or nozzle, the vapor deposition of the bleed hole or nozzle towards substrate 40,50
Face releases evaporation material, and but not limited to this, as long as opposite with substrate 40,50, the type of the pattern of mask, evaporation material etc.
Answer the appropriate selection in ground, such as point (point) evaporation source, linear (linear) evaporation source, small-sized evaporation material receiving portion
Also it can be used and the evaporation source etc. for the construction that there is the diffuser casing for the multiple bleed holes for releasing evaporation material to connect.In addition, steaming
It plates shown in chamber EC such as Fig. 4 (b), can further include film thickness monitor 218, film thickness gauge 217, power supply 216, substrate holder 213, cover
The others constituent part such as mould holder 215.Film thickness monitor 218 monitors the evaporation rate for the evaporation material that spontaneous evaporation source 210 releases
(rate).Film thickness gauge 217 receives the input signal from film thickness monitor 218 and measures film thickness.Power supply 216 is to set on evaporation source
210 heating device is controlled.Substrate holder 213 is able to maintain substrate 40,50 and makes substrate relative to mask 214 and evaporation
It relatively moves in source.Mask holder 215 be able to maintain mask 214 and make mask 214 relative to substrate and evaporation source 210 relatively
It is mobile.Two substrates 40,50 are moved in a chamber by the vapor deposition chamber EC expression of diagram, relative to one of base
Plate 40 be deposited during (for example, the side A workbench), relative to another substrate 50 (for example, the side B workbench) be masked with
The vapor deposition chamber of alignment (alignment) between substrate, so-called " dual workbench " structure.Substrate supporting tectosome of the invention
Can be used together with the vapor deposition chamber with the structure other than dual workbench, but as dual workbench by multiple
Substrate is moved in a chamber, is stood in each vapor deposition while in the case where carry out the vapor deposition treatment to multiple substrates, as being used for
It is temporarily trapped in the substrate supporting tectosome of the cushion chamber falls for multiple substrates that upstream side station is deposited, can especially be had
Effect ground uses.
Vapor deposition process in vapor deposition chamber EC is carried out by following such process.It will be as vapor deposition using conveyance member
The substrate 40,50 of object is moved in vapor deposition chamber EC, and is configured on substrate holder 213.Then, using being formed in mask 214
Alignment mark and be formed in the alignment mark of substrate 40,50, be masked the alignment of 214 Yu substrate 40,50.Mask 214 with
The alignment of substrate 40,50, which can both move control base board bracket 213, keeps substrate mobile, can also move control mask holder 215
Keep mask mobile.After alignment, the gate of evaporation source 210 is opened, makes the moving in rotation portion 70 connecting with evaporation source 210 on one side
Movement, on one side along the pattern of mask 214 on substrate 40,50 evaporation film-forming material.At this point, the film thickness such as crystal oscillator monitor
Device 218 measures evaporation rate, is converted into film thickness by film thickness gauge 217.Lasting vapor deposition becomes mesh until the film thickness to be converted by film thickness gauge 217
Until marking film thickness.When the film thickness to be converted by film thickness gauge 217 reaches target film thickness, the gate of evaporation source 210 is closed, terminates to steam
Plating.
By above such process, the substrate that each vapor deposition chamber at upstream side vapor deposition station completes vapor deposition is being transferred
Before in each vapor deposition chamber at the downstream side vapor deposition station for carrying out subsequent vapor deposition process, it is moved to and is set to previous-next trip side vapor deposition
Buffer chamber (BC between standing；In referring to Fig.1), temporarily it is detained.
In buffer chamber BC, the substrate supporting tectosome of above-mentioned embodiments of the present invention is configured, as described above, logical
A pair of of the supporting member configured opposite to each other across gap in the short side center region of the substrate for the entrance side for becoming substrate is crossed, with
The mode supporting substrates higher than the part 1 far from above-mentioned gap close to the height of the substrate of the part 2 in above-mentioned gap.That is,
By the 1st supporting part of position in a pair of of supporting member, being located remotely from above-mentioned gap is arranged in and is connect positioned at than the 1st supporting part
The position in nearly above-mentioned gap and the 2nd supporting part for being formed high than the 1st supporting part (or by having with from separate above-mentioned gap
The supporting part for the inclined upper surface of mode that height is gradually got higher until position to the position close to above-mentioned gap), between approaching
The part 2 of the gap mode higher than the part 1 far from above-mentioned gap, supporting substrates.It is trapped in substrate temporarily respectively as a result,
In process between vapor deposition station, the other addition component such as consigns even if being not provided with previous central branches, can also will act on
The stress of substrate is relieved within specified value, can also increase the number for the substrate that can be detained.
More than, mode for carrying out the present invention is specifically illustrated, but purport of the invention is not limited to these notes
It carries, should explain based on the descriptions of the claims and on a large scale.In addition, recorded based on these, numerous variations, change etc.
Certainly it is contained in purport of the invention.For example, in the above description, primarily illustrating and constructing substrate supporting of the invention
Body is applied to the example for making substrate temporarily be trapped in the buffer chamber between each vapor deposition station, but other than buffer chamber,
It can be applied to the indoor substrate supporting tectosome of path chamber of above-mentioned organic illuminating element production line, and along with such as machine
Base plate transfer mechanism as tool arm can also apply to the substrate supporting of substrate storing apparatus to the move-in/move-out of substrate
Tectosome.
The explanation of appended drawing reference
1: box (substrate supporting tectosome)
2,3: support plate (supporting member)
4: mechanical arm
5,6,7,23: supporting part
8: central branches are consigned
9: elastic component
10: coupling member
11: additional supporting part
40,50: substrate
70: moving in rotation portion
200: evaporation source unit
210: evaporation source
213: substrate holder
214: mask
215: mask holder
216: power supply
217: film thickness gauge
218: film thickness monitor
Claims (21)
1. a kind of substrate supporting tectosome has a pair of of the supporting member configured opposite to each other across gap, which is characterized in that
Above-mentioned a pair of supporting member is respectively provided with the 1st supporting part and height and supports than the above-mentioned 1st supporting part forms high the 2nd
Portion.
2. substrate supporting tectosome according to claim 1, which is characterized in that
Above-mentioned 1st supporting part is disposed substantially away from the position in above-mentioned gap,
Above-mentioned 2nd supporting part configuration is between above-mentioned 1st supporting part and above-mentioned gap.
3. substrate supporting tectosome according to claim 2, which is characterized in that
In each of above-mentioned a pair of of supporting member supporting member, it is equipped with compartment of terrain and is configured with multiple above-mentioned 1st supporting parts,
In each of above-mentioned a pair of of supporting member supporting member, it is equipped with compartment of terrain and is configured with multiple above-mentioned 2nd supporting parts.
4. substrate supporting tectosome according to claim 2, which is characterized in that
Above-mentioned a pair of supporting member respectively includes multiple part 1s and the part 2 that above-mentioned multiple part 1s are connected to each other,
The 1st direction that above-mentioned multiple part 1s are arranged respectively along above-mentioned a pair of of supporting member extends,
Above-mentioned multiple part 1s configure in a row along the 2nd direction intersected with above-mentioned 1st direction,
Above-mentioned part 2 extends along above-mentioned 2nd direction, and with above-mentioned 1st supporting part compare away from remote at a distance from above-mentioned gap
Position, above-mentioned multiple part 1s are connected to each other,
In each of above-mentioned a pair of of supporting member supporting member, above-mentioned 1st supporting part and the configuration of above-mentioned 2nd supporting part are upper
State at least one part 1 in multiple part 1s.
5. substrate supporting tectosome according to claim 4, which is characterized in that
The supporting part of height identical with above-mentioned 1st supporting part is equipped in above-mentioned part 2.
6. substrate supporting tectosome according to claim 1, which is characterized in that
Above-mentioned a pair of supporting member is respectively provided at least two above-mentioned 1st supporting parts,
Above-mentioned 2nd supporting part and above-mentioned at least two above-mentioned 1st supporting part are in the 1st direction with above-mentioned a pair of of supporting member arrangement
It is configured in a row on the 2nd direction intersected,
Above-mentioned 2nd supporting part is configured between above-mentioned at least two above-mentioned 1st supporting parts.
7. substrate supporting tectosome according to claim 6, which is characterized in that
In each of above-mentioned supporting member supporting member, it is equipped with compartment of terrain and is configured with multiple above-mentioned 1st supporting parts,
In each of above-mentioned supporting member supporting member, it is equipped with compartment of terrain and is configured with multiple above-mentioned 2nd supporting parts.
8. substrate supporting tectosome according to claim 6, which is characterized in that
Above-mentioned a pair of supporting member respectively includes multiple part 1s and the part 2 that above-mentioned multiple part 1s are connected to each other,
Above-mentioned multiple part 1s extend respectively along above-mentioned 1st direction,
Above-mentioned multiple part 1s configure in a row along above-mentioned 2nd direction,
Above-mentioned part 2 extends along above-mentioned 2nd direction,
In each of above-mentioned a pair of of supporting member supporting member, above-mentioned 2nd supporting part and above-mentioned at least two above-mentioned 1st
Bearing portion is configured in above-mentioned part 2.
9. substrate supporting tectosome according to claim 8, which is characterized in that
At least one part 1 in above-mentioned multiple part 1s, the bearing equipped with height identical with above-mentioned 1st supporting part
Portion.
10. substrate supporting tectosome described according to claim 1~any one of 9, which is characterized in that
The height of above-mentioned 2nd supporting part forms to obtain high 2mm~6mm than the height of above-mentioned 1st supporting part.
11. substrate supporting tectosome according to claim 10, which is characterized in that
The height of above-mentioned 2nd supporting part forms to obtain high 3.5mm~4mm than the height of above-mentioned 1st supporting part.
12. substrate supporting tectosome according to claim 10, which is characterized in that
It is glass substrate by the substrate that aforesaid substrate supporting structure supports, size in length and breadth is 1500mm × 925mm, and thickness is
400 μm~500 μm.
13. substrate supporting tectosome described according to claim 1~any one of 9, which is characterized in that
Above-mentioned 1st supporting part and above-mentioned 2nd supporting part respectively include the protrusion of the base portion relative to above-mentioned supporting member.
14. substrate supporting tectosome according to claim 13, which is characterized in that
Above-mentioned 1st supporting part and above-mentioned 2nd supporting part are formed with the 1st material,
Above-mentioned base portion is formed with the 2nd material different from above-mentioned 1st material,
The elasticity of above-mentioned 1st material is bigger than the elasticity of above-mentioned 2nd material.
15. substrate supporting tectosome described according to claim 1~any one of 9, which is characterized in that
Above-mentioned 1st supporting part and above-mentioned 2nd supporting part are integrally formed, and are formed to have with from the upper table of above-mentioned 1st supporting part
Face inclined face of mode for getting higher of height to the upper surface of above-mentioned 2nd supporting part.
16. a kind of substrate supporting method has the substrate branch of a pair of of the supporting member configured opposite to each other across gap as utilization
Tectosome is held, the substrate branch of aforesaid substrate is supported in such a way that the opposite direction of above-mentioned a pair of of supporting member becomes the short side of substrate
Hold method, which is characterized in that
It is above-mentioned a pair of supporting member with approach aforesaid substrate above-mentioned gap part 2 than separate aforesaid substrate above-mentioned gap
The high mode of part 1 support aforesaid substrate.
17. substrate supporting method according to claim 16, which is characterized in that
Above-mentioned a pair of of supporting member of aforesaid substrate supporting structure has respectively: being located remotely from the 1st of the position in above-mentioned gap the
Supporting part；And between above-mentioned 1st supporting part and above-mentioned gap and height formed high than above-mentioned 1st supporting part the 2nd
Supporting part,
It is supported by above-mentioned 1st supporting part and above-mentioned 2nd supporting part in the above-mentioned part 2 mode higher than above-mentioned part 1 above-mentioned
Substrate.
18. a kind of evaporation coating device, which is characterized in that
The evaporation coating device includes:
Carry out the vapor deposition chamber to the vapor deposition of substrate；And
Chamber with substrate supporting tectosome according to any one of claims 1 to 9.
19. evaporation coating device according to claim 18, which is characterized in that
Above-mentioned vapor deposition chamber includes: multiple 1st vapor deposition process chambers, is configured to carry out aforesaid substrate the 1st vapor deposition process；And
Multiple 2nd vapor deposition process chambers are configured to carry out the substrate for having carried out above-mentioned 1st vapor deposition process subsequent in above-mentioned 1st vapor deposition
2nd vapor deposition process of process,
Above-mentioned chamber with aforesaid substrate supporting structure is configured in above-mentioned 1st vapor deposition process chamber and above-mentioned 2nd vapor deposition
Between process chamber, removed by the aforesaid substrate for having carried out above-mentioned 1st vapor deposition process moved out from above-mentioned 1st vapor deposition process chamber
Enter to before above-mentioned 2nd vapor deposition process chamber, which is temporarily kept.
20. evaporation coating device according to claim 19, which is characterized in that
Above-mentioned chamber with aforesaid substrate supporting structure can be accommodated in the above-mentioned 1st using aforesaid substrate supporting structure and be steamed
The substrate more than number for the aforesaid substrate that can be deposited simultaneously in plating process chamber or above-mentioned 2nd vapor deposition process chamber.
21. a kind of manufacturing method of organic illuminating element, which is characterized in that
The manufacturing method of the organic illuminating element includes:
Using a pair of of the supporting member configured opposite to each other across gap, substrate is become with the direction that above-mentioned a pair of of supporting member is opposite
The mode of short side keep the holding process of aforesaid substrate；And
When keeping aforesaid substrate by above-mentioned supporting member or before and after keeping aforesaid substrate by above-mentioned supporting member, to upper
The vapor deposition process of substrate vapor deposition organic material is stated,
In above-mentioned holding process, above-mentioned supporting member with approach aforesaid substrate above-mentioned gap part 2 ratio far from above-mentioned base
The mode that the part 1 in the above-mentioned gap of plate is high keeps aforesaid substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2017-0127182 | 2017-09-29 | ||
| KR1020170127182A KR101904671B1 (en) | 2017-09-29 | 2017-09-29 | Structure for supporting substrate, vacuum deposition apparatus including the same and deposition method |
Publications (2)
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| CN109576666A true CN109576666A (en) | 2019-04-05 |
| CN109576666B CN109576666B (en) | 2021-07-06 |
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| Country | Link |
|---|---|
| JP (2) | JP6700361B2 (en) |
| KR (1) | KR101904671B1 (en) |
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| JP2021175824A (en) | 2020-03-13 | 2021-11-04 | 大日本印刷株式会社 | Evaluation method of vapor deposition chamber of manufacturing apparatus of organic device, standard mask device and standard substrate used for evaluation method, manufacturing method of standard mask device, manufacturing apparatus of organic device having vapor deposition chamber evaluated by evaluation method, organic device having vapor-deposited layer formed in vapor deposition chamber evaluated by evaluation method, and maintenance method of vapor deposition chamber in manufacturing apparatus of organic device |
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| CN1477693A (en) * | 2002-07-15 | 2004-02-25 | 夏普株式会社 | Frame for base plate |
| CN100456446C (en) * | 2005-07-18 | 2009-01-28 | 三星Sdi株式会社 | Holder for fabricating organic light emitting display |
| KR20120006748A (en) * | 2010-07-13 | 2012-01-19 | 삼성전기주식회사 | Magazine |
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Also Published As
| Publication number | Publication date |
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| JP2020122221A (en) | 2020-08-13 |
| JP7221238B2 (en) | 2023-02-13 |
| JP6700361B2 (en) | 2020-05-27 |
| CN109576666B (en) | 2021-07-06 |
| JP2019065393A (en) | 2019-04-25 |
| KR101904671B1 (en) | 2018-10-04 |
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