KR20110102678A - Cassette for storing substrate - Google Patents

Cassette for storing substrate Download PDF

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Publication number
KR20110102678A
KR20110102678A KR1020100021825A KR20100021825A KR20110102678A KR 20110102678 A KR20110102678 A KR 20110102678A KR 1020100021825 A KR1020100021825 A KR 1020100021825A KR 20100021825 A KR20100021825 A KR 20100021825A KR 20110102678 A KR20110102678 A KR 20110102678A
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KR
South Korea
Prior art keywords
support
substrate
cassette
color filter
support pin
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KR1020100021825A
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Korean (ko)
Inventor
박원
Original Assignee
엘지디스플레이 주식회사
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Priority to KR1020100021825A priority Critical patent/KR20110102678A/en
Publication of KR20110102678A publication Critical patent/KR20110102678A/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/38Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/48Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67309Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Liquid Crystal (AREA)

Abstract

The present invention relates to a cassette for storing a substrate that provides a substrate storage space, and more particularly to a support pin provided in the support bar of the cassette.
A feature of the present invention is that the support pin is positioned closest to the connecting portion connecting the support bar with the rear side of the cassette so that the supporting pin is located within 15 to 35 mm from the point where the supporting portion protrudes from the horizontal surface of the connecting portion so that the supporting pin is a dummy region of the substrate. To support it.
Through this, when deflection of the substrate loaded in the cassette occurs, even if a black spot defect occurs due to a press mark or a scratch caused by a support pin positioned closest to the connection part, the black spot defect is substantially realized. It occurs on the area, that is, the color filter pattern.
Therefore, it is possible to prevent the occurrence of black spot defects, etc., and also to prevent the problem that the yield of the process is lowered.

Description

Cassette for storing substrate

The present invention relates to a cassette for storing a substrate that provides a substrate storage space, and more particularly to a support pin provided in the support bar of the cassette.

Cathode ray tube (CRT), one of the widely used display devices, has been mainly used for monitors such as TVs, measuring devices, information terminal devices, etc., but due to the large weight and size of CRT itself, It could not respond actively to the demand for weight reduction.

In order to replace the CRT, liquid crystal display devices (LCDs), plasma display panel devices (PDPs), and the like, which have advantages of small size and light weight, have been actively developed.

Here, the liquid crystal display device has a flat display panel in which a pair of transparent substrates are bonded to each other with a unique fluorescent or polarizing layer therebetween as an essential component. Such a panel forms a thin film of a predetermined material. The deposition process, the photolithography process, and the etching process are repeated several times. In addition, various different processes such as cleaning, bonding, and cutting are involved.

Substrate is transported and supplied to the process equipment to perform the process for each of these processes, and a cassette for storing a plurality of substrates to reduce the time and effort required to transport and store the substrate during the process It is currently used in the manufacturing process of flat panel display devices, and constitutes the smallest unit of substrate storage and transportation.

On the other hand, the size of the substrate 10 is also increasing according to the recent trend of large area of the liquid crystal display device, which is rapidly progressing. As a result, the weight of the substrate is also greatly increased.

This increase in size and weight of the substrate is accompanied by the deflection of the substrate contained in the cassette, Figures 1a to 1b is a schematic diagram for examining the deflection of the substrate accommodated in the cassette, in particular Figure 1b is a substrate of Figure 1a It is a figure which shows this stored cassette simply in the side.

Cassette 10 is provided with a plurality of side slot pins 32 protruding horizontally in the direction facing each other on both sides facing each other based on the front inlet surface 12 to form a substrate storage space at regular intervals. On the rear surface of the cassette 10, a plurality of support bars 34 having the same spacing as the side slot pins 32 protrude horizontally toward the inlet surface 12.

The support bar 34 serves to substantially support the entire load of the substrate 2.

At this time, the support bar 34 is formed with a support pin 36 to prevent direct contact with the substrate (2).

Accordingly, the substrate 2 is provided at both sides by supporting bar 34 supported by both side edge pins 32 corresponding to each other and supported across the back surface of the substrate 2. Housed in.

Accordingly, since the substrate 2 is supported by the side slot pin 32 and the support bar 34 only the other three edges other than one edge facing the inlet surface 12 of the cassette 10, the substrate 2 is substantially covered by the substrate 2. The deflection is concentrated on one edge 2a facing the inlet face 12 of the cassette 10.

As described above, when the deflection of the substrate 2 occurs, the load of the substrate 2 concentrates on one edge 2a facing the inlet surface 12 of the cassette 10 and supports the entire load of the substrate 2. The support bar 34 is subjected to a load larger than the weight of the actual substrate (2).

The support bar 34 fixed to the back of the cassette 10 is a specific force, that is, a stress acts, one end of the support bar 34 toward the inlet surface 12 of the cassette 10 has a separate fixed structure Since it does not exist, it can absorb and reduce stress as it flows within a certain range, but the other end of the support bar 34 fixed through the back of the cassette 10 and the fixing structure (not shown) cannot absorb and reduce the stress. The stress will be concentrated.

Accordingly, the stress concentrated at the other end of the support bar 34 is transferred to the support pin 36 positioned closest to the other end of the support bar 34, and the support is in direct contact with the substrate 2. The stress transmitted to the pin 36 may generate a mark due to the pressing of the support pin 36 on the rear surface of the substrate 2 or a scratch on the rear surface of the substrate 2.

In particular, the transverse electric field type liquid crystal display device having excellent viewing angle characteristics is easy to introduce unnecessary charges such as static electricity, and thus, indium-tin-oxide (ITO) or indium-ink-oxide, which is a transparent conductive material, is formed on the back of the color filter substrate. (IZO) is deposited through sputtering to form a back electrode (not shown), and then a unit process for forming a color filter layer (not shown) is performed. Thus, a back electrode (not shown) is formed on the back surface of the substrate 2. When formed, when the pressing occurs by the support pin 36, a problem of lowering the yield of the process occurs by causing a black spot defect.

This problem is further exacerbated as the size of the substrate 2 increases as the resolution of the substrate 2 increases.

The present invention is to solve the above problems, in the process of storing and transporting a transverse electric field type liquid crystal display device having a back electrode in the cassette, to prevent the black spot defect caused by the support pin formed on the support bar to improve the yield of the process The purpose is to improve.

In order to achieve the object as described above, a cassette for storing the substrate having an upper and lower plates, the upper and lower plates are connected to the rear side of the side and the rear to provide a front opening inlet surface and a substrate storage space therein, Frame bars forming the two sides by connecting the upper and lower plates; A support frame bar forming the rear surface by connecting the upper and lower plates; A plurality of support bars divided into a connection part connected to the support frame bar and a support part protruding toward the entrance surface from the connection part to directly support the substrate; And first to sixth support pins sequentially arranged at regular intervals perpendicular to the support part, wherein the first support pins closest to the connection part are located in an area within 15 to 35 mm from the point where the support part protrudes. Provide a cassette.

Here, the substrate is divided by a dummy area, and a plurality of color filter patterns are defined by being divided into a display area for displaying an image and a non-display area covering an edge of the display area, and the first to sixth support pins The rear surface is in direct contact with a mother color filter substrate having a back electrode formed thereon, and the dummy region has a width of 22.5 to 42 mm, and the first support pin supports the dummy region.

The first to sixth support pins have a truncated conical shape that decreases in diameter as they progress toward the upper plate, and the first support pins have the same height as the second to sixth support pins. It has a small diameter compared with the sixth.

In addition, an auxiliary support pin is further provided between the first support pin and the second support pin adjacent to the first support pin, and the first to sixth support pins are made of PEEK (poly ether ether ketone) material.

In addition, the present invention provides a substrate storage cassette which is divided by a dummy area, and provides a storage space of a substrate having a plurality of color filter patterns defined by being divided into a display area for displaying an image and a non-display area covering the edge of the display area. As the upper and lower plates; Frame bars forming the two sides by connecting the upper and lower plates; A support frame bar forming the rear surface by connecting the upper and lower plates; A plurality of support bars divided into a connection part connected to the support frame bar and a support part protruding toward the entrance surface from the connection part to directly support the substrate; And first to sixth support pins sequentially arranged at regular intervals perpendicular to the support part, and the first support pin closest to the connection part provides a cassette for storing the dummy area.

As described above, in accordance with the present invention, the support pin is positioned closest to the connecting portion connecting the support bar to the rear side of the cassette so that the supporting pin is located within an area within 15 to 35 mm from the point where the supporting portion protrudes from the horizontal surface of the connecting portion. By supporting the dummy region of the substrate, when the substrate is loaded in the cassette, the black spot defect is prevented even if a black spot defect occurs due to a press mark or a scratch caused by a support pin positioned closest to the connecting portion. It is possible to prevent the image from occurring on the area where the image is realized, that is, the color filter pattern.

Therefore, there is an effect that can prevent the occurrence of black spot defects, etc., there is also an effect to prevent the problem that the yield of the process is lowered.

1A to 1B are schematic views for examining the deflection phenomenon of a substrate housed in a cassette.
2 is a cross-sectional view schematically showing a transverse electric field type liquid crystal display device.
3 is a plan view schematically illustrating a mother color filter substrate having a plurality of unit color filter patterns before a cutting process during a cell process;
Figure 4 is a perspective view of a cassette for storing the substrate according to an embodiment of the present invention.
5 is a perspective view schematically showing an enlarged structure of the support bar of FIG. 4.
6 is a cross-sectional view schematically showing the structure of the support bar and the substrate supported by the support bar.
FIG. 7 is a graph showing the defect rate of black spot defects of a mother color filter substrate loaded in a cassette and a mother color filter substrate loaded in a general cassette according to an embodiment of the present invention; FIG.

Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings.

2 is a cross-sectional view schematically illustrating a transverse electric field type liquid crystal display device.

As shown in the figure, in the transverse electric field type liquid crystal display device 100, the array substrate 101 and the color filter substrate 102 are spaced apart from each other, and the liquid crystal layer is disposed between the array substrate and the color filter substrate 101 and 102. FIG. 103 is interposed.

In this case, a plurality of gate wirings (not shown) and common wirings (not shown) arranged in parallel with the gate wirings (not shown) are arranged on the array substrate 101 in parallel with a predetermined interval. In addition, data wirings (not shown) intersecting the two wirings (not shown and not shown), and intersecting with the gate wirings (not shown) are defined to define the pixel region P.

In this case, a thin film transistor Tr is formed in the switching region TrA, which is an intersection point of the gate wiring (not shown) and the data wiring (not shown) of each pixel region P, and the display area (not shown) The common electrode 112 and the pixel electrode 114 are formed in AA.

The thin film transistor Tr includes the gate electrode 111, the gate insulating layer 113, the semiconductor layer 115, and the source and drain electrodes 117 and 119.

A protective layer 116 is formed on the front surface of the array substrate 101 including the thin film transistor Tr, and the pixel electrode 114 is electrically connected to the drain electrode 119 of the thin film transistor Tr. .

The common electrode 112 is formed on one side of the pixel electrode 114 of the display area AA at a predetermined interval to form a transverse electric field.

Although the pixel electrode 114 and the common electrode 112 are not well illustrated in the drawing, a plurality of pixel electrodes 114 and a common electrode 112 are provided, and the plurality of pixel electrodes 114 and the common electrode 112 are alternately arranged side by side.

On the color filter substrate 102 facing the array substrate 101, a black matrix 121 having an opening corresponding to the pixel area P is formed, and red and green are sequentially and sequentially arranged corresponding to these openings. The color filter layer 123 including the blue color filter is formed.

An overcoat layer 125 is formed on the black matrix 121 and the color filter layer 123.

As described above, the transverse field type liquid crystal display device 100 forms a common electrode 112 and a pixel electrode 114 on the same substrate 101, and generates a horizontal electric field between the two electrodes 112 and 114 to form a liquid crystal molecule. By arranging parallel to the horizontal electric field parallel to the substrates 101 and 102, the viewing angle of the liquid crystal display device 100 can be widened.

At this time, a lot of static electricity is generated in the process of the unit process is mounted on the stage (not shown) of the unit processing equipment for the process progress in each step in the manufacturing of each substrate (101, 102).

Since the array substrate 101 is formed of metal wires and electrodes 111, 117, and 119, static electricity can be effectively removed through the array substrate 101, but in the case of the color filter substrate 102 for a transverse electric field type liquid crystal display device, Since there is no component made of material, it is very vulnerable to static electricity generated during unit process or movement.

In addition, even though the color filter substrate 102 is manufactured as a complete product, the color filter substrate 102 does not have a component made of a conductive material, and thus there is no means for removing the charge charged by static electricity.

Therefore, indium tin oxide (ITO) or indium- which is a transparent conductive material on the back surface of the color filter substrate 102 in order to discharge the static electricity generated during the progress of the unit process and effectively discharge the charged charge during the formation of the finished product. After depositing zinc oxide (IZO) through sputtering, the back electrode 130 is formed, and a unit process for forming the color filter layer 123 is performed.

Here, in order to increase productivity in manufacturing the liquid crystal display device 100, a plurality of units are cut into a mother substrate to form one array substrate 101 or a color filter substrate 102 by using one large mother substrate. After forming an array pattern (not shown) and a unit color filter pattern (not shown) to form a mother array substrate (not shown) and a mother color filter substrate (not shown), respectively, these two mother substrates are formed on the liquid crystal layer 103. After bonding to each other via the cut, the liquid crystal display device 100 is completed by cutting.

3 is a plan view schematically illustrating a mother color filter substrate having a plurality of unit color filter patterns before a cutting process during a cell process.

As illustrated, a plurality of unit color filter patterns 102a having a predetermined size such as 15 ″ and 17 ″ before being cut into each color filter substrate 120 (FIG. 2) are formed on the mother color filter substrate 120. have.

Each unit color filter pattern 102a is divided into two parts, the inner area of which is divided into a display area AA for displaying an image and a non-display area NA that surrounds the edge of the display area AA. .

Each unit color filter pattern 102a is formed to be separated at a predetermined distance, that is, the dummy region 140 having a predetermined width is formed between neighboring unit color filter patterns 102a. .

Here, the dummy region 140 has a different width for each model and resolution, but in order to optimally implement the width d of the dummy region 140 in consideration of process efficiency, the dummy region 140 may be kept within 22.5 to 42 mm. Do.

Meanwhile, the mother color filter substrate 120 illustrated before the color filter layer 123 of FIG. 2 is formed, and the black matrix 121 for each unit color filter pattern 102a on the mother color filter substrate 120. ) Is formed, and a back electrode (130 in FIG. 2) is formed on the rear surface of the mother color filter substrate 120.

As such, the mother color filter substrate 120 having the back electrode 130 of FIG. 2 and the black matrix 121 is formed in a minimum unit by a cassette to form a color filter layer 123 of FIG. 2. Transported and supplied to process equipment.

4 is a perspective view of a cassette for storing a substrate according to an exemplary embodiment of the present invention, and FIG. 5 is a perspective view schematically showing an enlarged structure of the support bar of FIG. 4.

As illustrated, the overall shape of the cassette 200 defines a box shape of a hexahedron which defines the substrate storage space therein while the other vertical surface is opened to form the inlet surface 212.

Looking at this in more detail, the upper and lower horizontal planes of the cassette 200 according to the present invention consists of rectangular upper and lower plates 214 and 216 similar to the parent color filter substrate (120 of FIG. 3), respectively, and serve as ceiling and floor, respectively. . The upper and lower plates 214 and 216 may be configured in one plate shape or may be configured by connecting a plurality of frames into one.

The edges of the upper and lower plates 214 and 216 corresponding to each other are connected to the plurality of frame bars 222 and the support frame bars 224.

That is, the support frame bar 224 supports the frame bar 222 connecting the opposite edges of the upper and lower plates 214 and 216, respectively, and the one edge surface connecting both edges of the upper and lower plates 214 and 216, respectively. ) Connects the two sides 214 and 216 and the entrance face 212 which face each other with respect to the front entrance face 212 so as to form the substrate storage space therein, including the opened entrance face 212. This defines the back side 218 of the back.

At this time, the back surface 218 including both side surfaces 214 and 216 may accommodate the color filter substrate (120 of FIG. 3) through the frame bar 222 and the support frame bar 224 arranged at predetermined intervals. Make it possible to check in the direction.

In addition, a plurality of side slot pins 226 protruding horizontally in a direction facing each other are provided on the inner surface of each frame bar 222 at regular intervals, and support frame bars 224 forming the back surface 218 of the cassette 200. There are a plurality of support bars 230 at equal intervals with the side slot pins 226 protrude horizontally toward the inlet surface 212.

At this time, in order to prevent direct contact with the back surface of the mother color filter substrate (120 of FIG. 3) having the back electrode (130 of FIG. 2) formed on the support bar 230, the support pins 240a, 240b, 240c, 240d, 240e, 240f) are formed.

Therefore, the mother color filter substrate 120 (FIG. 3) is provided on both sides, and both edges thereof are supported by the side slot pins 226 corresponding to each other, and at the same time across the rear surface of the mother color filter substrate (120 of FIG. 3). The support bar 230 holds up each floor.

Here, referring to FIG. 5, the structure of the support bar 230 will be described in more detail. The support bar 230 is largely divided into a connection part 231 and a support part 233, and the connection part 231 has an approximately “b” shape. It consists of a support frame bar 224 and a horizontal vertical surface 231a and a horizontal surface 231b perpendicular thereto.

Thus, the vertical surface 231a of the connecting portion 231 is in close contact with one surface of the support frame bar 224 facing the inlet surface 212 of the cassette 200, and then the support frame through a fastening member (not shown) such as a screw. It is assembled with the bar 224 and fastened.

In addition, the support part 223 protrudes from the horizontal surface 231b of the connection part 231 toward the inlet surface 212 of the cassette 200 to support the rear surface of the mother color filter substrate 120 (FIG. 3). The support 223 may be made of various materials, but preferably, carbon fiber reinforced plastics (CFRP).

On one surface of the support part 223 facing the upper plate 214 of the cassette 200, a plurality of support pins 240a, 240b, 240c, 240d, 240e and 240f which are formed perpendicular to the support part 223 may have a predetermined interval. The plurality of support pins 240a, 240b, 240c, 240d, 240e, and 240f have a truncated conical shape that decreases in diameter from the support part 223 toward the upper plate 214 of the cassette 200.

Therefore, the substrate (120 of FIG. 3) supported by the support part 223 through the plurality of support pins 240a, 240b, 240c, 240d, 240e, and 240f is in point contact, thereby supporting the support. Generation of particles due to scratches due to surface contact of the bar 230 is prevented in advance.

The plurality of support pins 240a, 240b, 240c, 240d, 240e, and 240f may be made of polyether ether ketone (PEEK), and PEEK has heat resistance, chemical resistance, and rigidity.

Such a plurality of support pins 240a, 240b, 240c, 240d, 240e, and 240f are in direct contact with the rear surface of the mother color filter substrate (120 in FIG. 3) having the back electrode (130 in FIG. 2) formed thereon. The back of the color filter substrate (120 of FIG. 3) is supported.

In particular, the support pins 240a, 240b, 240c, 240d, 240e, and 240f of the present invention include a support pin 240a (hereinafter, referred to as a first support pin) positioned closest to the connection part 231, and a connection part 231. It is characterized in that located in the area (D1) within 15 ~ 35mm from the point where the support 233 protrudes in the horizontal plane (231b) of the.

This is for the position of the first support pin 240a to correspond to the dummy region (140 in FIG. 3) of the substrate (120 in FIG. 3) seated on the support bar 230. This will be described in more detail with reference to FIG. 6.

6 is a cross-sectional view schematically showing the structure of a support bar and a substrate supported by the support bar, and FIG. 7 is a view of a mother color filter substrate loaded in a cassette and a mother color filter substrate loaded in a general cassette according to an embodiment of the present invention. It is a graph showing the rate of poor spot spraying.

As shown in FIG. 6, a plurality of support pins 240a, 240b, 240c, 240d, 240e, and 240f are formed to protrude vertically on the support part 233 of the support bar 230, in particular, the support bar 230. The first support pin 240a, which is positioned closest to the connection part 231, is located in an area D1 within 15 to 35 mm from the point where the support part 233 protrudes from the horizontal surface 231 b of the connection part 231. .

A mother color having a plurality of color filter patterns 102a and a dummy region 140 formed on a cassette (200 in FIG. 4) including the support bar 230 and a back electrode (130 in FIG. 2) formed on a rear surface thereof. The first substrate formed in the area D1 while the filter substrate 120 is loaded and the back surface of the mother color filter substrate 120 is supported in contact with the plurality of support pins 240a, 240b, 240c, 240d, 240e and 240f. The support pin 240a supports the rear surface of the dummy region 140 of the mother color filter substrate 120.

Therefore, when the drooping phenomenon of the mother color filter substrate 120 loaded in the cassette (200 of FIG. 4) occurs, the stress is concentrated on the first support pin 240a of the support bar 230, and thus the first support pin 240a. As a result of marks or scratches caused by the pressing of the first support pin 240a on the rear surface of the mother color filter substrate 120 in contact with the c), it is possible to prevent a problem of causing black spot defects.

Looking more closely at this, the substrate 120 cannot support one edge toward the inlet surface (212 of FIG. 4) of the cassette (200 of FIG. 4), so that the substrate (200 of FIG. 4) One edge toward the entrance face (212 in FIG. 4) will cause sagging.

As described above, when the deflection of the substrate 120 occurs, the load of the substrate 120 is concentrated on one edge of the cassette (200 in FIG. 4) toward the inlet surface (212 in FIG. 4), and thus, the entirety of the substrate 120. The support bar 230 supporting the load receives a load that is greater than the weight of the actual substrate 120.

The support bar 230 fixed to the backside (218 of FIG. 4) of the cassette (200 of FIG. 4) acts a specific force, that is, a stress, and the back side (218 of FIG. 4) of the cassette (200 of FIG. 4). And the other end of the support bar 230 fixed through the fixing structure (not shown) is not absorbed and reduced the stress is concentrated stress.

Accordingly, the stress concentrated at the other end of the support bar 230 is transferred to the first support pin 240a positioned closest to the other end of the support bar 230, and the first support directly contacts the substrate 120. The stress transmitted to the pins 240a may generate marks due to the pressing of the first support pins 240a on the back surface of the substrate 120 or scratches on the back surface of the substrate 120.

In particular, the substrate 120 of the present invention is a substrate for a transverse electric field type liquid crystal display device, and indium-tin-oxide (ITO) or indium-zinc-, which is a transparent conductive material, in order to prevent unnecessary charges such as static electricity from flowing into the rear surface thereof. The back electrode (130 of FIG. 2) is formed of oxide (IZO), and thus, when the pressing mark or the scratch is generated by the first support pin 240a, black spot defects are caused.

Thus, according to the present invention, the first support pin 240a supports the dummy region 140 of the substrate 120, so that a pressing mark or scratch caused by the first support pin 240a may be generated to cause a black spot defect. This is to prevent such black spot defects from occurring on the area where the image is substantially implemented, that is, the color filter pattern 102a.

Table 1 below and FIG. 7 illustrates a cassette in which the first support pin 240a of the support bar 230 corresponds to the dummy region 140 of the substrate 120 according to an embodiment of the present invention (200 in FIG. 4). ) Is a table and a graph showing the black spot defect rate of the mother color filter substrate 120 and the mother color filter substrate loaded in a general cassette.

Number of boards Number of NG substrates sample 1 16613 86 sample 2 41275 7

Prior to the description, sample 1 shows a mother color filter substrate that was loaded in a general cassette, and sample 2 shows a first support pin of the support bar 15 to 35 mm from the point where the support portion protrudes from the horizontal plane of the connection part according to the embodiment of the present invention. The mother color filter substrate loaded in the cassette located in the area D1 is shown.

In addition, the black spot defect was inspected for the occurrence of black spot defect on the image that is substantially implemented through the auto probe inspection, and the substrate on which the black spot defect was generated was defined as an NG substrate.

As can be seen from the table (1) and the graph of FIG. 7, according to an embodiment of the present invention, the first support pin of the support bar is located in the area D1 within 15 to 35 mm from the point where the support protrudes from the horizontal plane of the connection part. It can be seen that the black spot defect occurrence rate of the mother color filter substrate loaded in the cassette was improved to 0.02%, compared to 0.52% of the black spot defect occurrence rate of the mother color filter substrate loaded in the general cassette.

For this reason, the problem that the yield of the process by the black spot defect falls can be prevented.

Meanwhile, the first support pin 240a is positioned in the region D1 within 15 to 35 mm from the point where the support portion 233 protrudes from the horizontal surface 231b of the connection portion 231, thereby providing the first support pin 240a. The distance D2 between the neighboring second support pins 240b and the first support pins 240a may be wider than the distance D3 between the other support pins 240b, 240c, 240d, 240e, and 240f. Can be.

Therefore, since the deflection of the substrate 120 may occur, an auxiliary support pin (not shown) may be further provided at the center of the gap D2 between the first support pin 240a and the second support pin 240b to prevent the deflection. Can be.

The first support pin 240a has the same height h as the other support pins 240b, 240c, 240d, 240e, and 240f, but has a small area S, which is also implemented as an image. This is to prevent the occurrence of black spot defects caused by the first support pins 240a in the region.

For example, when the second to sixth support pins 240b, 240c, 240d, 240e, and 240f have a truncated conical shape having a diameter S2 of 10 mm with a height h2 of 2 mm, the first support pin of the present invention. 240a is a truncated conical shape having a diameter S1 of 5 mm at a height h1 of 2 mm.

As described above, the first support pin 240a positioned closest to the connection part 231 connecting the support bar 230 to the rear surface 218 of FIG. The first support pin 240a supports the dummy region 140 of the substrate 120 by placing the support portion 233 in the region D1 within 15 to 35 mm from the point where the support portion 233 protrudes from the horizontal plane 231b. do.

Through this, when the deflection phenomenon of the substrate 120 loaded in the cassette (200 in FIG. 4) occurs, even if a black spot defect occurs due to a pressing mark or a scratch caused by the first support pin 240a, such a black spot defect It can be prevented from occurring on the area where the image is substantially implemented, that is, the color filter pattern 102a.

Therefore, it is possible to prevent the occurrence of black spot defects, etc., and also to prevent the problem that the yield of the process is lowered.

120: substrate, 102a: color filter pattern
140: dummy area
230: support bar, 231: connection portion, 233: support portion
240a, 240b, 240c, 240d, 240e, 240f: first to sixth support pins

Claims (8)

A cassette for storing a substrate having an upper and a lower plate, the upper and lower plates connected to each other, and having a rear surface of both sides and a rear thereof to provide a front opening entrance surface and a substrate storage space therein.
Frame bars forming the two sides by connecting the upper and lower plates;
A support frame bar forming the rear surface by connecting the upper and lower plates;
A plurality of support bars divided into a connection part connected to the support frame bar and a support part protruding toward the entrance surface from the connection part to directly support the substrate;
First to sixth support pins sequentially arranged at regular intervals perpendicular to the support;
And a first support pin closest to the connection portion is located in an area within 15 to 35 mm from the point at which the support portion protrudes.
The method of claim 1,
The substrate is divided by a dummy area, and a plurality of color filter patterns are defined by being divided into a display area for displaying an image and a non-display area surrounding an edge of the display area, and directly contact the first to sixth support pins. The substrate storage cassette is a mother color filter substrate having a back electrode formed on the back.
The method of claim 2,
The dummy region has a width of 22.5 ~ 42mm, the first support pin is a substrate storage cassette for supporting the dummy region.
The method of claim 1,
The first to sixth support pin is a substrate storage cassette having a truncated conical shape as the diameter progresses toward the upper plate side.
The method of claim 4, wherein
The first support pin has the same height as the second to sixth support pins, and has a smaller diameter than the second to sixth substrate cassette.
The method of claim 1,
The substrate storage cassette further comprises an auxiliary support pin between the first support pin and the second support pin adjacent to the first support pin.
The method of claim 1,
The first to sixth support pins are substrate storage cassettes of PEEK (poly ether ether ketone) material.
A cassette for storing a substrate, which is divided by a dummy area and provides a storage space of a substrate having a plurality of color filter patterns defined by being divided into a display area displaying an image and a non-display area covering an edge of the display area.
Vertical plate,
Frame bars forming the two sides by connecting the upper and lower plates;
A support frame bar forming the rear surface by connecting the upper and lower plates;
A plurality of support bars divided into a connection part connected to the support frame bar and a support part protruding toward the entrance surface from the connection part to directly support the substrate;
First to sixth support pins sequentially arranged at regular intervals perpendicular to the support;
And a first support pin closest to the connection part supporting the dummy area.
KR1020100021825A 2010-03-11 2010-03-11 Cassette for storing substrate KR20110102678A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020100021825A KR20110102678A (en) 2010-03-11 2010-03-11 Cassette for storing substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100021825A KR20110102678A (en) 2010-03-11 2010-03-11 Cassette for storing substrate

Publications (1)

Publication Number Publication Date
KR20110102678A true KR20110102678A (en) 2011-09-19

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103448048A (en) * 2013-09-09 2013-12-18 深圳市华星光电技术有限公司 Substrate storage rack
KR20150124743A (en) * 2014-04-29 2015-11-06 삼성전자주식회사 wafer storage container
JP2019065393A (en) * 2017-09-29 2019-04-25 キヤノントッキ株式会社 Substrate support structure, vacuum vapor deposition device including the same and vapor deposition method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103448048A (en) * 2013-09-09 2013-12-18 深圳市华星光电技术有限公司 Substrate storage rack
CN103448048B (en) * 2013-09-09 2015-11-25 深圳市华星光电技术有限公司 Substrate storage rack
US9324596B2 (en) 2013-09-09 2016-04-26 Shenzhen China Star Optoelectronics Technology Co., Ltd. Substrate storage rack
KR20150124743A (en) * 2014-04-29 2015-11-06 삼성전자주식회사 wafer storage container
JP2019065393A (en) * 2017-09-29 2019-04-25 キヤノントッキ株式会社 Substrate support structure, vacuum vapor deposition device including the same and vapor deposition method

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