KR20120006748A - Magazine - Google Patents

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Publication number
KR20120006748A
KR20120006748A KR1020100067387A KR20100067387A KR20120006748A KR 20120006748 A KR20120006748 A KR 20120006748A KR 1020100067387 A KR1020100067387 A KR 1020100067387A KR 20100067387 A KR20100067387 A KR 20100067387A KR 20120006748 A KR20120006748 A KR 20120006748A
Authority
KR
South Korea
Prior art keywords
slot
thin plate
protrusion
magazine
sides
Prior art date
Application number
KR1020100067387A
Other languages
Korean (ko)
Inventor
이재준
정순오
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020100067387A priority Critical patent/KR20120006748A/en
Publication of KR20120006748A publication Critical patent/KR20120006748A/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

The present invention relates to a magazine for laminating, storing and moving a substrate.
Magazine for thin plate transfer of the present invention, the main body; And a plurality of slots protruding from the inner wall of both sides of the main body, wherein the plurality of slots are provided with protrusions protruding upward from a portion of a lower surface thereof, respectively, when mounting the thin plate through the slots formed on the inner wall. By allowing a gradient to be formed through the protrusions formed in the slots on both sides of the thin plate, there is an effect of improving the amount of deflection of the central portion of the thin plate.

Description

Thin plate transfer magazine {Magazine}

The present invention relates to a magazine for stacking, storing, and moving a substrate, and more particularly, an inclined protrusion is formed inside an individual slot provided in the magazine body to support an end of the substrate, thereby minimizing warpage of the substrate. To a thin sheet conveying magazine.

Due to the high performance and miniaturization of electronic devices, thin package substrates with improved signal transmission speeds are being manufactured, and the thickness of the thin substrates is gradually getting thinner according to the speed of technology development. The thin board | substrate made thin was produced.

In general, the substrate is made of a multi-layer structure, the front-end process for building up the number of layers of the design specification and the back end for forming a structure for connecting the completed board with the main substrate ( back-end) process.

In the case of the coreless substrate from which the aforementioned core part is removed, the front end process proceeds to the thick plate and the back end process proceeds to the ultra thin plate due to the characteristics of the manufacturing method.

As described above, the substrate in which the process is moved in the form of a thick plate and an ultra-thin plate is carried out through a magazine having a cradle formed on both sides of the process and the storage, and a plurality of substrates are sequentially stacked in the magazine, and the magazine is then processed. The substrate is inserted into the magazine by moving to a position for progressing again to allow the next process to proceed.

At this time, when the coreless substrate of the ultra-thin plate is inserted into the magazine, the central portion of the substrate may be sag due to its own weight, and one side end of the substrate may be dropped from the slot due to shaking during the movement. .

1 is a cross-sectional view of a magazine for transporting a conventional substrate, as shown in FIG. 1, in the state where both ends of the substrate 20 are fixed through the slots 11 inside the magazine 10, severe deflection occurs due to its own weight. As the amount of deflection increases, a portion supported by the slot 11 decreases, and one or both ends thereof may be separated from the slot 11.

In addition, when one side or both sides of the substrate is separated, there is a disadvantage that a failure may occur during the substrate process as the substrate is dropped by the overlap or collision between the substrates while falling to the bottom of the magazine 10. .

Therefore, the present invention was devised to solve the above-mentioned disadvantages and problems raised in the conventional magazine, and provided on both sides of the substrate inserted into the slot by having an inclined protrusion in the slot provided at both sides of the magazine body. It is an object of the invention to provide a thin sheet conveying magazine which is capable of reducing the amount of deflection at the center of the substrate as a local warpage is formed.

The object of the present invention is composed of a main body of the enclosure, and a plurality of slots protruding on the inner side of both sides of the main body, each of the plurality of slots for thin plate transfer provided with a protrusion protruding upward from a portion of the lower surface This is accomplished by providing a magazine.

The slots are formed on both inner side surfaces of the main body in the form of long grooves along the horizontal direction, and are arranged in a line along the inner side longitudinal direction. Each of the slots formed on both inner side surfaces of the main body is formed at a position where a pair of slots facing each other correspond.

In addition, the slot is configured such that the protrusion protruding from a portion of the lower surface has an inclined portion, the inclined portion is formed to be inclined toward the upper side of the inclined side portion formed inclined toward the inner side from the outside of the slot and the inlet side of the slot It consists of a front slope.

In this case, the protrusion formed in the slot may be formed to protrude over the entire lower surface of the slot.

As described above, when both sides of the thin plate are mounted through slots protruding from the inner sides of both sides, both ends of the thin plate are bent downward due to their own weight as the upper ends of the protrusions of the slots are placed on both sides of the thin plate. It is to be generated, the line contact point of the upper end of the protrusion and the thin plate is to force the deflection in the opposite direction of its own weight so that the center deflection amount of the thin plate mounted on both slots can be improved.

As described above, in the thin plate conveying magazine of the present invention, when the thin plate is mounted through the slot formed on the inner wall, a gradient is formed through the protrusions formed in the slots on both sides of the thin plate, thereby improving the central deflection amount of the thin plate. There is an effect, and through this there is an advantage that can prevent the damage of the transport or storage products by preventing both sides of the sheet from falling off the slot during transport or storage of the magazine.

1 is a front view of a conventional thin plate transfer magazine.
Figure 2 is a front view of the thin plate transport magazine according to the present invention.
3 is a perspective view of a slot employed in the thin plate conveying magazine according to the present invention.
4 is a front view of the slot shown in FIG.
5 is a side view of the slot shown in FIG.

Matters relating to the operational effects including the technical configuration for the above object of the sheet transport magazine according to the present invention will be clearly understood by the following detailed description with reference to the drawings showing preferred embodiments of the present invention.

First, Figure 2 is a front view of the thin plate conveying magazine according to the present invention, Figure 3 is a perspective view of a slot employed in the thin plate conveying magazine according to the present invention, Figure 4 is a front view of the slot shown in Figure 3, 5 is a side view of the slot shown in FIG. 3.

As shown, the thin plate transport magazine 100 according to the present invention is composed of a main body 110 and a plurality of slots 120 protruding on the inner side surfaces of both sides of the main body 110.

In addition, the magazine 100 may be configured as a main body 110 of the enclosure type, so that the insertion and withdrawal of the thin plate 110 through the front and rear of the main body 110 is opened and opened. In addition, only the front of the body 110 may be opened to enable insertion and withdrawal of the thin plate 200 through the front opening.

Slot 120 formed on the inner surface of the both side wall constituting the main body 110 is mounted on both sides of the thin plate 200 when the thin plate 200 is inserted, the plurality of thin plates 200 in the main body 110 of the magazine at regular intervals In order to be vertically stacked in the form of a long groove along the horizontal direction of the inner side surface of both sides of the main body 110, a plurality in the longitudinal direction of the inner surface is arranged in a row at the same interval.

In addition, when the slot 120 is configured in a row on the inner side surfaces of the both walls 111 and 112 constituting the main body 110, the slot 120 is formed at an opposite position among the slots 120 provided in the both walls 111 and 112. 120 is preferably formed in a position corresponding to each other so that the mounting position of the thin plate is inserted into the slot 120 on both sides to form a parallel position.

On the other hand, the slot 120 is applied to the magazine 100 of the present embodiment is provided with a protrusion 121 protruding upward from a portion of the lower surface.

When the thin plate 200 is inserted into the magazine, the slot 120 concentrates all the loads of the thin plate 200 through both sides of the thin plate 200 mounted on the slot 120 to be horizontal in the magazine 100. The thin plate 200 must be maintained. However, as the thickness of the thin plate 200 becomes relatively thin and the length thereof becomes relatively long, the mounting is not performed only by the load concentrated on both sides of the thin plate 200, and the load is concentrated on the center portion of the thin plate 200. A certain amount of deflection will inevitably occur.

Therefore, in the present embodiment, as shown in FIG. 2, by forming a protrusion 121 protruding from a portion of the lower surface inside the slot 120 to generate a forced bending of both sides of the thin plate 200, the central portion is concentrated. The deflection amount of the thin plate 200 may be improved, which will be described in more detail below.

2 to 5, the thin plate 200 inserted into the main body 110 of the magazine 100 and stacked and stored in multiple stages may include slots formed in the inner surfaces of both side walls 111 and 112 of the main body 110. When both sides are mounted through the 120, both sides of the thin plate 200 are mounted in line contact with the protrusion 121 formed in the slot 120.

In more detail, each of the slots 120 may have a protrusion 121 protruding from a portion of the lower surface thereof, and may have an inclined portion 130 inclined downward from the tip of the protrusion 121. .

At this time, the inclined portion 130 is a side inclined portion 131 configured to be inclined downward toward the inside of the slot 120 at the tip of the protrusion 121 protruding from the outside of the slot 120, and the inlet side of the slot 120 It may be composed of a front inclined portion 132 formed to be inclined upward from the lower surface of the predetermined point to the front end of the protrusion 121.

The side slope portion 130 may be formed from a tip of the protrusion 121 to a portion of the bottom surface of the slot 120, and in some cases, may extend from the tip of the protrusion 121 to the inner wall surface of the slot 120. have.

As described above, the side surface of the protrusion 121 is formed in a triangular shape as shown in FIG. 5 by the side inclined portion 130 formed in the protrusion 121, and both sides of the thin plate 200 mounted on the slot 120. The line is in line contact with the upper edge portion of the protrusion 121, so that both sides of the thin plate 200 is localized bending along the side slope portion 131 of the protrusion 121 by its own weight.

Therefore, a phenomenon in which both side portions of the thin plate 200 may be pulled due to the bending generated inside the side inclined portion 131, and thus the amount of deflection of the central portion of the thin plate 200 may be significantly improved as compared with the related art. .

On the other hand, the side inclined portion 131 has an angle α of the side inclined portion 131 from the point where the inclined surface of the lower surface or the inner wall surface of the slot 120 starts to the tip of the protrusion 121 is approximately 30 ° to 50 degrees. It is preferred to be configured at an angle of °.

Here, if the angle α of the side inclined portion 131 is configured to be within 30 °, the amount of deflection of the central portion of the thin plate 200 is insufficient because the amount of warpage of both sides of the thin plate 200 in contact with the tip portion of the protrusion 121 is small. If the angle α of the side inclined portion 131 is 50 ° or more, local bending on both sides of the thin plate 200 in contact with the tip portion of the protrusion 121 may not be expected, and thus the deflection amount of the central portion may be improved. You can't expect it.

On the other hand, the protrusion 121 formed in the slot 120 of the present embodiment is provided with a front inclined portion 132, as shown in Figure 4 to be inclined toward the upper portion of the protrusion 121 in the lower portion of the inlet side of the slot 120 Is formed.

The front inclined portion 132 is such that when the thin plate 200 inserted into the slot () is inserted along the front inclined portion 132, both sides of the thin plate 200 can be easily settled to the upper end of the protrusion 121. It is to.

That is, as the front inclined portion 132 starts at the inner bottom surface adjacent to the inlet side of the slot 120, the inlet of the slot 120 is secured to facilitate the insertion of the thin plate 200 into the slot 120. In addition, the thin plate 200 inserted into the slot 120 may be naturally moved to the upper end of the protrusion 121 along the front inclined portion 132.

At this time, the front inclined portion 132 is preferably formed at an angle β of the inclined surface from the point where the inclined surface of the slot 120 inlet side to the top of the protrusion (β) of 15 ° to 30 °.

Preferred embodiments of the present invention described above are disclosed for the purpose of illustration, and various substitutions, modifications, and changes within the scope without departing from the spirit of the present invention for those skilled in the art to which the present invention pertains. It will be possible, but such substitutions, changes and the like should be regarded as belonging to the following claims.

100.Magazine 110.Body
120.Slot 121.Protrusion
131. Side slopes 132. Front slopes

Claims (8)

main body;
It includes a plurality of slots protruding on the inner wall of the body of both sides,
Each of the plurality of slots is a thin plate transport magazine having a projection protruding upward from a portion of the lower surface.
The method of claim 1,
The slot is a thin plate transport magazine configured to have an inclined portion projecting from the lower portion.
The method of claim 2,
The inclined portion is a thin plate transport magazine consisting of a side inclined portion configured to be inclined downward from the leading end of the protrusion of the slot toward the inner bottom surface of the slot, and a front inclined portion formed to be inclined upwardly to the upper side of the protrusion at a lower surface adjacent to the inlet side of the slot. .
The method of claim 2,
The projecting portion is a thin plate transfer magazine formed to project over the entire lower surface of the slot
The method of claim 3,
Both sides of the thin plate inserted into the magazine are mounted to the protrusion of the slot, and both sides of the thin plate mounted on the slot are in line contact with the tip of the protrusion, so that both sides of the thin plate are locally warped along the inclined portion of the protrusion. Thin sheet transfer magazine.
The method of claim 3,
The lateral inclined portion is formed in the thin film transfer magazine formed to extend from the leading end of the protrusion to a portion of the lower surface of the slot, or extending from the leading end of the protrusion to the inner wall surface of the slot.
The method of claim 3,
The lateral inclined portion is a thin plate transfer magazine composed of an angle (α) from the starting point of the inclined surface on the lower surface of the slot to the tip portion of the protrusion is an angle of 30 ° to 50 °.
The method of claim 3,
And the front inclined portion is formed at an angle (β) of the inclined surface from the point where the inclined surface of the slot inlet side starts to the upper end of the protruding portion at an angle of 15 ° to 30 °.
KR1020100067387A 2010-07-13 2010-07-13 Magazine KR20120006748A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020100067387A KR20120006748A (en) 2010-07-13 2010-07-13 Magazine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100067387A KR20120006748A (en) 2010-07-13 2010-07-13 Magazine

Publications (1)

Publication Number Publication Date
KR20120006748A true KR20120006748A (en) 2012-01-19

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100067387A KR20120006748A (en) 2010-07-13 2010-07-13 Magazine

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109576666A (en) * 2017-09-29 2019-04-05 佳能特机株式会社 Substrate supporting tectosome and vacuum deposition apparatus and evaporation coating method including it

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109576666A (en) * 2017-09-29 2019-04-05 佳能特机株式会社 Substrate supporting tectosome and vacuum deposition apparatus and evaporation coating method including it
JP2019065393A (en) * 2017-09-29 2019-04-25 キヤノントッキ株式会社 Substrate support structure, vacuum vapor deposition device including the same and vapor deposition method
JP2020122221A (en) * 2017-09-29 2020-08-13 キヤノントッキ株式会社 Substrate support structure, vacuum vapor deposition device including the same and vapor deposition method
CN109576666B (en) * 2017-09-29 2021-07-06 佳能特机株式会社 Substrate support structure, vacuum deposition apparatus including the same, and deposition method

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