JP2020076123A - Film deposition device, manufacturing system, and organic el panel manufacturing system - Google Patents

Film deposition device, manufacturing system, and organic el panel manufacturing system Download PDF

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JP2020076123A
JP2020076123A JP2018210047A JP2018210047A JP2020076123A JP 2020076123 A JP2020076123 A JP 2020076123A JP 2018210047 A JP2018210047 A JP 2018210047A JP 2018210047 A JP2018210047 A JP 2018210047A JP 2020076123 A JP2020076123 A JP 2020076123A
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film forming
vacuum chamber
substrate
alignment
forming apparatus
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JP7118864B2 (en
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俊明 姫路
Toshiaki Himeji
俊明 姫路
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Canon Tokki Corp
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Canon Tokki Corp
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Priority to KR1020190055146A priority patent/KR20200052810A/en
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04Coating on selected surface areas, e.g. using masks
    • C23C16/042Coating on selected surface areas, e.g. using masks using masks
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2051Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2059Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam
    • G03F7/2063Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam for the production of exposure masks or reticles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/16Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Abstract

To provide a light film deposition device, in which it is difficult to give influences on an operation of an alignment mechanism even when a film deposition chamber is deformed and vibration occurs inside and outside the film deposition chamber.SOLUTION: A film deposition device (100) comprises: a vacuum chamber; an alignment driving part (15) arranged outside the vacuum chamber, and adjusting a relative position of a mask and a substrate arranged in the vacuum chamber; and a frame body fixed on the vacuum chamber via a leg part (22) arranged on a side wall (1S) of the vacuum chamber. The frame body has plural beams (23, 24, 25) parallel to the side wall of the vacuum chamber, and the alignment driving part (15) is fixed to a support plate (21) fixed to the plural beams and supported at an interval from a top plate of the vacuum chamber.SELECTED DRAWING: Figure 2

Description

本発明は、成膜装置、製造システム、有機ELパネルの製造システムに関する。特に、真空チャンバと、基板とマスクのアライメント機構とを備えた成膜装置に関する。   The present invention relates to a film forming apparatus, a manufacturing system, and an organic EL panel manufacturing system. In particular, the present invention relates to a film forming apparatus including a vacuum chamber and a substrate / mask alignment mechanism.

近年、自発光型で、視野角、コントラスト、応答速度に優れた有機EL素子は、壁掛けテレビをはじめとする種々の表示装置に盛んに応用されている。
有機EL素子の製造は、減圧されたチャンバ内に基板を搬入し、基板とマスクを高精度に位置合わせ(アライメント)し、所定パターンの有機膜をマスク越しに基板上に成膜する方法で行われることが多い。
In recent years, organic EL elements that are self-luminous and have excellent viewing angles, contrasts, and response speeds have been widely applied to various display devices such as wall-mounted televisions.
The organic EL element is manufactured by a method in which the substrate is carried into a depressurized chamber, the substrate and the mask are accurately aligned (aligned), and an organic film having a predetermined pattern is formed on the substrate through the mask. It is often seen.

図9は、従来の成膜に用いられていた成膜装置の構成を示す模式的な断面図である。減圧可能な気密容器である成膜室が、外壁110と、外壁の一部である110aに接合された天板110bとにより構成され、成膜室内には、基板111、成膜用マスク113、有機材料の蒸着源116が配置されている。基板111は、基板支持体112により両側(又は、4辺)から支持され、成膜用マスク113は、マスク支持体114により両側(又は、4辺)から支持されている。基板支持体112およびマスク支持体114の各軸は、不図示の金属ベローズを介して気密性が確保された状態で上下動が可能に大気側に連通している。   FIG. 9 is a schematic cross-sectional view showing the configuration of a film forming apparatus used for conventional film forming. A film forming chamber, which is an airtight container capable of depressurizing, is composed of an outer wall 110 and a top plate 110b joined to 110a which is a part of the outer wall. Inside the film forming chamber, a substrate 111, a film forming mask 113, A vapor deposition source 116 of organic material is arranged. The substrate 111 is supported by the substrate support 112 from both sides (or four sides), and the film formation mask 113 is supported by the mask support 114 from both sides (or four sides). Each of the axes of the substrate support 112 and the mask support 114 communicates with the atmosphere side via a metal bellows (not shown) so as to be vertically movable in a state where airtightness is ensured.

天板110b上の大気側には、アライメント機構115とアライメントカメラ132が設置されている。アライメントカメラ132は、天板110bに設けられた気密窓133を通して真空チャンバ内の基板111と成膜用マスク113のアライメントマークを撮影する。アライメント機構115は、アライメントカメラ132の撮影結果に基づいて、基板111と成膜用マスク113の位置合わせ(アライメント)を行うための機構である。   An alignment mechanism 115 and an alignment camera 132 are installed on the atmosphere side of the top plate 110b. The alignment camera 132 takes an image of the alignment mark between the substrate 111 and the film formation mask 113 in the vacuum chamber through the airtight window 133 provided on the top plate 110b. The alignment mechanism 115 is a mechanism for performing alignment (alignment) between the substrate 111 and the film formation mask 113 based on the image pickup result of the alignment camera 132.

最近では、有機EL素子を用いた表示装置が大画面化や高精細化しているため、大面積の基板に高いパターニング精度で有機膜を成膜することが可能な成膜装置が求められている。大面積の基板を扱う成膜装置においては、従来よりも成膜室の容積を大きくする必要があるが、内外の圧力差によって成膜室の天井や壁面が変形しやすくなる。この変形により、アライメント機構115やアライメントカメラ132の位置に変位が生じると、基板111と成膜用マスク113は相対位置ずれを引き起こし易くなる。例えば、アライメントカメラ132の光軸のずれや、アライメント機構115の動作の再現性の低下が生じ、基板111と成膜用マスク113の位置合わせ精度が低下するのである。
基板111と成膜用マスク113の位置合わせ精度が低下すると、有機膜のパターニング精度が低下し、所望の画質の有機EL素子を高い歩留まりで量産できない可能性がある。
Recently, since display devices using organic EL elements have large screens and high definition, there is a demand for a film forming device capable of forming an organic film on a large-area substrate with high patterning accuracy. .. In a film forming apparatus that handles a large-area substrate, the volume of the film forming chamber needs to be larger than in the past, but the ceiling and wall surfaces of the film forming chamber are easily deformed due to the pressure difference between the inside and the outside. When the positions of the alignment mechanism 115 and the alignment camera 132 are displaced due to this deformation, the substrate 111 and the film formation mask 113 are likely to be displaced relative to each other. For example, the optical axis of the alignment camera 132 is displaced, the reproducibility of the operation of the alignment mechanism 115 is deteriorated, and the alignment accuracy of the substrate 111 and the film formation mask 113 is deteriorated.
When the alignment accuracy between the substrate 111 and the film formation mask 113 is lowered, the patterning accuracy of the organic film is lowered, and there is a possibility that the organic EL element having a desired image quality cannot be mass-produced with a high yield.

そこで、成膜室の外壁と天板の厚さを大きくすれば圧力差による変形を抑制できる可能性があるが、装置重量が大きくなってしまい、装置の製造コストや輸送費が増大し、更には成膜装置を設置する建屋の床面荷重が大きくなってしまう。これは、有機EL素子の製造設備のトータルコストの増大を招くことになる。   Therefore, if the thickness of the outer wall of the film forming chamber and the top plate are increased, the deformation due to the pressure difference may be suppressed, but the weight of the device is increased, and the manufacturing cost and transportation cost of the device are increased. Will increase the load on the floor of the building where the film deposition apparatus is installed. This leads to an increase in the total cost of the manufacturing facility for the organic EL element.

特許文献1には、成膜室の天板の上に、天板とは離間した支持板を設け、支持板の少なくとも一部に振動を熱エネルギーに変換する制振材料を用いた成膜装置が開示されている。この装置では、アライメント機構はこの支持板に載置されている。
この構成により、成膜装置内外の圧力差により天板が変形したとしても支持板は天板と離間しており、振動が熱エネルギーに変換されるようになり、変形や振動がアライメント機構の動作に及ぼす影響を軽減することができる。
Patent Document 1 discloses a film forming apparatus in which a support plate separated from the top plate is provided on a top plate of a film forming chamber, and at least a part of the support plate uses a vibration damping material for converting vibration into heat energy. Is disclosed. In this device, the alignment mechanism is mounted on this support plate.
With this configuration, even if the top plate is deformed due to the pressure difference between the inside and outside of the film forming apparatus, the support plate is separated from the top plate, and the vibration is converted into thermal energy. Can be reduced.

特開2012−33468号公報JP, 2012-33468, A

しかしながら、成膜装置のアライメント機構には、圧力差による天板の変形や振動だけでなく種々の原因による振動が伝わる可能性があるが、特許文献1に記載された装置では、アライメント機構の動作への影響を十分に抑制しきれない可能性がある。支持板の材料の制振性のみでは、チャンバ内外から伝達される振動の影響を吸収しきれない場合が有り得るからである。振動を熱エネルギーに変換する支持板の厚みを大きくして制震性を向上させようとすると、装置重量が大きくなってしまい、装置の製造コストや輸送費が増大し、さらには成膜装置を設置する建屋の床面荷重も大きくなってしまう。これは、有機EL素子の製造設備のトータルコストの増大を招くことになる。   However, not only the deformation and vibration of the top plate due to the pressure difference but also vibration due to various causes may be transmitted to the alignment mechanism of the film forming apparatus. However, in the apparatus described in Patent Document 1, the operation of the alignment mechanism It may not be possible to sufficiently suppress the impact on This is because there is a possibility that the effect of vibration transmitted from the inside and outside of the chamber may not be completely absorbed only by the damping property of the material of the support plate. If the thickness of the support plate that converts vibrations into heat energy is increased to improve the vibration control performance, the weight of the device increases, which increases the manufacturing cost and transportation cost of the device. The floor load of the building to be installed also increases. This leads to an increase in the total cost of the manufacturing facility for the organic EL element.

そこで、成膜室の変形が生じたり、成膜室の内外で振動が生じたとしても、アライメント機構の動作が影響を受けにくく、しかも軽量な成膜装置が求められていた。   Therefore, even if the film forming chamber is deformed or vibrations are generated inside and outside the film forming chamber, the operation of the alignment mechanism is not easily affected and a lightweight film forming apparatus has been demanded.

本発明は、真空チャンバと、前記真空チャンバの外に配置され、前記真空チャンバの中に配置されたマスクと基板の相対位置を調整するアライメント駆動部と、前記真空チャンバの側壁の上に配置された脚部を介して前記真空チャンバの上に固定された枠体と、を備え、前記枠体は、前記真空チャンバの側壁と平行な複数の梁を有し、前記複数の梁に固定されて前記真空チャンバの天板から間隔をおいて支持された支持板に、前記アライメント駆動部は固定されている、ことを特徴とする成膜装置である。   The present invention provides a vacuum chamber, an alignment driver that is disposed outside the vacuum chamber and adjusts a relative position of a mask and a substrate that is disposed in the vacuum chamber, and is disposed on a sidewall of the vacuum chamber. A frame body fixed on the vacuum chamber via leg portions, the frame body having a plurality of beams parallel to the side wall of the vacuum chamber, and being fixed to the plurality of beams. In the film forming apparatus, the alignment drive unit is fixed to a support plate supported at a distance from a top plate of the vacuum chamber.

本発明によれば、成膜室の変形が生じたり、成膜室の内外で振動が生じたとしても、アライメント機構の動作が影響を受けにくく、しかも軽量な成膜装置を提供することができる。   According to the present invention, even if the film forming chamber is deformed or vibration is generated inside and outside the film forming chamber, the operation of the alignment mechanism is not easily affected, and a lightweight film forming apparatus can be provided. ..

実施形態1及び実施形態2の成膜装置の模式的な概観斜視図。3 is a schematic perspective view of the film forming apparatus according to the first and second embodiments. FIG. 実施形態1及び実施形態2の成膜装置の模式的な上面図。3 is a schematic top view of the film forming apparatus of Embodiments 1 and 2. FIG. 実施形態1の成膜装置の模式的な断面図。3 is a schematic cross-sectional view of the film forming apparatus of Embodiment 1. FIG. 実施形態1及び実施形態2の成膜装置の模式的な断面図。3 is a schematic cross-sectional view of the film forming apparatus of Embodiments 1 and 2. FIG. 実施形態1及び実施形態2の枠体の模式的な上面図。FIG. 3 is a schematic top view of the frame body according to the first and second embodiments. (a)実施形態1の梁25の断面図。(b)実施形態1の梁23の断面図。(c)実施形態2の梁25の断面図。(d)実施形態2の梁23の断面図。(A) Sectional drawing of the beam 25 of Embodiment 1. FIG. (B) A sectional view of the beam 23 of the first embodiment. (C) A sectional view of the beam 25 of the second embodiment. (D) A cross-sectional view of the beam 23 of the second embodiment. 実施形態2の成膜装置の模式的な断面図。5 is a schematic cross-sectional view of the film forming apparatus of Embodiment 2. FIG. 実施形態3の製造システムの模式的な構成図。The schematic block diagram of the manufacturing system of Embodiment 3. 従来の成膜装置の模式的な断面図。The typical sectional view of the conventional film-forming device.

本発明の実施形態である成膜装置及び製造システムについて、図面を参照して説明する。尚、以下の説明で参照する複数の図面では、特に但し書きがない限り、同一の機能の構成要素については同一の番号を付して示すものとする。   A film forming apparatus and a manufacturing system according to an embodiment of the present invention will be described with reference to the drawings. In the plurality of drawings referred to in the following description, components having the same function are denoted by the same reference numerals unless otherwise specified.

[実施形態1]
(成膜装置の構成)
実施形態1の成膜装置の構成について、複数の図面を参照して説明する。成膜装置100に関し、図1は模式的な概観斜視図、図2は模式的な上面図、図3および図4は模式的な断面図である。尚、図3は、図1におけるYZ面と平行なC1面で装置を切った断面図、あるいは図2のC1−C1線に沿って装置を切った断面図である。また、図4は、図2のC2−C2線に沿って装置を切った断面図である。
[Embodiment 1]
(Structure of film forming apparatus)
The configuration of the film forming apparatus according to the first embodiment will be described with reference to a plurality of drawings. Regarding the film forming apparatus 100, FIG. 1 is a schematic perspective view, FIG. 2 is a schematic top view, and FIGS. 3 and 4 are schematic sectional views. Note that FIG. 3 is a cross-sectional view of the device cut along a C1 plane parallel to the YZ plane in FIG. 1 or a cross-sectional view taken along the line C1-C1 of FIG. 4 is a cross-sectional view of the device cut along the line C2-C2 in FIG.

成膜装置100は、成膜室の外囲器としての真空チャンバ1を備え、真空チャンバ1の内部は不図示の真空ポンプにより、例えば10−3Pa以下の圧力領域まで減圧可能である。図1に示すように、真空チャンバ1は、典型的には概略形状が六面体であり、図3に示すように、底板1Bと4面の側壁1Sと天板1Rが接合された気密容器である。4面の側壁1Sは、XZ面に平行な2つの側壁と、YZ面に平行な2つの側壁を備えている。天板1Rは、図3に示すように中央側と側壁側の板材を接合して構成したものでもよいし、単一の板材で構成してよい。 The film forming apparatus 100 includes a vacuum chamber 1 as an envelope of a film forming chamber, and the inside of the vacuum chamber 1 can be depressurized to a pressure region of, for example, 10 −3 Pa or less by a vacuum pump (not shown). As shown in FIG. 1, the vacuum chamber 1 is typically a hexahedron in outline shape, and as shown in FIG. 3, is a hermetic container in which a bottom plate 1B, four side walls 1S, and a top plate 1R are joined. .. The four side walls 1S include two side walls parallel to the XZ plane and two side walls parallel to the YZ plane. The top plate 1R may be configured by joining plate members on the center side and the side wall side as shown in FIG. 3, or may be configured by a single plate member.

図1、図2、図4に示すように、成膜装置100は、X方向に沿って並んで配置された2台の蒸着ステージを備えている。実施形態の成膜装置では、一方の蒸着ステージで蒸着を行う間に、他方の蒸着ステージで基板の交換とアライメントを行うことができる。   As shown in FIGS. 1, 2, and 4, the film forming apparatus 100 includes two vapor deposition stages arranged side by side along the X direction. In the film forming apparatus of the embodiment, while performing vapor deposition on one vapor deposition stage, substrate exchange and alignment can be performed on the other vapor deposition stage.

図3を参照して、蒸着ステージの構造を説明する。蒸着ステージには、真空チャンバ1内に下から順にマスク13、基板11が配置され、基板11の上には不図示のマグネット板が配置されている。   The structure of the vapor deposition stage will be described with reference to FIG. On the vapor deposition stage, a mask 13 and a substrate 11 are arranged in order from the bottom in the vacuum chamber 1, and a magnet plate (not shown) is arranged on the substrate 11.

マスク13は、パターニングのための開口を有する薄板形状の部材で、特に大型基板向けには、インバー等で剛性の高い枠部材に囲まれた領域に薄膜のマスクを形成した形態のマスクが用いられることが多い。マスク13は、マスク支持部14の対により両側(又は、4辺)から支持されている。   The mask 13 is a thin plate-shaped member having an opening for patterning, and particularly for a large-sized substrate, a mask in which a thin film mask is formed in a region surrounded by a highly rigid frame member such as Invar is used. Often. The mask 13 is supported from both sides (or four sides) by a pair of mask support portions 14.

基板11としては、製造しようとする対象製品により、ガラス基板あるいはプラスチック基板等が適宜に選択して用いられる。基板11は、基板支持部12の対により両側(又は、4辺)から支持されている。
マスク支持部14の軸と基板支持部12の軸は、各々不図示の金属ベローズを介して気密性が確保された状態で上下動が可能に大気側に連通している。
As the substrate 11, a glass substrate, a plastic substrate, or the like is appropriately selected and used according to the target product to be manufactured. The substrate 11 is supported by the pair of substrate support portions 12 from both sides (or four sides).
The axis of the mask support portion 14 and the axis of the substrate support portion 12 communicate with the atmosphere side through a metal bellows (not shown) so that they can move up and down while ensuring airtightness.

15は、真空チャンバ上に設けられたアライメント駆動部である。本実施形態では、基板11とマスク13をアライメントする時には、アライメント駆動部15が基板支持部12を移動させ、基板11をX軸方向移動、Y軸方向移動、およびθ回転させて、マスク13との相対位置合わせを行う。   Reference numeral 15 is an alignment drive unit provided on the vacuum chamber. In the present embodiment, when the substrate 11 and the mask 13 are aligned, the alignment driving unit 15 moves the substrate support unit 12, moves the substrate 11 in the X-axis direction, moves in the Y-axis direction, and rotates by θ to move the mask 13 to the mask 13. Relative alignment of.

真空チャンバ上には、アライメントカメラ32が設けられている。アライメントカメラ32は、基板11とマスク13の各々に設けられたアライメントマークを、天板1Rに設けられた気密窓33及び支持板21に設けられた窓(開口穴)を通じて撮像可能である。アライメント駆動部15は、アライメントカメラ32の撮像結果に基づき基板11とマスク13の位置合わせを行う。すなわち、図3に示すように、基板11とマスク13が離間している状態で基板11とマスク13にそれぞれ形成されたアライメントマークの相対的な位置関係を調整する。   An alignment camera 32 is provided on the vacuum chamber. The alignment camera 32 can image the alignment marks provided on each of the substrate 11 and the mask 13 through the airtight window 33 provided on the top plate 1R and the window (opening hole) provided on the support plate 21. The alignment driving unit 15 aligns the substrate 11 and the mask 13 based on the image pickup result of the alignment camera 32. That is, as shown in FIG. 3, the relative positional relationship of the alignment marks formed on the substrate 11 and the mask 13 is adjusted while the substrate 11 and the mask 13 are separated from each other.

真空チャンバ内には蒸着源装置16が配置されており、蒸着源装置16の内部には成膜材料である有機材料が貯留され、有機材料は制御されたヒータによって加熱されて所定のレートで蒸発あるいは昇華する。蒸着源装置16の上面には、気化した有機材料を基板に向けて放出するための開口部と、必要に応じて開口部を遮蔽するためのシャッターが設けられている。   An evaporation source device 16 is arranged in the vacuum chamber, an organic material that is a film forming material is stored inside the evaporation source device 16, and the organic material is heated by a controlled heater and evaporated at a predetermined rate. Or sublimate. On the upper surface of the vapor deposition source device 16, an opening for discharging the vaporized organic material toward the substrate and a shutter for blocking the opening as needed are provided.

蒸着源装置16は、不図示のX軸スライド機構とY軸スライド機構によってX方向及びY方向に移動可能である。蒸着源装置16はX軸スライド機構により、二つの蒸着ステージのどちらの側にも移動できる。
また、蒸着源装置16は、各蒸着ステージにおいて、Y軸スライド機構により基板11に沿ってY方向に往復走査が可能で、基板11上に均一性の高い膜を成膜することができる。
The vapor deposition source device 16 can be moved in the X and Y directions by an X-axis slide mechanism and a Y-axis slide mechanism (not shown). The vapor deposition source device 16 can be moved to either side of the two vapor deposition stages by the X-axis slide mechanism.
Further, the vapor deposition source device 16 can perform reciprocal scanning in the Y direction along the substrate 11 by the Y-axis slide mechanism at each vapor deposition stage, and can form a highly uniform film on the substrate 11.

(アライメント駆動部の支持構造)
次に、実施形態1の成膜装置の特徴的部分として、アライメント駆動部15を支持している支持構造について説明する。図5は、支持構造を抽出して示した模式的な平面図である。
(Support structure for alignment drive unit)
Next, a supporting structure that supports the alignment driving unit 15 will be described as a characteristic part of the film forming apparatus of the first embodiment. FIG. 5 is a schematic plan view showing an extracted support structure.

図3に示すように、本実施形態では、アライメント駆動部15とアライメントカメラ32は、真空チャンバの天板1Rに直接支持されるのではなく、天板1Rと間隔をおいて設置された支持板21に固定されている。図5に示すように、支持板21は、X方向に伸びる梁23およびY方向に伸びる梁25に囲まれ、これらに固定されている。すなわち、支持板21は、真空チャンバの各側壁と平行な2本の梁23および2本の梁25に固定されている。梁23の両端は梁25に接続されており、梁23と梁25は梯子形の枠体を構成して支持板21を囲んで固定している。枠体は、強度を大きくするためにX方向に伸びる一対の梁24を更に備え、梁24の端部と梁25の端部は接合されている。すなわち、梁23、梁24、梁25は接合され、支持板21を固定する枠体を構成している。各梁には剛性が高い部材が用いられ、具体的には、長手方向と直交する方向で切った断面形状がH字形のH型鋼や、I字形のI型鋼など、断面係数の大きな金属部材が好適に用いられる。梯子形の枠体を構成する梁25及び梁23を、図5のC3−C3線及びC4−C4線で切った断面形状を、図6(a)及び図6(b)に示す。本実施形態では、梁25及び梁23には、断面形状がI字形のI型鋼を用いている。また、梁24にも、同様のI型鋼を用いている。   As shown in FIG. 3, in the present embodiment, the alignment driving unit 15 and the alignment camera 32 are not directly supported by the top plate 1R of the vacuum chamber, but a support plate installed at a distance from the top plate 1R. It is fixed at 21. As shown in FIG. 5, the support plate 21 is surrounded by and fixed to a beam 23 extending in the X direction and a beam 25 extending in the Y direction. That is, the support plate 21 is fixed to the two beams 23 and the two beams 25 parallel to the side walls of the vacuum chamber. Both ends of the beam 23 are connected to the beam 25, and the beam 23 and the beam 25 form a ladder-shaped frame and surround and fix the support plate 21. The frame further includes a pair of beams 24 extending in the X direction to increase the strength, and the ends of the beams 24 and the beams 25 are joined to each other. That is, the beam 23, the beam 24, and the beam 25 are joined together to form a frame body for fixing the support plate 21. A member having high rigidity is used for each beam, and specifically, a metal member having a large section modulus, such as an H-shaped steel having an H-shaped cross section cut in a direction orthogonal to the longitudinal direction or an I-shaped I-shaped steel, is used. It is preferably used. 6A and 6B show cross-sectional shapes obtained by cutting the beam 25 and the beam 23 forming the ladder-shaped frame along the line C3-C3 and the line C4-C4 in FIG. In the present embodiment, the beams 25 and 23 are made of I-shaped steel having an I-shaped cross section. Further, the beam 24 is also made of the same type I steel.

図1に示すように、枠体の外縁のうちの3辺、すなわち2本の梁24と1本の梁25は、真空チャンバ1の側壁1Sの上に位置するよう配置されている。図1、図3に示すように、枠体は、真空チャンバ1の側壁1Sの上に配置された脚部22を介して、真空チャンバ1の上に固定されている。枠体は、少なくとも四隅の端部を脚部22により真空チャンバ1の側壁1Sに固定するが、本実施形態では固定強度を高めるため、更に梁24の中央部も脚部22を介して真空チャンバ1の側壁1Sの上に固定している。脚部の形状や個数、配置位置は、適宜変更することができる。   As shown in FIG. 1, three sides of the outer edge of the frame body, that is, two beams 24 and one beam 25 are arranged on the side wall 1S of the vacuum chamber 1. As shown in FIGS. 1 and 3, the frame body is fixed on the vacuum chamber 1 via the leg portions 22 arranged on the side wall 1S of the vacuum chamber 1. The frame body is fixed to the side wall 1S of the vacuum chamber 1 by the legs 22 at least at the four corners. However, in the present embodiment, in order to enhance the fixing strength, the central portion of the beam 24 is further connected to the vacuum chamber via the legs 22. It is fixed on the side wall 1S of 1. The shape, number, and arrangement position of the legs can be changed as appropriate.

真空チャンバ1は、内部を減圧した際に内外圧力差により変形や振動を生じる場合があり、特に天板は、大気圧に押されて中央部が鉛直下向きに凹む。本実施形態では、アライメント駆動部15とアライメントカメラ32は、真空チャンバの天板1Rの中央部に直接支持されるのではなく、天板1Rと間隔をおいて設置された支持板21に固定されている。このため、アライメント駆動部15やアライメントカメラ32の位置や姿勢が、天板の変形による影響を直接受けることはない。   The vacuum chamber 1 may be deformed or vibrated due to the pressure difference between the inside and the outside when the inside pressure is reduced, and in particular, the top plate is pressed by the atmospheric pressure and the central portion is vertically downwardly dented. In the present embodiment, the alignment driving unit 15 and the alignment camera 32 are not directly supported on the central portion of the top plate 1R of the vacuum chamber, but are fixed to the support plate 21 installed at a distance from the top plate 1R. ing. Therefore, the positions and orientations of the alignment driving unit 15 and the alignment camera 32 are not directly affected by the deformation of the top plate.

そして、本実施形態では、支持板21は、断面係数の大きな梁23と梁25で構成された梯子形の枠体に支持されており、枠体の四隅の端部が、真空チャンバの側壁の上に配置された脚部を介して真空チャンバの上に固定されている。また、枠体には、断面係数の大きな金属部材よりなる梁24が更に接続されており、梁24も真空チャンバの側壁の上に脚部を介して固定されている。このように、アライメント駆動部15やアライメントカメラ32を固定した支持板21は、軽量でありながら強固で、外部の変形や振動の影響を受けにくい枠体に支持されている。   Further, in the present embodiment, the support plate 21 is supported by a ladder-shaped frame body composed of the beam 23 and the beam 25 having a large section coefficient, and the four corners of the frame body have the end portions of the side wall of the vacuum chamber. It is fixed above the vacuum chamber via the legs arranged above. Further, a beam 24 made of a metal member having a large section modulus is further connected to the frame body, and the beam 24 is also fixed on the side wall of the vacuum chamber via legs. As described above, the support plate 21 to which the alignment driving unit 15 and the alignment camera 32 are fixed is lightweight and strong, and is supported by the frame body that is not easily affected by external deformation or vibration.

このように、本実施形態では、枠体は脚部を介して真空チャンバの側壁の上に脚部を介して固定されているが、側壁の上部は天板1Rの外周部と連結されており、この部分は構造的に耐震性が高いと言える。枠体の少なくとも四隅の端部をこの部分に脚部で固定するため、アライメント駆動部15やアライメントカメラ32は、特に周波数の小さな振動の影響を受けにくくなる。例えば、自らの蒸着ステージの動作に起因する振動、隣接する蒸着ステージにおける蒸着動作に起因する振動、真空チャンバのドアバルブや排気装置等の各種機器類に起因する振動、装置外から伝わる振動、等の影響を受けにくくなる。そして、本実施形態では、支持板21を、断面係数の大きな梁23と梁25で構成された梯子形の枠体で支持するため、振動に対する強度が大きな構造を極めて軽量に実現することができる。   As described above, in the present embodiment, the frame is fixed on the side wall of the vacuum chamber via the leg through the leg, but the upper portion of the side wall is connected to the outer peripheral portion of the top plate 1R. , It can be said that this part is structurally highly earthquake resistant. Since the ends of at least the four corners of the frame body are fixed to this portion by the legs, the alignment driving unit 15 and the alignment camera 32 are less likely to be affected by vibrations having a small frequency. For example, vibration caused by the operation of the vapor deposition stage of its own, vibration caused by the vapor deposition operation at the adjacent vapor deposition stage, vibration caused by various equipment such as a door valve of a vacuum chamber or an exhaust device, vibration transmitted from outside the device, etc. Less susceptible to impact. Further, in the present embodiment, the support plate 21 is supported by the ladder-shaped frame body composed of the beam 23 and the beam 25 having a large section modulus, so that the structure having a large strength against vibration can be realized extremely lightweight. ..

この結果、本実施形態では、基板とマスクとの位置合わせ誤差を低減できるので、例えば、寸法精度のよい有機化合物層のパターンが形成された有機EL素子や有機EL装置を製造することが可能になる。また、カメラで認識するアライメントマークの検出精度の低下を防止でき、リトライ回数が減少し、所定の精度に達成するまでに要する時間を短縮できる。
本実施形態によれば、成膜装置の重量増を抑制しながら、成膜室の変形や成膜室の内外からの振動によるアライメント機構への影響を抑制することができる。
As a result, in the present embodiment, since the alignment error between the substrate and the mask can be reduced, it is possible to manufacture, for example, an organic EL element or an organic EL device having a pattern of an organic compound layer with good dimensional accuracy. Become. Further, it is possible to prevent the detection accuracy of the alignment mark recognized by the camera from being lowered, reduce the number of retries, and shorten the time required to reach a predetermined accuracy.
According to the present embodiment, it is possible to suppress the influence on the alignment mechanism due to the deformation of the film forming chamber and the vibration from inside and outside the film forming chamber while suppressing the increase in the weight of the film forming apparatus.

[実施形態2]
実施形態2の成膜装置について説明するが、本実施形態は、アライメント駆動部の支持構造の一部が実施形態1と異なる。実施形態1と共通する部分については、説明を省略する。
図7は、実施形態2の成膜装置の模式的な断面図であり、実施形態1の説明における図3と同様に、図1におけるYZ面と平行なC1面で装置を切った断面図、あるいは図2のC1−C1線に沿って装置を切った断面図である。
[Embodiment 2]
Although the film forming apparatus of the second embodiment will be described, the present embodiment is different from the first embodiment in a part of the support structure of the alignment driving unit. Descriptions of portions common to the first embodiment will be omitted.
FIG. 7 is a schematic cross-sectional view of the film forming apparatus of the second embodiment, and like FIG. 3 in the description of the first embodiment, a cross-sectional view of the apparatus cut along a C1 plane parallel to the YZ plane in FIG. Alternatively, it is a cross-sectional view of the device taken along line C1-C1 of FIG.

実施形態1では、梁23、梁24、及び梁25に断面形状がI字形のI型鋼を用いていたが、本実施形態では、図7に示すように各梁に断面形状がH字形のH型鋼を用いる点が異なる。
梯子形の枠体を構成する梁25及び梁23を、図5のC3−C3線及びC4−C4線で切った断面形状を、図6(c)及び図6(d)に示す。本実施形態では、梁25及び梁23には、断面形状がH字形のH型鋼を用いている。また、梁24にも、同様のH型鋼を用いている。
In the first embodiment, the beam 23, the beam 24, and the beam 25 are made of I-shaped steel having an I-shaped cross section, but in the present embodiment, as shown in FIG. 7, each beam has an H-shaped H-shaped cross section. The difference is that it uses shaped steel.
6C and 6D show cross-sectional shapes obtained by cutting the beam 25 and the beam 23 forming the ladder-shaped frame along the line C3-C3 and the line C4-C4 in FIG. In the present embodiment, the beams 25 and 23 are made of H-shaped steel having an H-shaped cross section. The beam 24 also uses the same H-shaped steel.

本実施形態においても、アライメント駆動部15とアライメントカメラ32は、真空チャンバの天板1Rの中央部に直接支持されるのではなく、天板1Rと間隔をおいて設置された支持板21に固定されている。このため、アライメント駆動部15やアライメントカメラ32の位置や姿勢が、天板の変形による影響を直接受けることはない。   Also in the present embodiment, the alignment driving unit 15 and the alignment camera 32 are not directly supported by the central portion of the top plate 1R of the vacuum chamber, but are fixed to the support plate 21 installed at a distance from the top plate 1R. Has been done. Therefore, the positions and orientations of the alignment driving unit 15 and the alignment camera 32 are not directly affected by the deformation of the top plate.

そして、本実施形態では、支持板21は、断面係数の大きなH型鋼の梁23と梁25で構成された梯子形の枠体に支持されており、枠体の端部が、真空チャンバの側壁の上に配置された脚部を介して真空チャンバの上に固定されている。また、枠体は、断面係数の大きなH型鋼よりなる梁24を更に有し、梁24も真空チャンバの側壁の上に脚部を介して固定されている。すなわち、アライメント駆動部15やアライメントカメラ32は、軽量でありながら強固で、外部の変形や振動の影響を受けにくい枠体に支持されている。   Further, in the present embodiment, the support plate 21 is supported by a ladder-shaped frame body composed of an H-shaped steel beam 23 and a beam 25 having a large section modulus, and an end portion of the frame body is a side wall of the vacuum chamber. Is fixed on the vacuum chamber via the legs arranged above. Further, the frame body further has a beam 24 made of H-shaped steel having a large section modulus, and the beam 24 is also fixed on the side wall of the vacuum chamber via legs. That is, the alignment driving unit 15 and the alignment camera 32 are supported by a frame body that is lightweight but strong and is not easily affected by external deformation or vibration.

本実施形態も、枠体は脚部を介して真空チャンバの側壁の上に脚部を介して固定されているが、側壁の上部は天板1Rの外周部と連結されており、この部分は構造的に耐震性が高いと言える。このため、アライメント駆動部15やアライメントカメラ32は、特に周波数の小さな振動の影響を受けにくくなる。例えば、自らの蒸着ステージの動作に起因する振動、隣接する蒸着ステージにおける蒸着動作に起因する振動、真空チャンバのドアバルブや排気装置等の各種機器類に起因する振動、装置外から伝わる振動、等の影響を受けにくくなる。そして、本実施形態では、支持板21を、断面係数の大きな梁23と梁25で構成された梯子形の枠体で支持するため、振動に対する強度が大きな構造を極めて軽量に実現することができる。   Also in this embodiment, the frame is fixed on the side wall of the vacuum chamber via the leg through the leg, but the upper portion of the side wall is connected to the outer peripheral portion of the top plate 1R, and this portion is It can be said that it is structurally highly earthquake resistant. Therefore, the alignment driving unit 15 and the alignment camera 32 are less likely to be affected by the vibration having a particularly small frequency. For example, vibration caused by the operation of the vapor deposition stage of its own, vibration caused by the vapor deposition operation at the adjacent vapor deposition stage, vibration caused by various equipment such as a door valve of a vacuum chamber or an exhaust device, vibration transmitted from outside the device, etc. Less susceptible to impact. Further, in the present embodiment, the support plate 21 is supported by the ladder-shaped frame body composed of the beam 23 and the beam 25 having a large section modulus, so that the structure having a large strength against vibration can be realized extremely lightweight. ..

この結果、本実施形態も、基板とマスクとの位置合わせ誤差を低減できるので、例えば、寸法精度のよい有機化合物層のパターンが形成された有機EL素子や有機EL装置を製造することが可能になる。また、カメラで認識するアライメントマークの検出精度の低下を防止でき、リトライ回数が減少し、所定の精度に達成するむまでに要する時間を短縮できる。
本実施形態においても、成膜装置の重量増を抑制しながら、成膜室の変形や成膜室の内外からの振動によるアライメント機構への影響を抑制することができる。
As a result, in the present embodiment as well, the alignment error between the substrate and the mask can be reduced, so that it is possible to manufacture, for example, an organic EL element or an organic EL device in which a pattern of an organic compound layer with high dimensional accuracy is formed. Become. Further, it is possible to prevent the detection accuracy of the alignment mark recognized by the camera from being lowered, reduce the number of retries, and shorten the time required to reach the predetermined accuracy.
Also in the present embodiment, it is possible to suppress the influence of the deformation of the film forming chamber and the vibration from the inside and outside of the film forming chamber on the alignment mechanism while suppressing the increase in the weight of the film forming apparatus.

[実施形態3]
次に、本発明を実施した製造システムについて説明する。図8は、本発明を実施した製造システムの模式的な構成図で、有機ELパネルを製造する製造システム300を例示している。
[Third Embodiment]
Next, a manufacturing system embodying the present invention will be described. FIG. 8 is a schematic configuration diagram of a manufacturing system embodying the present invention, and illustrates a manufacturing system 300 for manufacturing an organic EL panel.

製造システム300は、複数台の成膜装置100、搬送室1101、搬送室1102、搬送室1103、基板供給室1105、マスクストック室1106、受渡室1107、ガラス供給室1108、貼合室1109、取出室1110等を備えている。成膜装置100は、有機ELパネルの発光層、正孔注入層、正孔輸送層、電子輸送層、電極層等の異なる機能層の成膜に用いられ得るため、成膜装置ごとに成膜材料やマスクなどが相違する場合がある。各成膜装置100は、実施形態1で説明したように2つの蒸着ステージを備える装置であってもよいし、単一の蒸着ステージを備える装置であってもよい。2つの蒸着ステージを備える場合には、一方の蒸着ステージにおける蒸着が完了するまでの間に、他方の蒸着ステージでは蒸着済の基板の搬出と未蒸着の基板の搬入を行い、基板とマスクとのアライメントを完了させ成膜ポジションにセットすることができる。   The manufacturing system 300 includes a plurality of film forming apparatuses 100, a transfer chamber 1101, a transfer chamber 1102, a transfer chamber 1103, a substrate supply chamber 1105, a mask stock chamber 1106, a delivery chamber 1107, a glass supply chamber 1108, a bonding chamber 1109, and an extraction. A room 1110 and the like are provided. The film forming apparatus 100 can be used for forming different functional layers such as a light emitting layer, a hole injecting layer, a hole transporting layer, an electron transporting layer, and an electrode layer of an organic EL panel. Materials and masks may differ. Each film forming apparatus 100 may be an apparatus including two vapor deposition stages as described in the first embodiment, or may be an apparatus including a single vapor deposition stage. When two vapor deposition stages are provided, the vapor deposition substrate is unloaded and the vapor deposition substrate is unloaded on the other vapor deposition stage until the vapor deposition on one vapor deposition stage is completed. The alignment can be completed and the film formation position can be set.

基板供給室1105には、外部から基板が供給される。搬送室1101、搬送室1102、搬送室1103には、搬送機構であるロボット1120が配置されている。ロボット1120によって各室間の基板の搬送が行われる。本実施形態の製造システム300が複数台備える成膜装置100のうち、少なくとも一台は有機材料の蒸着源を備えている。製造システム300に含まれる複数の成膜装置100は、お互いが同一材料を成膜する装置であってもよいし、異なる材料を成膜する装置であってもよい。例えば、各成膜装置において、互いに異なる発光色の有機材料を蒸着してもよい。製造システム300では、基板供給室1105から供給された基板に有機材料を蒸着したり、あるいは金属材料等の無機材料の膜を形成し、有機ELパネルを製造する。   A substrate is supplied to the substrate supply chamber 1105 from the outside. A robot 1120 as a transfer mechanism is arranged in each of the transfer chamber 1101, the transfer chamber 1102, and the transfer chamber 1103. The robot 1120 transfers the substrate between the chambers. At least one of the film forming apparatuses 100 included in the manufacturing system 300 of the present embodiment includes an organic material vapor deposition source. The plurality of film forming apparatuses 100 included in the manufacturing system 300 may be apparatuses that form the same material, or apparatuses that form different materials. For example, in each film forming apparatus, organic materials having different emission colors may be vapor-deposited. In the manufacturing system 300, an organic material is deposited on the substrate supplied from the substrate supply chamber 1105, or a film of an inorganic material such as a metal material is formed to manufacture an organic EL panel.

マスクストック室1106には、各成膜装置100にて用いられ、膜が堆積したマスクが、ロボット1120によって搬送される。マスクストック室1106に搬送されたマスクを回収することで、マスクを洗浄することができる。また、マスクストック室1106に洗浄済みのマスクを収納しておき、ロボット1120によって成膜装置100にセットすることもできる。   In the mask stock chamber 1106, the mask used in each film forming apparatus 100 and having a film deposited thereon is conveyed by the robot 1120. The mask can be washed by collecting the mask transported to the mask stock chamber 1106. Further, it is also possible to store a cleaned mask in the mask stock chamber 1106 and set it in the film forming apparatus 100 by the robot 1120.

ガラス供給室1108には、外部から封止用のガラス材が供給される。貼合室1109において、成膜された基板に封止用のガラス材を貼り合わせることで、有機ELパネルが製造される。製造された有機ELパネルは、取出室1110から取り出される。   A glass material for sealing is supplied to the glass supply chamber 1108 from the outside. In the bonding chamber 1109, an organic EL panel is manufactured by bonding a glass material for sealing to the film-formed substrate. The manufactured organic EL panel is taken out from the take-out chamber 1110.

本製造システムに含まれる成膜装置は、すでに実施形態1及び実施形態2で説明したように、真空チャンバの側壁の上に配置された脚部を介して真空チャンバの上に固定された枠体を備え、枠体は真空チャンバの側壁と平行な複数の梁を有している。そして、アライメント駆動部及びアライメントカメラが固定された支持板が、枠体の複数の梁に固定されており、支持板は真空チャンバの天板から間隔をおいて支持されている。   The film forming apparatus included in the present manufacturing system is, as already described in the first and second embodiments, a frame body fixed on the vacuum chamber via the legs arranged on the side wall of the vacuum chamber. And the frame has a plurality of beams parallel to the side walls of the vacuum chamber. A support plate to which the alignment drive unit and the alignment camera are fixed is fixed to the plurality of beams of the frame body, and the support plate is supported at a distance from the top plate of the vacuum chamber.

このため、本製造システムに含まれる成膜装置では、内外圧力差による自身の変形や、隣接する搬送室や成膜装置等から伝達される振動から、アライメント駆動部やアライメントカメラが隔離され、アライメント動作が極めて安定し高速化する。本製造システムでは、大面積基板に高精度に成膜できるため、高画質の有機ELパネルを高い歩留まりで製造することが可能である。しかも、各成膜装置の重量増加は抑制されているため、製造システムの総重量を抑制することができる。このように、本発明は有機EL素子を製造する製造システムにおいて好適に実施され得るが、それ以外のデバイスを製造するための製造システムにおいて実施してもかまわない。
本実施形態によれば、成膜室の変形が生じたり、成膜室の内外で振動が生じたとしても、アライメント機構の動作が影響を受けにくく、しかも軽量な成膜装置を備えた成膜システムを提供することができる。
Therefore, in the film forming apparatus included in the present manufacturing system, the alignment drive unit and the alignment camera are isolated from the deformation of the apparatus itself due to the pressure difference between the inside and the outside, and the vibration transmitted from the adjacent transfer chamber or the film forming apparatus. The operation is extremely stable and speeds up. In the present manufacturing system, since it is possible to form a film on a large-area substrate with high precision, it is possible to manufacture an organic EL panel with high image quality at a high yield. Moreover, since the weight increase of each film forming apparatus is suppressed, the total weight of the manufacturing system can be suppressed. As described above, the present invention can be suitably implemented in a manufacturing system for manufacturing an organic EL element, but may be implemented in a manufacturing system for manufacturing other devices.
According to the present embodiment, even if the film forming chamber is deformed or vibrates inside and outside the film forming chamber, the operation of the alignment mechanism is not easily affected, and the film forming apparatus is provided with a light weight. A system can be provided.

[他の実施形態]
尚、本発明は、以上に説明した実施形態に限定されるものではなく、本発明の技術的思想内で多くの変形が可能である。
例えば、枠体を構成する複数の梁は、どの梁も同じ断面形状を有しなければならないわけではない。実施形態1では断面がI字形の梁を用い、実施形態2では断面がH字形の梁を用いたが、一つの枠をI字形とH字形の梁を組み合わせて構成してもよい。また、断面係数の大きな部材であれば、断面形状はI字形やH字形には限らない。
[Other Embodiments]
The present invention is not limited to the embodiment described above, and many modifications can be made within the technical idea of the present invention.
For example, the plurality of beams forming the frame body do not have to have the same cross-sectional shape. Although the beam having the I-shaped cross section is used in the first embodiment and the beam having the H-shaped cross section is used in the second embodiment, one frame may be configured by combining the I-shaped and H-shaped beams. Further, the cross-sectional shape is not limited to the I-shape or the H-shape as long as it has a large section modulus.

また、アライメント駆動部は、基板支持部を移動させてアライメントを行う機構には限らない。マスク支持部を移動させるものでもよく、あるいは基板支持部とマスク支持部の両方を移動させる機構でもよい。すなわち、マスク13を所定位置に静置し、基板11を移動させる構成でも良いし、基板11を所定位置に静置し、マスク13を移動させることで位置合わせを行う構成でも良いし、基板11及びマスク13の両方を移動させても良い。例えば、基板に比べてマスクの重量が大きい場合には、基板を移動させることでアライメント精度を高められる場合がある。また基板とマスクの両方を移動させて相対的な位置関係を調整することで、アライメント時間を短縮することができる場合がある。このように移動させる物体の選択は、装置の形態や目的に応じて任意に設計することが可能である。   Further, the alignment drive unit is not limited to a mechanism that moves the substrate support unit to perform alignment. It may be one that moves the mask support, or a mechanism that moves both the substrate support and the mask support. That is, the mask 13 may be left at a predetermined position and the substrate 11 may be moved. Alternatively, the substrate 11 may be left at a predetermined position and the mask 13 may be moved to perform alignment, or the substrate 11 may be moved. Both the mask 13 and the mask 13 may be moved. For example, when the weight of the mask is larger than that of the substrate, the alignment accuracy may be improved by moving the substrate. In addition, it may be possible to shorten the alignment time by moving both the substrate and the mask to adjust the relative positional relationship. The selection of the object to be moved in this way can be arbitrarily designed according to the form and purpose of the device.

また、基板を支持するための基板支持部、マスクを支持するためのマスク支持部、あるいはアライメント用カメラの配置や個数は、上述した実施形態の例に限られるものではない。基板の大きさや重さ、マスクの大きさや重さ、アライメントマークの数やレイアウト位置等によって、適宜変更することが可能である。   Further, the arrangement and the number of the substrate supporting portion for supporting the substrate, the mask supporting portion for supporting the mask, or the alignment camera are not limited to those in the above-described embodiments. It can be appropriately changed depending on the size and weight of the substrate, the size and weight of the mask, the number of alignment marks, the layout position, and the like.

また、実施形態1の成膜装置は蒸着ステージを2台備え、アライメント駆動部と支持板と枠体よりなる組を真空チャンバの上に独立して2組配置したが、蒸着ステージの数は2台に限らず1台あるいは3台以上でもよい。3台以上の場合にも、アライメント駆動部と支持板と枠体からなる組を、蒸着ステージ毎に真空チャンバの上に独立して配置するのが望ましい。   Further, the film forming apparatus of Embodiment 1 is provided with two vapor deposition stages, and two sets of the alignment drive unit, the support plate and the frame are independently arranged on the vacuum chamber, but the number of vapor deposition stages is two. The number is not limited to one and may be one or three or more. Also in the case of three or more units, it is desirable to dispose a set including the alignment drive unit, the support plate and the frame body independently on the vacuum chamber for each vapor deposition stage.

また、1つの蒸着源装置が2つの蒸着ステージ間を移動して交互に蒸着する装置でなくとも、各蒸着ステージが専用の蒸着源装置を備える成膜装置であってもよい。蒸着源装置の形態は、単一の蒸着源であっても、複数の蒸着源を配列したものでもよい。また、成膜室内には蒸着源からの蒸発レートを管理あるいは制御することを目的としたレート管理センサを配置してもよい。また、基板11に有機材料を成膜する際に、基板11と蒸着源装置16との相対位置は、実施形態のように走査する形態であってもよいし、固定した形態であってもよい。   Further, instead of a device in which one vapor deposition source device moves between two vapor deposition stages to alternately vapor deposit, a vapor deposition device in which each vapor deposition stage includes a dedicated vapor deposition source device may be used. The form of the vapor deposition source device may be a single vapor deposition source or an array of a plurality of vapor deposition sources. Further, a rate control sensor for controlling or controlling the evaporation rate from the vapor deposition source may be arranged in the film forming chamber. Further, when the organic material is formed on the substrate 11, the relative position between the substrate 11 and the vapor deposition source device 16 may be in the form of scanning as in the embodiment, or may be fixed. ..

また、実施形態1においては、基板11の被成膜面を下向きにする目的で、マスク13を基板11の下側に配置させているが、成膜物質が基板11の被成膜面上にパターニングできる配置でありさえすれば、基板とマスクと配置はこれに限らない。例えば、基板11とマスク13とを鉛直方向に沿って縦置きにした状態で配置してもよいし、あるいは基板11の被成膜面を上向きに配置してもよい。   Further, in the first embodiment, the mask 13 is arranged below the substrate 11 for the purpose of making the surface of the substrate 11 on which the film is to be formed face down. The arrangement of the substrate, the mask and the arrangement is not limited to this as long as the arrangement can be patterned. For example, the substrate 11 and the mask 13 may be vertically arranged along the vertical direction, or the film formation surface of the substrate 11 may be arranged upward.

また、本発明は有機EL素子を構成する有機膜を成膜する装置に好適に実施され得るが、有機EL素子のそれ以外の膜や、有機EL素子以外のデバイスの膜を成膜する装置に用いてもかまわない。   Further, the present invention can be suitably applied to an apparatus for forming an organic film that constitutes an organic EL element, but it can be applied to an apparatus for forming a film other than the organic EL element or a film of a device other than the organic EL element. You can use it.

1・・・真空チャンバ/1B・・・底板/1S・・・側壁/1R・・・天板/11・・・基板/12・・・基板支持部/13・・・マスク/14・・・マスク支持部/15・・・アライメント駆動部/16・・・蒸着源装置/21・・・支持板/22・・・脚部/23、24、25・・・梁/32・・・アライメントカメラ/33・・・気密窓/100・・・成膜装置/110・・・外壁/110a・・・外壁の一部/110b・・・天板/111・・・基板/113・・・成膜用マスク/132・・・アライメントカメラ/133・・・気密窓/300・・・有機ELパネルを製造する製造システム/1101、1102、1103・・・搬送室/1105・・・基板供給室/1106・・・マスクストック室/1107・・・受渡室/1108・・・ガラス供給室/1109・・・貼合室/1110・・・取出室/1120・・・ロボット   1 ... Vacuum chamber / 1B ... Bottom plate / 1S ... Side wall / 1R ... Top plate / 11 ... Substrate / 12 ... Substrate support / 13 ... Mask / 14 ... Mask support part / 15 ... Alignment drive part / 16 ... Deposition source device / 21 ... Support plate / 22 ... Leg parts / 23, 24, 25 ... Beam / 32 ... Alignment camera / 33 ... Airtight window / 100 ... Film forming apparatus / 110 ... Outer wall / 110a ... Part of outer wall / 110b ... Top plate / 111 ... Substrate / 113 ... Film formation Mask / 132 ... Alignment camera / 133 ... Airtight window / 300 ... Manufacturing system for manufacturing organic EL panel / 1101, 1102, 1103 ... Transfer chamber / 1105 ... Substrate supply chamber / 1106・ ・ ・ Mask stock room / 1107 ・ ・ ・ Transfer room / 1108 ・ ・ ・ Glass supply room / 1109 ・ ・ ・ Laminating room / 1110 ・ ・ ・ Ejecting room / 1120 ・ ・ ・ Robot

Claims (10)

真空チャンバと、
前記真空チャンバの外に配置され、前記真空チャンバの中に配置されたマスクと基板の相対位置を調整するアライメント駆動部と、
前記真空チャンバの側壁の上に配置された脚部を介して前記真空チャンバの上に固定された枠体と、を備え、
前記枠体は、前記真空チャンバの側壁と平行な複数の梁を有し、
前記複数の梁に固定されて前記真空チャンバの天板から間隔をおいて支持された支持板に、前記アライメント駆動部は固定されている、
ことを特徴とする成膜装置。
A vacuum chamber,
An alignment drive unit arranged outside the vacuum chamber, for adjusting the relative position of the mask and the substrate arranged inside the vacuum chamber,
A frame body fixed on the vacuum chamber via legs arranged on the side wall of the vacuum chamber,
The frame has a plurality of beams parallel to the side wall of the vacuum chamber,
The alignment drive unit is fixed to a support plate that is fixed to the plurality of beams and is supported at a distance from a top plate of the vacuum chamber,
A film forming apparatus characterized by the above.
前記枠体は、前記真空チャンバの側壁と平行な複数の梁が接続された梯子形の枠体である、
ことを特徴とする請求項1に記載の成膜装置。
The frame body is a ladder-shaped frame body in which a plurality of beams parallel to the side wall of the vacuum chamber are connected.
The film forming apparatus according to claim 1, wherein:
前記枠体が有する複数の梁は、長手方向と直交する方向で切った断面がH字形もしくはI字形の梁である、
ことを特徴とする請求項1または2に記載の成膜装置。
The plurality of beams included in the frame body are beams having a H-shaped or I-shaped cross section taken in a direction orthogonal to the longitudinal direction,
The film forming apparatus according to claim 1, wherein the film forming apparatus is a film forming apparatus.
前記アライメント駆動部と前記支持板と前記枠体よりなる組が、前記真空チャンバの上に2組配置されている、
ことを特徴とする請求項1乃至3のいずれか1項に記載の成膜装置。
Two sets of the alignment drive unit, the support plate, and the frame are arranged on the vacuum chamber.
The film forming apparatus according to any one of claims 1 to 3, characterized in that.
前記アライメント駆動部は、前記マスクを支持するマスク支持部と前記基板を支持する基板支持部の相対位置を調整する、
ことを特徴とする請求項1乃至4のいずれか1項に記載の成膜装置。
The alignment drive unit adjusts a relative position between a mask support unit supporting the mask and a substrate support unit supporting the substrate,
The film forming apparatus according to any one of claims 1 to 4, characterized in that.
前記支持板には、前記マスクと前記基板のアライメントマークを撮像するためのアライメントカメラが固定されている、
ことを特徴とする請求項1乃至5のいずれか1項に記載の成膜装置。
An alignment camera for capturing an image of the alignment mark of the mask and the substrate is fixed to the support plate,
The film forming apparatus according to any one of claims 1 to 5, wherein
前記支持板には、前記アライメントカメラが前記マスクと前記基板のアライメントマークを撮像するための窓が設けられている、
ことを特徴とする請求項6に記載の成膜装置。
The support plate is provided with a window for the alignment camera to capture an image of the alignment mark of the mask and the substrate,
The film forming apparatus according to claim 6, wherein
請求項1乃至7の中のいずれか1項に記載の成膜装置を複数台備える、
ことを特徴とする製造システム。
A plurality of film forming apparatuses according to any one of claims 1 to 7 are provided,
A manufacturing system characterized by the above.
請求項1乃至7の中のいずれか1項に記載の成膜装置を複数台備え、少なくとも一台の前記成膜装置は有機材料の蒸着源を備える、
ことを特徴とする有機ELパネルの製造システム。
A plurality of film forming apparatuses according to any one of claims 1 to 7 are provided, and at least one of the film forming apparatuses is provided with an evaporation source of an organic material.
A manufacturing system for an organic EL panel, which is characterized in that
請求項9に記載の有機ELパネルの製造システムを用いて有機ELパネルを製造する、
ことを特徴とする有機ELパネルの製造方法。
An organic EL panel is manufactured using the organic EL panel manufacturing system according to claim 9.
A method of manufacturing an organic EL panel, comprising:
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