KR20230151455A - Work holding apparatus, alignment apparatus, and film-forming apparatus - Google Patents

Abstract

[Project] Provide a structure that supports workpieces with less deformation.
[Solution] A work holding device comprising a first support unit for supporting a work and a second support unit for supporting the first support unit by extending it, wherein the first support unit is extended in a first direction. First and second base members, a plurality of first and second support parts installed on each base member along the first direction and supporting the peripheral portion of the work, and connecting the first and second base members. A connection member is provided. The connection member is connected to the base member at a portion closer to the support axis of the second support unit than a support portion located at an end in the first direction.

Description

Work holding device, alignment device, and film forming device {WORK HOLDING APPARATUS, ALIGNMENT APPARATUS, AND FILM-FORMING APPARATUS}

The present invention relates to a work holding device, an alignment device, and a film forming device.

As the workpiece becomes larger, it may become necessary to consider the burden of the load on the support structure supporting the workpiece. For example, in order to increase the area of organic EL displays and improve production efficiency, it is required to form a film using a large-sized substrate. Generally, when manufacturing organic EL displays, thin plates such as glass or resin are often used as substrates. As the size of the substrate increases, the deflection when the substrate is held horizontally increases, so the substrate is held on a carrier and transported. There are cases where it happens. Patent Document 1 and Patent Document 2 disclose a structure for supporting a substrate.

Patent Document 1: Korean Patent Publication No. 10-2018-0067031 Patent Document 2: Japanese Patent Publication No. 2005-248249

As the size and weight of the substrate increase, the support structure that supports it may receive reaction force and become deformed. In fields such as the manufacture of organic EL displays, where a substrate and a mask are aligned and then a predetermined pattern is deposited on the substrate through the mask, deformation of the support structure becomes a factor in reducing alignment accuracy.

The present invention provides a structure that supports a workpiece with less deformation.

According to the present invention,

a first support unit supporting the work,

A work holding device comprising a second support unit that extends and supports the first support unit,

The first support unit,

A first base member extending in a first direction,

a second base member extending in the first direction and spaced apart from the first base member in a second direction intersecting the first direction;

a plurality of first support parts installed on the first base member along the first direction and supporting a peripheral portion of the workpiece;

a plurality of second support parts installed on the second base member along the first direction and supporting a peripheral portion of the workpiece;

a connection member extending in the second direction and connecting the first base member and the second base member;

The second support unit,

a first support shaft extending the first base member;

Provided with a second support shaft that extends the second base member,

The connection member is,

Among the plurality of first supports, a portion closer to the first support shaft than a first support portion located at an end in the first direction is connected to the first base member,

A work holding device is provided, wherein, among the plurality of second supports, a portion closer to the second support shaft than a second support portion located at an end in the first direction is connected to the second base member. .

According to the present invention, it is possible to provide a structure supporting a workpiece with less deformation.

1 is a schematic diagram of a film forming apparatus according to an embodiment of the present invention.
FIG. 2 is a side view of the film forming apparatus of FIG. 1.
FIG. 3 is a perspective view of a portion of the film forming apparatus of FIG. 1.
FIG. 4 is a perspective view of a portion of the film forming apparatus of FIG. 1.
Fig. 5 is a diagram showing the support mode of the carrier holding the substrate and the support mode of the mask during alignment.
Figure 6 is a partially enlarged view of Figure 5.
Figure 7 is a plan view of the support unit.
Figure 8 is an explanatory diagram of a comparative example.
9(A) and 9(B) are diagrams illustrating the operation of the film forming apparatus of FIG. 1.
FIG. 10(A) is an overall view of an organic EL display device, and FIG. 10(B) is a diagram showing the cross-sectional structure of one pixel.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Meanwhile, the following embodiments do not limit the invention according to the scope of the patent claims. Although a plurality of features are described in the embodiments, not all of these features are necessarily essential to the invention, and the plurality of features may be arbitrarily combined. In addition, in the accompanying drawings, the same or similar components are given the same reference numerals, and duplicate descriptions are omitted.

<Overview of the tabernacle equipment>

1 is a schematic diagram (front view) of a film forming apparatus 1 according to an embodiment of the present invention. Figure 2 is a side view of the film forming apparatus 1. 3 and 4 are perspective views showing a partial configuration of the film forming apparatus 1, and FIG. 4 is a partially broken view.

The film forming apparatus 1 is an apparatus that forms a film of a deposition material on a substrate 101 held on a carrier 100, and uses a mask 102 to form a thin film of the deposition material in a predetermined pattern. The operation of the film forming apparatus 1 is controlled by the control unit 10 . The control unit 10 includes a processor such as a CPU, a storage unit, and an interface unit, and the processor controls the film forming apparatus 1 by executing a program stored in the storage unit. The storage unit is composed of one or more storage devices such as semiconductor memory such as ROM and RAM and a hard disk, and the interface unit relays signals between the sensor or actuator and the processor.

The material of the substrate 101 on which film formation is performed in the film formation apparatus 1 can be appropriately selected from materials such as glass, resin, and metal, and a resin layer such as polyimide formed on glass is preferably used. The deposition material is a material such as an organic material or an inorganic material (metal, metal oxide, etc.). The film forming device 1 can be applied to, for example, a manufacturing device that manufactures electronic devices such as display devices (flat panel displays, etc.), thin film solar cells, organic photoelectric conversion elements (organic thin film imaging elements), and optical members. And, in particular, it is applicable to manufacturing equipment for manufacturing organic EL panels. In the following description, an example in which the film forming apparatus 1 forms a film on the substrate 101 by vacuum deposition will be described. However, the present invention is not limited to this, and various film forming methods such as sputtering and CVD are applicable.

Meanwhile, in each drawing, arrows (X, Y, Z) indicate directions that intersect each other. In the case of this embodiment, the arrows

The film forming apparatus 1 has a box-shaped vacuum chamber 2. The vacuum chamber 2 has a ceiling wall 20, a plurality of side walls 21, and a bottom wall 22. The internal space (film formation space) of the vacuum chamber 2 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas. Meanwhile, in this specification, “vacuum” refers to a state filled with gas at a pressure lower than atmospheric pressure (1 atm: 1013 hPa), in other words, a reduced pressure state.

Among the internal spaces of the vacuum chamber 2, a carrier support unit 3 for supporting the carrier 100 in a horizontal position and a mask support unit 4 for supporting the mask 102 in a horizontal position are disposed in the alignment room. , an evaporation source 5 is placed in the deposition chamber at the rear end. The conveying roller 9 is disposed from the alignment room to the film formation room. Outside of the vacuum chamber 2 (on the ceiling wall 20), a support unit 6 supporting the carrier support unit 3, a position adjustment unit 7, and a plurality of measurement units 8 are disposed. The support unit 6 may be called the lifting unit 6 in that it has a mechanism for raising and lowering the carrier support unit 3. The carrier support unit 3, the mask support unit 4, the lifting unit 6, the position adjustment unit 7, and the measurement unit 8 are alignment devices that align the substrate 101 and the mask 102. It consists of Additionally, the carrier support unit 3 and the lifting unit 6 constitute a work holding device that holds the carrier 100 as a work.

The evaporation source 5 is composed of a heater, a shutter, an evaporation source driving mechanism, an evaporation rate monitor, etc., and discharges and deposits the evaporation material on the substrate 101. For example, the evaporation source 5 is a linear evaporation source in which a plurality of nozzles (not shown) are arranged and evaporation material is discharged from each nozzle. A reciprocating movement mechanism may be installed to displace the evaporation source 5 relative to the substrate 101 and the mask 102 to uniformize the film formation on the substrate 101.

The deposition material flying from the evaporation source 5 toward the substrate 101 reaches the substrate 101 through the mask 102, and a film is formed on the substrate 101. In this embodiment, as shown in FIG. 4, the mask 102 has a structure in which a mask foil 102b with a thickness of several μm to several tens of μm is welded and fixed to a frame-shaped mask frame 102a. The mask frame 102a supports the mask foil 102b in a stretched state in its surface direction (X direction and Y direction) so that the mask foil 102b does not sag. An opening according to a desired film formation pattern is formed in the mask foil 102b.

When using a glass substrate or a substrate on which a film of a resin such as polyimide is formed as the substrate 101, an iron alloy can be used as the main material of the mask frame 102a and the mask foil 102b. , it is preferable to use an iron alloy containing nickel. Specific examples of iron alloys containing nickel include invar materials containing 34% by mass and 38% by mass of nickel, super invar materials further containing cobalt in addition to 30% by mass and 34% by mass of nickel, and a low thermal expansion Fe-Ni-based plating alloy containing 38 mass% or more and 54 mass% or less of nickel.

Meanwhile, in this embodiment, the configuration of upward deposition (Deposition Up) in which a film is formed with the film-forming surface of the substrate 101 facing downward in the direction of gravity will be described. However, a deposition down configuration may be used in which the film is formed with the film-formation surface of the substrate 101 facing upward in the direction of gravity during film formation. Additionally, a side deposition configuration may be used in which the substrate 101 is erected vertically and the film deposition is performed with the film deposition surface substantially parallel to the direction of gravity.

In the case of this embodiment, the outer shapes of the carrier 100, the substrate 101, and the mask 102 all have a rectangular shape long in the Y direction. However, these external shapes may be short rectangular shapes in the Y direction, or may be square.

The carrier 100 holding the substrate 101 and the mask 102 are each conveyed to the vacuum chamber 2 at different timings along separate conveyance paths, and are transferred to the vacuum chamber 2 by the conveyance roller 9. 2) is conveyed from the outside to the inside. The conveyance rollers 9 are arranged in a row in the Y direction, and this conveyance roller row is installed in two rows spaced apart in the X direction.

The carrier 100 is conveyed in the Y direction with its peripheral portion on the long side opposite to the X direction supported by the conveyance roller 9. The carrier support unit 3 has two sets of a plurality of support parts 31 arranged in the Y direction, spaced apart in the X direction, and the carrier 100 has its peripheral portion supported by a plurality of support parts 31. do. When the carrier 100 is conveyed from the outside to the inside of the vacuum chamber 2, the receiving fingers 31a of the plurality of supports 31 are lowered to a position lower than the conveying surface of the conveying roller 9, and the carrier 100 ) is conveyed into the inside of the vacuum chamber 2, it is raised by the lifting unit 6 to the position shown in FIG. 1 or FIG. 2, and the carrier 100 is moved from the conveying roller 9 to the carrier support unit 3. Lose.

The mask support unit 4 is provided with two sets of combinations of a plurality of lifting platforms 41 and lifting guide portions 40 spaced apart in the He is lifted up and down by a miracle. As for the mask 102, the peripheral portion (mask frame 102a) of the long side opposite to the X direction is supported on the lifting platform 41. When the mask 102 is transported from the outside to the inside of the vacuum chamber 2, the lifting platform 41 is lowered to a position lower than the transport surface of the transport roller 9, and the mask 102 is transported from the outside of the vacuum chamber 2 to the inside. When conveyed inside, it is raised to the position shown in FIG. 1 or FIG. 2, and the mask 102 is moved from the conveyance roller 9 to the lifting platform 41.

In the case of this embodiment, the carrier 100 is first brought into the vacuum chamber 2. The carrier 100 is transferred from the conveyance roller 9 to the carrier support unit 3, and the carrier 100 is moved to the conveyance surface of the conveyance roller 9 by the lifting unit 6 together with the carrier support unit 3. is retreated to the upper side of Afterwards, the mask 102 is brought into the vacuum chamber 2. The mask 102 is transferred from the conveyance roller 9 to a plurality of lifting platforms 41. As a result, the carrier 100, the substrate 101, and the mask 102 are each supported separately in an arrangement where they overlap in the vertical direction with a predetermined distance in between. In this state, the substrate 101 and the mask 102 can be aligned, and after alignment, the substrate 101 and the mask 102 are overlapped vertically, and film formation is performed.

The elevating unit 6 for elevating the carrier support unit 3 will be described. The lifting unit 6 is provided with a plurality of lifting mechanisms 60 . In this embodiment, four lifting mechanisms 60 are installed. Each lifting mechanism 60 is mounted on the movable plate 71 of the position adjustment unit 7. Each lifting mechanism 60 uses the motor 62 as a drive source and includes a mechanism (for example, a ball screw mechanism) for raising and lowering the support shaft 61. The support shaft 61 is a member extending in the Z direction, and the carrier support unit 3 hangs from its lower end. The four support shafts 61 are spaced apart from each other in the X and Y directions. Each support shaft 61 is provided through a hole formed in the base plate 73 of the position adjustment unit 7 and an opening 20a formed in the ceiling wall 20 of the vacuum chamber 2 from above the vacuum chamber 2. It is installed to extend inside the vacuum chamber 2. A seal structure necessary to maintain airtightness inside the vacuum chamber 2 is provided between the opening 20a and the base plate 73 or in the hole of the base plate 73.

Each lifting mechanism 60 includes an encoder head (encoder sensor) 64 that moves up and down integrally with the support shaft 61, and a fixed encoder scale 63 extending in the Z direction. In the case of this embodiment, the encoder scale 63 and the encoder head 64 constitute an absolute encoder, and the encoder head 64 reads the encoder scale 63 to detect the raising/lowering position of the support shaft 61. do.

The control unit 10 drives each lifting mechanism 60 independently. For example, the corresponding motor ( 62) Determine the control amount. According to this control, the posture of the carrier support unit 3 can be maintained horizontally, and the reproducibility of the seating point can be improved when the carrier 100 is lowered and seated on the mask 102. In particular, when targeting a large-sized substrate 101, the carrier 100 is also enlarged, and the central portions of the substrate 101 and the carrier 100 sag downward under their own weight in a convex shape. By controlling the lifting and lowering positions of the four support shafts 61, the lowering of the carrier 100 can be controlled by using the central portion of the carrier 100 and the substrate 101 as a reference point for starting contact with the mask 102.

The position adjustment unit 7 is a mechanism that adjusts the X-direction, Y-direction positions, and the direction around the Z-direction axis (referred to as the θ-direction position) of the lifting unit 6. By adjusting the angular positions of the lifting unit 6 in the X direction, Y direction, and θ direction, the angular positions of the carrier support unit 3 in the It is possible to adjust the positional deviation of each relative position of the substrate 101 in the X-direction, Y-direction, and θ-direction.

In this embodiment, the carrier support unit 3 is supported and raised and lowered by the four lifting mechanisms 60, so that it can handle the relatively heavy substrate 101 or carrier 100. For example, a G8 size board has a size exceeding 2 m on one side, and holding it by a board carrier becomes essential to suppress sagging of the board due to its own weight. If this substrate carrier itself is made of metal, it can weigh more than 100 kg. In this embodiment, it is possible to cope with such a heavy substrate 101 or carrier 100 by providing a plurality of lifting mechanisms 60 each equipped with a motor 62 as an independent driving source.

The position adjustment unit 7 includes a base plate 73, a movable plate 71 spaced apart from the base plate 73 in the Z direction, the base plate 73, and a plurality of actuators disposed between these plates. (70) is provided. The movable plate 71 and the base plate 73 have a rectangular shape in this embodiment. The base plate 73 is fixed to the ceiling wall 20 so as to close the opening 20a. A lifting unit 6 is mounted on the movable plate 71.

In the case of this embodiment, four actuators 70 are installed and are located at four corners of the base plate 73. Each actuator 70 is a mechanism that uses the motor 72 as a driving source to move the movable plate 71 relative to the base plate 73 in the X or Y direction. For example, among the four actuators 70, the moving direction of the movable plate 71 by the two actuators 70 located on the diagonal of the base plate 73 is in the X direction, and the remaining two actuators 70 ) The moving direction of the movable plate 71 is the Y direction. By combining the movement amounts of the movable plate 71 by the four actuators 70, the movable plate 71 can be displaced in the X direction, Y direction, and θ direction with respect to the base plate 73. The movement amount can be controlled, for example, from the detection results of a sensor such as a rotary encoder that detects the rotation amount of each motor 72.

In this embodiment, the elevating mechanism 60 and the position adjustment unit 7, which include many drive sources and movable parts, are disposed outside the vacuum chamber 2 to prevent particle generation within the film formation space within the vacuum chamber 2. It can be suppressed. Meanwhile, in the present embodiment, a configuration for moving the carrier 100 and the substrate 101 in the ) and both the substrate 101 and the mask 102 may be moved.

The measurement unit 8 measures the positional misalignment between the substrate 101 and the mask 102. By controlling the position adjustment unit 7 according to the measurement results of the measurement unit 8, the positions of the substrate 101 and the mask 102 can be aligned. In the case of this embodiment, the measurement unit 8 is an imaging device (CCD camera, etc.) that has an optical axis 8a and captures images. On the optical axis 8a, the ceiling wall 20 and the carrier 100 have transparent portions or openings. The measurement unit 8 captures images of alignment marks provided on the substrate 101 and the mask 102, and the control unit 10 calculates the amount of positional misalignment between the substrate 101 and the mask 102 from the image capturing results. do. Then, the control amount of the position adjustment unit 7 is determined.

<Carrier>

The configuration of the carrier 100 will be described with reference to FIGS. 5 and 6. FIG. 5 is a diagram showing the support mode of the carrier 100 holding the substrate 101 and the support mode of the mask 102 during alignment, and FIG. 6 is a partial enlarged view of FIG. 5.

In the carrier 100, a seating member 100a and a chuck member 100b are installed in a plate-shaped main body 101c. The main body 101c is a plate-shaped member made of metal or the like, and constitutes a holding surface that holds the substrate 101 on its lower surface. The main body 101c has a certain degree of rigidity (at least higher rigidity than the substrate 101) and holds the substrate 101 while suppressing sagging of the substrate 101 itself.

A plurality of seating members 100a are arranged outside the substrate holding area of the holding surface of the main body 101c, protruding from the holding surface. The seating member 100a is installed so as to protrude from the substrate 101 toward the mask 102 while the substrate 101 is held by the carrier 100 . After the substrate 101 and the mask 102 are aligned, the carrier 100 is seated on the mask frame 102a through the seating member 100a.

The chuck member 100b is a member for holding the substrate 101 along the holding surface of the main body 100c. The chuck member 10lb of this embodiment is an adhesive member and can hold the substrate 101 by adhesive force. The chuck member 100b may also be called an adhesive pad.

Meanwhile, in this embodiment, a member that holds the substrate 101 by adhesive force is used as the chuck member 100b, but the present invention is not limited to this, and the chuck member 100b uses an electrostatic force to hold the substrate (101). A member (electrostatic chuck) holding 101) may also be used.

The carrier 100 may further have a magnetic adsorption portion for magnetically adsorbing the mask 102 via the held substrate 101. As the magnetic adsorption unit, a permanent magnet, an electromagnet, or a magnetic plate equipped with a permanent magnet can be used. Additionally, the magnetic adsorption unit may be installed to be movable relative to the main body 100c. More specifically, the magnetic adsorption unit may be installed so that the distance in the Z direction between it and the main body 100c can be changed.

Of the four sides of the carrier 100, the peripheral portions of two sides facing the X direction are supported by a plurality of support portions 31a. Of the four sides of the mask 102, the peripheral portions of two sides facing the X direction are supported by a plurality of lifting platforms 41. The central portions of the carrier 100, substrate 101, and mask 102 in the X direction are sagging due to their own weight. Supporting the carrier 100, the substrate 101, and the mask 102 in a horizontal position also includes cases where such sagging occurs, and the support position (periphery on the two sides opposing the X direction) is a horizontal position. If you are in a relationship, it is included in the horizontal posture.

<Carrier support unit>

The configuration of the carrier support unit 3 will be explained with reference to FIG. 7 in addition to FIGS. 1 to 6. Figure 7 is a top view of the carrier support unit 3.

The carrier support unit 3 includes a pair of base members 30. Each base member 30 is a beam member extending in the Y direction. The pair of base members 30 are spaced apart in the X direction. A plurality of support portions 31 are supported on each base member 30. In this embodiment, four support portions 31 are supported on one base member 30. The support portion 31 includes a pillar 3lb extending downward from the base member 30, and a receiving finger 31a fixed to the lower end of the pillar 3lb and protruding in the X direction from the pillar 3lb. , It has an overall L- or J-shape. The carrier 100 is supported by placing its peripheral portion on the receiving finger 31a.

The base member 30 has two main body parts 32 spaced apart in the Y direction and a connecting part 33 that is located between the two main body parts 32 and connects these main body parts 32. Each main body portion 32 supports the support portion 31. In the case of this embodiment, two support parts 31 are supported on one main body part 32. Additionally, the main body portion 32 is fixed to the lower end of the support shaft 61. In the case of this embodiment, one main body portion 32 is fixed to one support shaft 61. The support shaft 61 is located between the two support portions 31 in the Y direction. The connecting portion 33 has two end portions 33a, a central portion 33b, and a movable portion 33c between the central portion 33b and the two end portions 33a. One of the two ends 33a is fixed to one main body 32, and the other end 33a is fixed to the other main body 32.

The two movable parts 33c are respectively rotating parts that enable rotation of the end part 33a with respect to the central part 33b. In the case of this embodiment, the movable part 33c is a hinge part that allows rotation of the end part 33a with respect to the central part 33b around the axis in the X direction, as indicated by arrow D2 in FIG. 2. However, the movable portion 33c may be a spherical bearing or an elastic hinge, and may enable rotation of the end portion 33a with respect to the central portion 33b in directions other than around the X-direction axis. By providing the movable portion 33c, the main body portion 32 (more precisely, the main body portion 32 relative to the central portion 33b) can be rotated in the direction of arrow D2 in FIG. 2 with respect to the connecting portion 33. I do it.

A pair of base members 30 are connected by a plurality of connecting members 34. In the case of this embodiment, the pair of base members 30 are connected by two connecting members 34. Each connection member 34 is a beam member extending in the X direction. The connecting member 34 has two end portions 34a, a central portion 34b, and a movable portion 34c between the central portion 34b and the two end portions 34a. One of the two end portions 34a is fixed to one base member 30, and the other end portion 34a is fixed to the other base member 30. The end portion 34a is fixed to the main body 32 with a plurality of bolts 35. The fixed position is between the two support portions 31 in the Y direction, two locations between the support portion 31 and the support shaft 61, and between the support shaft 61 and the movable portion 34c in the X direction. It is a place in between. By fixing the end portion 34a and the main body portion 32 at multiple positions around the support shaft 61, rigidity against torsional deformation can be improved.

The two movable portions 34c are respectively rotating portions that enable rotation of the end portion 34a relative to the central portion 34b. In the case of this embodiment, the movable portion 34c is a hinge portion that enables rotation of the end portion 34a with respect to the central portion 34b around the axis in the Y direction, as indicated by arrow D1 in FIG. 1. . However, the movable portion 34c may be a spherical bearing or an elastic hinge, and may enable rotation of the end portion 34a with respect to the central portion 34b in directions other than around the Y-direction axis. By providing the movable portion 34c, the base member 30 (more precisely, the base member 30 with respect to the central portion 34b) is rotated in the direction of arrow D1 in FIG. 1 with respect to the connecting member 34. It becomes possible.

The connection position of the connection member 34 and the base member 30 will be described. In the case of this embodiment, in the Y direction, with respect to the positions P1 and P2 of each support portion 31 located at both ends, the connection positions P11 and P12 of the connection member 34 are connected to the support shaft 61. It is in a close position, and in particular, the connection positions P11 and P12 are at the same position as the support shaft 61 in the Y direction. Each connection member 34 and each support shaft 61 are located more centrally than the positions P1 and P2 in the Y direction. Comparing the distance between each support part 31 located at both ends and the distance between the connection members 34, the distance at the connection positions P11 and P12 is relative to the distance L1 between the positions P1 and P2. (L2) has the relationship L1>L2.

With this structure, the rigidity of the carrier support unit 3 can be improved and a structure with less deformation can be provided. As a comparative example, the problem in the carrier support unit 3' without the connecting member 34 in FIG. 8 will be described.

When the carrier 100 is supported by the support portion 31 when viewed from the front of the device as shown in FIG. 8, the carrier 100 is deformed into a convex shape that droops downward due to its own weight. This deformation increases as the size of the substrate 101 and the carrier 100 increases. In this state, when the carrier support unit 3' is lowered and the carrier 100 sits on the mask 102, the lowest part of the sagging of the substrate 102 first lands on the mask 102. When the carrier support unit 3' is further lowered to bring the substrate 101 into close contact with the mask 102, the deflection of the carrier 100 is reduced and returns to a flat shape, so that the carrier support unit 3' has a Outwardly, reaction forces (Fhl and Fhr) act.

Due to the moment due to the reaction forces (Fhl and Fhr), the support shaft 61 and the base member 30 tilt outward, resulting in a misalignment in the X direction between the mask 102 and the substrate 101, thereby reducing the alignment accuracy. worsens. Additionally, depending on the size of the reaction force or the state of the difference (bias) between the reaction forces (Fhl and Fhr), the operation of the lifting mechanism 60 may be hindered.

In this embodiment, reinforcement by the connecting member 34 prevents the pair of base members 30 from being spaced apart in the X direction. As a result, the problem shown in FIG. 8 can be solved. Figure 9(A) is an explanatory diagram.

In Fig. 9(A), after aligning the positions of the substrate 101 and the mask 102, the carrier support unit 3 is lowered by the lifting unit 6, and the carrier 100 is placed on the mask 102. It represents a state. In this embodiment, when the carrier 100 is seated on the mask 102, even if the reaction forces (Fhl and Fhr) described in FIG. 8 are generated due to a change in the deflection of the carrier 100's own weight, the pair of base members Since (30) is connected by the connecting member (34), the support shaft (61) and the base member (30) can be prevented from tilting outward. Furthermore, the connection position of the connection member 34 and the base member 30 (P11, P12 in Fig. 7) is closer to the support shaft 61 than the position of the support portion 31 at both ends (P1, P2 in Fig. 7). Therefore, by constraining the position of the support shaft 61 with respect to the reaction forces (Fhl and Fhr), it is possible to strongly prevent the support shaft 61 from tilting.

That is, the connection member 34 is connected to the base member 30 at a position closer to the support shaft 61 than the support portion 31 that is outermost in the Y direction, so that the support portion 31 is outermost in the Y direction. It is possible to increase rigidity against the moment force applied to the base member 30 and the support shaft 61 due to the stress acting on (stress resulting from the deflection of the carrier 100). In particular, since the reaction forces (Fhl and Fhr) act at the lower end of the support shaft 61 furthest from the lifting mechanism 60, the reaction forces (Fhl and Fhr) act as a moment force on the lifting mechanism 60. It is also extremely effective in reducing this moment force.

If the position of the connection member 34 in the Y direction is located outside the support portion 31, which is the outermost in the Y direction (case of L2>L1 in FIG. 7), when receiving reaction forces (Fhl and Fhr), Since the connection member 34 is separated from the support shaft 61, which is a point, in the Y direction, depending on the strength of the connection member 34 itself, it may be deformed locally and the effect of sufficiently improving rigidity may not be obtained. Additionally, there is a risk that the base member 30 may be deformed in the direction of rotation centered on the support shaft 61. Therefore, depending on the size, weight, and precision of the carrier 100 or the mask 102, it is important that the relationship L2<L1 in FIG. 7 is maintained, and the actual design value can be appropriately selected within this range.

In addition, as shown in FIG. 9(A) and later in FIG. 9(B), the mask 102 is transferred to the conveying roller 9 by lowering the lifting platform 41. At this time, the space where the carrier 100, substrate 101, and mask 102 are conveyed by the conveyance roller 9, that is, the conveyance pass line 11, is the range indicated by the broken line, and is conveyed in the X direction. , it moves from the alignment room to the film formation room at the rear stage and is deposited by the deposition source 5.

As can be seen from the figure, the connection member 34 is disposed above and outside the conveyance pass line 11, and does not interfere with the conveyance function while ensuring the effect of reinforcement. On the other hand, it is preferable that the height of the conveyance pass line 11 is greater than the sum of the thickness of the mask 102 and the thickness of the carrier 100, and that the stroke by which the receiving finger 31a retracts during delivery is also taken into account. .

Next, the functions of the movable parts 33c and 34c will be explained. When the base member 30 is composed of a single member with high rigidity without the movable part 33c, or when the connecting member 34 is composed of a single member with high rigidity without the movable part 34c, four lifting mechanisms ( When the synchronization of 60) is released for some reason, an excessive load may be applied to the carrier support unit 3 or each lifting mechanism 60. An example of a case where the synchronization of the four lifting mechanisms 60 is released is when the detection result of the encoder head 64 becomes difficult to obtain due to noise or the like (when synchronization is lost). When one of the four lifting mechanisms 60 operates arbitrarily with respect to the other lifting mechanisms 60, the force in the Z direction varies depending on the connection portion of the carrier support unit 3 with the four support shafts 61. This causes deformation in the Z direction, and a large load acts on the lifting mechanism 60 as a reaction force.

In the case of this embodiment, each main body part 32 and each central part 34b are mutually deformable by rotation of the movable parts 33c and 34c. Even if a part of each lifting mechanism 60 operates independently due to malfunction, etc., the rotation of the movable parts 33c and 34c provides a shearing direction force acting on each main body part 32 or each central part 34b. You can receive it. Therefore, it is possible to prevent excessive load from acting on the carrier support unit 3 or each lifting mechanism 60.

<Electronic device>

Next, an example of an electronic device will be described. Hereinafter, the configuration of an organic EL display device will be illustrated as an example of an electronic device.

First, the organic EL display device to be manufactured will be described. FIG. 10(A) is an overall view of the organic EL display device 500, and FIG. 10(B) is a diagram showing the cross-sectional structure of one pixel.

As shown in FIG. 10(A), in the display area 51 of the organic EL display device 500, a plurality of pixels 52 having a plurality of light-emitting elements are arranged in a matrix shape. As will be explained in detail later, each light emitting element has a structure including an organic layer sandwiched between a pair of electrodes.

In addition, the pixel referred to here refers to the minimum unit that enables display of a desired color in the display area 51. In the case of a color organic EL display device, the pixel 52 is composed of a combination of a plurality of subpixels of the first light-emitting element 52R, the second light-emitting element 52G, and the third light-emitting element 52B that emit different light. It is done. The pixel 52 is often composed of a combination of three types of subpixels: a red (R) light-emitting element, a green (G) light-emitting element, and a blue (B) light-emitting element, but is not limited to this. The pixel 52 may include at least one type of subpixel, preferably including two or more types of subpixels, and more preferably including three or more types of subpixels. The sub-pixels constituting the pixel 52 include, for example, a combination of four types of sub-pixels: a red (R) light-emitting element, a green (G) light-emitting element, a blue (B) light-emitting element, and a yellow (Y) light-emitting element. You can continue.

FIG. 10(B) is a partial cross-sectional schematic diagram taken along line A-B in FIG. 10(A). The pixel 52 is formed on the substrate 53 by a first electrode (anode) 54, a hole transport layer 55, and a red layer 56R, a green layer 56G, or a blue layer 56B. It has a plurality of subpixels composed of an organic EL element including one, an electron transport layer 57, and a second electrode (cathode) 58. Among these, the hole transport layer 55, red layer 56R, green layer 56G, blue layer 56B, and electron transport layer 57 correspond to the organic layer. The red layer 56R, green layer 56G, and blue layer 56B are formed in patterns corresponding to light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue colors, respectively.

Additionally, the first electrode 54 is formed separately for each light-emitting element. The hole transport layer 55, the electron transport layer 57, and the second electrode 58 may be formed in common across the plurality of light-emitting elements 52R, 52G, and 52B, or may be formed for each light-emitting element. That is, as shown in FIG. 11(B), after the hole transport layer 55 is formed as a common layer across a plurality of subpixel areas, the red layer 56R, green layer 56G, and blue layer 56B are formed. It may be formed separately for each subpixel area, and further, the electron transport layer 57 and the second electrode 58 may be formed as a common layer over a plurality of subpixel areas.

Meanwhile, in order to prevent short circuit between the adjacent first electrodes 54, an insulating layer 59 is provided between the first electrodes 54. Furthermore, since the organic EL layer deteriorates due to moisture or oxygen, a protective layer 600 is provided to protect the organic EL element from moisture or oxygen.

In FIG. 10(B), the hole transport layer 55 and the electron transport layer 57 are shown as one layer, but depending on the structure of the organic EL display element, they may be formed of multiple layers having a hole blocking layer or an electron blocking layer. do. In addition, between the first electrode 54 and the hole transport layer 55, a hole injection layer having an energy band structure that allows smooth injection of holes from the first electrode 54 to the hole transport layer 55 is provided. You can form it. Similarly, an electron injection layer may be formed between the second electrode 58 and the electron transport layer 57.

Each of the red layer 56R, green layer 56G, and blue layer 56B may be formed as a single light-emitting layer or may be formed by stacking a plurality of layers. For example, the red layer 56R may be composed of two layers, the upper layer may be formed as a red light-emitting layer, and the lower layer may be formed as a hole transport layer or an electron blocking layer. Alternatively, the lower layer may be formed as a red light-emitting layer, and the upper layer may be formed as an electron transport layer or a hole blocking layer. By providing a layer below or above the light emitting layer in this way, there is an effect of improving the color purity of the light emitting element by adjusting the light emission position in the light emitting layer and adjusting the optical path length.

Meanwhile, although an example of the red layer 56R is shown here, a similar structure may be adopted for the green layer 56G and the blue layer 56B. Additionally, the number of layers may be two or more. Furthermore, layers of different materials, such as a light-emitting layer and an electron block layer, may be stacked, or layers of the same material may be stacked, for example, two or more light-emitting layers are stacked.

In the manufacture of such electronic devices, the above-described film forming apparatus 1 is applicable, and the manufacturing method includes an alignment process of aligning the substrate and the mask, and forming at least one layer of each layer on the substrate by using the deposition source 5. It may include a deposition process for depositing any one layer.

<Other embodiments>

In the above embodiment, a configuration in which the substrate 101 is held by the carrier 100 is illustrated, but a configuration not using the carrier 100 can also be adopted. In this case, the carrier support unit 3 may be configured as a support unit that directly supports the substrate 101. Additionally, a support unit with the same structure as the carrier support unit 3 may be employed as a support unit for the mask 102. Although the carrier 100 is exemplified as the work, the present invention is applicable as a holding device for various works in devices other than the substrate 101 and the mask 102 and the film forming device.

The invention is not limited to the above embodiments, and various changes and modifications are possible without departing from the spirit and scope of the invention. Therefore, the claims are attached to publicize the scope of the invention.

1: Tabernacle device
3: Carrier support unit
6: Support unit (elevating unit)
30: Base member
31: support part
34: Connection member
61: support axis

Claims (8)

a first support unit supporting the work,
A work holding device comprising a second support unit that extends and supports the first support unit,
The first support unit,
A first base member extending in a first direction,
a second base member extending in the first direction and spaced apart from the first base member in a second direction intersecting the first direction;
a plurality of first support parts installed on the first base member along the first direction and supporting a peripheral portion of the workpiece;
a plurality of second support parts installed on the second base member along the first direction and supporting a peripheral portion of the workpiece;
a connection member extending in the second direction and connecting the first base member and the second base member;
The second support unit,
a first support shaft extending the first base member;
Provided with a second support shaft that extends the second base member,
The connection member is,
Connected to the first base member at a portion closer to the first support shaft than a first support portion located at an end of the plurality of first support portions in the first direction,
A work holding device characterized in that the work holding device is connected to the second base member at a portion closer to the second support shaft than a second support portion located at an end of the plurality of second support portions in the first direction. According to paragraph 1,
The second support unit,
a first lifting means for raising and lowering the first support shaft;
A work holding device comprising a second lifting means that is driven independently of the first lifting means and raises and lowering the second support shaft. According to paragraph 2,
A first sensor that detects the lifting position of the first support shaft,
a second sensor that detects the lifting position of the second support shaft;
A work holding device comprising control means for controlling the first lifting means based on the detection result of the first sensor and controlling the second lifting means based on the detection result of the second sensor. . According to paragraph 1,
The connection member is,
It is rotatably connected to the first base member about an axis in the first direction, and
A work holding device characterized in that it is rotatably connected to the second base member about an axis in the first direction. According to paragraph 1,
The second support unit,
two first support shafts spaced apart in the first direction;
Provided with two second support shafts spaced apart in the first direction,
The first base member is,
Two first body parts to which the two first support shafts are respectively connected,
A first connecting portion between the two first body portions,
The second base member,
Two second main bodies to which the two second support shafts are respectively connected,
Provided with a second connection between the two second body parts,
The first connection portion is connected to each of the two first body portions so as to be rotatable about an axis in the second direction,
A work holding device characterized in that the second connecting portion is connected to each of the two second main body portions so as to be rotatable about an axis in the second direction. a carrier support unit supporting a carrier holding a substrate;
A mask support means for supporting the mask,
a lifting unit that extends and supports the carrier support unit above the mask and raises and lowers the carrier support unit relative to the mask;
Measuring means for measuring the amount of positional misalignment between the substrate and the mask;
An alignment device including position adjustment means for adjusting the relative positions of the substrate and the mask,
The carrier support unit,
a first base member extending in a first horizontal direction;
a second base member extending in the first horizontal direction and spaced apart from the first base member in a second horizontal direction intersecting the first horizontal direction;
a plurality of first support parts installed on the first base member along the first horizontal direction and supporting a peripheral portion of the carrier;
a plurality of second support parts installed on the second base member along the first horizontal direction and supporting a peripheral portion of the carrier;
A plurality of connection members are installed to be spaced apart in the first horizontal direction and extend in the second horizontal direction to connect the first base member and the second base member,
The lifting unit is,
a plurality of first support shafts arranged to be spaced apart in the first horizontal direction and extending the first base member;
A plurality of second support axes are arranged to be spaced apart in the first horizontal direction and extend the second base member,
The plurality of first support shafts and the plurality of connection members are located more centrally than the first support portions at both ends of the plurality of first support portions in the first horizontal direction,
The alignment device is characterized in that the plurality of second support shafts and the plurality of connection members are located more centrally than the second support portions at both ends of the plurality of second support portions in the first horizontal direction. According to clause 6,
An alignment device characterized in that the plurality of connection members, the plurality of first support shafts, and the plurality of second support shafts are provided in equal numbers and each has the same position in the first horizontal direction. The alignment device according to claim 6 or 7,
A film forming apparatus comprising a deposition means for discharging a deposition material onto a substrate through a mask.