CN109494173B - 芯片贴装装置和半导体器件的制造方法 - Google Patents

芯片贴装装置和半导体器件的制造方法 Download PDF

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CN109494173B
CN109494173B CN201811051542.6A CN201811051542A CN109494173B CN 109494173 B CN109494173 B CN 109494173B CN 201811051542 A CN201811051542 A CN 201811051542A CN 109494173 B CN109494173 B CN 109494173B
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vibration
vibration displacement
displacement
waveform
mounting head
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CN109494173A (zh
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楯充明
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Fasford Technology Co Ltd
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Fasford Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
CN201811051542.6A 2017-09-11 2018-09-10 芯片贴装装置和半导体器件的制造方法 Active CN109494173B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-173907 2017-09-11
JP2017173907A JP7102113B2 (ja) 2017-09-11 2017-09-11 ダイボンディング装置および半導体装置の製造方法

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CN109494173A CN109494173A (zh) 2019-03-19
CN109494173B true CN109494173B (zh) 2022-03-29

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JP (1) JP7102113B2 (ja)
KR (1) KR102100278B1 (ja)
CN (1) CN109494173B (ja)
TW (1) TWI697981B (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200119971A (ko) 2019-04-11 2020-10-21 주식회사 지와이엘테크놀로지 반도체 본딩 장치 및 그 방법
WO2020227987A1 (zh) * 2019-05-15 2020-11-19 深圳市兴华炜科技有限公司 高速贴片的转移方法及相关产品
CN110418503B (zh) * 2019-06-26 2021-06-01 龙南领德实业有限公司 一种柔性电路板的补强胶片贴附预压设备
KR20210039661A (ko) 2019-10-02 2021-04-12 삼성전자주식회사 기판 본딩 장치
CN110943011A (zh) * 2019-11-21 2020-03-31 深圳市德沃先进自动化有限公司 一种键合设备用的质量监测控制器及其集总控制方法
JP7408434B2 (ja) * 2020-02-25 2024-01-05 ファスフォードテクノロジ株式会社 モータ制御装置、ダイボンディング装置および半導体装置の製造方法
KR102619967B1 (ko) * 2020-05-22 2024-01-03 세메스 주식회사 기판 처리 장치 및 액 공급 유닛
CN116033675B (zh) * 2023-02-16 2023-10-20 深圳市乐祺微电子科技有限公司 Smt物料纠错系统
CN117080127B (zh) * 2023-10-11 2024-01-05 江苏快克芯装备科技有限公司 芯片吸取异常检测装置及检测方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000180175A (ja) * 1998-12-15 2000-06-30 Mitsumi Electric Co Ltd 多軸検出型角速度、加速度センサ
CN101546175A (zh) * 2008-03-25 2009-09-30 塔工程有限公司 用于结合机的控制方法
CN102655143A (zh) * 2011-03-03 2012-09-05 精工爱普生株式会社 振动装置、振动装置的制造方法以及电子设备
JP2015173551A (ja) * 2014-03-12 2015-10-01 ファスフォードテクノロジ株式会社 半導体製造方法及びダイボンダ
JP2015177110A (ja) * 2014-03-17 2015-10-05 ファスフォードテクノロジ株式会社 ダイボンダ及びボンディング方法
CN105923475A (zh) * 2016-06-22 2016-09-07 广州广日电梯工业有限公司 一种基于传感器的智能自动调节系统及方法
CN106486398A (zh) * 2015-08-31 2017-03-08 捷进科技有限公司 芯片贴装机、贴装方法及半导体器件的制造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008091856A (ja) 2006-03-22 2008-04-17 Juki Corp 電子部品搭載装置
JP2007275244A (ja) 2006-04-05 2007-10-25 Kawasaki Plant Systems Ltd 挙動異常検出装置および検出方法
JP5367623B2 (ja) 2010-03-15 2013-12-11 オムロン株式会社 サーボシステム、サーボモータ駆動装置、セーフティユニットおよびサーボシステムの制御方法
JP2011232103A (ja) 2010-04-26 2011-11-17 Nikon Corp 形状測定装置
JP5320420B2 (ja) 2011-02-18 2013-10-23 株式会社日立ハイテクインスツルメンツ モータ制御装置およびモータ制御方法
JP5865639B2 (ja) * 2011-09-15 2016-02-17 ファスフォードテクノロジ株式会社 ダイボンダ及びボンディング方法
JP6055239B2 (ja) * 2012-08-29 2016-12-27 ファスフォードテクノロジ株式会社 ダイボンディング装置並びにダイピックアップ装置及びダイピックアップ方法
JP2015060543A (ja) 2013-09-20 2015-03-30 船井電機株式会社 デジタルペン及びそれを備える情報処理システム
KR102004797B1 (ko) * 2014-10-31 2019-10-01 삼성전기주식회사 센서 패키지 및 그 제조 방법
JP6470054B2 (ja) * 2015-01-26 2019-02-13 ファスフォードテクノロジ株式会社 ダイボンダおよびボンディング方法
JP2016174056A (ja) * 2015-03-16 2016-09-29 株式会社東芝 半導体製造装置および半導体装置の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000180175A (ja) * 1998-12-15 2000-06-30 Mitsumi Electric Co Ltd 多軸検出型角速度、加速度センサ
CN101546175A (zh) * 2008-03-25 2009-09-30 塔工程有限公司 用于结合机的控制方法
CN102655143A (zh) * 2011-03-03 2012-09-05 精工爱普生株式会社 振动装置、振动装置的制造方法以及电子设备
JP2015173551A (ja) * 2014-03-12 2015-10-01 ファスフォードテクノロジ株式会社 半導体製造方法及びダイボンダ
JP2015177110A (ja) * 2014-03-17 2015-10-05 ファスフォードテクノロジ株式会社 ダイボンダ及びボンディング方法
CN106486398A (zh) * 2015-08-31 2017-03-08 捷进科技有限公司 芯片贴装机、贴装方法及半导体器件的制造方法
CN105923475A (zh) * 2016-06-22 2016-09-07 广州广日电梯工业有限公司 一种基于传感器的智能自动调节系统及方法

Also Published As

Publication number Publication date
CN109494173A (zh) 2019-03-19
TW201917818A (zh) 2019-05-01
JP2019050295A (ja) 2019-03-28
KR102100278B1 (ko) 2020-04-13
TWI697981B (zh) 2020-07-01
KR20190029434A (ko) 2019-03-20
JP7102113B2 (ja) 2022-07-19

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