CN109478539B - 浇铸电子元件或元件组的方法和可硬化组合物 - Google Patents

浇铸电子元件或元件组的方法和可硬化组合物 Download PDF

Info

Publication number
CN109478539B
CN109478539B CN201780043303.3A CN201780043303A CN109478539B CN 109478539 B CN109478539 B CN 109478539B CN 201780043303 A CN201780043303 A CN 201780043303A CN 109478539 B CN109478539 B CN 109478539B
Authority
CN
China
Prior art keywords
component
network
casting
region
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201780043303.3A
Other languages
English (en)
Chinese (zh)
Other versions
CN109478539A (zh
Inventor
A·赖尔
J·维泽尔
J·斯彭格勒
R·克莱因
A·克赖肯鲍姆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH, Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV filed Critical Robert Bosch GmbH
Publication of CN109478539A publication Critical patent/CN109478539A/zh
Application granted granted Critical
Publication of CN109478539B publication Critical patent/CN109478539B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/103—Esters of polyhydric alcohols or polyhydric phenols of trialcohols, e.g. trimethylolpropane tri(meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/07—Aldehydes; Ketones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C08K5/132—Phenols containing keto groups, e.g. benzophenones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515—Three-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5397—Phosphine oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/302—Polyurethanes or polythiourethanes; Polyurea or polythiourea
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
CN201780043303.3A 2016-07-11 2017-07-10 浇铸电子元件或元件组的方法和可硬化组合物 Active CN109478539B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE102016112655.1 2016-07-11
DE102016112655 2016-07-11
DE102017202956.0A DE102017202956A1 (de) 2016-07-11 2017-02-23 Verfahren und aushärtbare Masse zum Vergießen elektronischer Bauteile oder Bauteilgruppen
DE102017202956.0 2017-02-23
PCT/EP2017/067210 WO2018011116A1 (de) 2016-07-11 2017-07-10 Verfahren und aushärtbare masse zum vergiessen elektronischer bauteile oder bauteilgruppen

Publications (2)

Publication Number Publication Date
CN109478539A CN109478539A (zh) 2019-03-15
CN109478539B true CN109478539B (zh) 2022-08-23

Family

ID=60676709

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780043303.3A Active CN109478539B (zh) 2016-07-11 2017-07-10 浇铸电子元件或元件组的方法和可硬化组合物

Country Status (9)

Country Link
US (1) US10896860B2 (enExample)
EP (1) EP3482416B1 (enExample)
JP (1) JP6743269B2 (enExample)
KR (1) KR102232134B1 (enExample)
CN (1) CN109478539B (enExample)
DE (1) DE102017202956A1 (enExample)
HU (1) HUE051444T2 (enExample)
PT (1) PT3482416T (enExample)
WO (1) WO2018011116A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017202956A1 (de) * 2016-07-11 2018-01-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. Verfahren und aushärtbare Masse zum Vergießen elektronischer Bauteile oder Bauteilgruppen
DE102018121067A1 (de) 2018-08-29 2020-03-05 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Härtbare Zweikomponentenmasse
CN110648979B (zh) * 2019-09-29 2021-09-17 清华大学 具有大拉伸性的一体化柔性基底与柔性电路及其制造方法
DE102020209476A1 (de) 2020-07-28 2022-02-03 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zum Vergießen elektronischer, optischer und/oder optoelektronischer Bauteile

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0453149A2 (en) * 1990-04-20 1991-10-23 Sola International Holdings Limited Casting composition
JPH05267507A (ja) * 1992-03-24 1993-10-15 Hitachi Ltd 半導体装置の保護層の形成方法
US6066861A (en) * 1996-09-20 2000-05-23 Siemens Aktiengesellschaft Wavelength-converting casting composition and its use
JP2010034550A (ja) * 2008-07-02 2010-02-12 Panasonic Corp ２層防湿コート電子部品実装構造体およびその製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05160177A (ja) 1991-12-04 1993-06-25 Murata Mfg Co Ltd 電子部品の被覆形成方法
JPH08125071A (ja) * 1994-10-25 1996-05-17 Fuji Electric Co Ltd 半導体装置
JPH0951009A (ja) 1995-08-07 1997-02-18 Dainippon Printing Co Ltd Ｉｃモジュールの樹脂封止方法、ｉｃモジュール及びｉｃカード
DE19950538B4 (de) 1999-10-20 2008-05-29 Denso Corp., Kariya Halbleiterdrucksensorvorrichtung mit Schutzelementen
JP2001223305A (ja) * 2000-02-10 2001-08-17 Matsushita Electric Ind Co Ltd 樹脂封止半導体装置
DE102008032330A1 (de) 2008-07-09 2010-01-14 Akro Plastic Gmbh Verfahren zur Herstellung von montagefertigen, kunststoffumspritzten Elektronikbauteilen bzw. Elektronikbaugruppen
DE102010010598A1 (de) 2010-03-08 2011-09-08 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Dual härtende Masse und deren Verwendung
CN104744705B (zh) * 2010-05-18 2017-09-08 捷恩智株式会社 液状有机硅化合物的制造方法、热硬化性树脂组成物及其使用
DE102017202956A1 (de) * 2016-07-11 2018-01-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. Verfahren und aushärtbare Masse zum Vergießen elektronischer Bauteile oder Bauteilgruppen

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0453149A2 (en) * 1990-04-20 1991-10-23 Sola International Holdings Limited Casting composition
JPH05267507A (ja) * 1992-03-24 1993-10-15 Hitachi Ltd 半導体装置の保護層の形成方法
US6066861A (en) * 1996-09-20 2000-05-23 Siemens Aktiengesellschaft Wavelength-converting casting composition and its use
JP2010034550A (ja) * 2008-07-02 2010-02-12 Panasonic Corp ２層防湿コート電子部品実装構造体およびその製造方法

Also Published As

Publication number Publication date
US10896860B2 (en) 2021-01-19
WO2018011116A1 (de) 2018-01-18
JP6743269B2 (ja) 2020-08-19
EP3482416A1 (de) 2019-05-15
JP2019520713A (ja) 2019-07-18
DE102017202956A1 (de) 2018-01-11
KR102232134B1 (ko) 2021-03-25
PT3482416T (pt) 2020-05-28
US20190304861A1 (en) 2019-10-03
KR20190030684A (ko) 2019-03-22
HUE051444T2 (hu) 2021-03-01
CN109478539A (zh) 2019-03-15
EP3482416B1 (de) 2020-04-22

Similar Documents

Publication Publication Date Title
CN109478539B (zh) 浇铸电子元件或元件组的方法和可硬化组合物
EP1921114B1 (en) Light emitting diode element
EP1878768B1 (en) Curable silicone rubber compositions and cured product thereof
JP5138924B2 (ja) 光半導体封止用シリコーンゴム組成物および光半導体装置
JP2011032392A (ja) 光半導体装置用シリコーン樹脂組成物
KR102257952B1 (ko) 경화성 폴리오가노실록산 조성물 및 그 사용
JP2005072552A (ja) 発光ダイオードのパッケージ体及びその製造方法
US7479653B2 (en) UV curable protective encapsulant
KR20090130193A (ko) 열경화성 수지 조성물 및 그 경화물을 이용한 광학 부재
WO2015037571A1 (ja) 有機ケイ素化合物含有熱硬化性組成物及びその硬化物
US8937128B2 (en) Curable reaction resin system
JP4872358B2 (ja) 樹脂組成物、及びそれを用いた光学部材とその製造方法
JP2010195986A (ja) 硬化性樹脂組成物及び硬化物
JPH1095910A (ja) 半導体封止用不飽和ポリエステル樹脂組成物とその成形方法
JP2007327030A (ja) 硬化性樹脂組成物及び光学部材
KR101469265B1 (ko) 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 장치
JP5447458B2 (ja) 樹脂組成物、及びそれを用いた光学部材とその製造方法
KR101418012B1 (ko) 경화성 실리콘 조성물 및 이를 이용한 전자장치
JP2001247652A (ja) エポキシ樹脂組成物及び半導体装置
JPS6315295B2 (enExample)
JPH07118505A (ja) エポキシ樹脂組成物
KR20230033045A (ko) 이미다졸 계열의 수소-규소 결합의 안정성 개선개선을 위한 첨가제
KR20240008295A (ko) 열 경화성 수지 조성물, 유기 규소 화합물, 성형체및 광 반도체 장치
JPH03198353A (ja) 樹脂封止型半導体装置の製造方法
JP2021192421A (ja) 光半導体封止用樹脂成形物

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right
TA01 Transfer of patent application right

Effective date of registration: 20190716

Address after: Stuttgart, Germany

Applicant after: ROBERT BOSCH GmbH

Address before: Munich, Germany

Applicant before: FRAUNHOFER-GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG E.V.

GR01 Patent grant
GR01 Patent grant