CN109449100B - 一种电子元件的巨量转移方法及装置 - Google Patents
一种电子元件的巨量转移方法及装置 Download PDFInfo
- Publication number
- CN109449100B CN109449100B CN201811204677.1A CN201811204677A CN109449100B CN 109449100 B CN109449100 B CN 109449100B CN 201811204677 A CN201811204677 A CN 201811204677A CN 109449100 B CN109449100 B CN 109449100B
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- flip
- die bond
- led
- transfer head
- electronic component
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- 238000012546 transfer Methods 0.000 title claims abstract description 107
- 238000000034 method Methods 0.000 title claims abstract description 35
- 239000013013 elastic material Substances 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims description 30
- 239000000463 material Substances 0.000 claims description 7
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 7
- 238000005411 Van der Waals force Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 238000000608 laser ablation Methods 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 238000012800 visualization Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000006194 liquid suspension Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000013404 process transfer Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000001338 self-assembly Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811204677.1A CN109449100B (zh) | 2018-10-16 | 2018-10-16 | 一种电子元件的巨量转移方法及装置 |
| PCT/CN2018/124562 WO2020077865A1 (fr) | 2018-10-16 | 2018-12-28 | Procédé et dispositif de transfert d'éléments électroniques massifs |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811204677.1A CN109449100B (zh) | 2018-10-16 | 2018-10-16 | 一种电子元件的巨量转移方法及装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109449100A CN109449100A (zh) | 2019-03-08 |
| CN109449100B true CN109449100B (zh) | 2019-07-02 |
Family
ID=65546480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811204677.1A Active CN109449100B (zh) | 2018-10-16 | 2018-10-16 | 一种电子元件的巨量转移方法及装置 |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109449100B (fr) |
| WO (1) | WO2020077865A1 (fr) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11538786B2 (en) | 2019-03-19 | 2022-12-27 | Ordos Yuansheng Optoelectronics Co., Ltd. | Transfer printing method and transfer printing apparatus |
| CN110112091B (zh) * | 2019-04-26 | 2021-07-27 | 清华大学深圳研究生院 | 一种批量转移晶片裸片的装置 |
| CN110289240A (zh) * | 2019-06-27 | 2019-09-27 | 上海天马微电子有限公司 | 电子元件巨量转移头及转移方法 |
| CN110379761B (zh) * | 2019-07-18 | 2021-08-24 | 京东方科技集团股份有限公司 | 微发光二极管转移基板及装置 |
| CN113937039B (zh) * | 2021-12-16 | 2022-02-25 | 佛山市华道超精科技有限公司 | 一种芯片巨量转移方法及芯片巨量转移设备 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1491436A (zh) * | 2001-02-08 | 2004-04-21 | �Ҵ���˾ | 芯片转移方法及装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20120105262A (ko) * | 2011-03-15 | 2012-09-25 | 삼성테크윈 주식회사 | 이동형 스토퍼, 이를 구비한 컨베이어 시스템 및 그 제어 방법 |
| US9969078B2 (en) * | 2015-08-03 | 2018-05-15 | Mikro Mesa Technology Co., Ltd. | Transfer head array and transferring method |
| US10177113B2 (en) * | 2016-08-18 | 2019-01-08 | Genesis Photonics Inc. | Method of mass transferring electronic device |
| CN107799455B (zh) * | 2017-10-24 | 2020-06-19 | 上海天马微电子有限公司 | 转运头及其制作方法、转印方法及显示面板的制作方法 |
| CN107978548B (zh) * | 2017-11-20 | 2019-07-05 | 厦门市三安光电科技有限公司 | 微元件的巨量转移方法 |
| CN107910413B (zh) * | 2017-11-21 | 2019-07-12 | 福州大学 | 一种MicroLED的巨量转移装置及转移方法 |
| CN108490341B (zh) * | 2018-03-30 | 2019-10-08 | 惠州雷通光电器件有限公司 | 微型芯片转移系统及方法 |
-
2018
- 2018-10-16 CN CN201811204677.1A patent/CN109449100B/zh active Active
- 2018-12-28 WO PCT/CN2018/124562 patent/WO2020077865A1/fr active Application Filing
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1491436A (zh) * | 2001-02-08 | 2004-04-21 | �Ҵ���˾ | 芯片转移方法及装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020077865A1 (fr) | 2020-04-23 |
| CN109449100A (zh) | 2019-03-08 |
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