CN108807599A - 一种敷设装置 - Google Patents
一种敷设装置 Download PDFInfo
- Publication number
- CN108807599A CN108807599A CN201810726471.9A CN201810726471A CN108807599A CN 108807599 A CN108807599 A CN 108807599A CN 201810726471 A CN201810726471 A CN 201810726471A CN 108807599 A CN108807599 A CN 108807599A
- Authority
- CN
- China
- Prior art keywords
- laying
- adsorption jig
- laying apparatu
- laid
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001179 sorption measurement Methods 0.000 claims abstract description 76
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 230000005540 biological transmission Effects 0.000 claims description 33
- 230000002745 absorbent Effects 0.000 claims description 18
- 239000002250 absorbent Substances 0.000 claims description 18
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 12
- 230000033001 locomotion Effects 0.000 claims description 6
- 238000010521 absorption reaction Methods 0.000 claims description 4
- 230000005347 demagnetization Effects 0.000 claims description 4
- 238000000034 method Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000010030 laminating Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 241000252254 Catostomidae Species 0.000 description 1
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Manipulator (AREA)
Abstract
Description
Claims (15)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810726471.9A CN108807599A (zh) | 2018-07-04 | 2018-07-04 | 一种敷设装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810726471.9A CN108807599A (zh) | 2018-07-04 | 2018-07-04 | 一种敷设装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN108807599A true CN108807599A (zh) | 2018-11-13 |
Family
ID=64074560
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810726471.9A Pending CN108807599A (zh) | 2018-07-04 | 2018-07-04 | 一种敷设装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108807599A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111863656A (zh) * | 2019-04-28 | 2020-10-30 | 汉能移动能源控股集团有限公司 | 一种敷设装置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM320822U (en) * | 2007-01-29 | 2007-10-11 | D Tek Technology Co Ltd | Printer with magnetic attraction |
CN102501552A (zh) * | 2011-12-23 | 2012-06-20 | 常州天华新能源科技有限公司 | 晶体硅太阳能层压板智能敷设生产设备 |
CN203237432U (zh) * | 2012-12-24 | 2013-10-16 | 鸿准精密模具(昆山)有限公司 | 贴膜机构 |
CN204046954U (zh) * | 2014-07-28 | 2014-12-24 | 无锡市豪帮电器有限公司 | 一种防止贴装元件在贴片机上产生反片的工装结构 |
CN104900750A (zh) * | 2014-03-07 | 2015-09-09 | 营口金辰机械股份有限公司 | 电池串自动敷设机 |
CN108242478A (zh) * | 2017-12-20 | 2018-07-03 | 苏州德睿联自动化科技有限公司 | 电池串自动敷设焊接装置及方法 |
CN208596695U (zh) * | 2018-07-04 | 2019-03-12 | 汉能移动能源控股集团有限公司 | 一种敷设装置 |
-
2018
- 2018-07-04 CN CN201810726471.9A patent/CN108807599A/zh active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM320822U (en) * | 2007-01-29 | 2007-10-11 | D Tek Technology Co Ltd | Printer with magnetic attraction |
CN102501552A (zh) * | 2011-12-23 | 2012-06-20 | 常州天华新能源科技有限公司 | 晶体硅太阳能层压板智能敷设生产设备 |
CN203237432U (zh) * | 2012-12-24 | 2013-10-16 | 鸿准精密模具(昆山)有限公司 | 贴膜机构 |
CN104900750A (zh) * | 2014-03-07 | 2015-09-09 | 营口金辰机械股份有限公司 | 电池串自动敷设机 |
CN204046954U (zh) * | 2014-07-28 | 2014-12-24 | 无锡市豪帮电器有限公司 | 一种防止贴装元件在贴片机上产生反片的工装结构 |
CN108242478A (zh) * | 2017-12-20 | 2018-07-03 | 苏州德睿联自动化科技有限公司 | 电池串自动敷设焊接装置及方法 |
CN208596695U (zh) * | 2018-07-04 | 2019-03-12 | 汉能移动能源控股集团有限公司 | 一种敷设装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111863656A (zh) * | 2019-04-28 | 2020-10-30 | 汉能移动能源控股集团有限公司 | 一种敷设装置 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106001930B (zh) | 一种自动上下料的多工位镭雕设备 | |
CN205966380U (zh) | 一种具有全自动线性机械手的自动封胶装置 | |
CN106040534A (zh) | 一种具有全自动线性机械手的自动封胶装置 | |
TW200308065A (en) | Electronic component mounting apparatus and electronic component mounting method | |
CN206697730U (zh) | 充电器零件插接装置 | |
CN110281134B (zh) | 一种高效的自动化抛光机装置 | |
CN113245826B (zh) | 一种光伏组件接线盒的自动安装设备及其控制方法 | |
CN103796444A (zh) | 一种贴片机自动送料机构 | |
CN104916574A (zh) | 一种柔性oled脱膜装置 | |
CN208596695U (zh) | 一种敷设装置 | |
CN108807599A (zh) | 一种敷设装置 | |
CN215469350U (zh) | 一种接线盒自动安装设备 | |
CN205869717U (zh) | 一种自动上下料的多工位镭雕设备 | |
CN207158298U (zh) | 一种夹持力可调节的建筑装饰板防变形搬运装置 | |
CN211240664U (zh) | 全自动铜箔贴覆机 | |
CN204675357U (zh) | 一种成形纸板的抓取机构 | |
CN116798912A (zh) | 一种led晶片固晶装置及固晶方法 | |
CN212049846U (zh) | 基板摊平装置 | |
CN112441269A (zh) | 一种终端电子产品机身保护膜自动包膜装置 | |
JP2012094634A (ja) | 部品実装装置および部品実装方法 | |
CN210362526U (zh) | 一种保压设备 | |
CN100593864C (zh) | 空间太阳电池基板表面贴装电池串的方法 | |
TWI452648B (zh) | 基板移載裝置 | |
CN214057984U (zh) | 一种终端电子产品机身保护膜自动包膜装置 | |
CN111360404A (zh) | 一种转盘式激光焊板成型机 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20201223 Address after: 101400 Yanqi Street, Yanqi Economic Development Zone, Huairou District, Beijing Applicant after: Beijing Huihong Technology Co., Ltd Address before: Room 107, building 2, Olympic Village street, Chaoyang District, Beijing Applicant before: HANERGY MOBILE ENERGY HOLDING GROUP Co.,Ltd. |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20211028 Address after: No.31 Yanqi street, Yanqi Economic Development Zone, Huairou District, Beijing Applicant after: Dongjun new energy Co.,Ltd. Address before: 101400 Yanqi Street, Yanqi Economic Development Zone, Huairou District, Beijing Applicant before: Beijing Huihong Technology Co., Ltd |