CN109413857A - A kind of manufacture craft of high-frequency high-speed plate - Google Patents
A kind of manufacture craft of high-frequency high-speed plate Download PDFInfo
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- CN109413857A CN109413857A CN201811330513.3A CN201811330513A CN109413857A CN 109413857 A CN109413857 A CN 109413857A CN 201811330513 A CN201811330513 A CN 201811330513A CN 109413857 A CN109413857 A CN 109413857A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a kind of manufacture crafts of high-frequency high-speed plate, the high-frequency high-speed plate includes high-frequency high-speed substrate, high-frequency high-speed substrate includes complex media plate, upper layer top plate and lower layer's bottom plate, complex media plate is connected between upper layer top plate and lower layer's bottom plate, its production technology includes: sawing sheet, drilling, hole processing, heavy copper, plate electricity, pattern transfer, it checks, graphic plating, alkali etching, erosion inspection, welding resistance, character, molding, test, heavy tin and final inspection, heavy tin includes pre-treatment, pre-treatment includes chemically cleaning process, utensil used in chemically cleaning process includes ultrasonic cleaner and device for generating super-fine air bubble, it may be implemented to improve bore process, simplify machining, severization electroplating work procedure, reduce the Kong Wutong quantity of the heavy copper of PIH/, simple chemical cleaning procedure is replaced with superfine air bubble cleaning process, so that copper face Flatness is unaffected, and green oil and copper foil adhesive force is not more preferably, easy to foaming when silk-screen.
Description
Technical field
The present invention relates to wiring board fabricating technology fields, more specifically to a kind of production of high-frequency high-speed plate
Technique.
Background technique
It is constantly released in wireless communication, fiber optic communication, high speed data network product at present, it is information processing high speed, wireless
Analog front-end module, these propose new requirement to Digital Signal Processing, IC technique, microwave PCB design, in addition right
Pcb board material and PCB technology propose requirements at the higher level.High frequency microwave printed refer to for high-frequency (frequency be greater than 300MHZ or
Wavelength is less than 1 meter) (frequency is greater than 3GHZ or wavelength less than 0 with microwave.1 meter) PCB in field is in microwave substrate copper-clad plate
Board fabrication method is printed using conventional rigid, process portion is processed using the printed board for especially handling and producing with common FR4
Process is consistent, and only plate is more crisp, is easy disconnected plate, in addition, high-frequency signal once carries out under the environmental condition of high temperature and humidity
Transmission may generate the integrality for making a variation and influencing signal.And with the structure group of the substrate of existing printed circuit board
At being difficult to reach low-dielectric loss in the frequency of 10GHz, needless to say to take into account high temperature resistant and agent of low hygroscopicity energy.
In recent years, scientific research personnel more and more deeply changes the research of high-frequency high-speed plate, and China Patent No. is
CN201510990888.2 provides a kind of production method of high-frequency high-speed wiring board for inlaying cooling fin, including pressing plate, drilling,
Gong plate, heavy copper, plate electricity, outer-layer film drying, route plating, outer layer etch, inlay, second of gong plate, be surface-treated and
The processes such as third and fourth secondary gong plate.The production method of the high-frequency high-speed wiring board provided by the invention for inlaying cooling fin, can prevent
It is broken when drilling gong plate since high-frequency high-speed wiring board brittleness is higher, finally stablizes wiring board performance obtained, have very
The problem of good heat dissipation performance greatly improves plate because more crisp, is easy disconnected plate；At the same time, China Patent No. is
CN201721013342.2 discloses a kind of multiwiring board and its high-frequency high-speed board structure, high-frequency high-speed board structure include
The dielectric substrate layer of one low moisture absorption and one it is formed in metal layer on the dielectric substrate layer of low moisture absorption, wherein the dielectric of low moisture absorption
Substrate layer includes a modified polymer liquid crystal layer or a modified polyimide layer, and modified polymer liquid crystal layer
Or there is aromatic monomer in the structure composition of polyimide layer.By above-mentioned design, can ensure in the environment of high temperature and humidity
The quality and stability of high frequency signal transmission.However existing high-frequency high-speed plate also common problem is: machining compared with
For difficulty, easily there is Kong Wutong in the heavy copper of electroplating work procedure PIH/, and green oil and copper foil poor adhesive force are easy to appear in silk-screen to be caused
Blistering.
Through studying, the reason of green oil and copper foil poor adhesive force lead to blistering include wiring board itself green oil it is of poor quality,
The temperature extremes that can bear are relatively low, and there are also be exactly to use simple chemical cleaning procedure then in the pretreatment process of heavy tin
It is likely to that desired cleaning effect is not achieved, leads to copper face out-of-flatness.
Summary of the invention
1. technical problems to be solved
Aiming at the problems existing in the prior art, the purpose of the present invention is to provide a kind of production works of high-frequency high-speed plate
Skill, it may be implemented to improve bore process, simplify machining, and severization electroplating work procedure reduces the Kong Wutong number of the heavy copper of PIH/
Amount replaces simple chemical cleaning procedure with superfine air bubble cleaning process, so that the flatness of copper face is unaffected, when silk-screen
Green oil and copper foil adhesive force is not more preferably, easy to foaming.
2. technical solution
To solve the above problems, the present invention adopts the following technical scheme that.
A kind of manufacture craft of high-frequency high-speed plate, the high-frequency high-speed plate include high-frequency high-speed substrate, the high-frequency high-speed base
Plate includes complex media plate, upper layer top plate and lower layer's bottom plate, the complex media plate be connected to upper layer top plate and lower layer's bottom plate it
Between, production technology include: sawing sheet, drilling, hole processing, heavy copper, plate electricity, pattern transfer, inspection, graphic plating, alkali etching,
Inspection, welding resistance, character, molding, test, heavy tin and final inspection are lost, may be implemented to improve bore process, simplify machining, severization
Electroplating work procedure, reduces the Kong Wutong quantity of the heavy copper of PIH/, replaces simple chemical cleaning procedure with superfine air bubble cleaning process,
So that the flatness of copper face is unaffected, green oil and copper foil adhesive force is not more preferably, easy to foaming when silk-screen.
Further, the production raw material of the complex media plate includes polytetrafluoro resinoid, glass cloth and ceramic powder, and is made pottery
ROGERS material is filled in porcelain powder, the upper layer top plate includes aluminium flake and intermediate plate, and the intermediate plate is connected to aluminium flake and compound
Between dielectric-slab, polytetrafluoro resinoid, glass cloth and ceramic powder etc. are reinforcing material, and the thickness range of material is big, intensity and
Firmness change is big.
Further, the intermediate plate is cold punching plate, the FR4 tabula rasa of 0.2-0.6mm and the yellow cover plate of 0.2mm of 0.5mm
One of, lower layer's bottom plate is the white high-density plate and paper base plate+total 2.0mm-2.5mm of Huang cover plate of 2.0mm-2.5mm
One of, so that machining is simplified, while improving the performance of high-frequency high-speed substrate.
Further, being drilled with fastly for the drilling determines raising height value for >=6mm, pierces the depth setting of high-frequency high-speed plate
For 0.6-0.8mm, guarantee hole it is thick≤40um, burr≤40um guarantees the standardization of drilling, reduces inferior rate.
Further, it needs to carry out polishing scratch confirmation before the heavy copper, and polishing scratch is 8-12mm, it need to be on lamp stand after the heavy copper
With the heavy copper effect of nine hole spectroscopies, heavy copper can not carry out backlight confirmation, can guarantee confirmation with nine hole spectroscopies on lamp stand.
Further, the heavy tin includes pre-treatment, and the pre-treatment includes chemically cleaning process, the chemically cleaning work
Utensil used in sequence includes ultrasonic cleaner, more thorough using ultrasonic cleaner cleaning, more efficient.
Further, utensil used in the chemically cleaning process further includes device for generating super-fine air bubble, and ultramicro air bubble occurs
Device and ultrasonic cleaner are acted on simultaneously in the chemical cleaning solution for being put into high-frequency high-speed boards half-finished product to be processed, ultramicro air bubble
The superfine air bubble diameter that generator generates only has 10 μm, and consistency is big, and a large amount of bubbles dissolve rupture in water, when moment ruptures
About 400 kilometers of ultrasonic wave per hour is generated, so that cleaning is more thorough, and copper face will not be damaged.
Further, mechanical polish-brush can also be used in the pre-treatment, and polishing scratch control is within 0.6-1.0mm.
Further, buck is carried out after the heavy tin to wash, and buck is washed equally using ultrasonic cleaner and ultramicro air bubble
Generator collective effect guarantees to neutralize intensity until cleaning solution pH value is 6.9-7.1.
Further, the heavy tin uses PSR-4000SN10 ink, and such ink quality is good, and stability is high, adhesive force
Preferably.
3. beneficial effect
Compared with the prior art, the present invention has the advantages that
(1) this programme may be implemented to improve bore process, simplify machining, and it is heavy to reduce PIH/ for severization electroplating work procedure
The Kong Wutong quantity of copper replaces simple chemical cleaning procedure with superfine air bubble cleaning process, so that the flatness of copper face is not
Impacted, green oil and copper foil adhesive force is not more preferably, easy to foaming when silk-screen.
(2) the production raw material of complex media plate includes polytetrafluoro resinoid, glass cloth and ceramic powder, and is filled in ceramic powder
ROGERS material, the upper layer top plate include aluminium flake and intermediate plate, and the intermediate plate is connected between aluminium flake and complex media plate,
Polytetrafluoro resinoid, glass cloth and ceramic powder etc. are reinforcing material, and the thickness range of material is big, and intensity and firmness change are big.
(3) intermediate plate is one of the cold punching plate of 0.5mm, the FR4 tabula rasa of 0.2-0.6mm and yellow cover plate of 0.2mm, institute
One of white high-density plate and the paper base plate+total 2.0mm-2.5mm of Huang cover plate that lower layer's bottom plate is 2.0mm-2.5mm are stated, is made
It must be machined simplification, while improving the performance of high-frequency high-speed substrate.
(4) being drilled with fastly for drilling determines raising height value for >=6mm, and the depth for piercing high-frequency high-speed plate is set as 0.6-
0.8mm, guarantee hole it is thick≤40um, burr≤40um guarantees the standardization of drilling, reduces inferior rate.
(5) it needs to carry out polishing scratch confirmation before heavy copper, and polishing scratch is 8-12mm, it need to be on lamp stand with nine Kong Jingjian after the heavy copper
Heavy copper effect is looked into, heavy copper can not carry out backlight confirmation, can guarantee confirmation with nine hole spectroscopies on lamp stand.
(6) tin that sinks includes pre-treatment, and the pre-treatment includes chemically cleaning process, utensil used in the chemically cleaning process
It is more thorough using ultrasonic cleaner cleaning including ultrasonic cleaner, it is more efficient.
(7) utensil used in chemically cleaning process further includes device for generating super-fine air bubble, and device for generating super-fine air bubble and ultrasonic wave
Washer acts in the chemical cleaning solution for being put into high-frequency high-speed boards half-finished product to be processed simultaneously, and device for generating super-fine air bubble generates
Superfine air bubble diameter there was only 10 μm, consistency is big, and a large amount of bubbles dissolve rupture in water, generated when moment ruptures every about
The ultrasonic wave of 400 kilometers of hour so that cleaning is more thorough, and will not damage copper face.
(8) it carries out buck after heavy tin to wash, and buck is washed and equally uses ultrasonic cleaner and device for generating super-fine air bubble common
Effect guarantees to neutralize intensity until cleaning solution pH value is 6.9-7.1.
(9) tin that sinks uses PSR-4000SN10 ink, and such ink quality is good, and stability is high, and adhesive force is preferable.
Detailed description of the invention
Fig. 1 is part fabrication processing figure of the invention；
Fig. 2 is the first drilling iterative structure schematic diagram of the invention；
Fig. 3 is the second drilling iterative structure schematic diagram of the invention.
Figure label explanation:
BB1 aluminium flake, BB2 intermediate plate, BB3 complex media plate, BB4 lower layer bottom plate, BB44 lower layer bottom plate.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description；Obviously, described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments, is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the instruction such as term " on ", "lower", "inner", "outside", " top/bottom end "
Orientation or positional relationship be based on the orientation or positional relationship shown in the drawings, be merely for convenience of description the present invention and simplification retouch
It states, rather than the device or element of indication or suggestion meaning must have a particular orientation, be constructed and operated in a specific orientation,
Therefore it is not considered as limiting the invention.In addition, term " first ", " second " are used for description purposes only, and cannot understand
For indication or suggestion relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation " " is set
Be equipped with ", " be arranged/connect ", " connection " etc., shall be understood in a broad sense, such as " connection ", may be a fixed connection, be also possible to removable
Connection is unloaded, or is integrally connected；It can be mechanical connection, be also possible to be electrically connected；It can be directly connected, it can also be in
Between medium be indirectly connected, can be the connection inside two elements.It for the ordinary skill in the art, can be specific
Situation understands the concrete meaning of above-mentioned term in the present invention.
Embodiment 1
Referring to Fig. 1, a kind of manufacture craft of high-frequency high-speed plate, the high-frequency high-speed plate include high-frequency high-speed substrate, high frequency
High speed substrate includes complex media plate BB3, upper layer top plate and lower layer bottom plate BB4, complex media plate BB3 be connected to upper layer top plate and
Between lower layer bottom plate BB4, production technology includes: sawing sheet, drilling, hole processing, heavy copper, plate electricity, pattern transfer, inspection, figure
Plating, alkali etching, erosion inspection, welding resistance, character, molding, test, heavy tin and final inspection, may be implemented to improve bore process, simplify machine
Tool processing, severization electroplating work procedure reduce the Kong Wutong quantity of the heavy copper of PIH/, are replaced with superfine air bubble cleaning process simple
Chemical cleaning procedure, so that the flatness of copper face is unaffected, green oil and copper foil adhesive force is not more preferably, easy to foaming when silk-screen.
The production raw material of complex media plate BB3 includes polytetrafluoro resinoid, glass cloth and ceramic powder, and is filled in ceramic powder
ROGERS material, using Huawei's thickness copper products drilling parameter, cutting speed reduces by 20% production, within non-edge PTH hole bores nozzle using mill 3
Nozzle is bored, hole limit presses the brill nozzle life control of system board, and high frequency mixed pressure product uses high frequency product drilling parameter, and high frequency when drilling
Material is face-up, and whitened area is produced apart from orifice edge≤2.5mm, the necessary special messenger's special plane operation of high frequency product around aperture,
Upper layer top plate includes aluminium flake BB1 and intermediate plate BB2, and intermediate plate BB2 is connected between aluminium flake BB1 and complex media plate BB3, and poly- four
Fluorine resin, glass cloth and ceramic powder etc. are reinforcing material, and the thickness range of material is big, and intensity and firmness change are big.
Heavy copper requirement in this programme are as follows: nog plate first confirms polishing scratch 8-12mm before A, heavy copper；B, copper is sunk because that can not be carried on the back
Light confirmation, with using the heavy copper effect of nine hole spectroscopies on lamp stand；C, the sand paper processing that plate face is coarse, copper particle must use 2000#.
Pattern transfer requirement in this programme are as follows: polishing scratch 8-12mm is first confirmed before A, nog plate；B, line width line gap ensures
In the compensation claimed range of " MI ", the line width after development, which is generally differed with film line width, is no more than ± 0.01mm；C, it is inserted after development
Aerial lattice insert rack, which is not filled, to be permitted to stick with frame, is prevented from wiping and be spent.
Graphic plating requirement in this programme are as follows: the problems such as bad, plate face is coarse, pin hole, finger-marks is pressed from both sides in A, control；B, hole copper
The minimum 18um of thickness, average 20um.
Alkali etching requirement in this programme are as follows: A, line width are ± 10%；B, the plate after etching does not allow naked hand to touch plate
Interior substrate prevents contaminated substrate face from ringing the adhesive force of green oil.
The improvement of drilling is: referring to Fig. 2, scheme one, using Taconic company TLX-8 series, RF30 material,
Non- edge PTH hole bores nozzle and presses the brill nozzle life control of system board using nozzle, hole limit is bored within mill 4；It drills iterative structure from top to bottom
Successively are as follows: during one of yellow cover plate of the cold punching plate of aluminium flake BB1,0.5mm, the FR4 tabula rasa of 0.2-0.6mm and 0.2mm is used as
Between plate BB2, the white high-density plate of complex media plate BB3,2.0mm-2.5mm are as lower layer bottom plate BB4；It is same referring to Fig. 2,
Scheme two, using ARLON company AD300 series, AD255 series, CTLE series material, non-edge PTH hole bores nozzle using boring within mill 4
Nozzle, hole limit press the brill nozzle life control of system board；It drills iterative structure from top to bottom successively are as follows: aluminium flake BB1's, 0.5mm is cold
One of yellow cover plate of punching, the FR4 tabula rasa of 0.2-0.6mm and 0.2mm is used as intermediate plate BB2, complex media plate BB3,
2.0mm-2.5mm white high-density plate as lower layer bottom plate BB4；Referring to Fig. 3, scheme three, using TACONIC company's T LY
The domestic PTFE material such as serial, prosperous spirit F4B/F4BM series and China and Britain's science and technology, edge PTH hole are bored nozzle and are pressed using nozzle, hole limit is bored within mill 5
The brill nozzle life control of system board；It drills iterative structure from top to bottom successively are as follows: cold punching plate, the 0.2- of aluminium flake BB1,0.5mm
One of FR4 tabula rasa and the yellow cover plate of 0.2mm of 0.6mm are used as intermediate plate BB2, complex media plate BB3,2.0mm-2.5mm
White high-density plate and one of paper base plate+total 2.0mm-2.5mm of Huang cover plate be used as lower layer's bottom plate BB44；Above structure makes
It must be machined simplification, while improving the performance of high-frequency high-speed substrate；It must notification technique when 0.40mm or less borehole
Department provides parameter and can just produce；For 0.40 or more edge PTH hole, is made of counterboring mode and (first bore aperture with old brill nozzle, then use
It is new to bore nozzle normal drill), the small 0.6-0.8mm of brill nozzle that a drilling is bored than two carries out preboring；It is bored when drilling on nozzle and is easy to produce fibre
Silk is tieed up, and borehole wall quality is impacted, a time plate of every brill must be cleared up in time, and not allowing to bore on nozzle has wrapping；Drilling
Be drilled with that determine raising height value be >=6mm fastly, the depth for piercing high-frequency high-speed plate is set as 0.6-0.8mm, guarantee hole it is thick≤40um,
Burr≤40um, is subject to the requirement for not influencing finished product hole tolerance；After drilling around aperture whitened area apart from orifice edge
≤ 2.5mm guarantees the standardization of drilling, reduces inferior rate.
Heavy tin includes pre-treatment, and pre-treatment includes chemically cleaning process, and utensil used in chemically cleaning process includes ultrasonic wave
Washer, it is more thorough using ultrasonic cleaner cleaning, it is more efficient, after pre-treatment, in the not tangible shaping area of hand.
Utensil used in chemically cleaning process further includes device for generating super-fine air bubble, and device for generating super-fine air bubble and ultrasonic cleaning
Device acts in the chemical cleaning solution for being put into high-frequency high-speed boards half-finished product to be processed simultaneously, and device for generating super-fine air bubble generates super
Micro air bubble diameter only has 10 μm, and consistency is big, and a large amount of bubbles dissolve rupture in water, generates about per hour when moment ruptures
400 kilometers of ultrasonic wave so that cleaning is more thorough, and will not damage copper face.
Mechanical polish-brush can also be used in pre-treatment, and polishing scratch control is within 0.6-1.0mm.
It carries out buck after heavy tin to wash, and buck is washed and equally made jointly using ultrasonic cleaner and device for generating super-fine air bubble
With until cleaning solution pH value is 6.9-7.1, guarantee neutralizes intensity.
Heavy tin uses PSR-4000SN10 ink, and such ink quality is good, and stability is high, and adhesive force is preferable, quiet after printing
Pre-baked again after setting 30 minutes, anti-welding printing is primary using 36T printing, and line top and substrate ink thickness control 10-40um, line angle position
Resist thickness >=5um.
The manufacture craft of the high-frequency high-speed plate further includes exposure process, and the exposure process requirement in this programme are as follows: A. exposes
When light contraposition is completed, require to have to inclined problem with 10 times of lens examination its Aligning degrees per a piece of；B. exposure energy ratio
Common ink wants high, and control avoids energy is low heavy tin is caused to fall oil in 11-13 lattice epiphragma.
Solidifying requirements after green oil in this programme are as follows: all high-frequency high-speed plates are baked after must being segmented: first segment: 80 DEG C 30 points
Clock；Second segment: 110 DEG C 30 minutes；Third section: 150 DEG C 45 minutes.
The foregoing is intended to be a preferred embodiment of the present invention；But scope of protection of the present invention is not limited thereto.
Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
It improves design and is subject to equivalent substitution or change, should be covered by the scope of protection of the present invention.
Claims (10)
1. a kind of manufacture craft of high-frequency high-speed plate, it is characterised in that: the high-frequency high-speed plate includes high-frequency high-speed substrate, the height
Frequency high speed substrate includes complex media plate BB3, upper layer top plate and lower layer bottom plate BB4, and the complex media plate BB3 is connected to upper layer
Between top plate and lower layer bottom plate BB4, production technology includes: sawing sheet, drilling, hole processing, heavy copper, plate electricity, pattern transfer, inspection
It looks into, graphic plating, alkali etching, lose inspection, welding resistance, character, molding, test, heavy tin and final inspection.
2. a kind of manufacture craft of high-frequency high-speed plate according to claim 1, it is characterised in that: the complex media plate
The production raw material of BB3 includes polytetrafluoro resinoid, glass cloth and ceramic powder, and ROGERS material is filled in ceramic powder, it is described on
Layer top plate includes aluminium flake BB1 and intermediate plate BB2, and the intermediate plate BB2 is connected between aluminium flake BB1 and complex media plate BB3.
3. a kind of manufacture craft that high-frequency high-speed plate is high according to claim 1 or 2, it is characterised in that: the intermediate plate
BB2 is one of the cold punching plate of 0.5mm, the FR4 tabula rasa of 0.2-0.6mm and yellow cover plate of 0.2mm, lower layer's bottom plate BB4
For one of white high-density plate and paper base plate+total 2.0mm-2.5mm of Huang cover plate of 2.0mm-2.5mm.
4. a kind of manufacture craft of high-frequency high-speed plate according to claim 1, it is characterised in that: the drilling is drilled with fastly
Determining raising height value is >=6mm, and the depth for piercing high-frequency high-speed plate is set as 0.6-0.8mm, guarantee hole it is thick≤40um, burr≤
40um。
5. a kind of manufacture craft of high-frequency high-speed plate according to claim 1, it is characterised in that: need to carry out before the heavy copper
Polishing scratch confirmation, and polishing scratch is 8-12mm, it need to be on lamp stand with the heavy copper effect of nine hole spectroscopies after the heavy copper.
6. a kind of manufacture craft of high-frequency high-speed plate according to claim 1, it is characterised in that: the heavy tin includes preceding place
Reason, the pre-treatment includes chemically cleaning process, and utensil used in the chemically cleaning process includes ultrasonic cleaner.
7. a kind of manufacture craft of high-frequency high-speed plate according to claim 6, it is characterised in that: the chemically cleaning process
Utensil used further includes device for generating super-fine air bubble, and device for generating super-fine air bubble is acted on simultaneously with ultrasonic cleaner and is put into wait locate
In the chemical cleaning solution of the high-frequency high-speed boards half-finished product of reason.
8. a kind of manufacture craft of high-frequency high-speed plate according to claim 6, it is characterised in that: the pre-treatment can also adopt
With mechanical polish-brush, and polishing scratch control is within 0.6-1.0mm.
9. a kind of manufacture craft of high-frequency high-speed plate according to claim 1, it is characterised in that: carry out alkali after the heavy tin
Washing, and buck is washed equally using ultrasonic cleaner and device for generating super-fine air bubble collective effect, until cleaning solution pH value is 6.9-
7.1。
10. according to claim 1 or a kind of manufacture craft of high-frequency high-speed plate described in 9, it is characterised in that: the heavy tin uses
PSR-4000SN10 ink.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811330513.3A CN109413857B (en) | 2018-11-09 | 2018-11-09 | Manufacturing process of high-frequency high-speed plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811330513.3A CN109413857B (en) | 2018-11-09 | 2018-11-09 | Manufacturing process of high-frequency high-speed plate |
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| CN109413857A true CN109413857A (en) | 2019-03-01 |
| CN109413857B CN109413857B (en) | 2021-07-06 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113225939A (en) * | 2021-04-16 | 2021-08-06 | 深圳正峰印刷有限公司 | Flexible circuit preparation method and flexible circuit |
Citations (7)
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| CN113225939B (en) * | 2021-04-16 | 2022-11-11 | 深圳正峰印刷有限公司 | Flexible circuit preparation method and flexible circuit |
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| CN109413857B (en) | 2021-07-06 |
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