TW548310B - High frequency electrical substrate with low dielectric constant - Google Patents
High frequency electrical substrate with low dielectric constant Download PDFInfo
- Publication number
- TW548310B TW548310B TW90107152A TW90107152A TW548310B TW 548310 B TW548310 B TW 548310B TW 90107152 A TW90107152 A TW 90107152A TW 90107152 A TW90107152 A TW 90107152A TW 548310 B TW548310 B TW 548310B
- Authority
- TW
- Taiwan
- Prior art keywords
- dielectric constant
- low dielectric
- frequency circuit
- patent application
- circuit substrate
- Prior art date
Links
Landscapes
- Inorganic Insulating Materials (AREA)
Abstract
Description
548310 案號 901071 五、發明說明(1) 【發明之應用領域】 本發明係關於一種高頻電路基板(electrical substrate ),特別是關於一種具有低介電常數之高頻電 路基板。 【發明背景】 、目前已被使用於做為電路基板(例如,印刷電路基板 或晶片構裝基板)的材料種類很多。以樹脂類電路基板材 料來5兒,即包括有盼駿樹脂(e n 〇 1丨C )、環氧樹脂 (epoxy)、聚亞醯胺樹脂(p〇lyimide)、聚四氟乙烯 (polytetrafluoroethylene ;PTFE)以及 B-三氮井樹脂 (Bismaleimide Triazine ;BT)等之熱固性樹脂 (Th^m^etted Plastic Resin)。在目前印刷電路板業 中以環氧樹脂為基材(matrix )所製作之電路基板用途最 為普遍。此種環氧樹脂為一種含溴之樹脂一般被稱為 FR 4树J!曰。由於FR — 4樹脂與銅箔的附著性很強,一4 樹脂與玻璃纖維強化填充物(r e i n f 0 r c i n g f丨1 1 e r )相結 合所得之複合材料板具有撓性、價格便宜、反應簡單以及 加工性良好的優點’因而被廣泛使用做為電路基板。但因 FR-4樹脂介電常數高(Dk值約為4· 5 ),對電訊傳遞的干 擾較大,故多使用於頻率在2GHz以下之電子裝置之電路基 板。而使用於衛星接收放器,無線通訊,高頻微波 (microwave )通訊,雷達設備以及其它精密度要求很高 的設備之高頻基板材料概略可分為BT樹脂,PP〇樹脂以及 PTFE樹脂三大系列。其中BT樹脂,PPo樹脂多用於^率在548310 Case number 901071 V. Description of the invention (1) [Application field of the invention] The present invention relates to a high-frequency circuit substrate, and particularly to a high-frequency circuit substrate having a low dielectric constant. [Background of the Invention] There are many types of materials that have been used as circuit substrates (for example, printed circuit substrates or wafer mounting substrates). Resin-based circuit board materials are used for 5 children, which include Pan-Resin (en 〇1 丨 C), epoxy resin (epoxy), polyimide resin (polyimide), polytetrafluoroethylene (polytetrafluoroethylene; PTFE) ), And B-triazine resin (Bismaleimide Triazine; BT) and other thermosetting resins (Th ^ m ^ etted Plastic Resin). In the current printed circuit board industry, the use of circuit substrates made of epoxy resin as the matrix (matrix) is the most common. This epoxy resin is a bromine-containing resin commonly known as FR 4 tree J !. Due to the strong adhesion between FR-4 resin and copper foil, the composite material board obtained by combining 4 resin with glass fiber reinforced filler (reinf 0 rcingf 丨 1 1 er) has flexibility, cheap price, simple response and processing. The advantage of good performance is therefore widely used as a circuit board. However, because FR-4 resin has a high dielectric constant (Dk value is about 4 · 5) and has a large interference with telecommunication transmission, it is mostly used for circuit boards of electronic devices with a frequency below 2GHz. The high-frequency substrate materials used in satellite receivers, wireless communications, high-frequency microwave communications, radar equipment, and other equipment with high precision requirements can be roughly divided into BT resin, PP0 resin, and PTFE resin. series. Among them, BT resin and PPo resin are mostly used in
548310 ----案號9010715IP_年月日 倐正_ 五、發明說明(2) 2〜12 GHz之電路基板,而ptfe樹脂則大部分使用於1〇 GHz 以上之電路基板。然而以PTFE樹脂做為高頻電路基板之基 材有著下列缺點··( 1 )Tg太低(約1 9 °C ),材質太軟,抗 刮性差且鑽孔性不良。(2 )加工溫度太高(7 〇 〇 τ ),加 工麼力太高(約丨6 〇 〇 ps i )以及成形時間過長(約6小時 )° (3)化學惰性高,在鍍通孔(piate(i Thr0Ugh Hole ; PTH )製程中,孔壁較難進行活化。(4 )價格昂貴(約為 FR-4的1〇倍)。為了改進上述缺點,其中一種做法乃是以 PTFE樹脂為基材而在其中均勻散佈補強填充物 (reinforcing filler )而形成一複合材料。該補強填充 物可為陶莞材料,如Si〇2 (美國專利5024871、5〇61548 )’或尚分子材料,如PEEK (美國專利5922453 );然而 在PTFE樹脂中加入上述補強填充物雖然可獲得剛性較高的 基板複合材料,但常因補強填充物之高介電常數而使基板 之介電性質變差。另一種改進的方式則是在pTFE樹脂中加 入多孔性纖維或中空纖維強化材(如歐洲專利 0 1 6041 8A2,美國專利4849284、5 1 94326 ),該方式雖然 可使所彳于到的複合材料板同時兼具高剛性與低介電常數, 然而卻會使得在進行電路基板的鍍通孔製程時產生不願見 到的毛細現象,即銅由孔壁之滲入基板内。 因此,仍有需要提供一種新的適用於高頻電路基板的 複合材料板,以解決上述問題。 【發明之目的及概述】 有鑑於此’本發的目的在提供一種兼具高剛性、低介548310 ---- Case No. 9010715IP_Year Month Date 日 正 _ V. Description of the invention (2) Circuit board of 2 ~ 12 GHz, and most of ptfe resin is used for circuit board above 10 GHz. However, the use of PTFE resin as the base material for high-frequency circuit boards has the following disadvantages: (1) Tg is too low (about 19 ° C), the material is too soft, the scratch resistance is poor, and the drillability is poor. (2) The processing temperature is too high (700 τ), the processing force is too high (about 丨 600 ps), and the forming time is too long (about 6 hours). (3) The chemical inertness is high, and the plated through hole is high. (Piate (i Thr0Ugh Hole; PTH)), the hole wall is difficult to activate. (4) expensive (about 10 times FR-4). In order to improve the above disadvantages, one of the methods is to use PTFE resin as The base material is uniformly dispersed with a reinforcing filler (reinforcing filler) to form a composite material. The reinforcing filler may be a ceramic material, such as Si02 (US Patent 5028871, 5086548) or a molecular material such as PEEK (U.S. Patent No. 5,922,453); However, although the above-mentioned reinforcing filler is added to the PTFE resin to obtain a rigid substrate composite material, the dielectric properties of the substrate are often deteriorated due to the high dielectric constant of the reinforcing filler. An improved method is to add porous fibers or hollow fiber reinforcements to the pTFE resin (such as European patent 0 1 6041 8A2, US patents 4849284, 5 1 94326), although this method can make the composite material board High rigidity Low dielectric constant, however, will cause unwanted capillary phenomena during the process of plating through-holes of circuit substrates, that is, copper penetrates into the substrate from the hole wall. Therefore, there is still a need to provide a new suitable for high High-frequency circuit substrate composite material board to solve the above problems. [Objective and Summary of the Invention] In view of this, the purpose of the present invention is to provide a high rigidity, low dielectric
548310 __案號9010715d>_年月日 倏,τ_ 五、發明說明(3) 電常數,且不會有鍍通孔滲銅現象的高頻電路基板。 本發明所提出的一種高頻電路基板,乃是將高分子讨 料-聚四鼠乙細(以下簡稱PTFE)以及氣化乙晞—丙稀聚合 物(fluorinated ethylene-propylene ;以下簡稱FEP) 均勻混合以做為该複合材料板之基材(in a t r i X ),並在該 咼分子基材中加入陶兗顆粒填充物(ceramic particle f i 1 ler ),如二氧化矽(si 1 ica ),做為補強材料 (reinforcement),其中該陶瓷顆粒填充物佔該複合材 料板總重的55wt%〜85wt%,而該FEP則約佔該複合材料板 總重的0 · 5 w t %〜1 0 w t %。 由於FEP與PTFE均為氟系之高子材料,因此FEp與pTFE 可均勻混合形成單一相(one Phase )。於PTFE中添加熱 ,性FEP,可提高此基材的剛性,及改善對電路板線路附 著力不足得問題,且FEP之低介電常數亦使得所獲得的複 合材料板能保有較低的整體介電常數。 為使對本發明的特徵與優點有更清楚的暸解,接下 將配合圖示加以詳細說明。但必須先說明的是,本發明險 了下述之實施例外,仍然可以有其它的實施例,且以下: 圖示並不一定完全依實際比例繪製。 【實施例詳細說明】 根據本發明實施例所揭露的高頻電路基板,其微、社 :參考「第1圖」所示之電子顯微鏡(SEM)相片圖。^ α材料基材乃是由氟系高分子材料pTFE以及FEp依適者 ^之陶-亮顆粒填充t例如為佔高頻電路基板總重田 I _________________________548310 __Case No. 9010715d > _ Month and Day 倏, τ_ V. Description of the invention (3) High-frequency circuit board with constant electric capacity and no copper plating through-hole phenomenon. A high-frequency circuit substrate proposed by the present invention is to uniformly disperse polymer-polytetramethylene acetate (hereinafter referred to as PTFE) and fluorinated ethylene-propylene (hereinafter referred to as FEP) uniformly. Mix as the base material (in atri X) of the composite material board, and add ceramic particle filler (ceric particle fi 1 ler), such as silicon dioxide (si 1 ica), to the molecular base material. Is a reinforcement material, wherein the ceramic particle filler accounts for 55wt% ~ 85wt% of the total weight of the composite material plate, and the FEP accounts for approximately 0.5 wt% ~ 1 0 wt% of the total weight of the composite material plate . Since FEP and PTFE are fluorine-based high-son materials, FEp and pTFE can be uniformly mixed to form a single phase. The addition of heat and sexual FEP to PTFE can improve the rigidity of this substrate and improve the problem of insufficient adhesion to circuit boards. The low dielectric constant of FEP also allows the obtained composite material board to maintain a lower overall. Dielectric constant. In order to have a clearer understanding of the features and advantages of the present invention, it will be described in detail with reference to the drawings. But it must be explained first that the present invention is protected from the following implementation exceptions, there are still other embodiments, and the following: The diagrams are not necessarily drawn in full scale. [Detailed description of the embodiment] According to the high-frequency circuit substrate disclosed in the embodiment of the present invention, the micrograph and the company refer to the electron microscope (SEM) photo diagram shown in "Fig. 1". ^ Alpha material substrate is based on the fluorine-based polymer materials pTFE and FEp. ^ The pottery-bright particles are filled t. For example, it accounts for the total weight of high-frequency circuit substrates. I _________________________
第8頁 :均句混合所形成之單一相基材。在該基材内則填, 五、發明說明(4) 55wt%〜85wt%之氧化矽顆粒填充材,加 之目的,一方面用以強化複合材料板,一瓷顆粒填充材 合材料板之熱膨脹係數;由於陶瓷顆粒:^則可控制複 (约為6 )比PTFE之介電常數(約為2)材之介電常數 制陶瓷顆粒填充材的比例,以避免多,故需控 之整體介電常數過高。 X传之面頻電路基板 該高頻電路基板之作法是將氧化 PTFE粉末之乳液以及含有FEp粉末之乳液真^二有 例調配並加以攪拌均勻混合;適量 无汁^之比 八匕:適之油類或醇類,亦可同時加入並加以 , ,覆f偶:训,該偶合劑可為矽氧烷系偶合劑,如ζ —“Μ 苯基三甲氧基矽烷(Phenyltrimeth〇xy SUane),或鍅 系偶合劑,如NZ12, neopentyl(dially)〇xy,tri(di〇ctyl)ph〇sphate zirconate,或鈦系偶合劑,如Ucal2, neopentyl(dially)〇Xy5 tri(diocty1)phosphate titanate ’或者氟系矽氧烷偶合劑;上述偶合劑之作用係 用以增進該複合材料板中氧化矽顆粒與基材之間的結合 力。 然後將上述陶瓷顆粒、PTFE粉末、fep粉末以及助塑 劑之混合物’以加壓方式成型為適當之形狀,例如平板形 狀’然後對該成型混合物進行烘烤,使其内含之助塑劑揮 548310 案號 9010715»,/ 五、發明說明(5) ' -----^--- 發掉;接著再以約3 6 0 °c之、、w择、佳—话^Page 8: Single-phase substrate formed by homogeneous mixing. Fill in the base material. V. Description of the invention (4) 55wt% ~ 85wt% silicon oxide particle filling material. In addition, the purpose is to strengthen the thermal expansion coefficient of the composite material plate and a porcelain particle filling material composite material plate. ; As the ceramic particles: ^ can control the ratio of complex (about 6) than PTFE dielectric constant (approximately 2) made of ceramic particle filler material to avoid more, so the overall dielectric needs to be controlled The constant is too high. X-frequency surface-frequency circuit substrate The method of this high-frequency circuit substrate is to mix the emulsion of oxidized PTFE powder and the emulsion containing FEP powder, and mix them evenly; an appropriate amount is juice-free. Oils or alcohols can also be added and added at the same time, covering the coupling: training, the coupling agent can be a siloxane coupling agent, such as ζ-"M phenyltrimethoxysilane (Phenyltrimethoxine SUane), Or a coupling agent such as NZ12, neopentyl (dially) 〇xy, tri (di〇ctyl) ph〇sphate zirconate, or a titanium coupling agent such as Ucal2, neopentyl (dially) 〇Xy5 tri (diocty1) phosphate titanate 'or Fluorine-based siloxane coupling agent; the function of the coupling agent is to improve the binding force between the silicon oxide particles and the substrate in the composite material board. Then, the ceramic particles, PTFE powder, fep powder and plasticizer are added. The mixture is' pressurized into an appropriate shape, such as a flat plate shape ', and then the molding mixture is baked to make the plasticizer contained therein 548310 Case No. 9010715 », / V. Description of the invention (5)'- ---- ^ --- send off; then Then, with about 3 6 0 ° c, w choose, good-words ^
FFP八革侦卜卜樜私r U之/皿度進订燒結製程,使PTFE與 F E P刀子彼此擴政而形成ρ τ p F 相基材,而該氧化石夕顆 得-高頻電路基板。、线材中’如此即可獲 ^ :據,卷日月所製作之高頻電路基板與一已商品The FFP Ba leather reconnaissance process is customized for the sintering process, so that the PTFE and F E P knives expand each other to form a ρ τ p F phase substrate, and the oxide stone is obtained as a high-frequency circuit substrate. 、 In the wire ’, you can get ^: According to the high-frequency circuit board and a commodity
化之高頻電路基板比較 試片種類 蠡 古 表為根據本發明所製作之三種含不同比例FEP之 ^盥^路基板(分別表示為FEP 1 3%,FEP 3· 4%,FEP 5% # =市面上已商品化之一種高頻電路基板肋3〇〇31^之介電 吊以及剛性比較表。其中R〇3〇〇3R之組成含有43.9 wt% 5 v〇l%)的 PTFE 以及 56.1 wt% (55·5 vol%)之陶瓷 πιΓ填充物。而根據本發明的三種複合材料材FEP 1. 3%, 3 w。3· 4% ’ FEP 5% ’則是分別含有佔高頻電路基板總重L 栌Wt/° ’ 3· 4 wt%,5 wt%的FEP取代部分的PTFE。由表一可 ^知’添加FEP之高頻電路基板剛性顯著提升至1 876〜2613 a ’夕比目前商品化同等級的叩30 0驴(剛性1 267 MPa )高 甚夕。前述之剛性係以動態機械分析測試(DMA Test ) 在30.29。(:溫度下測得。此外,根據本發明之高頻電路基Comparison of the types of high-frequency circuit board comparison test pieces The ancient watch is made according to the present invention with three different ratios of FEP ^ circuit board (represented as FEP 1 3%, FEP 3.4%, FEP 5% # = A commercially available dielectric suspension and rigidity comparison table for a high-frequency circuit substrate rib 3003 ^ on the market. The composition of R03003R contains 43.9 wt% 5 vol% of PTFE and 56.1. wt% (55 · 5 vol%) ceramic πΓ filler. The three composite materials according to the present invention have a FEP of 1.3% and 3 w. 3.4% ′ FEP 5% ′ is PTFE containing FEP-replaced portions of L 栌 Wt / ° ′ 3.4 wt% and 5 wt% of the total weight of the high-frequency circuit board, respectively. From Table 1, it can be known that the rigidity of the high-frequency circuit substrate with FEP significantly increased to 1 876 ~ 2613 a ′, which is even higher than the current commercialized equivalent 驴 300 donkey (rigidity 1 267 MPa). The aforementioned rigidity is determined by dynamic mechanical analysis test (DMA Test) at 30.29. (: Measured at temperature. In addition, the high frequency circuit
第10頁 548310 __案號9010715黍>_年月日 絛π: 五、發明說明(6) 板的介電性質亦相當優良,整體介電常數僅為3. 〇卜3. 〇8 左右,低於R03 00 3R的3.16,因而可適用於高頻電路基 板0Page 10 548310 __Case No. 9010715 黍 &_; yyyyyyyyyyyyyyyyyyy: Five, description of the invention (6) The dielectric properties of the board are also quite good, the overall dielectric constant is only 3. 〇 卜 3. 〇8 or so , Lower than 3.16 of R03 00 3R, so it can be applied to high frequency circuit substrates
根據本發明之複合材料板同時具有高彎曲模數(f 1 6 X ^ Β 1 modulus),以上述FEP 1·3%高頻電路基板為例,其彎曲 模數可達272 X 1 03 psi ;相較於美國專利5922453中,在 R03003R添加10 v〇U (6 wt%)的pEEK強化顆粒取代pTFE 所得之高頻電路基板板(彎 發明僅添加1.3 wt%的FEP即 【達成之功效】 本發明係在以陶瓷顆粒The composite material plate according to the present invention also has a high bending modulus (f 1 6 X ^ Β 1 modulus). Taking the above-mentioned FEP 1.3% high frequency circuit substrate as an example, its bending modulus can reach 272 X 1 03 psi; Compared with US Patent No. 5,922,453, adding 10 v〇U (6 wt%) of pEEK reinforced particles to R03003R instead of pTFE is a high-frequency circuit substrate board (the bending invention only added 1.3 wt% of FEP to achieve the effect.) Ceramic particle
佔總重0.5wt% 〜l〇wt% FEP 具高剛性與低介電常數之優 或產生鑛通孔滲銅的問題。 以上所述者,僅為本發 非用來限定本發明的實施範 本發明之精神下當可做適當 申請專利範圍所作的均等變 圍所涵蓋。 曲模數218 X 103 psi ),本 可獲得較南的彎曲模數。 強化之PTFE複合材料板中加入 ’所獲得的複合材料板同時兼 點’且不會大幅增加製作成本 明其中的較佳實施例而已,並 圍’熟習該項技術者在不脫離 之修改與潤飾;故凡依本發明 化與修飾,皆為本發明專利範It accounts for 0.5wt% to 10wt% of the total weight. FEP has the advantages of high rigidity and low dielectric constant, or it may cause copper through-hole penetration problems. The above are only covered by the present invention and are not intended to limit the implementation model of the present invention. The spirit of the present invention should be covered by the equivalent scope of appropriate patent application. The modulus of curvature is 218 X 103 psi), which can be obtained in the south. The reinforced PTFE composite material plate is added with the “acquired composite material plate at the same time” and does not significantly increase the cost of production. The preferred embodiment is included in the description, and those familiar with the technology will be able to modify and retouch without departing from it. ; Therefore, any changes and modifications in accordance with the present invention are patent models of the present invention
第11頁 548310 案號 901071511 年月曰 曰 修正 圖式簡單說明 第1圖,為本發明之高頻電路基板之一電子顯微鏡(SEM ) 相片圖。 iBii 第12頁Page 11 548310 Case No. 901071511 Modification Brief Description of Drawings Figure 1 is an electron microscope (SEM) photograph of one of the high frequency circuit substrates of the present invention. iBii Page 12
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW90107152A TW548310B (en) | 2001-03-27 | 2001-03-27 | High frequency electrical substrate with low dielectric constant |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW90107152A TW548310B (en) | 2001-03-27 | 2001-03-27 | High frequency electrical substrate with low dielectric constant |
Publications (1)
Publication Number | Publication Date |
---|---|
TW548310B true TW548310B (en) | 2003-08-21 |
Family
ID=29997842
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW90107152A TW548310B (en) | 2001-03-27 | 2001-03-27 | High frequency electrical substrate with low dielectric constant |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW548310B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7727703B2 (en) | 2006-08-14 | 2010-06-01 | Industrial Technology Research Institute | Methods of fabricating an electronic device and an sililation polyvinyl phenol for a dielectric layer of an electronic device |
CN109413857A (en) * | 2018-11-09 | 2019-03-01 | 博罗康佳精密科技有限公司 | A kind of manufacture craft of high-frequency high-speed plate |
-
2001
- 2001-03-27 TW TW90107152A patent/TW548310B/en active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7727703B2 (en) | 2006-08-14 | 2010-06-01 | Industrial Technology Research Institute | Methods of fabricating an electronic device and an sililation polyvinyl phenol for a dielectric layer of an electronic device |
CN109413857A (en) * | 2018-11-09 | 2019-03-01 | 博罗康佳精密科技有限公司 | A kind of manufacture craft of high-frequency high-speed plate |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4568603A (en) | Fiber-reinforced syntactic foam composites prepared from polyglycidyl aromatic amine and polycarboxylic acid anhydride | |
US5354611A (en) | Dielectric composite | |
US4595623A (en) | Fiber-reinforced syntactic foam composites and method of forming same | |
KR101575944B1 (en) | Composite material, high-frequency circuit baseboard made therefrom and production method thereof | |
KR101797722B1 (en) | Flexible metal laminate and preparation method of the same | |
EP2886589A1 (en) | Soft metal laminate and method for manufacturing same | |
EP0443400A1 (en) | Dielectric composite | |
JP3173332B2 (en) | Manufacturing method of metal foil-clad laminate | |
JP3586793B2 (en) | Ceramic-filled fluoropolymer composite | |
JP2022183337A (en) | Composite material | |
KR20190030981A (en) | Composite material | |
JP2011512441A (en) | Thermosetting composition comprising silicone polyether, its manufacture and use | |
EP0181368B1 (en) | Fiber-reinforced syntactic foam composites and method of forming same | |
TW548310B (en) | High frequency electrical substrate with low dielectric constant | |
KR20190033875A (en) | Composite material | |
JP2006143973A (en) | Epoxy resin composition and prepreg, laminate and printed wiring board | |
JP2018087305A (en) | Sheet-like thermosetting resin composition, and resin sheet, module component, power device and coil component prepared therewith | |
US10421855B2 (en) | Fluorinated vinyl polymer resin composition, prepreg and laminate materials containing the same | |
JP2000158589A (en) | Manufacture of metal foil clad laminated sheet | |
JP6037275B2 (en) | Epoxy resin composition, prepreg, metal-clad laminate, printed wiring board | |
JP5323368B2 (en) | Low dielectric insulating material and manufacturing method thereof | |
TWI688603B (en) | Resin composition and insulation film and product using the same | |
JPH01222950A (en) | Laminated plate | |
CN106605271A (en) | Electrically conductive composition | |
JP2019196476A (en) | Printed circuit board and resin composition for ic package, and product using the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent |