JP5323368B2 - Low dielectric insulating material and manufacturing method thereof - Google Patents
Low dielectric insulating material and manufacturing method thereof Download PDFInfo
- Publication number
- JP5323368B2 JP5323368B2 JP2008061756A JP2008061756A JP5323368B2 JP 5323368 B2 JP5323368 B2 JP 5323368B2 JP 2008061756 A JP2008061756 A JP 2008061756A JP 2008061756 A JP2008061756 A JP 2008061756A JP 5323368 B2 JP5323368 B2 JP 5323368B2
- Authority
- JP
- Japan
- Prior art keywords
- low dielectric
- insulating material
- dielectric insulating
- resin
- solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Organic Insulating Materials (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Description
本発明は、回路基板及び多層回路基板用の絶縁材や、半導体検査機器用摺動材、絶縁部品などの電子部品用途に好適に用いることのできる、誘電率が２．９以下で、成形性、機械加工性に優れた低誘電性絶縁材およびその製造方法に関する。 The present invention has a dielectric constant of 2.9 or less and can be suitably used for electronic parts such as insulating materials for circuit boards and multilayer circuit boards, sliding materials for semiconductor inspection equipment, and insulating parts. The present invention relates to a low dielectric insulating material excellent in machinability and a method for producing the same.
電子製品において、信号の伝播速度を高速化するためには、誘電率の低い絶縁材が必要であり、より性能の高い絶縁材が要求されている。ところが、従来の熱硬化性樹脂では低誘電率を達成することは出来ない。そのため、誘電率の低い樹脂として、フッ素樹脂、ポリエチレン樹脂、ポリブタジエン樹脂などが使われているが、これらはドリル加工性や耐熱性、寸法安定性が劣り、回路基板用絶縁材や半導体検査機器用摺動材に用いることのできる絶縁材としては適当ではない。 In electronic products, in order to increase the signal propagation speed, an insulating material having a low dielectric constant is required, and an insulating material with higher performance is required. However, a conventional thermosetting resin cannot achieve a low dielectric constant. For this reason, fluororesins, polyethylene resins, polybutadiene resins, etc. are used as low dielectric constant resins, but these are inferior in drillability, heat resistance, and dimensional stability, and are used for circuit board insulation and semiconductor inspection equipment. It is not suitable as an insulating material that can be used for the sliding material.
従来、低誘電率を達成可能な絶縁材料として、エポキシ変性ポリブタジエンとエポキシ樹脂とカルボン酸無水物とラジカル重合開始剤を主成分とする熱硬化性樹脂ワニスに、プラズマ表面処理したフッ素系樹脂粉末を１０〜２００重量部添加し、更にエポキシ基含有シランカップリング剤を配合したペースト組成物が開示されている（特許文献１）。 Conventionally, as an insulating material that can achieve a low dielectric constant, a plasma resin-treated fluororesin powder is applied to a thermosetting resin varnish mainly composed of an epoxy-modified polybutadiene, an epoxy resin, a carboxylic acid anhydride, and a radical polymerization initiator. The paste composition which added 10-200 weight part and mix | blended the epoxy group containing silane coupling agent is disclosed (patent document 1).
上記ペースト組成物は、溶媒としてジメチルホルムアミドやメチルイソブチルケトン、メチルセロソルブ等の有機溶剤を必須成分とし、ロールコーター、バーコーター、スクリーン印刷などで塗布することを目的としている。すなわち、このペースト組成物は、回路基板及び多層回路基板中の接着剤層、厚さ調整層、オーバーレイ層などの絶縁層を形成するため等の限定的使用に適している。しかし、このペースト組成物は溶媒を含むため乾燥が必要であり、そのため、基材に加工された穴や隙間に充填されて使用され、緻密であり、ドリル加工性や摺動性などの機械的特性や耐熱性を必要とする半導体検査機器用摺動材に用いることのできる絶縁材としては不適である。 The paste composition has an organic solvent such as dimethylformamide, methyl isobutyl ketone, or methyl cellosolve as an essential component, and is intended to be applied by a roll coater, bar coater, screen printing, or the like. That is, this paste composition is suitable for limited use such as forming an insulating layer such as an adhesive layer, a thickness adjusting layer, and an overlay layer in circuit boards and multilayer circuit boards. However, since this paste composition contains a solvent, it needs to be dried. Therefore, the paste composition is used by being filled in holes and gaps processed in the base material, is dense, and has mechanical properties such as drillability and slidability. It is not suitable as an insulating material that can be used for a sliding material for semiconductor inspection equipment that requires characteristics and heat resistance.
低誘電性絶縁材が適用される半導体検査機器用摺動材は、特殊な形状を有しており、金属部材に加工された穴や隙間に充填されて使用されることが多い。したがって、その製造に当たっては、トランスファー成形、圧入成形、射出成形を用いることができれば、大変効率的な製造が可能となる。しかしながら、上記従来のペースト組成物は、かかる成形方法に適したものではない。 A sliding material for semiconductor inspection equipment to which a low dielectric insulating material is applied has a special shape and is often used by being filled in a hole or a gap formed in a metal member. Therefore, if transfer molding, press-fitting molding, or injection molding can be used for the production, very efficient production is possible. However, the conventional paste composition is not suitable for such a molding method.
このように、従来の低誘電性絶縁材は、基材に加工された穴や隙間に充填されて使用される、緻密、かつ機械加工性を必要とする半導体検査機器用摺動材には、不適であるし、また、そのための効率的な製造方法にも適したものでもない。 As described above, the conventional low dielectric insulating material is used by being filled in holes and gaps processed in the base material, and used for a sliding material for semiconductor inspection equipment that requires precise and machinability. It is not suitable, nor is it suitable for an efficient manufacturing method therefor.
本発明は、上記従来の事情に鑑みてなされたもので、その課題は、トランスファー成形、圧入成形、射出成形が可能な、誘電率が２．９以下で、金属との接着性、ドリル加工性、摺動性、耐熱性の良好な低誘電性絶縁材およびその製造方法を提供することにある。 The present invention has been made in view of the above-described conventional circumstances, and its problems are transfer molding, press-molding, and injection molding, having a dielectric constant of 2.9 or less, adhesion to metal, and drillability. Another object of the present invention is to provide a low dielectric insulating material having good sliding properties and heat resistance and a method for producing the same.
本発明にかかる低誘電性絶縁材は、前記課題を解決するために、熱硬化性樹脂成分２０〜５０体積％とフッ素系樹脂粉末８０〜５０体積％とからなる無溶剤樹脂混練物の熱硬化物であることを特徴とする。 In order to solve the above-mentioned problems, the low dielectric insulating material according to the present invention is a thermosetting of a solventless resin kneaded material comprising 20 to 50% by volume of a thermosetting resin component and 80 to 50% by volume of a fluororesin powder. It is a thing.
また、本発明にかかる低誘電性絶縁材の製造方法は、液状の熱硬化性樹脂成分２０〜５０体積％に対し、フッ素系樹脂粉末を８０〜５０体積％配合し、前記配合物を溶剤を用いずに真空条件下にて混練し気泡を含まない無溶剤樹脂混練物を調製する無溶剤樹脂混練物調製工程と、前記無溶剤樹脂混練物を熱硬化させて低誘電性絶縁材を得る熱硬化工程と、を有することを特徴とする。 Moreover, the manufacturing method of the low dielectric insulating material concerning this invention mix | blends 80-50 volume% of fluororesin powder with respect to 20-50 volume% of liquid thermosetting resin components, and uses the said compound as a solvent. A solvent-free resin kneaded material preparation step for preparing a solvent-free resin kneaded material containing no bubbles by kneading under vacuum conditions, and heat for curing the solvent-free resin kneaded material to obtain a low dielectric insulating material And a curing step.
本発明に用いられる樹脂混練物は、チクソ指数が高く、粘性流動可能であるので、トランスファー成形や圧入成形、射出成形により低誘電性絶縁材を製造することができる。
また、本発明に用いられる樹脂組成物は、無溶剤で混練されたものであるので、溶剤由来の気泡発生を防止することができる。
さらに、本発明の製造方法においては、チクソ指数が高く、粘性流動可能な樹脂混練物は、真空下にて調製されるので、製造後の低誘電体絶縁材の組織中に気泡を混入させることがない。
また、本発明の低誘電体絶縁材は、誘電率２．１程度という極めて誘電率が小さいフッ素系樹脂粉末が混練された樹脂混練物から得られたものであるために、２．９〜２．２という低い誘電率範囲に容易に調整される。
熱硬化性樹脂成分として、特に、ビスマレイミド−トリアジン樹脂を用いた場合、その誘電率を小さくすることができ、また、金属への接着性が向上され、機械加工性も優れたものとすることができる。
Since the resin kneaded material used in the present invention has a high thixotropy and is capable of viscous flow, a low dielectric insulating material can be produced by transfer molding, press-in molding, or injection molding.
Moreover, since the resin composition used for this invention is knead | mixed without a solvent, it can prevent the bubble generation derived from a solvent.
Furthermore, in the manufacturing method of the present invention, a resin kneaded material having a high thixotropy and capable of viscous flow is prepared under vacuum, so that bubbles are mixed into the structure of the low dielectric insulating material after manufacturing. There is no.
In addition, since the low dielectric insulating material of the present invention is obtained from a resin kneaded material obtained by kneading a fluorine resin powder having a dielectric constant of about 2.1 and having a very low dielectric constant, 2.9-2. Easily adjusted to a low dielectric constant range of.
In particular, when a bismaleimide-triazine resin is used as a thermosetting resin component, its dielectric constant can be reduced, adhesion to metal is improved, and machinability is excellent. Can do.
このように、本発明の低誘電性絶縁材は、誘電率を２．９〜２．２という低い範囲に調整でき、金属との接着性、機械加工性が優れるため、信号伝播速度の高速化に対応した半導体検査機器用摺動材などの機械強度を必要とする低誘電性部品材料として好適に使用できる。また、本発明の低誘電性絶縁材の製造方法は、かかる機械加工性に優れた低誘電性絶縁材を効率的に製造することができる。 As described above, the low dielectric insulating material of the present invention can adjust the dielectric constant to a low range of 2.9 to 2.2 and has excellent adhesion to metal and machinability, so that the signal propagation speed is increased. Can be suitably used as a low dielectric component material that requires mechanical strength, such as a sliding material for semiconductor inspection equipment. Further, the method for producing a low dielectric insulating material of the present invention can efficiently produce such a low dielectric insulating material excellent in machinability.
前述のように、本発明にかかる低誘電体絶縁材は、熱硬化性樹脂成分２０〜５０体積％とフッ素系樹脂粉末８０〜５０体積％とからなる無溶剤樹脂混練物の熱硬化物であることを特徴とする。また、本発明にかかる低誘電性絶縁材の製造方法は、液状の熱硬化性樹脂成分２０〜５０体積％に対し、フッ素系樹脂粉末を８０〜５０体積％配合し、前記配合物を溶剤を用いずに真空条件下にて混練し気泡を含まない無溶剤樹脂混練物を調製する無溶剤樹脂混練物調製工程と、前記無溶剤樹脂混練物を熱硬化させて低誘電性絶縁材を得る熱硬化工程と、を有することを特徴とする。
かかる構成を特徴とする本発明について、以下にさらに詳しく説明する。
As described above, the low dielectric insulating material according to the present invention is a thermosetting product of a solventless resin kneaded material composed of 20 to 50% by volume of a thermosetting resin component and 80 to 50% by volume of a fluororesin powder. It is characterized by that. Moreover, the manufacturing method of the low dielectric insulating material concerning this invention mix | blends 80-50 volume% of fluororesin powder with respect to 20-50 volume% of liquid thermosetting resin components, and uses the said compound as a solvent. A solvent-free resin kneaded material preparation step for preparing a solvent-free resin kneaded material containing no bubbles by kneading under vacuum conditions, and heat for curing the solvent-free resin kneaded material to obtain a low dielectric insulating material And a curing step.
The present invention having such a configuration will be described in more detail below.
（熱硬化性樹脂成分）
本発明に用いる熱硬化性樹脂成分は、低誘電率材料であるフッ素系樹脂粉末を溶剤を用いることなく混練するための母材であり、そのために、室温近傍の温度範囲で、液状ないし半固体であることが好ましい。ここで言う「室温近傍の温度範囲」とは、１０℃〜４０℃の範囲である。かかる温度範囲にて液状ないし半固体である熱硬化性樹脂としては、エポキシ樹脂、アクリル樹脂、シリコーン樹脂、ビスマレイミド−トリアジン樹脂、ウレタン樹脂などを挙げることができ、これらを用いることができる。これらの熱硬化性樹脂成分の内、ビスマレイミド−トリアジン樹脂（ＢＴ樹脂と略記される場合もある）が、誘電率が低く、金属に接着し易く、ドリル加工性が優れているため、最も好適に用いることができる。
(Thermosetting resin component)
The thermosetting resin component used in the present invention is a base material for kneading fluororesin powder, which is a low dielectric constant material, without using a solvent. For this reason, it is liquid or semisolid in a temperature range near room temperature. It is preferable that Here, the “temperature range near room temperature” is a range of 10 ° C. to 40 ° C. Examples of thermosetting resins that are liquid or semi-solid within such a temperature range include epoxy resins, acrylic resins, silicone resins, bismaleimide-triazine resins, and urethane resins, and these can be used. Among these thermosetting resin components, bismaleimide-triazine resin (sometimes abbreviated as BT resin) is most suitable because of its low dielectric constant, easy adhesion to metal, and excellent drillability. Can be used.
本発明に用いる熱硬化性樹脂成分として、ＢＴ樹脂を用いる場合は、単独成分で十分に硬化反応を生じ得るので、本発明の熱硬化性樹脂成分は、ＢＴ樹脂単独成分から構成される。これに対して、例えば、エポキシ樹脂を用いる場合では、単独成分にて硬化反応を生じさせることが難しいので、エポキシ樹脂に酸無水物および重合開始剤を加えたものを、本発明の熱硬化性樹脂成分として用いる。このように、本発明に用いる熱硬化性樹脂成分は、用いる樹脂の特性に従って、樹脂単独から構成される場合と、樹脂に重合開始剤などの他の成分を添加した樹脂組成物から構成される場合とがあるが、溶剤は全く含まない点が重要である。 When a BT resin is used as the thermosetting resin component used in the present invention, a single component can sufficiently cause a curing reaction. Therefore, the thermosetting resin component of the present invention is composed of a BT resin single component. On the other hand, for example, in the case of using an epoxy resin, it is difficult to cause a curing reaction by a single component, so that an epoxy resin added with an acid anhydride and a polymerization initiator is used as the thermosetting property of the present invention. Used as a resin component. Thus, the thermosetting resin component used in the present invention is composed of a resin alone and a resin composition in which other components such as a polymerization initiator are added to the resin according to the characteristics of the resin used. In some cases, it is important that no solvent is contained.
本発明に用いる熱硬化性樹脂成分の配合量は、この熱硬化性樹脂成分とフッ素系樹脂成分からなる樹脂混練物全量の２０体積％〜５０体積％である。 The compounding quantity of the thermosetting resin component used for this invention is 20 volume%-50 volume% of the resin kneaded material whole quantity which consists of this thermosetting resin component and a fluorine-type resin component.
（フッ素系樹脂粉末）
本発明に用いるフッ素系樹脂粉末としては、ポリテトラフルオロエチレン（ＰＴＦＥ）、テトラフロオロエチレン・ヘキサフルオロプロピレン共重合体（ＦＥＰ）、テトラフロオロエチレン・パーフルオロアルキルビニルエーテル共重合体（ＰＦＡ）の各粉末が好ましい。本発明においては、これらのフッ素系樹脂粉末から選択した一種または二種以上を組み合わせて使用することができる。
(Fluorine resin powder)
Examples of the fluororesin powder used in the present invention include polytetrafluoroethylene (PTFE), tetrafluoroethylene / hexafluoropropylene copolymer (FEP), and tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer (PFA). Each powder is preferred. In the present invention, one or a combination of two or more selected from these fluororesin powders can be used.
本発明に用いるフッ素系樹脂粉末の平均粒径としては、５０μｍ以下０．２μｍ以上が好ましい。粉末の粒径がこの範囲にあれば、上記熱硬化性樹脂成分に均一に混練することができ、かつ成形金型への加圧注入が可能な粘性流動を確保することができる。 The average particle size of the fluororesin powder used in the present invention is preferably 50 μm or less and 0.2 μm or more. If the particle size of the powder is within this range, it is possible to uniformly knead the above thermosetting resin component and secure a viscous flow that can be injected under pressure into a molding die.
本発明に用いるフッ素系樹脂粉末の配合量は、このフッ素系樹脂粉末と上記熱硬化性樹脂成分とからなる混練物全量の５０〜８０体積％である。５０体積％より少ないと誘電率が高くなるとともに、樹脂混練物に流動性が生じて適切な成形が得られにくくなる。また、８０体積％より多いと、フッ素系樹脂粉末を熱硬化性樹脂成分に混合させにくくなり、適度な粘性流動を得ることができなくなる。例え、成形が可能であっても、その熱硬化物は、強度が低下して磨耗性が悪くなるなど性能上の問題点が出てくる。 The compounding quantity of the fluororesin powder used for this invention is 50-80 volume% of the kneaded material whole quantity which consists of this fluororesin powder and the said thermosetting resin component. If it is less than 50% by volume, the dielectric constant becomes high, and fluidity occurs in the resin kneaded product, making it difficult to obtain appropriate molding. On the other hand, when the amount is more than 80% by volume, it becomes difficult to mix the fluororesin powder with the thermosetting resin component, and an appropriate viscous flow cannot be obtained. Even if molding is possible, the thermoset has performance problems such as reduced strength and poor wear.
前記熱硬化性樹脂成分２０体積％〜５０体積％に対して、前記フッ素系樹脂粉末を８０体積％〜５０体積％配合して混練すると、成形用金型への加圧注入に適した粘性流動を得ることができる。なお、このような好適な粘性流動を得るためには、前記配合比率であることが要求されるが、その前提として、配合に用いるフッ素系樹脂粉末の平均粒径が所定の範囲に入る必要がある。例えば、上述のように、５０μｍ以下０．２μｍ以上の範囲に調整されていることが好ましい。この粘性流動性は、チクソ指数にて表すことができ、本発明に用いる樹脂混練物は、チクソ指数が２以上である。 When the fluororesin powder is blended in an amount of 80% to 50% by volume and kneaded with 20% to 50% by volume of the thermosetting resin component, a viscous flow suitable for pressure injection into a molding die is obtained. Can be obtained. In order to obtain such a suitable viscous flow, the blending ratio is required. As a precondition, the average particle diameter of the fluororesin powder used for blending needs to be within a predetermined range. is there. For example, as described above, it is preferably adjusted to a range of 50 μm or less and 0.2 μm or more. This viscous fluidity can be represented by a thixo index, and the resin kneaded material used in the present invention has a thixo index of 2 or more.
チクソ性を有する物質は、静置状態では、流動せずに固形状態を保っているが、撹拌や振動などにより剪断力を持続的にかけると、流動化する物質である。このチクソ性の程度（チクソ指数）が大きければ、静止状態の固形保持が安定的であり、流動化にはより強い剪断力をかける必要があることになる。成形性を考慮すると、成形時には、容易に変形し、成形後は形状保持が安定したものであることが好ましい。成形を金型を用いて行う場合も、注入時には流動性が良好であり、注入後は、容易に流動しないことが好ましい。かかる観点から、チクソ性がある程度高い樹脂混練物は、成形に相応しい物質であると言うことができる。 A substance having thixotropy is a substance that does not flow in a stationary state and maintains a solid state, but fluidizes when a shearing force is continuously applied by stirring or vibration. If the degree of thixotropy (thixo index) is large, the solid holding in a stationary state is stable, and a stronger shearing force needs to be applied for fluidization. In consideration of moldability, it is preferable that the material is easily deformed at the time of molding, and the shape retention is stable after molding. Even when molding is performed using a mold, it is preferable that fluidity is good at the time of injection, and it does not flow easily after injection. From this point of view, it can be said that the resin kneaded material having a high thixotropy is a material suitable for molding.
チクソ指数の測定方法は、色々あるが、本発明でいうチクソ指数とは、得られた樹脂混練物をフローテスタで粘度測定（測定温度６０℃、ずり速度１００／秒と１０００／秒）し、得られた測定値を、Ｔ＝（ずり速度１００／秒とした時の粘度測定値）÷（ずり速度１０００／秒とした時の粘度測定値）に代入して求めた数値Ｔである。この数値（チクソ指数）Ｔが２以上であると、トランスファー成形や、注型作業において熱硬化性樹脂成分とフッ素系樹脂粉末が分離せず、注型後の熱硬化時に液ダレすることも無く、成形品を忠実に製造することができる。 There are various methods for measuring the thixo index, but the thixo index referred to in the present invention is to measure the viscosity of the obtained resin kneaded product with a flow tester (measuring temperature 60 ° C., shear rate 100 / sec and 1000 / sec), The measured value obtained is a numerical value T determined by substituting T = (viscosity measurement value at a shear rate of 100 / sec) / (viscosity measurement value at a shear rate of 1000 / sec). When this numerical value (thixotropic index) T is 2 or more, the thermosetting resin component and the fluororesin powder are not separated in transfer molding or casting, and there is no dripping at the time of thermosetting after casting. The molded product can be manufactured faithfully.
（無溶剤樹脂混練物の調製）
熱硬化性樹脂成分２０体積％〜５０体積％に対するフッ素系樹脂粉末（平均粒径５０μｍ以下０．２μｍ以上）の配合量を８０体積％〜５０体積％とする配合比は、通常の粉末混合から考えると、かなり大量であり、均一混合が可能とは理解しにくい大変多い配合量である。しかしながら、本発明者らの研究によれば、溶剤を用いなくとも、十分に均一な混練が可能であり、しかも注型作業に適した粘性流動が得られることが判明した。しかし、通常の混練方法により混練すると、粘性が高いため、空気の混入が生じやすく、樹脂混練物の組織中に気泡が形成されやすい。気泡が混入した樹脂混練物を熱硬化して得られた低誘電性絶縁材は、誘電率や強度、ドリル加工性にばらつきが生じることになり、適用製品、例えば半導体検査機器などの製品の不良につながるので好ましくない。
(Preparation of solvent-free resin kneaded product)
The blending ratio of 80 vol% to 50 vol% of the fluororesin powder (average particle size of 50 μm or less and 0.2 μm or more) with respect to 20 vol% to 50 vol% of the thermosetting resin component is from normal powder mixing. Considering this, it is a very large amount and it is difficult to understand that uniform mixing is possible. However, according to the study by the present inventors, it has been found that sufficiently uniform kneading is possible without using a solvent, and that a viscous flow suitable for casting work can be obtained. However, when kneaded by a normal kneading method, since the viscosity is high, air is likely to be mixed in, and bubbles are easily formed in the structure of the resin kneaded product. Low dielectric insulating material obtained by thermosetting resin kneaded material mixed with bubbles will cause variations in dielectric constant, strength and drill workability, resulting in defective products such as semiconductor inspection equipment. It is not preferable because it leads to.
そこで、本発明にかかる低誘電性絶縁材の製造方法では、熱硬化性樹脂成分にフッ素系樹脂粉末を配合し、これを混練する工程は、真空下で行うことが重要となる。
このように、熱硬化性樹脂成分とフッ素系樹脂粉末の混合は、樹脂混練物中に気泡を混入させないために、真空環境下にて行うこと大切であり、真空下での撹拌方法としては、遠心撹拌方法が好ましい。真空下での撹拌により、より好ましくは真空遠心攪拌方法を用いて樹脂混練物を調製することにより、樹脂混練物の撹拌時の温度の上昇が少なく、気泡を混入させることなく、混練が可能である。
Therefore, in the method for producing a low dielectric insulating material according to the present invention, it is important that the step of blending the fluororesin powder with the thermosetting resin component and kneading it is performed under vacuum.
As described above, the mixing of the thermosetting resin component and the fluororesin powder is important to be performed in a vacuum environment in order to prevent air bubbles from being mixed into the resin kneaded product, and as a stirring method under vacuum, A centrifugal stirring method is preferred. By preparing the resin kneaded product by stirring under vacuum, more preferably using a vacuum centrifugal stirring method, the temperature rise during stirring of the resin kneaded product is small, and kneading can be performed without mixing bubbles. is there.
（樹脂混練物の熱硬化）
前記樹脂混練物は、所望の金型に注入し、所定の温度にて所定の時間をかけて加熱することにより、所望形状の熱硬化物とすることができる。この樹脂混練物を熱硬化する場合の加熱温度および加熱時間は、使用する熱硬化性樹脂成分とその配合量により適宜に決定する必要がある。例えば、熱硬化性樹脂成分として、ＢＴ樹脂を用いた場合では、加熱温度は１８０〜２３０℃であり、加熱時間は、６０〜２４０分である。また、エポキシ樹脂組成物を用いた場合では、加熱温度は１００〜１８０℃であり、加熱時間は、６０〜２４０分である。
(Thermosetting of resin kneaded product)
The resin kneaded material is poured into a desired mold and heated at a predetermined temperature over a predetermined time, whereby a thermoset having a desired shape can be obtained. The heating temperature and heating time in the case of thermosetting this resin kneaded material need to be appropriately determined depending on the thermosetting resin component to be used and its blending amount. For example, when BT resin is used as the thermosetting resin component, the heating temperature is 180 to 230 ° C., and the heating time is 60 to 240 minutes. Moreover, when using an epoxy resin composition, heating temperature is 100-180 degreeC, and heating time is 60-240 minutes.
（機械加工）
上記のようにして樹脂混練物を熱硬化して得られた熱硬化物は、樹脂混練物に溶剤が含まれていないこと、混練は、真空下にて行われたことから、気泡形成がなく、緻密である。そのため、機械加工性、機械的強度に優れている。従って、金型による成形の後にさらに機械加工を施すことができ、より複雑な形状に仕上げることが可能となる。
(Machining)
The thermoset obtained by thermosetting the resin kneaded product as described above is free from bubbles because the resin kneaded product does not contain a solvent and the kneading was performed under vacuum. , Dense. Therefore, it is excellent in machinability and mechanical strength. Therefore, further machining can be performed after the molding by the mold, and it becomes possible to finish in a more complicated shape.
特にＢＴ系樹脂を用いた場合、金属への接着性、機械加工性をさらに向上させることができるので、トランスファー成形などを用いることにより金属との複合製品を容易に作製することができる。
半導体検査機器用の摺動材は、通常、金属製の型枠に樹脂を埋め込み、この樹脂を硬化した後、ドリルにより貫通孔を設けて、検査用のプローブの摺動穴を形成する。本発明の低誘電性絶縁材は、上述のように、誘電率が大変低く、かつ金属への接着性、機械加工性に優れるので、特に、上記半導体検査機器用の摺動材に好適に用いることができる。
In particular, when a BT resin is used, adhesion to metal and machinability can be further improved, so that a composite product with metal can be easily produced by using transfer molding or the like.
In a sliding material for a semiconductor inspection device, a resin is usually embedded in a metal mold, and after the resin is cured, a through hole is provided by a drill to form a sliding hole for an inspection probe. Since the low dielectric insulating material of the present invention has a very low dielectric constant and excellent adhesion to metal and machinability as described above, it is particularly suitable for the sliding material for the semiconductor inspection equipment. be able to.
以下、本発明の実施例を説明する。以下に示す実施例は、本発明を説明する好適な例示であるが、何ら本発明を限定するものではない。 Examples of the present invention will be described below. The following examples are suitable examples for explaining the present invention, but do not limit the present invention.
（実施例１）
熱硬化性樹脂成分として、室温にて半固形状で、６０℃を超えると液状となるビスマレイミド−トリアジン系樹脂（三菱瓦斯化学（株）製、商品名「ＢＴレジンＢＴ２１６０」：密度１．２ｇ/ｃｍ３）を２０体積％（２４ｇ）と、フッ素系樹脂粉末として、平均粒径１５μｍのポリテトラフロロエチレン粉末（旭硝子（株）製、商品名「フルオンＰＴＦＥルブリカントＬ１５０Ｊ」：密度２．１７ｇ/ｃｍ３）を８０体積％（１７３．６ｇ）の割合になるように計り取った。これらを、溶剤を加えることなく、真空遠心攪拌装置（（株）シンキー製、商品名「あわとり練太郎ＡＲＶ−３１０」）に投入し、装置内部を０．６７ｋＰａまで減圧した。続いて、２０００ｒｐｍの回転数で２分間脱気混合して粘土状の無溶剤樹脂混練物を得た。この混練時の原料温度は、７０℃であった。
Example 1
Bismaleimide-triazine resin (trade name “BT Resin BT2160”, manufactured by Mitsubishi Gas Chemical Co., Ltd.) which is semi-solid at room temperature and becomes liquid when the temperature exceeds 60 ° C. as a thermosetting resin component: density 1.2 g / cm 3) 20 vol% (and 24 g), as a fluorine-based resin powder, average particle diameter 15μm polytetrafluoroethylene powder (Asahi Glass Co., Ltd., trade name "Fluon PTFE Lubricant L150J": density 2.17 g / cm 3 ) was weighed to a proportion of 80% by volume (173.6 g). Without adding a solvent, these were put into a vacuum centrifugal stirrer (trade name “Awatori Nertaro ARV-310” manufactured by Shinky Co., Ltd.), and the inside of the device was decompressed to 0.67 kPa. Subsequently, the mixture was degassed and mixed for 2 minutes at a rotational speed of 2000 rpm to obtain a clay-like solvent-free resin kneaded product. The raw material temperature at the time of kneading was 70 ° C.
得られた無溶剤樹脂混練物をフローテスタで粘度測定（測定温度６０℃）を行った。この測定では、ずり速度１００／秒と１０００／秒のときの粘度を測定した。これらの測定値から、チクソ指数を求めた。 The obtained solvent-free resin kneaded product was subjected to viscosity measurement (measurement temperature 60 ° C.) with a flow tester. In this measurement, the viscosities at shear rates of 100 / sec and 1000 / sec were measured. From these measurements, the thixo index was determined.
さらに、上記無溶剤樹脂混練物を、射出成形機（（株）新興セルビック製、商品名「ハンディトライ」）を用いて、縦５０ｍｍ×横５０ｍｍ×厚さ２．８ｍｍの大きさに成形した。得られた成形物を、２００℃で１２０分間加熱硬化させた。 Furthermore, the solvent-free resin kneaded product was molded into a size of 50 mm in length, 50 mm in width, and 2.8 mm in thickness using an injection molding machine (trade name “Handy Try” manufactured by Shinsei Servic Co., Ltd.). The obtained molding was heat-cured at 200 ° C. for 120 minutes.
（成形性の評価）
得られた熱硬化物（低誘電性絶縁材）を誘電率測定と摺動試験のサンプルとして用いた。成形性は加熱硬化したとき、サンプルが形状保持できている場合を良品（○）とし、流動して変形した場合を不良品（×）として評価した。
(Evaluation of formability)
The obtained thermoset (low dielectric insulating material) was used as a sample for dielectric constant measurement and sliding test. The moldability was evaluated as a non-defective product (◯) when the sample was able to retain its shape when heat-cured, and as a defective product (×) when deformed by flowing.
（誘電率の測定）
誘電率の測定は、ＪＩＳ Ｋ６９１１に準拠して、電圧上昇比率法（Ｑメータ法、周波数１ＭＨｚ）により、測定した。
(Measurement of dielectric constant)
The dielectric constant was measured by the voltage increase ratio method (Q meter method, frequency 1 MHz) in accordance with JIS K6911.
（加工性の評価）
加工性については、前記の熱硬化物サンプルに直径３．０ｍｍのドリルで穴を開けた時の、穴周辺のバリ、欠け及び磨耗の有無（有り：×、無し：○）で評価した。
また、摺動性については、上記ドリル穴に直径２．８ｍｍのプローブを挿入し、穴に対してプローブを１００万回摺動させた後の穴周辺のバリ、欠け及び磨耗の有無（有り：×、無し：○）で評価した。
(Processability evaluation)
The workability was evaluated based on the presence or absence of burrs, chips and wear around the hole when the hole was drilled in the thermoset sample with a diameter of 3.0 mm (existence: x, absence: ◯).
As for slidability, the presence or absence of burrs, chips and wear around the hole after inserting a probe with a diameter of 2.8 mm into the drill hole and sliding the probe against the hole 1 million times (present: ×, None: ○)
（無気泡性の評価）
得られた樹脂混練物を圧入機を用いて金属製の枠体に圧入し、これを硬化した複合成形品（熱硬化物サンプル）の切断面を走査型電子顕微鏡（ＳＥＭ）により観察して、気泡の有り（○）無し（×）を確認した。測定条件としては、１０ｋＶ、３０倍に設定した。このＳＥＭによる観察によって、直径０．００５ｍｍ以上の気泡の有無が確認できる。
このＳＥＭ写真の一例を図１に示した。写真に示されている縦の等間隔に配置された白く見える格子状の隔壁は、樹脂混練物を圧入機により圧入した金属製の枠体（金属製基材）である。この枠体の多数の仕切壁で区切られた空間に樹脂混練物が充填された状態で熱硬化されている。この仕切壁の間隔は、写真下部のスケールから分かるように、０．５ｍｍであり、この仕切壁の間に充填されている熱硬化物の組織中には、気泡が全く形成されていないことが確認できる。
(Evaluation of bubble-free properties)
The obtained resin kneaded product was press-fitted into a metal frame using a press-fitting machine, and the cut surface of a composite molded product (thermoset sample) obtained by curing this was observed with a scanning electron microscope (SEM), The presence of bubbles (O) and absence (X) were confirmed. Measurement conditions were set to 10 kV and 30 times. The presence of bubbles having a diameter of 0.005 mm or more can be confirmed by observation with this SEM.
An example of this SEM photograph is shown in FIG. The grid-like partition walls that appear white and are arranged at equal vertical intervals shown in the photograph are metal frames (metal substrates) into which the resin kneaded material is press-fitted by a press-fitting machine. The frame is thermally cured in a state where the resin kneaded material is filled in a space defined by a number of partition walls. As can be seen from the scale at the bottom of the photograph, the interval between the partition walls is 0.5 mm, and no bubbles are formed in the structure of the thermosetting material filled between the partition walls. I can confirm.
（実施例２）
熱硬化性樹脂成分としてビスマレイミド−トリアジン系樹脂（三菱瓦斯化学（株）製、商品名「ＢＴレジンＢＴ２１６０」：密度１．２ｇ/ｃｍ３）を３０体積％（３６ｇ）と、フッ素系樹脂粉末として平均粒径１５μｍのポリテトラフロロエチレン粉末（旭硝子（株）製、商品名「フルオンＰＴＦＥルブリカントＬ１５０Ｊ」：密度２．１７ｇ/ｃｍ３）を７０体積％（１５１．９ｇ）の割合になるように計り取る以外は、実施例１と同様に行い、熱硬化物を得た。得られた熱硬化物に対して、実施例１と同様に物性測定および性能評価を行った。
(Example 2)
30% by volume (36 g) of a bismaleimide-triazine resin (manufactured by Mitsubishi Gas Chemical Co., Ltd., trade name “BT Resin BT2160”: density 1.2 g / cm 3 ) as a thermosetting resin component, fluorine resin powder As a polytetrafluoroethylene powder having an average particle size of 15 μm (trade name “Fluon PTFE Lubricant L150J”: density 2.17 g / cm 3 , manufactured by Asahi Glass Co., Ltd.) to a ratio of 70% by volume (151.9 g). Except measuring, it carried out similarly to Example 1 and obtained the thermosetting material. Measurement of physical properties and performance evaluation were performed on the obtained thermoset in the same manner as in Example 1.
（実施例３）
熱硬化性樹脂成分としてビスマレイミド−トリアジン系樹脂（三菱瓦斯化学（株）製、商品名「ＢＴレジンＢＴ２１６０」：密度１．２ｇ/ｃｍ３）を５０体積％（６０ｇ）と、フッ素系樹脂粉末として平均粒径１５μｍのポリテトラフロロエチレン粉末（旭硝子（株）製、商品名「フルオンＰＴＦＥルブリカントＬ１５０Ｊ」：密度２．１７ｇ/ｃｍ３）を５０体積％（１０８．５ｇ）の割合になるように計り取る以外は、実施例１と同様に行い、熱硬化物を得た。得られた熱硬化物に対して、実施例１と同様に物性測定および性能評価を行った。
(Example 3)
50% by volume (60 g) of bismaleimide-triazine resin (trade name “BT Resin BT2160”: density 1.2 g / cm 3 ) manufactured by Mitsubishi Gas Chemical Co., Ltd. as a thermosetting resin component, and fluorine resin powder As a polytetrafluoroethylene powder having an average particle size of 15 μm (trade name “Fluon PTFE Lubricant L150J”: density 2.17 g / cm 3 , manufactured by Asahi Glass Co., Ltd.) so as to have a ratio of 50 volume% (108.5 g). Except measuring, it carried out similarly to Example 1 and obtained the thermosetting material. Measurement of physical properties and performance evaluation were performed on the obtained thermoset in the same manner as in Example 1.
（実施例４）
フッ素系樹脂粉末として、平均粒径２０μｍのテトラフルオロエチレン・ヘキサフルオロプロピレン共重合体粉末（三井・デュポンフロロケミカル（株）製、商品名「テフロンＦＥＰ」の粉砕品：密度２．１５ｇ/ｃｍ３）７０体積％（１５０．５ｇ）を用いたこと以外は、実施例２と同様の配合量にて同様の処理を行い、熱硬化物を得た。得られた熱硬化物に対して、実施例１と同様に物性測定および性能評価を行った。
Example 4
Tetrafluoroethylene / hexafluoropropylene copolymer powder having an average particle diameter of 20 μm (made by Mitsui / DuPont Fluorochemical Co., Ltd., trade name “Teflon FEP”) as a fluororesin powder: density 2.15 g / cm 3 ) Except that 70% by volume (150.5 g) was used, the same treatment was performed in the same amount as in Example 2 to obtain a thermoset. Measurement of physical properties and performance evaluation were performed on the obtained thermoset in the same manner as in Example 1.
（実施例５）
フッ素系樹脂粉末として、平均粒径２０μｍのテトラフルオロエチレン・パーフルオロアルキルビニルエーテル共重合体粉末（旭硝子（株）製、商品名「フルオンＰＦＡ」の粉砕品：密度２．１５ｇ/ｃｍ３）７０体積％（１５０．５ｇ）を用いたこと以外は、実施例２と同様の配合量にて同様の処理を行い、熱硬化物を得た。得られた熱硬化物に対して、実施例１と同様に物性測定および性能評価を行った。
(Example 5)
As a fluororesin powder, a tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer powder having an average particle size of 20 μm (product of Asahi Glass Co., Ltd., pulverized product of “Fluon PFA”: density 2.15 g / cm 3 ) 70 volumes % (150.5 g) was used, and the same treatment was performed with the same amount as in Example 2 to obtain a thermoset. Measurement of physical properties and performance evaluation were performed on the obtained thermoset in the same manner as in Example 1.
（実施例６）
熱硬化性樹脂成分として、エポキシ系樹脂（長瀬産業（株）製、商品名「オンコートＥＸ１０２０」）１００重量部と、酸無水物（新日本理化（株）製、商品名「リカシッドＭＨ−７００」）９０重量部と、硬化促進剤（２エチル４メチルイミダゾール）１重量部とからなる樹脂組成物（密度１．１８ｇ/ｃｍ３）を２０体積％（２３．４ｇ）を用いたこと以外は、実施例１と同様の配合量にて同様の処理を行い、熱硬化物を得た。混練時の温度は６０℃、熱硬化処理の温度および時間は、１００℃/６０分＋１８０℃/２４０分とした。得られた熱硬化物に対して、実施例１と同様に物性測定および性能評価を行った。
(Example 6)
As the thermosetting resin component, 100 parts by weight of an epoxy resin (manufactured by Nagase Sangyo Co., Ltd., trade name “ONCOAT EX1020”) and an acid anhydride (manufactured by Shin Nippon Rika Co., Ltd., trade name “Ricacid MH-700” “) Except that 20% by volume (23.4 g) of a resin composition (density 1.18 g / cm 3 ) consisting of 90 parts by weight and 1 part by weight of a curing accelerator (2-ethyl 4-methylimidazole) was used. The same treatment was performed with the same blending amount as in Example 1 to obtain a thermoset. The temperature during kneading was 60 ° C., and the temperature and time of the thermosetting treatment were 100 ° C./60 minutes + 180 ° C./240 minutes. Measurement of physical properties and performance evaluation were performed on the obtained thermoset in the same manner as in Example 1.
（実施例７）
熱硬化性樹脂成分として、エポキシ系樹脂（長瀬産業（株）製、商品名「オンコートＥＸ１０２０」）１００重量部と、酸無水物（新日本理化（株）製、商品名「リカシッドＭＨ−７００」）９０重量部と、硬化促進剤（２エチル４メチルイミダゾール）１重量部とからなる樹脂組成物（密度１．１８ｇ/ｃｍ３）を３０体積％（３５．１ｇ）と、フッ素系樹脂粉末として、平均粒径１５μｍのポリテトラフロロエチレン粉末（旭硝子（株）製、商品名「フルオンＰＴＦＥルブリカントＬ１５０Ｊ」：密度２．１７ｇ/ｃｍ３）を７０体積％（１５１．９ｇ）の割合になるように計り取った以外は、実施例６と同様の処理を行い、熱硬化物を得た。得られた熱硬化物に対して、実施例１と同様に物性測定および性能評価を行った。
(Example 7)
As the thermosetting resin component, 100 parts by weight of an epoxy resin (manufactured by Nagase Sangyo Co., Ltd., trade name “ONCOAT EX1020”) and an acid anhydride (manufactured by Shin Nippon Rika Co., Ltd., trade name “Ricacid MH-700” ”) 30% by volume (35.1 g) of a resin composition (density 1.18 g / cm 3 ) consisting of 90 parts by weight and 1 part by weight of a curing accelerator (2-ethyl 4-methylimidazole), and fluorine-based resin powder As a polytetrafluoroethylene powder having an average particle diameter of 15 μm (trade name “Fluon PTFE Lubricant L150J”: density 2.17 g / cm 3 , manufactured by Asahi Glass Co., Ltd.) so as to have a ratio of 70% by volume (151.9 g). Except for measuring, the same treatment as in Example 6 was performed to obtain a thermoset. Measurement of physical properties and performance evaluation were performed on the obtained thermoset in the same manner as in Example 1.
（実施例８）
熱硬化性樹脂成分として、エポキシ系樹脂（長瀬産業（株）製、商品名「オンコートＥＸ１０２０」）１００重量部と、酸無水物（新日本理化（株）製、商品名「リカシッドＭＨ−７００」）９０重量部と、硬化促進剤（２エチル４メチルイミダゾール：１重量部）とからなる樹脂組成物（密度１．１８ｇ/ｃｍ３）を５０体積％（５８．５ｇ）と、フッ素系樹脂粉末として、平均粒径１５μｍのポリテトラフロロエチレン粉末（旭硝子（株）製、商品名「フルオンＰＴＦＥルブリカントＬ１５０Ｊ」：密度２．１７ｇ/ｃｍ３）を５０体積％（１０８．５ｇ）の割合になるように計り取った以外は、実施例６と同様の処理を行い、熱硬化物を得た。得られた熱硬化物に対して、実施例１と同様に物性測定および性能評価を行った。
(Example 8)
As the thermosetting resin component, 100 parts by weight of an epoxy resin (manufactured by Nagase Sangyo Co., Ltd., trade name “ONCOAT EX1020”) and an acid anhydride (manufactured by Shin Nippon Rika Co., Ltd., trade name “Ricacid MH-700” ] 50% by volume (58.5 g) of a resin composition (density 1.18 g / cm 3 ) comprising 90 parts by weight and a curing accelerator (2 ethyl 4-methylimidazole: 1 part by weight), and a fluororesin As a powder, a polytetrafluoroethylene powder having an average particle diameter of 15 μm (product name “Fluon PTFE Lubricant L150J” manufactured by Asahi Glass Co., Ltd .: density 2.17 g / cm 3 ) is 50% by volume (108.5 g). Except for the measurement, the same treatment as in Example 6 was performed to obtain a thermoset. Measurement of physical properties and performance evaluation were performed on the obtained thermoset in the same manner as in Example 1.
（実施例９）
フッ素系樹脂粉末として、平均粒径２０μｍのテトラフルオロエチレン・ヘキサフルオロプロピレン共重合体粉末（三井・デュポンフロロケミカル（株）製、商品名「テフロンＦＥＰ」の粉砕品：密度２．１５ｇ/ｃｍ３）７０体積％（１５０．５ｇ）を用いたこと以外は、実施例７と同様の配合量にて同様の処理を行い、熱硬化物を得た。得られた熱硬化物に対して、実施例１と同様に物性測定および性能評価を行った。
Example 9
Tetrafluoroethylene / hexafluoropropylene copolymer powder having an average particle diameter of 20 μm (made by Mitsui / DuPont Fluorochemical Co., Ltd., trade name “Teflon FEP”) as a fluororesin powder: density 2.15 g / cm 3 ) Except that 70% by volume (150.5 g) was used, the same treatment was performed in the same amount as in Example 7 to obtain a thermoset. Measurement of physical properties and performance evaluation were performed on the obtained thermoset in the same manner as in Example 1.
（実施例１０）
フッ素系樹脂粉末として、平均粒径２０μｍのテトラフルオロエチレン・パーフルオロアルキルビニルエーテル共重合体粉末（旭硝子（株）製、商品名「フルオンＰＦＡ」の粉砕品：密度２．１５ｇ/ｃｍ３）７０体積％（１５０．５ｇ）を用いたこと以外は、実施例７と同様の配合量にて同様の処理を行い、熱硬化物を得た。得られた熱硬化物に対して、実施例１と同様に物性測定および性能評価を行った。
(Example 10)
As a fluororesin powder, a tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer powder having an average particle size of 20 μm (product of Asahi Glass Co., Ltd., pulverized product of “Fluon PFA”: density 2.15 g / cm 3 ) 70 volumes % (150.5 g) was used, and the same treatment was carried out with the same blending amount as in Example 7 to obtain a thermoset. Measurement of physical properties and performance evaluation were performed on the obtained thermoset in the same manner as in Example 1.
（比較例１）
熱硬化性樹脂成分として、ビスマレイミド−トリアジン系樹脂（三菱瓦斯化学（株）製、商品名「ＢＴレジンＢＴ２１６０」：密度１．２ｇ/ｃｍ３）を５５体積％（６６ｇ）と、フッ素系樹脂粉末として平均粒径１５μｍのポリテトラフロロエチレン粉末（旭硝子（株）製、商品名「フルオンＰＴＦＥルブリカントＬ１５０Ｊ」：密度２．１７ｇ/ｃｍ３）を４５体積％（９７．７ｇ）の割合になるように計り取る以外は、実施例１と同様に行い、熱硬化物を得た。得られた熱硬化物に対して、実施例１と同様に物性測定および性能評価を行った。
この比較例１では、加熱硬化時に樹脂混練物が若干流れ出し変形を生じた。
(Comparative Example 1)
As a thermosetting resin component, bismaleimide-triazine resin (trade name “BT Resin BT2160”: density 1.2 g / cm 3 , manufactured by Mitsubishi Gas Chemical Co., Ltd.) 55% by volume (66 g), fluorine resin 45% by volume (97.7 g) of polytetrafluoroethylene powder (produced by Asahi Glass Co., Ltd., trade name “Fluon PTFE Lubricant L150J”: density 2.17 g / cm 3 ) having an average particle size of 15 μm as a powder A thermosetting product was obtained in the same manner as in Example 1 except for measuring. Measurement of physical properties and performance evaluation were performed on the obtained thermoset in the same manner as in Example 1.
In Comparative Example 1, the resin kneaded material flowed out slightly during the heat curing and caused deformation.
（比較例２）
熱硬化性樹脂成分としてビスマレイミド−トリアジン系樹脂（三菱瓦斯化学（株）製、商品名「ＢＴレジンＢＴ２１６０」：密度１．２ｇ/ｃｍ３）を１５ｖｏｌ％（１８ｇ）と、フッ素系樹脂粉末として平均粒径１５μｍのポリテトラフロロエチレン粉末（旭硝子（株）製、商品名「フルオンＰＴＦＥルブリカントＬ１５０Ｊ」：密度２．１７ｇ/ｃｍ３）を８５体積％（１８４．５ｇ）の割合になるように計り取る以外は、実施例１と同様に行い、熱硬化物を得た。得られた熱硬化物に対して、実施例１と同様に物性測定および性能評価を行った。
この比較例２では、穴加工時に穴周辺に欠けが生じ、摺動試験後は穴に磨耗が見られた。
(Comparative Example 2)
As a thermosetting resin component, bismaleimide-triazine resin (manufactured by Mitsubishi Gas Chemical Co., Ltd., trade name “BT resin BT2160”: density 1.2 g / cm 3 ) is 15 vol% (18 g), and fluorine resin powder. A polytetrafluoroethylene powder having an average particle diameter of 15 μm (trade name “Fluon PTFE Lubricant L150J” manufactured by Asahi Glass Co., Ltd .: density 2.17 g / cm 3 ) is measured to a ratio of 85 volume% (184.5 g). Except for taking, it carried out similarly to Example 1 and obtained the thermosetting material. Measurement of physical properties and performance evaluation were performed on the obtained thermoset in the same manner as in Example 1.
In Comparative Example 2, chipping occurred around the hole during drilling, and the hole was worn after the sliding test.
（比較例３）
熱硬化性樹脂成分として、エポキシ系樹脂（長瀬産業（株）製、商品名「オンコートＥＸ１０２０」）１００重量部と、酸無水物（新日本理化（株）製、商品名「リカシッドＭＨ−７００」）９０重量部と、硬化促進剤（２エチル４メチルイミダゾール）１重量部とからなる樹脂組成物（密度１．１８ｇ/ｃｍ３）を５５ｖｏｌ％（３５．１ｇ）と、フッ素系樹脂粉末として、平均粒径１５μｍのポリテトラフロロエチレン粉末（旭硝子（株）製、商品名「フルオンＰＴＦＥルブリカントＬ１５０Ｊ」：密度２．１７ｇ/ｃｍ３）を４５体積％（９７．７ｇ）の割合になるように計り取った以外は、実施例６と同様に行い、熱硬化物を得た。得られた熱硬化物に対して、実施例１と同様に物性測定および性能評価を行った。
(Comparative Example 3)
As the thermosetting resin component, 100 parts by weight of an epoxy resin (manufactured by Nagase Sangyo Co., Ltd., trade name “ONCOAT EX1020”) and an acid anhydride (manufactured by Shin Nippon Rika Co., Ltd., trade name “Ricacid MH-700” ”) 55 vol% (35.1 g) of a resin composition (density 1.18 g / cm 3 ) consisting of 90 parts by weight and 1 part by weight of a curing accelerator (2-ethyl 4-methylimidazole) as a fluorine resin powder Polytetrafluoroethylene powder having an average particle size of 15 μm (trade name “Fluon PTFE Lubricant L150J” manufactured by Asahi Glass Co., Ltd .: density 2.17 g / cm 3 ) is 45% by volume (97.7 g). Except having measured, it carried out similarly to Example 6 and obtained the thermosetting material. Measurement of physical properties and performance evaluation were performed on the obtained thermoset in the same manner as in Example 1.
（比較例４）
熱硬化性樹脂成分として、エポキシ系樹脂（長瀬産業（株）製、商品名「オンコートＥＸ１０２０」）１００重量部と、酸無水物（新日本理化（株）製、商品名「リカシッドＭＨ−７００」）９０重量部と、硬化促進剤（２エチル４メチルイミダゾール）１重量部とからなる樹脂組成物（密度１．１８ｇ/ｃｍ３）を１５体積％（１８ｇ）と、フッ素系樹脂粉末として、平均粒径１５μｍのポリテトラフロロエチレン粉末（旭硝子（株）製、商品名「フルオンＰＴＦＥルブリカントＬ１５０Ｊ」：密度２．１７ｇ/ｃｍ３）を８５体積％（１８４．５ｇ）の割合になるように計り取った以外は、実施例６と同様に行い、熱硬化物を得た。得られた熱硬化物に対して、実施例１と同様に物性測定および性能評価を行った。
(Comparative Example 4)
As the thermosetting resin component, 100 parts by weight of an epoxy resin (manufactured by Nagase Sangyo Co., Ltd., trade name “ONCOAT EX1020”) and an acid anhydride (manufactured by Shin Nippon Rika Co., Ltd., trade name “Ricacid MH-700” ] 15% by volume (18 g) of a resin composition (density 1.18 g / cm 3 ) consisting of 90 parts by weight and 1 part by weight of a curing accelerator (2-ethyl 4-methylimidazole) as a fluorine-based resin powder, A polytetrafluoroethylene powder having an average particle diameter of 15 μm (trade name “Fluon PTFE Lubricant L150J” manufactured by Asahi Glass Co., Ltd .: density 2.17 g / cm 3 ) is measured to a ratio of 85 volume% (184.5 g). Except having taken, it carried out similarly to Example 6 and obtained the thermosetting material. Measurement of physical properties and performance evaluation were performed on the obtained thermoset in the same manner as in Example 1.
（比較例５）
熱硬化性樹脂として、エポキシ系樹脂（長瀬産業（株）製、商品名「オンコートＥＸ１０２０」）１００重量部と、酸無水物（新日本理化（株）製、商品名「リカシッドＭＨ−７００」）９０重量部と、硬化促進剤（２エチル４メチルイミダゾール）１重量部とからなる樹脂組成物（密度１．１８ｇ／ｃｍ３）を３０体積％（３５．１ｇ）と、フッ素系樹脂粉末として、平均粒径１５μｍのポリテトラフロロエチレン粉末（旭硝子（株）製、商品名「フルオンＰＴＦＥルブリカントＬ１５０Ｊ」：密度２．１７ｇ/ｃｍ３）を７０体積％（１５１．９ｇ）の割合になるように計り取り、さらに溶媒（メチルエチルケトン）を前記の樹脂組成物１００ｇに対し２０ｇの割合で加えた。揮発性溶媒を含む組成であるため、常圧で２０００ｒｐｍの回転数で２分間混合して粘土状の樹脂混練物を得た。
得られた樹脂混練物のチクソ係数を実施例１と同様に行って求めた。
この比較例５の樹脂混練物は、硬化するため１００℃で６０分間加熱したところ、流れ出して変形してしまった。また、発泡したため誘電率測定用のサンプルや摺動試験用のサンプルは得られなかった。
(Comparative Example 5)
As a thermosetting resin, 100 parts by weight of an epoxy resin (manufactured by Nagase Sangyo Co., Ltd., trade name “ONCOAT EX1020”) and an acid anhydride (manufactured by Shin Nippon Rika Co., Ltd., trade name “Licacid MH-700”) ) 30% by volume (35.1 g) of a resin composition (density 1.18 g / cm 3 ) consisting of 90 parts by weight and 1 part by weight of a curing accelerator (2-ethyl 4-methylimidazole) as a fluorine-based resin powder Polytetrafluoroethylene powder having an average particle size of 15 μm (manufactured by Asahi Glass Co., Ltd., trade name “Fluon PTFE Lubricant L150J”: density 2.17 g / cm 3 ) so as to have a ratio of 70% by volume (151.9 g). Weighed out and further added a solvent (methyl ethyl ketone) at a ratio of 20 g to 100 g of the resin composition. Since it was a composition containing a volatile solvent, it was mixed for 2 minutes at a rotation speed of 2000 rpm under normal pressure to obtain a clay-like resin kneaded product.
The thixotropic coefficient of the obtained resin kneaded product was determined in the same manner as in Example 1.
When the resin kneaded material of Comparative Example 5 was heated at 100 ° C. for 60 minutes to be cured, it flowed out and deformed. Further, because of foaming, a sample for dielectric constant measurement and a sample for sliding test were not obtained.
（比較例６）
樹脂混練を常圧雰囲気下にて行ったこと以外は、実施例１と同様にして熱硬化物を作製し、実施例１と同様にして性能の評価を行った。
また、この比較例６で得られた樹脂混練物を圧入機を用いて金属製の枠体に圧入し、これを硬化した複合成形品の断面ＳＥＭ写真を図２に示した。図２に示す写真は、先に実施例１の熱硬化物の断面ＳＥＭ写真と同じ条件、すなわち、走査型電子顕微鏡（ＳＥＭ）を１０．０ｋＶ、３０倍の条件に設定して観察したものである。写真に示されている縦の等間隔に配置された白く見える格子状の隔壁は、樹脂混練物を圧入機により圧入した金属製の枠体である。この枠体の多数の仕切壁で区切られた空間に樹脂混練物が充填された状態で熱硬化されている。この仕切壁の間隔は、写真下部のスケールから分かるように、０．５ｍｍであり、この仕切壁の間に充填されている熱硬化物の組織中には、多数の気泡が形成されていることが確認できる。
(Comparative Example 6)
A thermoset was prepared in the same manner as in Example 1 except that the resin kneading was performed under an atmospheric pressure atmosphere, and the performance was evaluated in the same manner as in Example 1.
Further, FIG. 2 shows a cross-sectional SEM photograph of a composite molded product obtained by press-fitting the resin kneaded product obtained in Comparative Example 6 into a metal frame using a press-fitting machine and curing the resin frame. The photograph shown in FIG. 2 was previously observed under the same conditions as the cross-sectional SEM photograph of the thermoset of Example 1, that is, a scanning electron microscope (SEM) set at 10.0 kV and 30 times the conditions. is there. The grid-like partition walls that appear white and are arranged at regular intervals in the vertical direction shown in the photograph are metal frame bodies in which the resin kneaded material is press-fitted by a press-fitting machine. The frame is thermally cured in a state where the resin kneaded material is filled in a space defined by a number of partition walls. As can be seen from the scale at the bottom of the photograph, the interval between the partition walls is 0.5 mm, and a large number of bubbles are formed in the structure of the thermosetting material filled between the partition walls. Can be confirmed.
以上の実施例１〜１０の組成および性能評価結果を下記（表１）および（表２）に示し、比較例１〜６の組成および製法評価結果を下記（表３）に示した。 The compositions and performance evaluation results of Examples 1 to 10 described above are shown in the following (Table 1) and (Table 2), and the compositions and manufacturing method evaluation results of Comparative Examples 1 to 6 are shown in the following (Table 3).
上記（表１）〜（表３）から明らかなように、液状の熱硬化性樹脂成分２０〜５０体積％に対し、フッ素系樹脂粉末を８０〜５０体積％配合し、前記配合物を溶剤を用いずに真空条件下にて混練し気泡を含まない無溶剤樹脂混練物を調製し、この無溶剤樹脂混練物を熱硬化させることにより、気泡を含まない機械加工性の良好な低誘電性絶縁材を得ることができる。 As is clear from the above (Table 1) to (Table 3), 80 to 50% by volume of fluororesin powder is blended with 20 to 50% by volume of the liquid thermosetting resin component, and the blend is mixed with the solvent. Prepare a solvent-free resin kneaded product that does not contain bubbles by kneading under vacuum conditions without using it, and heat cure this solvent-free resin kneaded product to achieve low-dielectric insulation with good machinability without bubbles A material can be obtained.
以上のように、本発明にかかる低誘電性絶縁材は、トランスファー成形、圧入成形、射出成形が可能な、誘電率が２．９以下で、金属との接着性、ドリル加工性、摺動性、耐熱性の良好であり、回路基板用絶縁材、特に、半導体検査機器用摺動材などの機械強度を必要とする低誘電性部品材料として好適に使用できる。また、本発明の低誘電性絶縁材の製造方法は、かかる機械加工性に優れた低誘電性絶縁材を効率的に製造することができる。 As described above, the low dielectric insulating material according to the present invention is capable of transfer molding, press-fitting molding and injection molding, has a dielectric constant of 2.9 or less, adhesion to metal, drillability, and slidability. It has good heat resistance and can be suitably used as a low dielectric component material that requires mechanical strength, such as an insulating material for circuit boards, particularly a sliding material for semiconductor inspection equipment. Further, the method for producing a low dielectric insulating material of the present invention can efficiently produce such a low dielectric insulating material excellent in machinability.
Claims (15)
前記無溶剤樹脂混練物を熱硬化させて低誘電性絶縁材を得る熱硬化工程と、を有することを特徴とする低誘電性絶縁材の製造方法。 Polytetrafluoroethylene (PTFE), tetrafluoroethylene / hexafluoropropylene copolymer (FEP), with respect to 20 to 50% by volume of a thermosetting resin component that is liquid or semisolid in a temperature range of 10 to 40 ° C. , Air bubbles are obtained by kneading a resin composition containing 80 to 50 % by volume of one or two or more fluororesin powders selected from tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer (PFA) without using a solvent. A solvent-free resin kneaded material preparation step for preparing a resin kneaded material not containing
And a thermosetting step of thermally curing the solvent-free resin kneaded material to obtain a low dielectric insulating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008061756A JP5323368B2 (en) | 2008-03-11 | 2008-03-11 | Low dielectric insulating material and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008061756A JP5323368B2 (en) | 2008-03-11 | 2008-03-11 | Low dielectric insulating material and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009215466A JP2009215466A (en) | 2009-09-24 |
| JP5323368B2 true JP5323368B2 (en) | 2013-10-23 |
Family
ID=41187656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008061756A Expired - Fee Related JP5323368B2 (en) | 2008-03-11 | 2008-03-11 | Low dielectric insulating material and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5323368B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110139462A (en) * | 2010-06-23 | 2011-12-29 | 삼성전기주식회사 | Insulating resin composition and printed circuit substrate using the same |
| JP6754999B2 (en) * | 2015-03-05 | 2020-09-16 | パナソニックＩｐマネジメント株式会社 | Resin composition, low dielectric constant resin sheet, prepreg, metal foil laminated board, high frequency circuit board and multilayer wiring board |
| JP6859897B2 (en) * | 2017-08-21 | 2021-04-14 | 味の素株式会社 | Resin composition |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01123850A (en) * | 1987-11-10 | 1989-05-16 | Asahi Glass Co Ltd | Resin composition for laminating material and metal foil-clad laminate comprising the same |
| JP3568231B2 (en) * | 1994-05-24 | 2004-09-22 | 日東電工株式会社 | Manufacturing method of resin for semiconductor encapsulation |
| JP3233193B2 (en) * | 1996-06-06 | 2001-11-26 | 信越ポリマー株式会社 | Semiconductor element inspection socket |
| JPH1180507A (en) * | 1997-09-05 | 1999-03-26 | Nissan Motor Co Ltd | Epoxy resin composition |
| JPH11269350A (en) * | 1998-03-19 | 1999-10-05 | Nitto Denko Corp | Semiconductor device |
| JP2006263691A (en) * | 2005-03-23 | 2006-10-05 | Eme:Kk | Method for mixing and defoaming and deforming mixer |
-
2008
- 2008-03-11 JP JP2008061756A patent/JP5323368B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009215466A (en) | 2009-09-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106189087B (en) | Low dielectric POSS type ring epoxy resin composite materials and preparation method thereof | |
| KR101797722B1 (en) | Flexible metal laminate and preparation method of the same | |
| KR101027857B1 (en) | Silica powder and use thereof | |
| JP6014270B2 (en) | Soft metal laminate and method for producing the same | |
| KR101573170B1 (en) | Composite resin composition for plugging hole | |
| TWI706024B (en) | Adhesive composition for heat dissipation material, heat dissipation material of adhesive, insert substrate and manufacturing method thereof | |
| JP5323368B2 (en) | Low dielectric insulating material and manufacturing method thereof | |
| JP2015151457A (en) | liquid epoxy resin composition and liquid epoxy resin molding material | |
| JP2019196475A (en) | Low-loss insulating resin composition and insulating film using the same | |
| Yuan et al. | Preparation, characterization and properties of FEP modified PTFE/glass fiber composites for microwave circuit application | |
| JP5551915B2 (en) | Phenolic resin molding materials and phenolic resin moldings | |
| JP2008106126A (en) | Thermally conductive material, heat releasing substrate using this and its manufacturing method | |
| TWI752350B (en) | Electrode-forming resin composition, wafer-type electronic component, and method for producing the same | |
| WO2023282183A1 (en) | Resin composition for extrusion molding, sheet, and method for producing sheet | |
| JP2022098733A (en) | Composition of tetrafluoroethylene polymer, liquid composition containing the same, and sheet | |
| JP7020825B2 (en) | Epoxy resin powder coating composition | |
| JP6655359B2 (en) | Method for producing electronic / electric parts and epoxy resin composition | |
| JP2016040215A (en) | Method for producing ceramic molding | |
| JP3772327B2 (en) | High frequency components | |
| JPH06145519A (en) | Heat-resistant conductive resin composition | |
| KR101797724B1 (en) | Flexible metal laminate | |
| JP7308426B1 (en) | Boron nitride-coated thermally conductive particles, method for producing the same, thermally conductive resin composition, and thermally conductive compact | |
| JP2009102596A (en) | Phenolic resin molding material and molded article using the same | |
| JP7367766B2 (en) | Thermosetting resin composition, cured product thereof, and structure containing the cured product | |
| JP2008120922A (en) | Prepreg, prepreg production method, printed circuit board using the prepreg, and method for production of printed board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20100812 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20120418 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120508 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120626 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20121225 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130430 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130604 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130702 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130717 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |