JP2000158589A - Manufacture of metal foil clad laminated sheet - Google Patents
Manufacture of metal foil clad laminated sheetInfo
- Publication number
- JP2000158589A JP2000158589A JP10339315A JP33931598A JP2000158589A JP 2000158589 A JP2000158589 A JP 2000158589A JP 10339315 A JP10339315 A JP 10339315A JP 33931598 A JP33931598 A JP 33931598A JP 2000158589 A JP2000158589 A JP 2000158589A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- prepreg
- metal foil
- weight
- thermal expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、面方向の熱膨張率
が小さい金属箔張り積層板の製造法に関する。この積層
板は、プリント回路板に表面実装方式で部品を搭載した
とき高い接続信頼性を確保するためのプリント回路板材
料として適したものである。The present invention relates to a method for producing a metal foil-clad laminate having a small coefficient of thermal expansion in the plane direction. This laminated board is suitable as a printed circuit board material for securing high connection reliability when components are mounted on the printed circuit board by a surface mounting method.
【０００２】[0002]
【従来の技術】近年、電子機器は、小型化、多機能化、
高速化が要求されている。これらの要求に対して使用さ
れるＬＳＩは、微細配線化とチップサイズの大型化、パ
ッケージサイズの小型化あるいはベアチップ実装へと向
かい、半導体素材であるシリコンと同等かそれに近い熱
膨張率を有する部品となってきた。このため、これらを
搭載するプリント回路板の基板にも接続信頼性の面から
より小さい熱膨張率が要求されている。従来、その要求
に対応するため、セラミック基板、セラミック−樹脂複
合基板、、繊維複合樹脂基板などが開発されているが、
小さい熱膨張率と良好な加工性の両方を満足するような
基板材料は存在しなかった。2. Description of the Related Art In recent years, electronic equipment has been reduced in size and function, and
Higher speed is required. LSIs used to meet these requirements are moving toward finer wiring, larger chip sizes, smaller package sizes, or bare chip mounting, and have components that have a thermal expansion coefficient equal to or close to that of silicon as a semiconductor material. It has become. For this reason, a substrate of a printed circuit board on which these are mounted is required to have a smaller coefficient of thermal expansion from the viewpoint of connection reliability. Conventionally, ceramic substrates, ceramic-resin composite substrates, fiber composite resin substrates, and the like have been developed in order to meet the demand.
There was no substrate material satisfying both a low coefficient of thermal expansion and good workability.
【０００３】この問題を解決するために、シート状繊維
基材にエポキシ樹脂を含浸乾燥して得たプリプレグの層
とその表面に載置した金属箔を加熱加圧成形により一体
化した金属箔張り積層板を基板に用いるものにおいて、
エポキシ樹脂にブタジエン−アクリロニトリル共重合
体、オルガノポリシロキサンなどの可とう化剤を添加す
る技術が提案されている。可とう化剤の添加により樹脂
の弾性率を低下させ、積層板の面方向の熱膨張率を抑え
ようとするのもである。（特開平３−９１２８８号公
報）。しかし、ブタジエン−アクリロニトリル共重合体
を添加すると電気特性が劣化する。また、オルガノポリ
シロキサンを添加するとオルガノポリシロキサンとエポ
キシ樹脂の反応性が乏しいため、積層板表面にオルガノ
ポリシロキサンがブリードする（オルガノポリシロキサ
ンの層が積層板表面に浮き出す現象）。In order to solve this problem, a prepreg layer obtained by impregnating and drying a sheet-like fiber base material with an epoxy resin and a metal foil placed on the surface thereof are integrated by heat and pressure molding. In the case of using a laminate as a substrate,
A technique has been proposed in which a flexibilizing agent such as a butadiene-acrylonitrile copolymer or an organopolysiloxane is added to an epoxy resin. By adding a flexible agent, the elastic modulus of the resin is reduced, and the coefficient of thermal expansion in the surface direction of the laminate is suppressed. (JP-A-3-91288). However, when the butadiene-acrylonitrile copolymer is added, the electrical properties deteriorate. Further, when the organopolysiloxane is added, the reactivity of the organopolysiloxane and the epoxy resin is poor, so that the organopolysiloxane bleeds on the surface of the laminate (a phenomenon in which the organopolysiloxane layer emerges on the surface of the laminate).
【０００４】これらの問題を解決するために、シート状
繊維基材に含浸してプリプレグを製造するためのエポキ
シ樹脂ワニスに、当該エポキシ樹脂と相溶しないゴム弾
性粒子を添加する技術が提案されている（特願平７−５
２１２８号）。この技術によれば、ゴム弾性成分の積層
板表面へのブリードの問題は解決できる。しかし、前記
ゴム弾性粒子は、エポキシ樹脂と相溶しないためにエポ
キシ樹脂ワニスへの均一分散が困難であり、エポキシ樹
脂との反応性も乏しい。このようなことから、積層板を
プリント回路板へ加工する工程で実施する打ち抜き加工
において、打ち抜き端面からゴム弾性粒子のほか樹脂粉
の脱落が多いという問題点がある。In order to solve these problems, a technique has been proposed in which rubber elastic particles which are incompatible with the epoxy resin are added to an epoxy resin varnish for producing a prepreg by impregnating a sheet-like fiber base material. Yes (Japanese Patent Application No. 7-5)
No. 2128). According to this technique, the problem of bleeding of the rubber elastic component to the surface of the laminate can be solved. However, since the rubber elastic particles are not compatible with the epoxy resin, it is difficult to uniformly disperse the rubber elastic particles in the epoxy resin varnish, and the reactivity with the epoxy resin is poor. For this reason, in the punching performed in the step of processing the laminated board into the printed circuit board, there is a problem that a lot of resin particles in addition to the rubber elastic particles fall off from the punched end face.
【０００５】[0005]
【発明が解決しようとする課題】本発明が解決しようと
する課題は、可とう化剤の添加によってエポキシ樹脂の
弾性率を低下させ、面方向の熱膨張率を抑えた金属箔張
り積層板を製造する方法において、熱膨張率が小さく、
かつ打ち抜き加工時の樹脂粉等の脱落が少ない金属箔張
り積層板を製造することである。An object of the present invention is to provide a metal foil-clad laminate in which the elasticity of an epoxy resin is reduced by adding a flexibilizing agent and the coefficient of thermal expansion in the plane direction is suppressed. In the manufacturing method, the coefficient of thermal expansion is small,
Another object of the present invention is to manufacture a metal foil-clad laminate in which resin powder and the like are less likely to fall off during punching.
【０００６】[0006]
【課題を解決するための手段】上記の課題を解決するた
めに、本発明に係る金属箔張り積層板の製造法は、硬化
剤を含有するエポキシ樹脂ワニスをシート状繊維基材に
含浸乾燥して得たプリプレグの層とその表面に載置した
金属箔とを加熱加圧成形して一体化する方法において、
前記プリプレグの層の一部ないし全部に、次のようなプ
リプレグを使用する。すなわち、エポキシ樹脂と相溶し
ないゴム弾性粒子コアをエポキシ樹脂に相溶するシェル
層で被覆したコアシェル構造ゴム粒子を分散させたエポ
キシ樹脂ワニスをシート状繊維基材に含浸乾燥して得た
プリプレグを使用することを特徴とする。In order to solve the above-mentioned problems, a method of manufacturing a metal foil-clad laminate according to the present invention comprises impregnating and drying an epoxy resin varnish containing a curing agent into a sheet-like fiber substrate. In the method of heating and pressure molding the prepreg layer obtained and the metal foil placed on its surface to integrate them,
The following prepreg is used for part or all of the prepreg layer. That is, a prepreg obtained by impregnating and drying a sheet-like fiber base material with an epoxy resin varnish in which core-shell structured rubber particles in which a rubber elastic particle core incompatible with an epoxy resin is coated with a shell layer compatible with the epoxy resin is dispersed. It is characterized by being used.
【０００７】この方法で製造した積層板は、ゴム弾性粒
子コアを被覆するシェル層がエポキシ樹脂と相溶するた
め、硬化したエポキシ樹脂中にコアシェル構造ゴム粒子
が均一分散している。これが、熱膨張によりエポキシ樹
脂に発生した応力を吸収緩和するため、積層板の平面方
向の熱膨張率を小さく抑えられるものと推測される。ま
た、ゴム弾性粒子コアを被覆するシェル層はエポキシ樹
脂と相溶しているため、ゴム弾性粒子コアとエポキシ樹
脂の界面の接着強度は強固であり、打ち抜き等の機械的
な衝撃を与えても、コアシェル構造ゴム粒子や樹脂粉の
脱落は少ない。In the laminate manufactured by this method, since the shell layer covering the rubber elastic particle core is compatible with the epoxy resin, the core-shell structured rubber particles are uniformly dispersed in the cured epoxy resin. It is presumed that this absorbs and relaxes the stress generated in the epoxy resin due to thermal expansion, so that the coefficient of thermal expansion in the planar direction of the laminate can be suppressed to a small value. In addition, since the shell layer covering the rubber elastic particle core is compatible with the epoxy resin, the adhesive strength at the interface between the rubber elastic particle core and the epoxy resin is strong, and even if a mechanical impact such as punching is applied. The core-shell structure rubber particles and resin powder are less likely to fall off.
【０００８】[0008]
【発明の実施の形態】コアシェル構造ゴム粒子は特に限
定するものではないが、ゴム弾性粒子コアとして、エチ
レン、プロピレン、スチレン、ブタジエン、イソプレ
ン、アクリル酸メチル、メタクリル酸メチル、アクリロ
ニトリル等の架橋ゴムを選択することができる。また、
ゴム弾性粒子コアを被覆するシェル層としては、メチル
メタアクリレート、スチレン、アクリロニトリルあるい
はその共重合体等を選択することができる。シェル層を
構成する樹脂には、官能基としてエポキシ基、カルボキ
シル基等の導入も可能であり、用途により選択すること
ができる。本発明に使用するコアシェル構造ゴム粒子と
して、「スタフィロイドＡＣ−３３５５」（武田薬品工
業製）、「ゼオンアクリルレジンＦ３５１」（日本ゼオ
ン製）、「クレハパラロイドＥＸＬ−２６５５」（呉羽
化学工業製）などを市場から入手可能である。BEST MODE FOR CARRYING OUT THE INVENTION The rubber particles having a core-shell structure are not particularly limited, but a crosslinked rubber such as ethylene, propylene, styrene, butadiene, isoprene, methyl acrylate, methyl methacrylate, and acrylonitrile is used as a rubber elastic particle core. You can choose. Also,
As the shell layer covering the rubber elastic particle core, methyl methacrylate, styrene, acrylonitrile or a copolymer thereof can be selected. An epoxy group, a carboxyl group, or the like can be introduced as a functional group into the resin constituting the shell layer, and the resin can be selected depending on the application. As the rubber particles having a core-shell structure used in the present invention, “Staphyloid AC-3355” (manufactured by Takeda Pharmaceutical Co., Ltd.), “Zeon Acrylic Resin F351” (manufactured by Zeon Corporation), “Kureha Paraloid EXL-2655” (manufactured by Kureha Chemical Industry) ) Etc. are available from the market.
【０００９】[0009]
【実施例】実施例１〜３ エポキシ樹脂（油化シェル製「エピコート１００１」、
エポキシ当量：５００）９６重量部、ジシアンジアミド
４重量部、２−エチル−４−メチルイミダゾール（２Ｅ
４ＭＺ）０．５重量部に、「スタフィロイドＡＣ−３３
５５」を所定量配合し、樹脂固形分が６０重量％となる
ようにメチルエチルケトンとメチルグリコールの混合溶
媒に溶解し、エポキシ樹脂ワニスを調製した。「スタフ
ィロイドＡＣ−３３５５」の配合量は、エポキシ樹脂と
硬化剤をあわせた固形重量１００に対して１０（実施例
１），２０（実施例２），４０（実施例３）のそれぞれ
である。「スタフィロイドＡＣ−３３５５」は、ゴム弾
性粒子コアがアクリル酸エステル・メタクリル酸エステ
ル共重合体からなり、シェル層がメチルメタアクリレー
トからなる。上記各ワニスをガラスクロス（＃７６２８
タイプ，厚み０．１８mm）に含浸乾燥して、樹脂量４０
重量％のプリプレグ１〜３を得た。各プリプレグをそれ
ぞれ４枚重ね、その両側に厚さ１８μｍの銅箔を配し
て、温度１７０℃，圧力４０kgf／cm2で９０分間加熱加
圧成形して、厚さ０．８mmの両面銅張り積層板を得た。EXAMPLES Examples 1 to 3 Epoxy resin ("Epicoat 1001" manufactured by Yuka Shell Co., Ltd.)
Epoxy equivalent: 500) 96 parts by weight, dicyandiamide 4 parts by weight, 2-ethyl-4-methylimidazole (2E
4MZ) 0.5 part by weight of “Staphyloid AC-33”
55 "was mixed in a predetermined amount, and dissolved in a mixed solvent of methyl ethyl ketone and methyl glycol so that the resin solid content was 60% by weight, to prepare an epoxy resin varnish. The compounding amount of “Staphyloid AC-3355” is 10 (Example 1), 20 (Example 2), and 40 (Example 3) based on 100 of the total solid weight of the epoxy resin and the curing agent. . In “Staphyloid AC-3355”, the rubber elastic particle core is made of an acrylate / methacrylate copolymer, and the shell layer is made of methyl methacrylate. The above varnishes were placed on a glass cloth (# 7628
Type, thickness 0.18mm)
% By weight of prepregs 1 to 3 were obtained. Each prepreg is laminated four times, copper foil with a thickness of 18 μm is placed on both sides of the prepreg, and heated and pressed at a temperature of 170 ° C. and a pressure of 40 kgf / cm 2 for 90 minutes. A laminate was obtained.
【００１０】実施例４〜６ エポキシ樹脂（油化シェル製「エピコート１００１」、
エポキシ当量：５００）９６重量部、ジシアンジアミド
４重量部、２−エチル−４−メチルイミダゾール（２Ｅ
４ＭＺ）０．５重量部に、「ゼオンアクリルレジンＦ３
５１」を所定量配合し、樹脂固形分が６０重量％となる
ようにメチルエチルケトンとメチルグリコールの混合溶
媒に溶解し、エポキシ樹脂ワニスを調製した。「ゼオン
アクリルレジンＦ３５１」の配合量は、エポキシ樹脂と
硬化剤をあわせた固形重量１００に対して１０（実施例
４），２０（実施例５），４０（実施例６）のそれぞれ
である。「ゼオンアクリルレジンＦ３５１」は、ゴム弾
性粒子コアがアクリル酸系共重合体からなり、シェル層
がメチルメタアクリレート・アクリル酸系共重合体かな
らる。上記各ワニスをガラスクロス（＃７６２８タイ
プ，厚み０．１８mm）に含浸乾燥して、樹脂量４０重量
％のプリプレグ４〜６を得た。各プリプレグをそれぞれ
４枚重ね、その両側に厚さ１８μｍの銅箔を配して、温
度１７０℃，圧力４０kgf／cm2で９０分間加熱加圧成形
して、厚さ０．８mmの両面銅張り積層板を得た。Examples 4 to 6 Epoxy resin ("Epicoat 1001" manufactured by Yuka Shell Co., Ltd.)
Epoxy equivalent: 500) 96 parts by weight, dicyandiamide 4 parts by weight, 2-ethyl-4-methylimidazole (2E
4MZ) 0.5 part by weight of “Zeon acrylic resin F3
51 "was mixed in a predetermined amount and dissolved in a mixed solvent of methyl ethyl ketone and methyl glycol so that the resin solid content was 60% by weight, to prepare an epoxy resin varnish. The amount of “Zeon acrylic resin F351” is 10 (Example 4), 20 (Example 5), and 40 (Example 6) based on 100 of the total solid weight of the epoxy resin and the curing agent. “Zeon acrylic resin F351” has a rubber elastic particle core made of an acrylic acid-based copolymer and a shell layer made of a methyl methacrylate-acrylic acid-based copolymer. Each varnish was impregnated and dried in a glass cloth (# 7628 type, thickness 0.18 mm) to obtain prepregs 4 to 6 having a resin amount of 40% by weight. Each prepreg is laminated four times, copper foil with a thickness of 18 μm is placed on both sides of the prepreg, and heated and pressed at a temperature of 170 ° C. and a pressure of 40 kgf / cm 2 for 90 minutes. A laminate was obtained.
【００１１】実施例７〜９ エポキシ樹脂（油化シェル製「エピコート１００１」、
エポキシ当量：５００）９６重量部、ジシアンジアミド
４重量部、２−エチル−４−メチルイミダゾール（２Ｅ
４ＭＺ）０．５重量部に、「クレハパラロイドＥＸＬ−
２６５５」を所定量配合し、樹脂固形分が６０重量％と
なるようにメチルエチルケトンとメチルグリコールの混
合溶媒に溶解し、エポキシ樹脂ワニスを調製した。「ク
レハパラロイドＥＸＬ−２６５５」の配合量は、エポキ
シ樹脂と硬化剤をあわせた固形重量１００に対して１０
（実施例７），２０（実施例８），４０（実施例９）の
それぞれである。「クレハパラロイドＥＸＬ−２６５
５」は、ゴム弾性粒子コアがブタジエ・スチレン共重合
体からなり、シェル層がメタクリル酸アルキル共重合体
からなる。上記各ワニスをガラスクロス（＃７６２８タ
イプ，厚み０．１８mm）に含浸乾燥して、樹脂量４０重
量％のプリプレグ７〜９を得た。各プリプレグをそれぞ
れ４枚重ね、その両側に厚さ１８μｍの銅箔を配して、
温度１７０℃，圧力４０kgf／cm2で９０分間加熱加圧成
形して、厚さ０．８mmの両面銅張り積層板を得た。Examples 7 to 9 Epoxy resin ("Epicoat 1001" manufactured by Yuka Shell Co., Ltd.)
Epoxy equivalent: 500) 96 parts by weight, dicyandiamide 4 parts by weight, 2-ethyl-4-methylimidazole (2E
4MZ) 0.5 parts by weight of “Kureha Paraloid EXL-
2655 "was mixed in a predetermined amount, and dissolved in a mixed solvent of methyl ethyl ketone and methyl glycol so that the resin solid content was 60% by weight, to prepare an epoxy resin varnish. The compounding amount of “Kureha paraloid EXL-2655” is 10 to the solid weight 100 of the epoxy resin and the curing agent.
(Example 7), 20 (Example 8), and 40 (Example 9). "Kureha Paraloid EXL-265
In No. 5 ", the rubber elastic particle core is made of a butadiene-styrene copolymer, and the shell layer is made of an alkyl methacrylate copolymer. Each varnish was impregnated and dried in a glass cloth (# 7628 type, thickness 0.18 mm) to obtain prepregs 7 to 9 having a resin amount of 40% by weight. Four layers of each prepreg are stacked, and copper foil with a thickness of 18 μm is arranged on both sides thereof.
It was heated and pressed at a temperature of 170 ° C. and a pressure of 40 kgf / cm 2 for 90 minutes to obtain a double-sided copper-clad laminate having a thickness of 0.8 mm.
【００１２】従来例１〜３ エポキシ樹脂（油化シェル製「エピコート１００１」、
エポキシ当量：５００）９６重量部、ジシアンジアミド
４重量部、２−エチル−４−メチルイミダゾール（２Ｅ
４ＭＺ）０．５重量部に、エポキシ樹脂と相溶しないシ
リコーンゴム微粒子（東レ・ダウ・コーニング製「Ｅ−
６０１」）を所定量配合し、樹脂固形分が６０重量％と
なるようにメチルエチルケトンとメチルグリコールの混
合溶媒に溶解し、エポキシ樹脂ワニスを調製した。「Ｅ
−６０１」の配合量は、エポキシ樹脂と硬化剤をあわせ
た固形重量１００に対して１０（従来例１），２０（従
来例２），４０（従来例３）のそれぞれである。上記各
ワニスをガラスクロス（＃７６２８タイプ，厚み０．１
８mm）に含浸乾燥して、樹脂量４０重量％のプリプレグ
１１〜１３を得た。各プリプレグをそれぞれ４枚重ね、
その両側に厚さ１８μｍの銅箔を配して、温度１７０
℃，圧力４０kgf／cm2で９０分間加熱加圧成形して、厚
さ０．８mmの両面銅張り積層板を得た。Conventional Examples 1-3 Epoxy resin ("Epicoat 1001" manufactured by Yuka Shell)
Epoxy equivalent: 500) 96 parts by weight, dicyandiamide 4 parts by weight, 2-ethyl-4-methylimidazole (2E
4MZ) 0.5 parts by weight of silicone rubber fine particles incompatible with epoxy resin (“E-
601 ") was mixed in a predetermined amount, and dissolved in a mixed solvent of methyl ethyl ketone and methyl glycol so that the resin solid content became 60% by weight, to prepare an epoxy resin varnish. "E
The compounding amount of “-601” is 10 (conventional example 1), 20 (conventional example 2), and 40 (conventional example 3) with respect to a solid weight of 100 including the epoxy resin and the curing agent. Apply each varnish to a glass cloth (# 7628 type, thickness 0.1
8 mm) to obtain prepregs 11 to 13 having a resin amount of 40% by weight. Each prepreg is piled up four times,
An 18 μm thick copper foil was placed on both sides of the
It was heated and pressed at 90 ° C. and a pressure of 40 kgf / cm 2 for 90 minutes to obtain a double-sided copper-clad laminate having a thickness of 0.8 mm.
【００１３】従来例４〜７ エポキシ樹脂（油化シェル製「エピコート１００１」、
エポキシ当量：５００）９６重量部、ジシアンジアミド
４重量部、２−エチル−４−メチルイミダゾール（２Ｅ
４ＭＺ）０．５重量部に、エポキシ樹脂と相溶しないＮ
ＢＲゴム微粒子（ＪＳＲ製「ＸＥＲ−９１」）を所定量
配合し、樹脂固形分が６０重量％となるようにメチルエ
チルケトンとメチルグリコールの混合溶媒に溶解し、エ
ポキシ樹脂ワニスを調製した。「ＸＥＲ−９１」の配合
量は、エポキシ樹脂と硬化剤をあわせた固形重量１００
に対して１０（従来例４），２０（従来例５），４０
（従来例６），０（従来例７）のそれぞれである。上記
各ワニスをガラスクロス（＃７６２８タイプ，厚み０．
１８mm）に含浸乾燥して、樹脂量４０重量％のプリプレ
グ１４〜１７を得た。各プリプレグをそれぞれ４枚重
ね、その両側に厚さ１８μｍの銅箔を配して、温度１７
０℃，圧力４０kgf／cm2で９０分間加熱加圧成形して、
厚さ０．８mmの両面銅張り積層板を得た。Conventional Examples 4 to 7 Epoxy resin ("Epicoat 1001" manufactured by Yuka Shell)
Epoxy equivalent: 500) 96 parts by weight, dicyandiamide 4 parts by weight, 2-ethyl-4-methylimidazole (2E
4MZ) 0.5 part by weight of N which is incompatible with epoxy resin
A predetermined amount of BR rubber fine particles (“XER-91” manufactured by JSR) was blended and dissolved in a mixed solvent of methyl ethyl ketone and methyl glycol so that the resin solid content became 60% by weight to prepare an epoxy resin varnish. The compounding amount of “XER-91” is 100% of solid weight of epoxy resin and curing agent.
10 (conventional example 4), 20 (conventional example 5), 40
(Conventional Example 6) and 0 (Conventional Example 7). Each of the above varnishes is made of glass cloth (# 7628 type, thickness of 0.
18 mm) to obtain prepregs 14 to 17 having a resin content of 40% by weight. Four prepregs were stacked on each other, and copper foil having a thickness of 18 μm was arranged on both sides thereof.
Heat and pressure molding at 0 ° C, pressure 40kgf / cm 2 for 90 minutes,
A double-sided copper-clad laminate having a thickness of 0.8 mm was obtained.
【００１４】以上の積層板の熱膨張率と打ち抜き加工時
の粉落ち量を表１にまとめて示した。表中の熱膨張率及
び粉落ち量の評価は以下の要領で実施した。熱膨張率：
積層板の平面方向の熱膨張率でたて方向とよこ方向の平
均値を示す。粉落ち量：図１に示す打ち抜き金型（１mm
×１６０mmのスリットを１２本打ち抜ける形状である）
を用い、１０枚の試験片に対し打ち抜き加工を実施した
後、金型に付着した粉及び試験片の打ち抜き端面に付着
している粉を刷毛で丁寧に集めて、その重量を測定し
た。Table 1 summarizes the thermal expansion coefficient and the amount of powder falling off during the punching of the above laminated plate. The evaluation of the coefficient of thermal expansion and the amount of powder falling off in the table were performed in the following manner. Thermal expansion coefficient:
The average value in the vertical direction and the horizontal direction is shown by the coefficient of thermal expansion in the plane direction of the laminate. Amount of powder falling: punching die shown in Fig. 1 (1mm
It is a shape that punches 12 slits of × 160mm)
After the punching process was performed on ten test pieces, the powder adhering to the mold and the powder adhering to the punched end face of the test piece were carefully collected with a brush, and the weight was measured.
【００１５】[0015]
【表１】 [Table 1]
【００１６】表１から、本発明に係る実施例による積層
板は、熱膨張率が小さく、かつ打ち抜き加工時の粉落ち
量も少ないことがわかる。その粉落ち量は、可とう化剤
を全く含まない積層板（従来例7）と同等にまで低減で
きる。From Table 1, it can be seen that the laminate according to the embodiment of the present invention has a small coefficient of thermal expansion and a small amount of powder falling off during punching. The amount of powder falling can be reduced to the same level as that of the laminate (conventional example 7) containing no flexible agent.
【００１７】[0017]
【発明の効果】上述のように、本発明に係る方法によれ
ば、熱膨張率が小さく、打ち抜き加工時の粉落ち量が少
ない金属箔張り積層板を製造することができる。この金
属箔張り積層板は、平面方向の熱膨張率が小さく、プリ
ント回路板としたとき、表面実装方式で搭載した部品の
高い接続信頼性を確保することができる。As described above, according to the method of the present invention, a metal foil-clad laminate having a small coefficient of thermal expansion and a small amount of powder falling off during punching can be manufactured. This metal foil-clad laminate has a small coefficient of thermal expansion in the plane direction, and when it is used as a printed circuit board, high connection reliability of components mounted by the surface mounting method can be ensured.
【図１】積層板の打ち抜き加工時の粉落ち量を確認する
ために使用する打ち抜き加工金型の平面図である。FIG. 1 is a plan view of a punching die used for confirming the amount of powder falling during punching of a laminated plate.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） // Ｃ０８Ｌ 63:00 Ｆターム(参考） 4F072 AA05 AB28 AD23 AE06 AE23 AG03 AG19 AH02 AH21 AJ04 AK14 AL13 4F100 AB17 AB33B AG00 AK25 AK25H AK53A AL01 AL01H AN00A AN00H BA02 BA03 BA06 BA10B BA13 CA02A CA23A DD32A DD32H DE01A DE01H DG06A DG12 DH01A EJ172 EJ422 EJ821 EJ861 GB43 JA02 JB04A JB04H JK07A JK07H JL01 4J038 CA022 CB042 CB092 CC022 CG142 CG162 CH032 DB001 GA06 GA07 MA03 NA21 NA23 PB09 PC02 PC10 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) // C08L 63:00 F term (Reference) 4F072 AA05 AB28 AD23 AE06 AE23 AG03 AG19 AH02 AH21 AJ04 AK14 AL13 4F100 AB17 AB33B AG00 AK25 AK25H AK53A AL01 AL01H AN00A AN00H BA02 BA03 BA06 BA10B BA13 CA02A CA23A DD32A DD32H DE01A DE01H DG06A DG12 DH01A EJ172 EJ422 EJ821 EJ861 GB43 JA02 JB04A JB04H JK02 CB07 GA02J02
Claims (1)
ート状繊維基材に含浸乾燥して得たプリプレグの層とそ
の表面に配置した金属箔とを加熱加圧成形して一体化す
る金属箔張り積層板の製造において、 以下のエポキシ樹脂ワニスをシート状繊維基材に含浸乾
燥して得たプリプレグを、前記プリプレグの層の一部な
いし全部に使用することを特徴とする金属箔張り積層板
の製造法。 エポキシ樹脂ワニス：エポキシ樹脂と相溶しないゴム弾
性粒子コアをエポキシ樹脂と相溶するシェル層で被覆し
たコアシェル構造ゴム粒子を分散させたエポキシ樹脂ワ
ニス。A prepreg layer obtained by impregnating and drying a sheet-like fiber base material with an epoxy resin varnish containing a curing agent and a metal foil disposed on the surface thereof by heating and pressing to integrate the metal foil. In the production of a laminated laminate, a prepreg obtained by impregnating and drying the following epoxy resin varnish in a sheet-like fiber base material is used for a part or all of the layers of the prepreg; Manufacturing method. Epoxy resin varnish: An epoxy resin varnish in which rubber particles having a core-shell structure in which a rubber elastic particle core incompatible with the epoxy resin is covered with a shell layer compatible with the epoxy resin are dispersed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10339315A JP2000158589A (en) | 1998-11-30 | 1998-11-30 | Manufacture of metal foil clad laminated sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10339315A JP2000158589A (en) | 1998-11-30 | 1998-11-30 | Manufacture of metal foil clad laminated sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000158589A true JP2000158589A (en) | 2000-06-13 |
Family
ID=18326302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10339315A Pending JP2000158589A (en) | 1998-11-30 | 1998-11-30 | Manufacture of metal foil clad laminated sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000158589A (en) |
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1998
- 1998-11-30 JP JP10339315A patent/JP2000158589A/en active Pending
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