CN109411398B - 一种硅片自动插片设备 - Google Patents
一种硅片自动插片设备 Download PDFInfo
- Publication number
- CN109411398B CN109411398B CN201811319594.7A CN201811319594A CN109411398B CN 109411398 B CN109411398 B CN 109411398B CN 201811319594 A CN201811319594 A CN 201811319594A CN 109411398 B CN109411398 B CN 109411398B
- Authority
- CN
- China
- Prior art keywords
- wafer
- basket
- slide way
- water tank
- slice
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 15
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 15
- 239000010703 silicon Substances 0.000 title claims abstract description 15
- 235000012431 wafers Nutrition 0.000 title claims description 56
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 54
- 239000008367 deionised water Substances 0.000 claims description 6
- 229910021641 deionized water Inorganic materials 0.000 claims description 6
- 239000013307 optical fiber Substances 0.000 claims description 5
- 230000001419 dependent effect Effects 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 3
- 238000004904 shortening Methods 0.000 abstract 1
- 210000000078 claw Anatomy 0.000 description 10
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811319594.7A CN109411398B (zh) | 2018-11-07 | 2018-11-07 | 一种硅片自动插片设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811319594.7A CN109411398B (zh) | 2018-11-07 | 2018-11-07 | 一种硅片自动插片设备 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109411398A CN109411398A (zh) | 2019-03-01 |
CN109411398B true CN109411398B (zh) | 2023-10-31 |
Family
ID=65472148
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811319594.7A Active CN109411398B (zh) | 2018-11-07 | 2018-11-07 | 一种硅片自动插片设备 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109411398B (zh) |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6896470B1 (en) * | 2000-09-08 | 2005-05-24 | Industrial Technology Research Institute | Front-opening unified pod auto-loading structure |
CN201336302Y (zh) * | 2008-12-19 | 2009-10-28 | 无锡市南亚科技有限公司 | 硅片自动装片机 |
CN104236103A (zh) * | 2014-09-26 | 2014-12-24 | 苏州巨浪热水器有限公司 | 一种热水器上的安装支架 |
CN204732381U (zh) * | 2015-06-30 | 2015-10-28 | 天津中环半导体股份有限公司 | 一种自动去边机用下料装置 |
CN206236697U (zh) * | 2016-12-13 | 2017-06-09 | 温州海旭科技有限公司 | 一种全自动硅片插片机 |
CN206270291U (zh) * | 2016-12-23 | 2017-06-20 | 谭斯品 | 一种凝胶电泳用防静电电泳槽 |
CN206602105U (zh) * | 2017-04-14 | 2017-10-31 | 常州亿晶光电科技有限公司 | 硅片自动纠正装置 |
CN207569362U (zh) * | 2017-12-15 | 2018-07-03 | 湖北浙商集团科技有限公司 | 一种斜支撑托架 |
CN209183523U (zh) * | 2018-11-07 | 2019-07-30 | 天津中环领先材料技术有限公司 | 一种硅片自动插片设备 |
-
2018
- 2018-11-07 CN CN201811319594.7A patent/CN109411398B/zh active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6896470B1 (en) * | 2000-09-08 | 2005-05-24 | Industrial Technology Research Institute | Front-opening unified pod auto-loading structure |
CN201336302Y (zh) * | 2008-12-19 | 2009-10-28 | 无锡市南亚科技有限公司 | 硅片自动装片机 |
CN104236103A (zh) * | 2014-09-26 | 2014-12-24 | 苏州巨浪热水器有限公司 | 一种热水器上的安装支架 |
CN204732381U (zh) * | 2015-06-30 | 2015-10-28 | 天津中环半导体股份有限公司 | 一种自动去边机用下料装置 |
CN206236697U (zh) * | 2016-12-13 | 2017-06-09 | 温州海旭科技有限公司 | 一种全自动硅片插片机 |
CN206270291U (zh) * | 2016-12-23 | 2017-06-20 | 谭斯品 | 一种凝胶电泳用防静电电泳槽 |
CN206602105U (zh) * | 2017-04-14 | 2017-10-31 | 常州亿晶光电科技有限公司 | 硅片自动纠正装置 |
CN207569362U (zh) * | 2017-12-15 | 2018-07-03 | 湖北浙商集团科技有限公司 | 一种斜支撑托架 |
CN209183523U (zh) * | 2018-11-07 | 2019-07-30 | 天津中环领先材料技术有限公司 | 一种硅片自动插片设备 |
Also Published As
Publication number | Publication date |
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CN109411398A (zh) | 2019-03-01 |
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GR01 | Patent grant | ||
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TR01 | Transfer of patent right |
Effective date of registration: 20240129 Address after: 300384 Tianjin Binhai New Area high tech Zone Huayuan Industrial Area (outside the ring) Hai Tai Road 12 inside. Patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Country or region after: China Patentee after: Zhonghuan Leading Semiconductor Technology Co.,Ltd. Address before: 300384 Tianjin Binhai New Area high tech Zone Huayuan Industrial Area (outside the ring) Hai Tai Road 12 inside. Patentee before: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Country or region before: China |