CN209183523U - 一种硅片自动插片设备 - Google Patents
一种硅片自动插片设备 Download PDFInfo
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- CN209183523U CN209183523U CN201821828510.8U CN201821828510U CN209183523U CN 209183523 U CN209183523 U CN 209183523U CN 201821828510 U CN201821828510 U CN 201821828510U CN 209183523 U CN209183523 U CN 209183523U
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 25
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 25
- 239000010703 silicon Substances 0.000 title claims abstract description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 27
- 210000000078 claw Anatomy 0.000 claims description 23
- 239000008367 deionised water Substances 0.000 claims description 7
- 229910021641 deionized water Inorganic materials 0.000 claims description 7
- 238000005452 bending Methods 0.000 claims description 6
- 239000000835 fiber Substances 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 5
- 238000010276 construction Methods 0.000 claims description 3
- 230000003447 ipsilateral effect Effects 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Abstract
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Priority Applications (1)
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CN201821828510.8U CN209183523U (zh) | 2018-11-07 | 2018-11-07 | 一种硅片自动插片设备 |
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CN201821828510.8U CN209183523U (zh) | 2018-11-07 | 2018-11-07 | 一种硅片自动插片设备 |
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CN209183523U true CN209183523U (zh) | 2019-07-30 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN109411398A (zh) * | 2018-11-07 | 2019-03-01 | 天津中环领先材料技术有限公司 | 一种硅片自动插片设备 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN109411398A (zh) * | 2018-11-07 | 2019-03-01 | 天津中环领先材料技术有限公司 | 一种硅片自动插片设备 |
CN109411398B (zh) * | 2018-11-07 | 2023-10-31 | 天津中环领先材料技术有限公司 | 一种硅片自动插片设备 |
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GR01 | Patent grant | ||
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TR01 | Transfer of patent right |
Effective date of registration: 20191227 Address after: 214200 Dongfen Avenue, Yixing Economic and Technological Development Zone, Wuxi City, Jiangsu Province Co-patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Patentee after: Zhonghuan leading semiconductor materials Co.,Ltd. Address before: 300384 in Tianjin Binhai high tech Zone Huayuan Industrial Zone (outer ring road No. 12 in Haitai) Patentee before: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. |
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CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 214200 Dongjia Avenue, Yixing Economic and Technological Development Zone, Wuxi City, Jiangsu Province Patentee after: Zhonghuan Leading Semiconductor Technology Co.,Ltd. Country or region after: China Patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Address before: 214200 Dongjia Avenue, Yixing Economic and Technological Development Zone, Wuxi City, Jiangsu Province Patentee before: Zhonghuan leading semiconductor materials Co.,Ltd. Country or region before: China Patentee before: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. |