CN109300843B - 晶片的加工方法和晶片的加工中使用的辅助器具 - Google Patents

晶片的加工方法和晶片的加工中使用的辅助器具 Download PDF

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Publication number
CN109300843B
CN109300843B CN201810800995.8A CN201810800995A CN109300843B CN 109300843 B CN109300843 B CN 109300843B CN 201810800995 A CN201810800995 A CN 201810800995A CN 109300843 B CN109300843 B CN 109300843B
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China
Prior art keywords
wafer
opening
auxiliary tool
dividing
device region
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CN201810800995.8A
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English (en)
Chinese (zh)
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CN109300843A (zh
Inventor
R·卢扎尼拉
D·马丁
R·瓦尔加斯
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Disco Corp
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Disco Corp
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Publication of CN109300843A publication Critical patent/CN109300843A/zh
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Publication of CN109300843B publication Critical patent/CN109300843B/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Micromachines (AREA)
CN201810800995.8A 2017-07-25 2018-07-20 晶片的加工方法和晶片的加工中使用的辅助器具 Active CN109300843B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-143565 2017-07-25
JP2017143565A JP6935257B2 (ja) 2017-07-25 2017-07-25 ウエーハの加工方法及びウエーハの加工に用いる補助具

Publications (2)

Publication Number Publication Date
CN109300843A CN109300843A (zh) 2019-02-01
CN109300843B true CN109300843B (zh) 2024-03-01

Family

ID=65167886

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810800995.8A Active CN109300843B (zh) 2017-07-25 2018-07-20 晶片的加工方法和晶片的加工中使用的辅助器具

Country Status (4)

Country Link
JP (1) JP6935257B2 (ko)
KR (1) KR102561376B1 (ko)
CN (1) CN109300843B (ko)
TW (1) TWI761558B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113732525A (zh) * 2021-09-03 2021-12-03 湖北三维半导体集成创新中心有限责任公司 一种晶圆的切割方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010073884A (ja) * 2008-09-18 2010-04-02 Fujitsu Microelectronics Ltd 半導体ウェーハ用治具及び半導体装置の製造方法
JP2013041908A (ja) * 2011-08-12 2013-02-28 Disco Abrasive Syst Ltd 光デバイスウェーハの分割方法
JP2013247130A (ja) * 2012-05-23 2013-12-09 Disco Abrasive Syst Ltd ウェーハの分割方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990030006U (ko) * 1997-12-29 1999-07-26 구본준 웨이퍼 홀더
JP3408805B2 (ja) 2000-09-13 2003-05-19 浜松ホトニクス株式会社 切断起点領域形成方法及び加工対象物切断方法
JP2004273895A (ja) * 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd 半導体ウエーハの分割方法
JP5074719B2 (ja) * 2006-07-14 2012-11-14 東京応化工業株式会社 ウエハを薄くする方法及びサポートプレート
JP2010141061A (ja) * 2008-12-10 2010-06-24 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 エピタキシャルウェーハの製造方法に用いる冶具
TW201630105A (zh) * 2015-02-12 2016-08-16 漢民科技股份有限公司 晶圓保持器
JP5641766B2 (ja) * 2010-04-22 2014-12-17 株式会社ディスコ ウェーハの分割方法
JP5294358B2 (ja) * 2012-01-06 2013-09-18 古河電気工業株式会社 ウエハ加工用テープ及びこれを使用した半導体装置の製造方法
JP2013152995A (ja) * 2012-01-24 2013-08-08 Disco Abrasive Syst Ltd ウエーハの加工方法
JP6360411B2 (ja) * 2014-10-09 2018-07-18 株式会社ディスコ ウエーハの加工方法
JP2016147342A (ja) * 2015-02-12 2016-08-18 株式会社ディスコ 加工装置のチャックテーブル

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010073884A (ja) * 2008-09-18 2010-04-02 Fujitsu Microelectronics Ltd 半導体ウェーハ用治具及び半導体装置の製造方法
JP2013041908A (ja) * 2011-08-12 2013-02-28 Disco Abrasive Syst Ltd 光デバイスウェーハの分割方法
JP2013247130A (ja) * 2012-05-23 2013-12-09 Disco Abrasive Syst Ltd ウェーハの分割方法

Also Published As

Publication number Publication date
CN109300843A (zh) 2019-02-01
TWI761558B (zh) 2022-04-21
JP2019029368A (ja) 2019-02-21
JP6935257B2 (ja) 2021-09-15
TW201909336A (zh) 2019-03-01
KR20190011675A (ko) 2019-02-07
KR102561376B1 (ko) 2023-07-28

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