CN109273370A - 汽车发电机用整流二极管芯片封装方法 - Google Patents

汽车发电机用整流二极管芯片封装方法 Download PDF

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CN109273370A
CN109273370A CN201810935457.XA CN201810935457A CN109273370A CN 109273370 A CN109273370 A CN 109273370A CN 201810935457 A CN201810935457 A CN 201810935457A CN 109273370 A CN109273370 A CN 109273370A
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chip
diode
scolding tin
pedestal
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黄永
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Jiangsu Yunyi Electric Co Ltd
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Jiangsu Yunyi Electric Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H01L2224/331Disposition
    • H01L2224/3318Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/33181On opposite sides of the body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

本发明公开了一种汽车发电机用整流二极管芯片封装方法,由底座、芯片、二极管引线、耐高温热固性塑料组成,是通过如下步骤实现的:将芯片放在涂有焊锡料的底座上并在芯片上表面再涂上焊锡料;将二极管引线的端部焊接面通过焊锡料与芯片贴合,放入高温炉内加热使焊锡料熔化将底座、芯片和引线焊接在一起,焊接完成后,将二极管放入塑料模具内,使用注塑机采用注塑成型工艺将耐高温热固性塑料注入模具型腔内,将二极管芯片密封起来,最后将模具打开,即可制作出汽车发电机用压装式整流二极管。其优点是:从而提高二极管生产效率;避免产生有害气体;同时也避免了二极管芯片因密封材料热膨胀产生的应力作用而失效。

Description

汽车发电机用整流二极管芯片封装方法
技术领域
本发明涉及一种二极管,尤其是一种汽车发电机用整流二极管芯片封装方法。
背景技术
现有技术条件下的压装式整流二极管其结构主要由底座,芯片,引线,塑料环、环氧树脂密封胶组成。制作过程是将芯片放在涂有焊锡料的底座上并在芯片上表面再涂上焊锡料,将二极管引线的端部焊接面通过焊锡料与芯片贴合,放入高温炉内加热使焊锡料熔化将底座芯片和引线焊接在一起,然后将塑料环套在底座上,往塑料环内注满环氧树脂密封胶,再放入高温炉内将环氧树脂密封胶固化,固化后即可制作成汽车发电机用压装式整流二极管。该结构在实际应用中存在以下问题:二极管生产过程中工序太多,生产效率低。
灌注环氧密树脂封胶后需高温烘烤才能使环氧树脂密封胶固化,造成电能浪费同时产生有害气体,危害工人健康,污染空气。
塑料环套在底座上是人工操作,装配的一致性较差,经常出现塑料环装配不到位导致环氧树脂密封胶从塑料环周围渗出或溢出,造成二极管报废。
当二极管工作时会产生高温,固化后的环氧树脂密封胶热膨胀系数与底座的热膨胀系数相差较大,两种材料受热膨胀后产生的应力积聚在二极管芯片上,由于芯片是较薄、较脆弱的硅半导体,积聚在芯片上应力经常会导致芯片破裂,从而造成发电机不能正常工作,影响汽车正常行驶。
发明内容
本发明主要目的是克服已有技术的不足,提供一种汽车发电机用整流二极管芯片封装方法,该方法在二极管制造过程中不再使用塑料环,不再灌注环氧密封胶,而是将焊接完成的二极管放入塑料模具内,使用注塑机采用注塑成型的方法将耐高温热固性塑料注入塑料模具内,将二极管芯片密封起来,从而提高二极管生产效率;避免产生有害气体;同时也避免了二极管芯片因密封材料热膨胀产生的应力作用而失效,为汽车的正常行驶提供保障。
本发明是这样实现的:一种汽车发电机用整流二极管芯片封装方法,由底座、芯片、二极管引线、耐高温热固性塑料组成,是通过如下步骤实现的:将芯片放在涂有焊锡料的底座上并在芯片上表面再涂上焊锡料;将二极管引线的端部焊接面通过焊锡料与芯片贴合,放入高温炉内加热使焊锡料熔化将底座、芯片和引线焊接在一起,焊接完成后,将二极管放入塑料模具内,使用注塑机采用注塑成型工艺将耐高温热固性塑料注入模具型腔内,将二极管芯片密封起来,最后将模具打开,即可制作出汽车发电机用压装式整流二极管。
本发明与现有技术相比具有以下优点:
在二极管制造过程中不再使用塑料环,不再灌注环氧密封胶,不用再为了使环氧树脂密封胶固化而烘烤,减少了二极管零件装配数量,减少了生产工序,提高了生产效率。
同时,因不再烘烤环氧树脂密封胶而避免了有害气体的产生,避免了有害气体对工人健康的危害和对大气的污染。
将焊接完成的二极管放入塑料模具内,使用注塑成型工艺将耐高温热固性塑料注入模具将二极管芯片密封起来,外观和尺寸靠模具保证,所以一致性特别好。避免了现有技术状态下塑料环装配一致性差导致渗胶或溢胶造成二极管报废的问题。
选用的耐高温热固性塑料热膨胀系数与二极管底座的热膨胀系数相近,两种材料受热膨胀后产生的应力较小,避免了应力对二极管芯片的损害,从而保证二极管能够在高温下持续稳定的工作,为汽车的正常行驶提供保障。
附图说明
下面结合附图及实施例对本发明作进一步说明。
图1为现有技术状态下发电机用压装式整流二极管装配主视图。
图2 为现有技术状态下发电机用压装式整流二极管A-A剖面图。
图3为本发明状态下发电机用压装式整流二极管装配主视图。
图4为本发明状态下发电机用压装式整流二极管B-B剖面图。
图中:1是二极管引线,2是密封胶,3是保护圈,4是芯片,5是底座,6是耐高温热固性塑料。
具体实施方式
参照图3和图4中,本发明涉及一种汽车发电机用整流二极管芯片封装方法,由底座5、芯片4、引线1、耐高温热固性塑料6组成,通过如下步骤进行的:将芯片4放在涂有焊锡料的底座5上并在芯片4上表面再涂上焊锡料,将二极管引线1的端部焊接面通过焊锡料与芯片4贴合,放入高温炉内加热使焊锡料熔化将底座5、芯片4和二极管引线1焊接在一起,焊接完成后,将二极管放入塑料模具内,使用注塑机采用注塑成型工艺将耐高温热固性塑料6注入模具型腔内,将芯片4密封起来,最后将模具打开,即可制作出本发明状态下的汽车发电机用压装式整流二极管。

Claims (1)

1.一种汽车发电机用整流二极管芯片封装方法,由底座、芯片、二极管引线、耐高温热固性塑料组成,其特征在于:是通过如下步骤实现的:将芯片放在涂有焊锡料的底座上并在芯片上表面再涂上焊锡料;将二极管引线的端部焊接面通过焊锡料与芯片贴合,放入高温炉内加热使焊锡料熔化将底座、芯片和引线焊接在一起,焊接完成后,将二极管放入塑料模具内,使用注塑机采用注塑成型工艺将耐高温热固性塑料注入模具型腔内,将二极管芯片密封起来,最后将模具打开,即可制作出汽车发电机用压装式整流二极管。
CN201810935457.XA 2018-08-16 2018-08-16 汽车发电机用整流二极管芯片封装方法 Withdrawn CN109273370A (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022021094A1 (zh) * 2020-07-28 2022-02-03 华为技术有限公司 一种功率模块及制备模具、设备

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101719473A (zh) * 2009-12-07 2010-06-02 昆山晨伊半导体有限公司 环氧塑封压入式汽车整流二极管的制造方法
CN203312417U (zh) * 2013-07-02 2013-11-27 国家电网公司 一种塑封动力电池均衡模块
CN104299917A (zh) * 2014-09-25 2015-01-21 江苏云意电气股份有限公司 一种汽车发电机二极管芯片与底座的制作安装工艺

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101719473A (zh) * 2009-12-07 2010-06-02 昆山晨伊半导体有限公司 环氧塑封压入式汽车整流二极管的制造方法
CN203312417U (zh) * 2013-07-02 2013-11-27 国家电网公司 一种塑封动力电池均衡模块
CN104299917A (zh) * 2014-09-25 2015-01-21 江苏云意电气股份有限公司 一种汽车发电机二极管芯片与底座的制作安装工艺

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022021094A1 (zh) * 2020-07-28 2022-02-03 华为技术有限公司 一种功率模块及制备模具、设备

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