CN104299917A - 一种汽车发电机二极管芯片与底座的制作安装工艺 - Google Patents

一种汽车发电机二极管芯片与底座的制作安装工艺 Download PDF

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CN104299917A
CN104299917A CN201410496021.7A CN201410496021A CN104299917A CN 104299917 A CN104299917 A CN 104299917A CN 201410496021 A CN201410496021 A CN 201410496021A CN 104299917 A CN104299917 A CN 104299917A
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base
chip
diode
manufacturing
installing process
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黄永
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Jiangsu Yunyi Electric Co Ltd
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Jiangsu Yunyi Electric Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Synchronous Machinery (AREA)

Abstract

本发明公开了一种汽车发电机二极管芯片与底座的制作安装工艺，是通过如下步骤进行的：先制作二极管底座时将无氧铜棒料放入冷镦模具内镦压成型，形成上部分为六边形，下部为圆柱形的结构，再用自动搓丝机加工出螺纹便形成完整的底座。然后将芯片放在涂有焊锡料的底座上并在芯片上表面再涂上焊锡料；其次在芯片放上二极管引线，放入高温炉内加热使焊锡料熔化将底座、芯片、和引线焊接在一起；将密封胶注入底座固化后即可。其优点是：该工艺有效的避免了产生损坏芯片的装配应力和解决了二极管装配脱落的问题，大大提高了整流器和汽车发电机的可靠性和行车的安全性。

Description

一种汽车发电机二极管芯片与底座的制作安装工艺
技术领域
本发明涉及一种二极管，尤其是一种汽车发电机二极管芯片与底座的制作安装工艺。 
背景技术
从汽车应用方面来讲，汽车发动机和发电机运行时均会产生高温和振动，汽车发电机上的整流器零件便会受热膨胀，与二极管挤压连接在一起的整流器散热板受热膨胀会产生很大的应力，并且聚积在二极管底座上，如果安装当，使聚积在二极管底座上的应力便会传递到芯片上，膨胀应力和振动共同作用在芯片上极易导致芯片破裂，使整个整流器失效，发电机不能正常工作。 
发明内容
发明主要目的在于解决现有汽车发电机用压装式整流二极管因挤压装配导致的两种失效模式，提供一种汽车发电机二极管芯片与底座的制作安装工艺。该工艺有效的避免了产生损坏芯片的装配应力和解决了二极管装配脱落的问题，大大提高了整流器和汽车发电机的可靠性和行车的安全性。
本发明的技术方案是：一种汽车发电机二极管芯片与底座的制作安装工艺是通过如下步骤进行的：（1）先制作二极管底座时将无氧铜棒料放入冷镦模具内镦压成型，形成上部分为六边形，下部为圆柱形的结构，再用自动搓丝机加工出螺纹便形成完整的底座。 
（2）将芯片放在涂有焊锡料的底座上并在芯片上表面再涂上焊锡料； 
（3）在芯片放上二极管引线，放入高温炉内加热使焊锡料熔化将底座、芯片、和引线焊接在一起； 
（4）将密封胶注入底座固化后即可。 
本发明的有益效果是：该工艺有效的避免了产生损坏芯片的装配应力和解决了二极管装配脱落的问题，大大提高了整流器和汽车发电机的可靠性和行车的安全性。 
附图说明
下面结合附图及实施例对本发明作进一步说明。 
图1本发明的结构示意图。  
图中：1是引线，2是密封胶，3是芯片，4是底座。
具体实施方式
参照图1中，本发明制作二极管底座4时将无氧铜棒料放入冷镦模具内镦压成型，形成上部分为六边形，下部为圆柱形的结构，再用自动搓丝机加工出螺纹便形成完整的底座。将芯片3放在涂有焊锡料的底座4上并在芯片3上表面再涂上焊锡料，在芯片放上二极管引线1，放入高温炉内加热使焊锡料熔化将底座4、芯片3、和引线1焊接在一起，然后将密封胶2注入底座4固化后即可。

Claims (1)

1.一种汽车发电机二极管芯片与底座的制作安装工艺，其特征是：通过如下步骤进行的：（1）先制作二极管底座时将无氧铜棒料放入冷镦模具内镦压成型，形成上部分为六边形，下部为圆柱形的结构，再用自动搓丝机加工出螺纹便形成完整的底座；
（2）将芯片放在涂有焊锡料的底座上并在芯片上表面再涂上焊锡料； 
（3）在芯片放上二极管引线，放入高温炉内加热使焊锡料熔化将底座、芯片、和引线焊接在一起； 
（4）将密封胶注入底座固化后即可。
CN201410496021.7A 2014-09-25 2014-09-25 一种汽车发电机二极管芯片与底座的制作安装工艺 Pending CN104299917A (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107039385A (zh) * 2017-05-19 2017-08-11 康宏裕 钼电极用铜包钢引线及其制作工艺
CN109273370A (zh) * 2018-08-16 2019-01-25 江苏云意电气股份有限公司 汽车发电机用整流二极管芯片封装方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107039385A (zh) * 2017-05-19 2017-08-11 康宏裕 钼电极用铜包钢引线及其制作工艺
CN107039385B (zh) * 2017-05-19 2023-06-02 康宏裕 钼电极用铜包钢引线及其制作工艺
CN109273370A (zh) * 2018-08-16 2019-01-25 江苏云意电气股份有限公司 汽车发电机用整流二极管芯片封装方法

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Application publication date: 20150121