CN107039385B - 钼电极用铜包钢引线及其制作工艺 - Google Patents

钼电极用铜包钢引线及其制作工艺 Download PDF

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CN107039385B
CN107039385B CN201710354724.XA CN201710354724A CN107039385B CN 107039385 B CN107039385 B CN 107039385B CN 201710354724 A CN201710354724 A CN 201710354724A CN 107039385 B CN107039385 B CN 107039385B
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康宏裕
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Abstract

本发明涉及电子元器件用接电电线的技术领域，尤其是一种钼电极用铜包钢引线及其制作工艺，所述的引线为将铜包钢引线至少一端冷镦成型为头部较粗的引线，且较粗头部的钢线在镦粗后仍被外部镦粗后的铜皮包住；制作工艺具有在冷镦机上的切断和冷镦头部的过程；所述的切断过程是利用具有摆动剪刀式双动刀头的冷镦机对铜包钢引线进行剪断的过程，该过程使铜包钢引线的剪口部在呈尖状状态下由外圈的铜皮塑性变形至将芯部的钢线包住；所述的冷镦头部的过程是将头部的钢线和铜皮同时镦粗后因剪断时剪口尖状部铜皮的存在而使内部的钢线仍被外部的铜皮包住。本发明的一种钼电极用铜包钢引线及其制作工艺，使二极管组件便于加工。

Description

钼电极用铜包钢引线及其制作工艺
技术领域
本发明涉及电子元器件用接电电线的技术领域，尤其是一种钼电极用铜包钢引线及其制作工艺。
背景技术
目前有一种适用于环境温度变化很大的二极管组件，具体结构见图1，它具有芯片2、钼电极1、引线和玻璃封壳3，芯片2的两极以钼作为电极，钼电极1与铜引线4焊接连接，在芯片2与两钼电极1外包裹着起绝缘和保护作用的玻璃封壳3，使用钼作为电极材料的原因是钼的膨胀系数与二极管芯片材料以及玻璃封壳3的膨胀系数相近，这样三者结合后可以保证在环境温度变化大的情况下仍能牢固的组合在一起。
上述二极管组件的制作过程是：一、将铜引线4与钼电极1一端进行焊接，其中铜引线4的接触部被冷镦成较大直径的头部，以增加两者的接触面积；二、将钼电极1的另一端与芯片2焊接；三、以铜引线4作为支撑，在600度以上的玻璃熔化温度下包裹上玻璃封壳3。
现有的问题是，铜引线4是纯铜材料，其在600度以上高温时会变软，这样，以铜引线4作为支撑包裹玻璃封壳3时，包裹的玻璃封壳3封装质量变得难以控制。
发明内容
本发明要解决的技术问题是：克服现有技术中之不足，提供一种钼电极用铜包钢引线及其制作工艺，使二极管组件便于加工。
本发明解决其技术问题所采用的技术方案是：一种钼电极用铜包钢引线，所述的引线为将铜包钢引线至少一端冷镦成型为头部较粗的引线，且较粗头部的钢线在镦粗后仍被外部镦粗后的铜皮包住。
本方案虽然是一种看似简单的材料替换，现有技术中本领域技术人员有可能会想到使用铜包钢引线，但却同时也会想到引线需要头部镦粗，钢线必然会裸露在外，这样在与钼电极焊连后，引线的导电性能就会变差，所以现有技术中一直没有出现这样的铜包钢引线，本技术方案相当于克服了一种技术偏见，当然，发明人的贡献还在于提出了下述的一种制作工艺。
一种制作钼电极用铜包钢引线的工艺，具有在冷镦机上的切断和冷镦头部的过程；
所述的切断过程是利用具有摆动剪刀式双动刀头的冷镦机对铜包钢引线进行剪断的过程，该过程使铜包钢引线的剪口部在呈尖状状态下由外圈的铜皮塑性变形至将芯部的钢线包住；
所述的冷镦头部的过程是将头部的钢线和铜皮同时镦粗后因剪断时剪口尖状部铜皮的存在而使内部的钢线仍被外部的铜皮包住。
该制作工艺的方案是着眼于对现有冷镦机的改造，使铜包钢引线被剪断而不是被切断，将原冷镦机的单个直线运动的切刀改成两个摆动运动的剪刀，从而改变线材断口的形状，满足了后续镦粗头部时，外部的铜皮仍能将内部的钢线完全包覆住。
本发明的有益效果是：本发明使用刚度较好的铜包钢引线替代铜引线作为钼电极引线，使二极管组件制作方便，组件中各零件的连接牢固，组件使用寿命长，实际产品试用过程也确实获得了高要求客户的认可。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请中记载的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是现有二极管组件的结构示意图；
图2是现有冷镦机切断引线的示意图。
图1和图2中的标号为：1、钼电极；2、芯片；3、玻璃封壳；4、铜引线；5、切刀；6、冷镦机。
图3是使用本发明的钼电极用铜包钢引线的二极管组件的结构示意图；
图4是本发明中冷镦机剪断引线的示意图；
图5是本发明中钼电极用铜包钢引线被摆动剪刀式双动刀头的冷镦机剪断后的结构示意图。
图3、图4和图5中的标号为：1、钼电极；2、芯片；3、玻璃封壳；4、钢线；5、铜皮；6、刀头；7、冷镦机。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
见图3、图4和图5，本发明的一种钼电极用铜包钢引线，引线为将铜包钢引线至少一端冷镦成型为头部较粗的引线，且较粗头部的钢线4在镦粗后仍被外部镦粗后的铜皮5包住。
因铜包钢引线中的铜皮5完全包覆住内部的钢线4，故当铜包钢引线与钼电极1焊连后，铜包钢引线的导电性能很好。另外，因铜包钢引线的刚度较好，在600度以上高温时不会变软，故将铜包钢引线作为钼电极1的引线，铜包钢引线作为支撑包裹玻璃封壳3时，包裹的玻璃封壳3的封装质量很容易得到控制和保证，使二极管组件制作方便，组件中各零件连接牢固，组件使用寿命长。
该钼电极用铜包钢引线的制作工艺，具有在冷镦机7上的切断和冷镦头部的过程。切断过程是利用具有摆动剪刀式双动刀头6的冷镦机7对铜包钢引线进行剪断的过程，该过程使铜包钢引线的剪口部在呈尖状状态下由外圈的铜皮5塑性变形至将芯部的钢线4包住。冷镦头部的过程是将头部的钢线4和铜皮5同时镦粗后因剪断时剪口尖状部铜皮5的存在而使内部的钢线4仍被外部的铜皮5包住。
该制作工艺中的冷镦机7用来剪断铜包钢引线，而不是切断铜包钢引线，并且运用两个摆动运动的刀头6来改变线材断口的形状，满足后续镦粗头部时，外部的铜皮5仍能将内部的钢线4完全包覆住。
以上所述，仅为本发明较佳的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，根据本发明的技术方案及其发明构思加以等同替换或改变，都应涵盖在本发明的保护范围之内。

Claims (2)

1.一种制作钼电极用铜包钢引线的工艺，其特征在于：具有在冷镦机（7）上的切断和冷镦头部的过程；
所述的切断过程是利用具有摆动剪刀式双动刀头（6）的冷镦机（7）对铜包钢引线进行剪断的过程，该过程使铜包钢引线的剪口部在呈尖状状态下由外圈的铜皮（5）塑性变形至将芯部的钢线（4）包住；
所述的冷镦头部的过程是将头部的钢线（4）和铜皮（5）同时镦粗后因剪断时剪口尖状部铜皮（5）的存在而使内部的钢线（4）仍被外部的铜皮（5）包住。
2.一种根据权利要求1所述工艺制备的钼电极用铜包钢引线，其特征在于：所述的引线为将铜包钢引线至少一端由双动刀头剪成尖状并冷镦成型为头部较粗的引线，且较粗头部的钢线（4）在镦粗后仍被外部镦粗后的铜皮（5）包住。
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