CN109219329A - 电路板的制造方法 - Google Patents
电路板的制造方法 Download PDFInfo
- Publication number
- CN109219329A CN109219329A CN201710526430.0A CN201710526430A CN109219329A CN 109219329 A CN109219329 A CN 109219329A CN 201710526430 A CN201710526430 A CN 201710526430A CN 109219329 A CN109219329 A CN 109219329A
- Authority
- CN
- China
- Prior art keywords
- layer
- hole
- conductive part
- manufacturing
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
预制板 | 10 |
绝缘层 | 11 |
电路层 | 12 |
电路结构 | 121 |
间隙 | 122 |
电磁屏蔽膜 | 20 |
胶合层 | 21 |
金属层 | 22 |
上表面 | 22a |
贯穿孔 | 23 |
内壁 | 23a,30a |
底壁 | 23b,30b |
导电部 | 30 |
上表面 | 30c |
保护膜 | 40 |
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710526430.0A CN109219329B (zh) | 2017-06-30 | 2017-06-30 | 电路板的制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710526430.0A CN109219329B (zh) | 2017-06-30 | 2017-06-30 | 电路板的制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109219329A true CN109219329A (zh) | 2019-01-15 |
CN109219329B CN109219329B (zh) | 2021-02-09 |
Family
ID=64976182
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710526430.0A Active CN109219329B (zh) | 2017-06-30 | 2017-06-30 | 电路板的制造方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109219329B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114205997A (zh) * | 2021-12-27 | 2022-03-18 | 武汉华星光电半导体显示技术有限公司 | 柔性电路板及显示模组 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1456030A (zh) * | 2001-01-30 | 2003-11-12 | 松下电器产业株式会社 | 叠层用双面电路板、其制法及用其的多层印刷电路板 |
CN101909399A (zh) * | 2009-06-04 | 2010-12-08 | 晟铭电子科技股份有限公司 | 电路板结构及其制造方法 |
CN102209428A (zh) * | 2010-03-29 | 2011-10-05 | 富葵精密组件(深圳)有限公司 | 具有电磁屏蔽结构的电路板 |
CN104427744A (zh) * | 2013-08-30 | 2015-03-18 | 富葵精密组件(深圳)有限公司 | 电路板及其制作方法 |
CN104837301A (zh) * | 2014-02-12 | 2015-08-12 | 富葵精密组件(深圳)有限公司 | 具有屏蔽结构的柔性电路板及其制作方法 |
US9301405B1 (en) * | 2015-01-26 | 2016-03-29 | Kinsus Interconnect Technology Corp. | Method for manufacturing microthrough-hole in circuit board and circuit board structure with microthrough-hole |
CN205793608U (zh) * | 2016-05-26 | 2016-12-07 | 东莞联桥电子有限公司 | 一种防止焊脚被氧化的电路板 |
-
2017
- 2017-06-30 CN CN201710526430.0A patent/CN109219329B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1456030A (zh) * | 2001-01-30 | 2003-11-12 | 松下电器产业株式会社 | 叠层用双面电路板、其制法及用其的多层印刷电路板 |
CN101909399A (zh) * | 2009-06-04 | 2010-12-08 | 晟铭电子科技股份有限公司 | 电路板结构及其制造方法 |
CN102209428A (zh) * | 2010-03-29 | 2011-10-05 | 富葵精密组件(深圳)有限公司 | 具有电磁屏蔽结构的电路板 |
CN104427744A (zh) * | 2013-08-30 | 2015-03-18 | 富葵精密组件(深圳)有限公司 | 电路板及其制作方法 |
CN104837301A (zh) * | 2014-02-12 | 2015-08-12 | 富葵精密组件(深圳)有限公司 | 具有屏蔽结构的柔性电路板及其制作方法 |
US9301405B1 (en) * | 2015-01-26 | 2016-03-29 | Kinsus Interconnect Technology Corp. | Method for manufacturing microthrough-hole in circuit board and circuit board structure with microthrough-hole |
CN205793608U (zh) * | 2016-05-26 | 2016-12-07 | 东莞联桥电子有限公司 | 一种防止焊脚被氧化的电路板 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114205997A (zh) * | 2021-12-27 | 2022-03-18 | 武汉华星光电半导体显示技术有限公司 | 柔性电路板及显示模组 |
CN114205997B (zh) * | 2021-12-27 | 2023-08-01 | 武汉华星光电半导体显示技术有限公司 | 柔性电路板及显示模组 |
Also Published As
Publication number | Publication date |
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CN109219329B (zh) | 2021-02-09 |
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TA01 | Transfer of patent application right |
Effective date of registration: 20190114 Address after: 223065 No. 11 Honghai North Road, Huaian Economic and Technological Development Zone, Jiangsu Province Applicant after: Qing Ding precision electronic (Huaian) Co., Ltd. Applicant after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Address before: 518105 Yanchuan Yanluo Road, Songgang Street, Baoan District, Shenzhen City, Guangdong Province Applicant before: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. |
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