CN109155234B - 具有辐照固化透镜的处理腔室 - Google Patents

具有辐照固化透镜的处理腔室 Download PDF

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Publication number
CN109155234B
CN109155234B CN201780030199.4A CN201780030199A CN109155234B CN 109155234 B CN109155234 B CN 109155234B CN 201780030199 A CN201780030199 A CN 201780030199A CN 109155234 B CN109155234 B CN 109155234B
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CN
China
Prior art keywords
substrate
processing chamber
lens
features
reflector
Prior art date
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Active
Application number
CN201780030199.4A
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English (en)
Chinese (zh)
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CN109155234A (zh
Inventor
O·特雷霍
R·萨卡拉克利施纳
T-J·龚
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Applied Materials Inc
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Applied Materials Inc
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Publication of CN109155234A publication Critical patent/CN109155234A/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
    • H10P14/6516—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials
    • H10P14/6536—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to radiation, e.g. visible light
    • H10P14/6538—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to radiation, e.g. visible light by exposure to UV light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/56—After-treatment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/02—Simple or compound lenses with non-spherical faces
    • G02B3/08—Simple or compound lenses with non-spherical faces with discontinuous faces, e.g. Fresnel lens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0095—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with ultraviolet radiation

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Surface Treatment Of Optical Elements (AREA)
CN201780030199.4A 2016-05-26 2017-05-26 具有辐照固化透镜的处理腔室 Active CN109155234B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/165,930 US10541159B2 (en) 2016-05-26 2016-05-26 Processing chamber with irradiance curing lens
US15/165,930 2016-05-26
PCT/US2017/034622 WO2017205714A1 (en) 2016-05-26 2017-05-26 Processing chamber with irradiance curing lens

Publications (2)

Publication Number Publication Date
CN109155234A CN109155234A (zh) 2019-01-04
CN109155234B true CN109155234B (zh) 2023-08-22

Family

ID=60411566

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780030199.4A Active CN109155234B (zh) 2016-05-26 2017-05-26 具有辐照固化透镜的处理腔室

Country Status (5)

Country Link
US (1) US10541159B2 (https=)
JP (1) JP6902053B2 (https=)
KR (1) KR102171712B1 (https=)
CN (1) CN109155234B (https=)
WO (1) WO2017205714A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117242560A (zh) * 2021-04-29 2023-12-15 应用材料公司 用于快速热处理腔室的窗

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09326346A (ja) * 1996-06-04 1997-12-16 Matsushita Electron Corp 紫外線照射装置およびその照射方法
US6862404B1 (en) * 2003-09-08 2005-03-01 Wafermasters Focused photon energy heating chamber
JP2007317991A (ja) * 2006-05-29 2007-12-06 Advanced Lcd Technologies Development Center Co Ltd 半導体装置の製造方法並びに薄膜トランジスタ
CN102136411A (zh) * 2006-03-17 2011-07-27 应用材料股份有限公司 紫外固化系统
KR20130112549A (ko) * 2012-04-04 2013-10-14 박흥균 자외선 경화장치용 광학모듈
CN103456661A (zh) * 2012-06-01 2013-12-18 台湾积体电路制造股份有限公司 用于半导体的uv固化系统
JP2015126044A (ja) * 2013-12-26 2015-07-06 ウシオ電機株式会社 真空紫外光照射処理装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4755654A (en) * 1987-03-26 1988-07-05 Crowley John L Semiconductor wafer heating chamber
JPH03277774A (ja) * 1990-03-27 1991-12-09 Semiconductor Energy Lab Co Ltd 光気相反応装置
US6809012B2 (en) * 2001-01-18 2004-10-26 Semiconductor Energy Laboratory Co., Ltd. Method of making a thin film transistor using laser annealing
US6547422B2 (en) * 2001-08-08 2003-04-15 Prokia Technology Co., Ltd. Illuminating module for a display apparatus
US6879777B2 (en) 2002-10-03 2005-04-12 Asm America, Inc. Localized heating of substrates using optics
US8980769B1 (en) * 2005-04-26 2015-03-17 Novellus Systems, Inc. Multi-station sequential curing of dielectric films
US8137465B1 (en) * 2005-04-26 2012-03-20 Novellus Systems, Inc. Single-chamber sequential curing of semiconductor wafers
JP2007229682A (ja) 2006-03-03 2007-09-13 Harison Toshiba Lighting Corp 紫外線照射装置
US7851232B2 (en) * 2006-10-30 2010-12-14 Novellus Systems, Inc. UV treatment for carbon-containing low-k dielectric repair in semiconductor processing
JP5282669B2 (ja) * 2009-06-12 2013-09-04 ウシオ電機株式会社 光照射装置
US8309421B2 (en) * 2010-11-24 2012-11-13 Applied Materials, Inc. Dual-bulb lamphead control methodology
KR20160086993A (ko) 2011-10-14 2016-07-20 크루서블 인텔렉츄얼 프라퍼티 엘엘씨. 일렬식 온도 제어 용융을 위한 봉쇄 게이트
US9905444B2 (en) 2012-04-25 2018-02-27 Applied Materials, Inc. Optics for controlling light transmitted through a conical quartz dome

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09326346A (ja) * 1996-06-04 1997-12-16 Matsushita Electron Corp 紫外線照射装置およびその照射方法
US6862404B1 (en) * 2003-09-08 2005-03-01 Wafermasters Focused photon energy heating chamber
CN102136411A (zh) * 2006-03-17 2011-07-27 应用材料股份有限公司 紫外固化系统
JP2007317991A (ja) * 2006-05-29 2007-12-06 Advanced Lcd Technologies Development Center Co Ltd 半導体装置の製造方法並びに薄膜トランジスタ
KR20130112549A (ko) * 2012-04-04 2013-10-14 박흥균 자외선 경화장치용 광학모듈
CN103456661A (zh) * 2012-06-01 2013-12-18 台湾积体电路制造股份有限公司 用于半导体的uv固化系统
JP2015126044A (ja) * 2013-12-26 2015-07-06 ウシオ電機株式会社 真空紫外光照射処理装置

Also Published As

Publication number Publication date
US20170345649A1 (en) 2017-11-30
JP2019518594A (ja) 2019-07-04
CN109155234A (zh) 2019-01-04
KR20180136577A (ko) 2018-12-24
KR102171712B1 (ko) 2020-10-29
WO2017205714A1 (en) 2017-11-30
JP6902053B2 (ja) 2021-07-14
US10541159B2 (en) 2020-01-21

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