JP2019518594A - 照射硬化レンズを備える処理チャンバ - Google Patents
照射硬化レンズを備える処理チャンバ Download PDFInfo
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- JP2019518594A JP2019518594A JP2018560940A JP2018560940A JP2019518594A JP 2019518594 A JP2019518594 A JP 2019518594A JP 2018560940 A JP2018560940 A JP 2018560940A JP 2018560940 A JP2018560940 A JP 2018560940A JP 2019518594 A JP2019518594 A JP 2019518594A
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- 238000003847 radiation curing Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 claims abstract description 100
- 238000000034 method Methods 0.000 claims description 9
- 239000010408 film Substances 0.000 description 11
- 238000003848 UV Light-Curing Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 238000005286 illumination Methods 0.000 description 4
- 238000001723 curing Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910018540 Si C Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
- H01L21/02345—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to radiation, e.g. visible light
- H01L21/02348—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to radiation, e.g. visible light treatment by exposure to UV light
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/56—After-treatment
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/02—Simple or compound lenses with non-spherical faces
- G02B3/08—Simple or compound lenses with non-spherical faces with discontinuous faces, e.g. Fresnel lens
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0095—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with ultraviolet radiation
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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- Optics & Photonics (AREA)
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- Health & Medical Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
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- Surface Treatment Of Optical Elements (AREA)
Abstract
【選択図】図1
Description
[0002] 酸化ケイ素、炭化ケイ素及び炭素がドープされた酸化ケイ素膜などのシリコン含有材料は、半導体デバイスの製造に頻繁に利用される。シリコン含有膜は様々な堆積プロセスによって半導体基板上に堆積される。その一例が化学気相堆積(CVD)である。例えば、半導体基板はCVDチャンバ内に配置されてよく、シリコン含有化合物は、反応して、基板上に酸化ケイ素膜を堆積するため、酸素源に沿って供給されうる。他の実施例では、Si−C結合を有する膜を堆積するため、有機シリコン源が使用されうる。CVDプロセスによって作られる膜層はまた、複合膜を形成するためスタックされてもよい。幾つかのプロセスでは、堆積プロセスによって作られる膜又は膜層を硬化、圧縮、及び/又はその内部応力を緩和するため、紫外線(UV)照射が利用されうる。また、水などの副生成物、有機フラグメント、或いは望ましくない結合が軽減又は除去される。CVD膜の硬化及び圧縮のためのUV照射の利用はまた、個々のウエハの熱履歴(thermal budget)の総量を低減し、製造プロセスを迅速化することができる。
Claims (20)
- 処理チャンバの内部空間であって、第1の領域と第2の領域を有する内部空間を画定するチャンバ本体と、
前記第2の領域内に配置された基板支持アセンブリであって、基板を支持するように構成された基板支持アセンブリと、
前記第1の領域内の前記基板支持アセンブリの上方に配置された光源と、
前記光源と前記基板支持アセンブリとの間に配置されたレンズであって、前記基板支持アセンブリの上に配置されたとき、前記光源からの光を前記基板上の関心領域へ選択的に配向するように構成されている、内部に形成された複数の特徴を有するレンズと
を備える処理チャンバ。 - 前記複数の特徴は前記レンズの本体まで外へ向かって形成される、請求項1に記載の処理チャンバ。
- 前記複数の特徴は、前記基板が前記基板支持アセンブリの上に配置されたとき、光を前記基板の外部領域又は内部領域へ選択的に配向するように選択される深さ、間隔、及び角度を含む、請求項1に記載の処理チャンバ。
- 前記複数の特徴は前記レンズに刻印される、請求項1に記載の処理チャンバ。
- 前記レンズは約1インチの厚みを有する、請求項1に記載の処理チャンバ。
- 前記特徴は同心である、請求項1に記載の処理チャンバ。
- 前記レンズは本体を含み、前記レンズの前記特徴は前記本体に少なくとも部分的に形成される、請求項1に記載の処理チャンバ。
- 処理チャンバの内部空間であって、第1の領域と第2の領域を有する内部空間を画定するチャンバ本体と、
前記第2の領域内に配置された基板支持アセンブリであって、基板を支持するように構成された基板支持アセンブリと、
前記第1の領域内の基板支持アセンブリの上方に配置された光源と、
前記第1の領域内に配置された一次リフレクタであって、前記光源を少なくとも部分的に取り囲む一次リフレクタと、
前記一次リフレクタの下方かつ前記基板支持アセンブリの上方の前記第1の領域に配置された二次リフレクタであって、前記光源からの光を前記基板の表面へ導くように構成された二次リフレクタと、
前記光源と前記基板支持アセンブリとの間に配置されたレンズであって、前記基板支持アセンブリの上に配置されたとき、前記二次リフレクタからの光を前記基板上の関心領域へ選択的に配向するように構成されている、内部に形成された複数の特徴を有するレンズと
を備える処理チャンバ - 前記複数の特徴は、前記レンズの本体まで外へ向かって形成される、請求項8に記載の処理チャンバ。
- 前記複数の特徴は、前記基板支持アセンブリの上に配置されたとき、光を前記基板の外部領域又は内部領域へ選択的に配向するように選択される深さ、間隔、及び角度を含む、請求項8に記載の処理チャンバ。
- 前記複数の特徴は前記レンズに刻印される、請求項8に記載の処理チャンバ。
- 前記レンズは前記二次リフレクタに隣接して配置される、請求項8に記載の処理チャンバ。
- 前記レンズは前記一次リフレクタの下方に配置される、請求項8に記載の処理チャンバ。
- 前記レンズは本体を含み、前記レンズの前記特徴は前記本体に少なくとも部分的に形成される、請求項8に記載の処理チャンバ。
- 前記二次リフレクタは、前記基板の直径よりも小さい直径を有する、請求項8に記載の処理チャンバ。
- 前記レンズは前記二次リフレクタの前記直径よりも大きい直径を有する、請求項15に記載の処理チャンバ。
- 前記レンズの前記直径は前記基板の前記直径よりも大きい、請求項16に記載の処理チャンバ。
- 前記複数の特徴は前記二次リフレクタの前記直径の外側の領域に形成される、請求項15に記載の処置チャンバ。
- 基板を硬化する方法であって、
処理チャンバの内部空間に紫外(UV)光を提供することと、
前記UV光をリフレクタによって導くことと、
基板上の関心領域に向かって内部に形成される複数の特徴を有するレンズによって、前記導かれたUV光を配向することと
を含む方法。 - 前記配向されたUV光に曝露することによって、前記基板の上に形成された膜の特性を変えることを更に含む、請求項19に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/165,930 US10541159B2 (en) | 2016-05-26 | 2016-05-26 | Processing chamber with irradiance curing lens |
US15/165,930 | 2016-05-26 | ||
PCT/US2017/034622 WO2017205714A1 (en) | 2016-05-26 | 2017-05-26 | Processing chamber with irradiance curing lens |
Publications (3)
Publication Number | Publication Date |
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JP2019518594A true JP2019518594A (ja) | 2019-07-04 |
JP2019518594A5 JP2019518594A5 (ja) | 2020-07-09 |
JP6902053B2 JP6902053B2 (ja) | 2021-07-14 |
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JP2018560940A Active JP6902053B2 (ja) | 2016-05-26 | 2017-05-26 | 照射硬化レンズを備える処理チャンバ |
Country Status (5)
Country | Link |
---|---|
US (1) | US10541159B2 (ja) |
JP (1) | JP6902053B2 (ja) |
KR (1) | KR102171712B1 (ja) |
CN (1) | CN109155234B (ja) |
WO (1) | WO2017205714A1 (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2010287759A (ja) * | 2009-06-12 | 2010-12-24 | Ushio Inc | 光照射装置 |
US20130320235A1 (en) * | 2012-06-01 | 2013-12-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Uv curing system for semiconductors |
JP2014507064A (ja) * | 2010-11-24 | 2014-03-20 | アプライド マテリアルズ インコーポレイテッド | 二重電球ランプヘッド制御方法 |
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US4755654A (en) * | 1987-03-26 | 1988-07-05 | Crowley John L | Semiconductor wafer heating chamber |
JPH03277774A (ja) * | 1990-03-27 | 1991-12-09 | Semiconductor Energy Lab Co Ltd | 光気相反応装置 |
JP3115822B2 (ja) * | 1996-06-04 | 2000-12-11 | 松下電子工業株式会社 | 紫外線照射装置およびその照射方法 |
US6809012B2 (en) * | 2001-01-18 | 2004-10-26 | Semiconductor Energy Laboratory Co., Ltd. | Method of making a thin film transistor using laser annealing |
US6547422B2 (en) * | 2001-08-08 | 2003-04-15 | Prokia Technology Co., Ltd. | Illuminating module for a display apparatus |
US6879777B2 (en) | 2002-10-03 | 2005-04-12 | Asm America, Inc. | Localized heating of substrates using optics |
US6862404B1 (en) * | 2003-09-08 | 2005-03-01 | Wafermasters | Focused photon energy heating chamber |
US8137465B1 (en) * | 2005-04-26 | 2012-03-20 | Novellus Systems, Inc. | Single-chamber sequential curing of semiconductor wafers |
US8980769B1 (en) * | 2005-04-26 | 2015-03-17 | Novellus Systems, Inc. | Multi-station sequential curing of dielectric films |
JP2007229682A (ja) | 2006-03-03 | 2007-09-13 | Harison Toshiba Lighting Corp | 紫外線照射装置 |
US7909595B2 (en) * | 2006-03-17 | 2011-03-22 | Applied Materials, Inc. | Apparatus and method for exposing a substrate to UV radiation using a reflector having both elliptical and parabolic reflective sections |
JP2007317991A (ja) * | 2006-05-29 | 2007-12-06 | Advanced Lcd Technologies Development Center Co Ltd | 半導体装置の製造方法並びに薄膜トランジスタ |
US7851232B2 (en) * | 2006-10-30 | 2010-12-14 | Novellus Systems, Inc. | UV treatment for carbon-containing low-k dielectric repair in semiconductor processing |
CN103974790B (zh) | 2011-10-14 | 2018-02-13 | 科卢斯博知识产权有限公司 | 用于直线温度控制熔融的容装浇口 |
KR20130112549A (ko) | 2012-04-04 | 2013-10-14 | 박흥균 | 자외선 경화장치용 광학모듈 |
US9905444B2 (en) | 2012-04-25 | 2018-02-27 | Applied Materials, Inc. | Optics for controlling light transmitted through a conical quartz dome |
JP6197641B2 (ja) * | 2013-12-26 | 2017-09-20 | ウシオ電機株式会社 | 真空紫外光照射処理装置 |
-
2016
- 2016-05-26 US US15/165,930 patent/US10541159B2/en not_active Expired - Fee Related
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2017
- 2017-05-26 JP JP2018560940A patent/JP6902053B2/ja active Active
- 2017-05-26 KR KR1020187036359A patent/KR102171712B1/ko active IP Right Grant
- 2017-05-26 WO PCT/US2017/034622 patent/WO2017205714A1/en active Application Filing
- 2017-05-26 CN CN201780030199.4A patent/CN109155234B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2010287759A (ja) * | 2009-06-12 | 2010-12-24 | Ushio Inc | 光照射装置 |
JP2014507064A (ja) * | 2010-11-24 | 2014-03-20 | アプライド マテリアルズ インコーポレイテッド | 二重電球ランプヘッド制御方法 |
US20130320235A1 (en) * | 2012-06-01 | 2013-12-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Uv curing system for semiconductors |
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Publication number | Publication date |
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JP6902053B2 (ja) | 2021-07-14 |
KR20180136577A (ko) | 2018-12-24 |
KR102171712B1 (ko) | 2020-10-29 |
US20170345649A1 (en) | 2017-11-30 |
CN109155234B (zh) | 2023-08-22 |
US10541159B2 (en) | 2020-01-21 |
CN109155234A (zh) | 2019-01-04 |
WO2017205714A1 (en) | 2017-11-30 |
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