CN109065533A - 一种半导体器件及其制造方法 - Google Patents
一种半导体器件及其制造方法 Download PDFInfo
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- CN109065533A CN109065533A CN201810890509.6A CN201810890509A CN109065533A CN 109065533 A CN109065533 A CN 109065533A CN 201810890509 A CN201810890509 A CN 201810890509A CN 109065533 A CN109065533 A CN 109065533A
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- semiconductor devices
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 47
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 238000002347 injection Methods 0.000 claims abstract description 113
- 239000007924 injection Substances 0.000 claims abstract description 113
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 238000002513 implantation Methods 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 5
- 230000008021 deposition Effects 0.000 claims description 2
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 239000002699 waste material Substances 0.000 abstract description 3
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 229940090044 injection Drugs 0.000 description 87
- 238000000034 method Methods 0.000 description 19
- 150000002500 ions Chemical class 0.000 description 17
- 238000001312 dry etching Methods 0.000 description 12
- 238000005530 etching Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 9
- 238000007254 oxidation reaction Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 230000004888 barrier function Effects 0.000 description 7
- 230000003647 oxidation Effects 0.000 description 7
- 238000001039 wet etching Methods 0.000 description 7
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000001052 transient effect Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- -1 phosphonium ion Chemical class 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 229910001882 dioxygen Inorganic materials 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910001439 antimony ion Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
- H01L27/0255—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using diodes as protective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201810890509.6A CN109065533B (zh) | 2018-08-07 | 2018-08-07 | 一种半导体器件及其制造方法 |
Applications Claiming Priority (1)
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CN201810890509.6A CN109065533B (zh) | 2018-08-07 | 2018-08-07 | 一种半导体器件及其制造方法 |
Publications (2)
Publication Number | Publication Date |
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CN109065533A true CN109065533A (zh) | 2018-12-21 |
CN109065533B CN109065533B (zh) | 2020-09-01 |
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CN201810890509.6A Active CN109065533B (zh) | 2018-08-07 | 2018-08-07 | 一种半导体器件及其制造方法 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111863802A (zh) * | 2019-04-24 | 2020-10-30 | 深圳第三代半导体研究院 | 一种垂直集成单元二极管芯片 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102789979A (zh) * | 2012-08-22 | 2012-11-21 | 上海宏力半导体制造有限公司 | 肖特基二极管及其形成方法 |
US20130075810A1 (en) * | 2011-09-27 | 2013-03-28 | Force Mos Technology Co., Ltd. | Semiconductor power devices integrated with a trenched clamp diode |
US20160126306A1 (en) * | 2014-02-13 | 2016-05-05 | Microsemi Corporation | Sic transient voltage suppressor |
CN106298510A (zh) * | 2015-06-05 | 2017-01-04 | 北大方正集团有限公司 | 沟槽型瞬态电压抑制器件及其制造方法 |
CN108063135A (zh) * | 2017-12-08 | 2018-05-22 | 深圳市晶特智造科技有限公司 | 瞬态电压抑制器及其制作方法 |
CN108198866A (zh) * | 2017-12-14 | 2018-06-22 | 北京世纪金光半导体有限公司 | 一种沟槽型低势垒肖特基二极管及其制备方法 |
-
2018
- 2018-08-07 CN CN201810890509.6A patent/CN109065533B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130075810A1 (en) * | 2011-09-27 | 2013-03-28 | Force Mos Technology Co., Ltd. | Semiconductor power devices integrated with a trenched clamp diode |
CN102789979A (zh) * | 2012-08-22 | 2012-11-21 | 上海宏力半导体制造有限公司 | 肖特基二极管及其形成方法 |
US20160126306A1 (en) * | 2014-02-13 | 2016-05-05 | Microsemi Corporation | Sic transient voltage suppressor |
CN106298510A (zh) * | 2015-06-05 | 2017-01-04 | 北大方正集团有限公司 | 沟槽型瞬态电压抑制器件及其制造方法 |
CN108063135A (zh) * | 2017-12-08 | 2018-05-22 | 深圳市晶特智造科技有限公司 | 瞬态电压抑制器及其制作方法 |
CN108198866A (zh) * | 2017-12-14 | 2018-06-22 | 北京世纪金光半导体有限公司 | 一种沟槽型低势垒肖特基二极管及其制备方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111863802A (zh) * | 2019-04-24 | 2020-10-30 | 深圳第三代半导体研究院 | 一种垂直集成单元二极管芯片 |
Also Published As
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CN109065533B (zh) | 2020-09-01 |
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Effective date of registration: 20210701 Address after: 211200 Qinhuai Avenue, Lishui District, Nanjing, Jiangsu 288 Patentee after: Shuangliyu Network Technology Co.,Ltd. Address before: 210000 Kechuang building, Futian Road, Zhetang street, Lishui Economic Development Zone, Nanjing, Jiangsu Province Patentee before: Nanjing Lishui hi tech Venture Capital Management Co.,Ltd. |
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Effective date of registration: 20220408 Address after: 211200 Qinhuai Avenue, Lishui District, Nanjing, Jiangsu 288 Patentee after: NANJING ZHENKUN INTELLIGENT TECHNOLOGY Co.,Ltd. Address before: 211200 Qinhuai Avenue, Lishui District, Nanjing, Jiangsu 288 Patentee before: Shuangliyu Network Technology Co.,Ltd. |
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