CN109037124B - Staged high-speed stripping device and method for large-size ultrathin chips - Google Patents
Staged high-speed stripping device and method for large-size ultrathin chips Download PDFInfo
- Publication number
- CN109037124B CN109037124B CN201811157121.1A CN201811157121A CN109037124B CN 109037124 B CN109037124 B CN 109037124B CN 201811157121 A CN201811157121 A CN 201811157121A CN 109037124 B CN109037124 B CN 109037124B
- Authority
- CN
- China
- Prior art keywords
- ejector pin
- chip
- connecting rod
- sleeve
- thimble
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 30
- 230000007246 mechanism Effects 0.000 claims abstract description 44
- 230000006835 compression Effects 0.000 claims abstract description 36
- 238000007906 compression Methods 0.000 claims abstract description 36
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 16
- 239000010959 steel Substances 0.000 claims abstract description 16
- 239000010410 layer Substances 0.000 claims description 14
- 230000009471 action Effects 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 11
- 239000012790 adhesive layer Substances 0.000 claims description 5
- 230000008878 coupling Effects 0.000 claims description 5
- 238000010168 coupling process Methods 0.000 claims description 5
- 238000005859 coupling reaction Methods 0.000 claims description 5
- 230000005284 excitation Effects 0.000 claims description 5
- 238000000926 separation method Methods 0.000 claims 2
- 230000033001 locomotion Effects 0.000 description 15
- 230000008569 process Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000005086 pumping Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000010023 transfer printing Methods 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- -1 polyethylene chloride Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811157121.1A CN109037124B (en) | 2018-09-30 | 2018-09-30 | Staged high-speed stripping device and method for large-size ultrathin chips |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811157121.1A CN109037124B (en) | 2018-09-30 | 2018-09-30 | Staged high-speed stripping device and method for large-size ultrathin chips |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109037124A CN109037124A (en) | 2018-12-18 |
CN109037124B true CN109037124B (en) | 2023-10-20 |
Family
ID=64615824
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811157121.1A Active CN109037124B (en) | 2018-09-30 | 2018-09-30 | Staged high-speed stripping device and method for large-size ultrathin chips |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109037124B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110255193A (en) * | 2019-05-31 | 2019-09-20 | 广东瑞谷光网通信股份有限公司 | A kind of chip Ding Qu mechanism |
CN110112093B (en) * | 2019-06-14 | 2024-02-09 | 深圳市哈德胜精密科技股份有限公司 | Flexible ejector pin operating device and system for inverted packaging chip |
CN111584398B (en) * | 2020-05-12 | 2023-06-27 | 武汉国创科光电装备有限公司 | Efficient chip mounting equipment for flexible electronic manufacturing |
CN114933167A (en) * | 2022-04-27 | 2022-08-23 | 泉州兰姆达仪器设备有限公司 | Ejector pin mechanism of laser chip testing and sorting machine and working method thereof |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20050019894A (en) * | 2002-07-17 | 2005-03-03 | 마쯔시다덴기산교 가부시키가이샤 | Method and apparatus for picking up semiconductor chip and suction and exfoliation tool up therefor |
JP2006191144A (en) * | 2006-03-13 | 2006-07-20 | Toshiba Corp | Pickup device and pickup method |
KR20080112127A (en) * | 2007-06-19 | 2008-12-24 | 가부시끼가이샤 르네사스 테크놀로지 | Manufacturing method of semiconductor integrated circuit device |
JP2009188157A (en) * | 2008-02-06 | 2009-08-20 | Panasonic Corp | Chip-releasing device, chip-releasing method, and chip-pickup device |
CN102074458A (en) * | 2010-11-19 | 2011-05-25 | 华中科技大学 | Chip peeling device |
CN103730333A (en) * | 2013-12-23 | 2014-04-16 | 华中科技大学 | Multi-centre chip stripping device |
CN103915368A (en) * | 2014-04-02 | 2014-07-09 | 华中科技大学 | Chip picking and placing device |
KR20150113853A (en) * | 2014-03-31 | 2015-10-08 | 닛토덴코 가부시키가이샤 | Die-bonding film with dicing sheet, semiconductor device, and method of manufacturing the semiconductor device |
CN105161444A (en) * | 2015-08-18 | 2015-12-16 | 北京中电科电子装备有限公司 | Jacking and separating apparatus for chip |
CN205355015U (en) * | 2015-12-18 | 2016-06-29 | 南通富士通微电子股份有限公司 | Damaged thimble cap device of thin chip of prevention |
CN107369642A (en) * | 2017-06-08 | 2017-11-21 | 太极半导体(苏州)有限公司 | A kind of suction method for being avoided that ultra-thin chip fragmentation |
CN208861945U (en) * | 2018-09-30 | 2019-05-14 | 汕头大学 | A kind of large-size ultra-thin chip stage high speed stripping off device |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1535312B1 (en) * | 2002-07-17 | 2007-09-26 | Matsushita Electric Industrial Co., Ltd. | Method and apparatus for picking up semiconductor chip and suction and exfoliation tool up therefor |
JP4693805B2 (en) * | 2007-03-16 | 2011-06-01 | 株式会社東芝 | Semiconductor device manufacturing apparatus and manufacturing method |
JP5893887B2 (en) * | 2011-10-11 | 2016-03-23 | ルネサスエレクトロニクス株式会社 | Manufacturing method of semiconductor device |
-
2018
- 2018-09-30 CN CN201811157121.1A patent/CN109037124B/en active Active
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20050019894A (en) * | 2002-07-17 | 2005-03-03 | 마쯔시다덴기산교 가부시키가이샤 | Method and apparatus for picking up semiconductor chip and suction and exfoliation tool up therefor |
JP2006191144A (en) * | 2006-03-13 | 2006-07-20 | Toshiba Corp | Pickup device and pickup method |
KR20080112127A (en) * | 2007-06-19 | 2008-12-24 | 가부시끼가이샤 르네사스 테크놀로지 | Manufacturing method of semiconductor integrated circuit device |
JP2009188157A (en) * | 2008-02-06 | 2009-08-20 | Panasonic Corp | Chip-releasing device, chip-releasing method, and chip-pickup device |
CN102074458A (en) * | 2010-11-19 | 2011-05-25 | 华中科技大学 | Chip peeling device |
CN103730333A (en) * | 2013-12-23 | 2014-04-16 | 华中科技大学 | Multi-centre chip stripping device |
KR20150113853A (en) * | 2014-03-31 | 2015-10-08 | 닛토덴코 가부시키가이샤 | Die-bonding film with dicing sheet, semiconductor device, and method of manufacturing the semiconductor device |
CN103915368A (en) * | 2014-04-02 | 2014-07-09 | 华中科技大学 | Chip picking and placing device |
CN105161444A (en) * | 2015-08-18 | 2015-12-16 | 北京中电科电子装备有限公司 | Jacking and separating apparatus for chip |
CN205355015U (en) * | 2015-12-18 | 2016-06-29 | 南通富士通微电子股份有限公司 | Damaged thimble cap device of thin chip of prevention |
CN107369642A (en) * | 2017-06-08 | 2017-11-21 | 太极半导体(苏州)有限公司 | A kind of suction method for being avoided that ultra-thin chip fragmentation |
CN208861945U (en) * | 2018-09-30 | 2019-05-14 | 汕头大学 | A kind of large-size ultra-thin chip stage high speed stripping off device |
Non-Patent Citations (1)
Title |
---|
用于3D封装的带TSV的超薄芯片新型制作方法;袁娇娇;吕植成;汪学方;师帅;吕亚平;张学斌;方靖;;微纳电子技术(第02期);全文 * |
Also Published As
Publication number | Publication date |
---|---|
CN109037124A (en) | 2018-12-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN109037124B (en) | Staged high-speed stripping device and method for large-size ultrathin chips | |
CN108133907B (en) | Chip stripping off device | |
JP4215818B1 (en) | Semiconductor die pickup apparatus and pickup method | |
WO2019109437A1 (en) | Device for laminating protective film, and laminating method | |
CN112571367A (en) | Laminating equipment, intermediary mechanism thereof and laminating method | |
CN210516691U (en) | Bearing device | |
TW202201592A (en) | Equipment and method for transferring workpieces including a carrying apparatus, a pressing apparatus, a peeling apparatus and a controlling apparatus | |
JP4198745B1 (en) | Semiconductor die pickup apparatus and pickup method | |
JP2015076410A (en) | Bonding method and die bonder | |
JP2007103826A (en) | Pickup device for semiconductor chip | |
KR20080039444A (en) | Device and method for picking up semiconductor chip | |
CN208861945U (en) | A kind of large-size ultra-thin chip stage high speed stripping off device | |
JPH09181150A (en) | Pickup equipment of semiconductor chip and pickup method using the same | |
CN210285945U (en) | Press from both sides base structure, elevating system, press from both sides base machine and body production line | |
JP4563862B2 (en) | Semiconductor chip pickup device and pickup method | |
TWM626383U (en) | Substrate Bonding Mechanism | |
TW569375B (en) | Method to separate article and adhesive film | |
CN207542226U (en) | A kind of push pin device of bonder | |
JP5214739B2 (en) | Chip peeling method, semiconductor device manufacturing method, and chip peeling apparatus | |
CN212888923U (en) | Negative pressure pad pasting device | |
JP4613838B2 (en) | Chip pickup device and chip pickup method | |
CN219716841U (en) | Thimble device | |
JP2014239090A (en) | Pickup system | |
US20240021462A1 (en) | Bonding machine with movable suction modules | |
CN220821525U (en) | Get a structure and separator |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Wu Tao Inventor after: Li Changhong Inventor after: Zhao Xiaohua Inventor after: Lou Yuxian Inventor after: Zhang Ruizhe Inventor after: Song Guang Inventor before: Wu Tao Inventor before: Li Changhong Inventor before: Lou Yuxian Inventor before: Zhang Ruizhe Inventor before: Song Guang |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20231019 Address after: Building B, 3-1B, Phase II, Diejin Industrial Zone, Jinping District, Shantou, Guangdong, 515000 Applicant after: SHANTOU A-PLUX OPTOELECTRONIC TECHNOLOGY CO.,LTD. Address before: 515000 No. 243, University Road, Shantou, Guangdong Applicant before: SHANTOU University |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240229 Address after: Building 3, 6th Floor, Financial Center, Dongshan Street Office, Nankang District, Ganzhou City, Jiangxi Province, 341000 Patentee after: Jiangxi Xinkang Technology Co.,Ltd. Country or region after: China Address before: Building B, 3-1B, Phase II, Diejin Industrial Zone, Jinping District, Shantou, Guangdong, 515000 Patentee before: SHANTOU A-PLUX OPTOELECTRONIC TECHNOLOGY CO.,LTD. Country or region before: China |