CN109037124B - Staged high-speed stripping device and method for large-size ultrathin chips - Google Patents
Staged high-speed stripping device and method for large-size ultrathin chips Download PDFInfo
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- CN109037124B CN109037124B CN201811157121.1A CN201811157121A CN109037124B CN 109037124 B CN109037124 B CN 109037124B CN 201811157121 A CN201811157121 A CN 201811157121A CN 109037124 B CN109037124 B CN 109037124B
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Abstract
The embodiment of the invention discloses a staged high-speed stripping device for a large-size ultrathin chip, which comprises a rotating motor, a motor fixing plate, an eccentric wheel, a fixed seat, a thimble connecting rod mechanism, a sleeve, a sub thimble cover and a mother thimble cover, wherein the rotating motor is fixedly connected with the motor fixing plate, the eccentric wheel is fixedly arranged at the output end of the rotating motor, and the fixed seat is fixedly connected with the motor fixing plate; the ejector pin connecting rod mechanism comprises a steel ball, an ejector pin connecting rod, a lock nut, a stripping sleeve, a first compression reset spring and an ejector pin, wherein the steel ball is arranged in a groove at the bottom of the ejector pin connecting rod, the ejector pin connecting rod penetrates through a center hole of the fixing seat until the ejector pin connecting rod is arranged in the sub ejector pin cover and the mother ejector pin cover, and the mother ejector pin cover is provided with an air passage communicated to a vacuumizing negative pressure air passage connecting piece arranged on the sleeve. The invention also discloses a corresponding chip stripping method. The invention can greatly improve the stripping efficiency and reliability, solve the stripping problem of the large-size ultrathin chip, has universality and effectively solves the problems of reliable stripping and reduced chip rate of the large-size ultrathin chip.
Description
Technical Field
The invention relates to the technical field of chip processing, in particular to a staged high-speed stripping device and method for a large-size ultrathin chip.
Background
IC chip delamination (peeling off) is widely used for testing and packaging high-performance chip devices such as CPU, DSP, LED, RFID, and is a key for improving the quality and efficiency of chip package.
The wafer of the chip is often adhered to the base film, and the three-layer structure of the chip-adhesive layer-base film belongs to a typical film-based bonding structure, and is characterized in that a thin layer of bonding material (Acrylic paint) is sandwiched between the chip and the base film (polyethylene chloride) and has a thickness of about 5-10 um. After the wafer dicing is completed, testing and sorting are required. The sorting is to peel off the chips from the adhesive base film, and then place the chips into sorting areas with corresponding quality grades through a conveying device. At present, there are four technical forms of chip peeling: (1) lifting and stripping; (2) differential transfer printing; (3) stripping by laser; (4) Roll-to-Roll peeling (R2R). In the jacking mode, the ejector pins are jacked upwards from the lower part of the base film, the pick-up head is sucked upwards, the chip is separated from the film surface under the combined action of the ejector pins and the base film, and at present, the jacking stripping mainly utilizes the cam mechanism to drive the ejector pins to move in the vertical direction to lift and strip the chip. The motor is used for driving the cam to rotate, the rotation motion of the cam is converted into the motion of the ejector pin in the vertical direction, and the ejector pin ejects the chip from the film surface. This approach can create problems in high speed delamination of ultra-thin large-sized chips. In the jacking process of the chip, as the chip is adhered to the base film, the places with the maximum adhesion and the least easy stripping are the four edges of the chip, and the chip is fragile and thin, and in the jacking stripping process of the thimble, the jacking impact of the center of the thimble and the couple pair formed by the jacking force and the edge adhesion force can cause fatal damage to the chip, such as impact fracture or fracture. The differential transfer printing mode utilizes the relation between the speed and the adsorption force, the chips are adsorbed by the upper Stamp and lifted quickly, the chips are peeled off from the substrate, then the chips are placed in place at a receiving end at a low speed, and the chips are separated by utilizing the tangential adhesion force. In the laser peeling method, a dissipation layer is interposed between an adhesive layer and a chip, and the dissipation layer is foamed by laser light to peel the chip from a base film. The roll-to-roll approach is also known as conformal stripping, and uses a sharp break in the lift-off knife structure on the travel path to strip the device from the carrier tape in a conformal variation. The differential transfer printing and laser stripping modes are only in theoretical exploration and test stages at present, and industrial application is not realized yet. The R2R technology is inconvenient to realize accurate positioning of the microchip and is rarely applied to the Inlay-level packaging of the chip.
The development of the chip stripping process can not meet the actual demand, and the main reason is that the efficiency and reliability of the chip stripping are difficult to improve. As the planar dimensions of the chip become larger and the thickness becomes thinner, the chip may undergo failure actions such as chipping and breaking during the peeling process, and the peeling becomes more difficult. When the chip is as thin as 75um or less, the production efficiency of picking up the chip on its standard device deteriorates to an unacceptable level.
Disclosure of Invention
The technical problem to be solved by the embodiment of the invention is to provide a staged high-speed stripping device and method for a large-size ultrathin chip. The chip is prevented from bearing larger moment of couple to generate damage when the thimble is jacked up through the migration of force points, and the stripping efficiency and reliability are greatly improved.
In order to solve the technical problems, the embodiment of the invention provides a staged high-speed stripping device for a large-size ultrathin chip, which comprises a rotating motor, a motor fixing plate, an eccentric wheel, a fixing seat, a thimble connecting rod mechanism, a sleeve, a sub thimble cover and a mother thimble cover;
the rotating motor is fixedly connected with the motor fixing plate, the eccentric wheel is fixedly arranged at the output end of the rotating motor, and the fixing seat is fixedly connected with the motor fixing plate;
the thimble connecting rod mechanism comprises a steel ball, a thimble connecting rod, a lock nut, a stripping sleeve, a first compression reset spring and a thimble, wherein the steel ball is arranged in a groove at the bottom of the thimble connecting rod, the steel ball is in contact fit with the periphery of the eccentric wheel, the thimble connecting rod penetrates through a center hole of the fixing seat until the thimble connecting rod is arranged in the sub thimble cover and the mother thimble cover, the lock nut fixedly arranges the thimble on the top of the thimble connecting rod, the stripping sleeve is vertically arranged on the top of the thimble connecting rod in a sliding manner, the thimble is sleeved in the stripping sleeve, and the first compression reset spring is arranged between the stripping sleeve and the top of the thimble connecting rod; the female thimble cover is airtight fixedly arranged on the sleeve, the sub thimble cover is fixedly sleeved on the female thimble cover, the top of the sub thimble cover is provided with a hole site which enables the stripping sleeve to extend out, and the female thimble cover is provided with an air passage which is communicated to a vacuumizing negative pressure air passage connecting piece arranged on the sleeve.
Further, still include direction slider mechanism, direction slider mechanism includes slider, guiding axle, second compression reset spring, compression reset spring fixed plate, the slider fixed set up in thimble connecting rod lower part, the guiding axle fixed set up in fixing base below, the slider with guiding axle sliding connection, second compression reset spring top is passed through compression reset spring fixed plate fixed set up in the fixing base lower extreme, the bottom acts on the thimble connecting rod.
Further, a first O-shaped sealing ring is arranged between the compression return spring fixing plate and the fixing seat.
Further, the female needle cover and the sleeve are provided with second O-shaped sealing rings.
Further, a boss is arranged at the top of the fixing seat and is arranged in the central through hole of the sleeve.
Still further, a third O-ring seal is disposed between the boss and the sleeve.
Furthermore, the top of the thimble connecting rod is in a plurality of valve structures, the thimble is arranged in the middle of the valve structures, and the lock nut is locked on the threads outside the valve structures.
Still further, the stripping sleeve comprises an upper sleeve and a lower sleeve which are fixedly connected up and down, the lower sleeve is provided with an inner convex edge, and a plurality of baffle plates arranged above the boss are fixedly arranged on the valve structures respectively.
Furthermore, a connecting swing arm is further arranged on the motor output shaft.
The invention also provides a method for stripping the chip by using the large-size ultrathin chip staged high-speed stripping device, which comprises the following steps:
s1: the suction nozzle and the ejector pin connecting rod mechanism which use negative pressure are matched with opposite forces which respectively act on the upper surface and the lower surface of the base film adhered with the chip to form coupling, so that the adhesive layer near the edge of the chip is promoted to complete initial excitation of rupture;
s2: and the ejector pins of the ejector pin connecting rod mechanism are continuously used for lifting and jacking the chip, and the bonding layer enters a fracture expansion stage through the lifting and jacking actions of the ejector pins and the suction lifting actions of the suction nozzle.
Further, in step S1, the sub-ejector pin cover of the ejector pin link mechanism and the cavity channel in the mother ejector pin cover form negative pressure.
Further, the coupled opposing force is generated by the push-fit of the peel-off sleeve of the ejector pin linkage with the suction nozzle.
The embodiment of the invention has the following beneficial effects: the invention fully utilizes the cooperative control of the jacking mechanism and the suction nozzle mechanism, can greatly improve the stripping efficiency and reliability, and has universality for solving the stripping problem of large-size ultrathin chips. Firstly, aiming at chips with different sizes and thicknesses, a coupling force surface can be constructed by matching the nested ejector pin and the suction nozzle structure, so that the edge singular force in the initial rupture of the bonding layer is greatly reduced, and the stripping reliability of the chip is improved. And secondly, the cooperative control action of the jacking mechanism and the suction nozzle mechanism is fully utilized, the upper pressing top in the initial stripping stage is used for triggering stripping, the upper pressing bottom in the crack propagation stage is used for accelerating stripping, and the stripping efficiency is improved. This cooperative control method is a key to solve the problem of breakage of large-size thin chips by peeling.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic cross-sectional view of the present invention;
FIG. 3 is a schematic view of a partial cross-sectional structure of the present invention;
FIG. 4 is a schematic view of an exploded construction of the present invention;
FIG. 5 is a schematic view of another embodiment of the present invention;
fig. 6 is a schematic view showing a partial cross-section of the a portion in fig. 5;
FIG. 7 is a schematic diagram a of a method of the present invention for chip detachment;
FIG. 8 is a schematic diagram b of the method of the present invention for chip detachment;
FIG. 9 is a schematic diagram c of the method of the present invention for chip detachment;
FIG. 10 is a schematic diagram d of the method of the present invention for chip detachment;
FIG. 11 is a schematic diagram e of the method of the present invention for chip detachment;
FIG. 12 is a schematic diagram f of a method of the present invention for chip detachment;
FIG. 13 is a schematic diagram g of the method of the present invention for chip detachment.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings, for the purpose of making the objects, technical solutions and advantages of the present invention more apparent.
Reference is made to the schematic structural diagram shown in fig. 1.
The invention provides a large-size ultrathin chip staged high-speed stripping device which comprises a rotating motor 1, a motor fixing plate 2, a connecting swing arm 3, an eccentric wheel 4, a vacuumizing negative pressure air path connecting piece 5, a steel ball 6, a guide shaft 7, a sliding bearing 8, a sliding block 9, a compression reset spring 10, a compression reset spring fixing plate 11, an O-shaped sealing ring 12, a fixing seat 13, a sleeve 14, an O-shaped sealing ring 15, a sliding bearing 16, a thimble connecting rod 17, an O-shaped sealing ring 18, a mother thimble cover 19, a child thimble cover 20, a thimble 21, a lock nut 22, a sliding bearing 23, a compression reset spring 24 and a stripping sleeve 25.
The guide slide block mechanism comprises a slide block 9, a guide shaft 7, a compression return spring 10 and a compression return spring fixing plate 11.
The rotary motor 1 is fixed on the motor fixing plate 2 through a screw, extends out of the output shaft through a positioning hole of the motor fixing plate 2 to be in hole-shaft fit with a through hole on the connecting swing arm 3, and is screwed into a tightening screw through a threaded hole on the connecting swing arm 3 to be fixed; the cylindrical boss connected with the swing arm 3 is used as a transmission shaft to be in interference fit with the inner hole of the eccentric wheel 4, and the rotation motion of the motor shaft is transmitted to drive the eccentric wheel to rotate; the steel ball 6 is arranged in a groove at the bottom of the thimble connecting rod 17, and the part of the steel ball exposed out of the groove is kept in contact with the eccentric wheel 4.
One end of the guide shaft 7 is connected with the fixed seat 13 through a screw, the main body of the guide shaft 7 passes through a large hole on the sliding block 9, and a sliding bearing 8 is arranged between the guide shaft 7 and the large hole; one end of the compression return spring 10 is contacted with the groove of the sliding block 9, the other end is fixed on the compression return spring fixing plate 11, and the compression return spring fixing plate 11 is fixed on the fixing seat 13 by a screw and presses the O-shaped sealing ring 12.
The fixed seat 13 is fixed on the motor fixed plate 2 through a screw, the sleeve 14 is fixed on the fixed seat 13 through a screw, the top end of the central through hole of the fixed seat 13 is provided with a sliding bearing 16, and the boss of the fixed seat 13 extends into the central through hole of the sleeve 14; the side surface of the sleeve 14 is provided with a vacuumizing negative pressure air passage connecting piece, the mother thimble cover 19 is connected to the top of the sleeve 14 through threads, and grooves are formed in two ends of a central through hole of the sleeve 14 for placing the O-shaped sealing ring 18 and the O-shaped sealing ring 15; the threaded hole at the bottom of the inner hole of the sub-thimble cover 20 is meshed with the external thread at the top of the mother thimble cover 19 and is further fixed by a screw.
The thimble connecting rod 17 respectively passes through a passage formed by the sliding block 9, the compression reset spring 10, the compression reset spring fixing plate 11, the fixing seat 13 and the sliding bearing 16 from bottom to top, the bottom is fixed with the sliding block 9 through screws, the top end is a boss which is cut into four parts, threads are arranged on the outer surface of the boss and are matched with the locking nut 22, a thimble is arranged in the middle of the boss of the four parts, the top of the boss is also sleeved with the sliding bearing 23, the outside of the sliding bearing 23 is sleeved with the stripping sleeve 25, the boss of the stripping sleeve 25 extends into the passage formed by the through holes of the sub thimble cover 20 and the mother thimble cover 19, the negative pressure in the passage enables the base film 26 to be adsorbed on the top surface of the sub thimble cover 20, the chip 28 is adhered on the base film 26 through the bonding layer 27, and the suction nozzle 31 adsorbs the chip from above.
As another embodiment of the present invention, fig. 5 and 6 show.
On the basis of the above embodiment, in a normal state, the top of the thimble connecting rod 17 is divided into four parts of four-flap structures, a gap exists in the top boss of the thimble connecting rod 17, and the thimble 21 can be inserted in the middle, so that when the lock nut 22 is screwed in, the four separated bosses are gathered together and the thimble 21 is locked at the same time, and the thimble connecting rod 17, the lock nut 22 and the thimble 21 are integrated.
Specifically, the slide bearing 16 reduces the frictional resistance to movement of the ejector pin link 17 and maintains the linearity of movement.
The stripping sleeve 25 further comprises an upper sleeve 27, a lower sleeve 25 fixedly connected up and down, both preferably by means of screws.
The lower sleeve is provided with an inner cavity inner convex edge arranged between the upper sleeve 27 and the lower sleeve 25, the upper parts of the plurality of valve structures at the top of the thimble connecting rod are respectively fixedly provided with a baffle plate 26 arranged above the boss, and the baffle plates 26 are preferably fixedly arranged on the plurality of valve structures through screws, so that the stripping sleeve 25 is prevented from being jacked up by a spring under the action of the spring when in a static state and can respond to the requirement of reciprocating motion in time, and when the thimble connecting rod mechanism is quickly lifted up, the thimble connecting rod mechanism can bear larger thrust without obvious deformation and jack up the sleeve together with the lifting motion at a higher response speed; when the thimble link mechanism falls back, the baffle plate rigidly drives the lower sleeve and the upper sleeve to fall back together. The whole system has stronger rigidity than the previous proposal, the movement and the positioning are ensured more accurately, and the system is in a stable state under the action of the baffle 26.
The embodiment of the invention also provides a method for stripping the chip by using the large-size ultrathin chip staged high-speed stripping device, which comprises the following steps of:
the rotating motor 1 directly drives the connecting swing arm 3 to rotate and then drives the eccentric wheel 4 to rotate; because the bottom of the thimble connecting rod 17 and the sliding block 9 are fixed through screws, the thimble connecting rod 17 and the sliding block 9 can move simultaneously, the guiding shaft 7 and the sliding bearing 8 are matched with each other to maintain the moving linearity and reduce friction, the steel ball 6 is positioned in a groove at the bottom of the thimble connecting rod 17 and limited by the eccentric wheel 4, when the eccentric wheel 4 rotates, the steel ball 6 and the thimble connecting rod 17 are driven to perform linear movement in the vertical direction, and because the reset spring 10 is in a compressed state between the sliding block 9 and the reset spring fixing plate 11, the steel ball 6 can keep contact with the eccentric wheel 4, and the steel ball 6, the thimble connecting rod 17, the thimble 21, the locking nut 22, the sliding bearing 23, the compressed reset spring 24, the split stripping lower sleeve 25, the baffle 26 and the split stripping upper sleeve 27 can perform vertical movement in the vertical direction by taking the contour line of the eccentric wheel as a reference.
Specifically, a vacuum-pumping negative pressure passage is formed by the vacuum-pumping negative pressure gas circuit connecting piece 5, the inner hole cavity of the sleeve 14, the boss of the fixing seat 13, the sub-thimble cover 20 and the inner hole cavity of the mother thimble cover 19, and is sealed by the O-shaped sealing rings 15 and 18 in grooves at two ends of the sleeve 14. First, the positioning device moves the base film with the chips adhered thereon, positions the chips to be peeled to the center of the top of the sub-ejector cover 20, and at this time, the inside starts to be vacuumized, and the upper end surface of the sub-ejector cover 20 adsorbs the base film 28.
Specifically, the ejector pin link mechanism, namely the steel ball 6, the ejector pin link 17, the ejector pin 21, the lock nut 22 and the compression return spring 24 are driven by the eccentric wheel to perform linear reciprocating motion in the vertical direction, so that the linear motion has a top dead center and a bottom dead center, and the sliding bearing 16 reduces the friction resistance of the movement of the ejector pin link 17 and maintains the linearity of the movement. When the ejector mechanism is positioned at the bottom dead center, the state is as shown in fig. 4, the compression return spring 24 is in a compressed state, and the upper end surface of the stripping sleeve is flush with the top end surface of the sub-ejector cover 20.
Specifically, in a normal state, a gap exists in the top four-lobe structure of the thimble connecting rod 17, and the thimble 21 can be inserted in the middle, so that when the lock nut 22 is screwed in, the four separated bosses are gathered together and the thimble 21 is locked at the same time, so that the thimble connecting rod 17, the lock nut 22 and the thimble 21 are integrated. Further, each of the four-lobe structures of the ejector pin link 17 has a threaded hole in the top end surface thereof, through which a retainer 26 is secured to the top surface of the ejector pin link 17 by means of screws. When the thimble linkage mechanism is at the bottom dead center of the cam mechanism, the compression return spring 24 is in a compression state, the split stripping upper sleeve 27 has a trend of moving upwards, but the split stripping lower sleeve 25 connected with the compression return spring is limited by the baffle 26, and the inner holes of the split stripping lower sleeve 25 are matched with the sliding bearings 23, so that the two split sleeves are in a stable state and are level with the top end face of the sub thimble cover 20.
As shown in fig. 7, the ejector pin link mechanism is at the bottom dead center of the cam mechanism, the split stripping upper sleeve 27 is level with the top end face of the sub ejector pin cover 20, the vacuumized negative pressure air circuit starts working, a vacuum negative pressure environment is established in the internal cavity, the base film is adsorbed through the hole on the sub ejector pin cover 20, and the suction nozzle 31 descends to the upper surface of the chip 30 to be stripped to primarily adsorb the chip; thereafter, as shown in fig. 8, the ejector pin mechanism starts to rise, the two split stripping sleeves also start to rise together, the split stripping upper sleeve 27 pushes up the chip 30, the suction nozzle head of the flexible part at the front end of the suction nozzle 31 is stressed and deformed, then a downward force is generated on the chip, the force of the split stripping upper sleeve 27 pushing up and the force of the suction nozzle 31 pushing down form a coupled opposite force surface to limit the deformation of the middle part of the chip, the edge part of the chip is deformed, the bonding layer near the edge of the chip is in a fracture initial excitation stage, and the four edges of the chip start to be separated from the base film; as shown in fig. 9, when the ejector pin link mechanism is lifted to a predetermined height, the split stripping upper sleeve 27 is lifted until the boss stepped surface thereof abuts against the inner hole end surface of the ejector pin cover 19 to stop moving upwards, and the upper end surface of the split stripping upper sleeve 27 exceeds the top end surface of the sub ejector pin cover 20, the chip is partially ejected and the four edges of the chip are further stripped from the chip base film, thus completing the initial excitation of the breakage of the chip bonding layer; as shown in fig. 10, the ejector pin link mechanism and the suction nozzle 31 continue to rise, the ejector pin cover 19 limits the split stripping upper sleeve 27, the stripping sleeve 25 stops moving upwards, the compression reset spring 24 is compressed further, the top end of the ejector pin 21 starts to surpass the upper end surface of the split stripping upper sleeve 27, the chip 30 is lifted by the ejector pin 21, the suction nozzle 31 moves upwards together with the adsorbed chip, the lifting of the ejector pin 21 and the suction lifting of the suction nozzle 31 enable the adhesive layer to enter a fracture expansion stage, namely, the stripped part of the chip and the base film is gradually expanded to the center from the four edges of the chip in the initial adhesive layer fracture excitation stage, and the chip and the base film are further separated; as shown in fig. 11, when the ejector pin link mechanism reaches the top dead center of the motion, the top end of the ejector pin 21 exceeds the upper end surface of the stripping sleeve 25 and fully ejects the chip, and the last small part of the chip is stripped by the suction nozzle, so that the chip stripping process is finished; as shown in fig. 12, after the chip is peeled off, the thimble 21 falls back to a height that the needle tip is flush with the upper surface of the split peeling upper sleeve 27, at this time, the baffle 26 abuts against the upper end surface of the split peeling lower sleeve 25, and the thimble connecting rod 17 moves downward together with the split peeling upper sleeve 27 and the split peeling lower sleeve 25 through the baffle 26; finally, as shown in fig. 13, the ejector pin link mechanism is lowered to a predetermined minimum height, the upper end surface of the split stripping upper sleeve 27 is flush with the top end surface of the sub ejector pin cover 20, the whole stripping mechanism is restored to an initial state, the state of vacuum pumping and negative pressure in the air path is relieved, the adsorbed base film is released, and the whole stripping process is completely finished. If the next chip needs to be stripped, the process starts the cycle again as shown in FIG. 7.
Compared with the traditional jacking stripping method, the invention has the key points that: 1. the chip is stripped through the cooperation control of multiple physical quantities of the suction nozzle and the jacking mechanism; 2. the chip stripping adopts a staged stripping mode, namely the initial cracking stage of the bonding layer excited by the stripping sleeve and the suction nozzle together and the crack propagation stage under the combined action of the ejector pin and the suction nozzle. In the mode, in the initial stripping stage, the suction nozzle is pressed down, the jacking mechanism jacks up, the jacking mechanism surface and the suction nozzle surface of the special structure form coupling force, under the action of the coupling force, the bending moment acting point born by the chip is transferred from the center to the edge of the chip, so that the singular force of the edge in the initial breaking process of the bonding layer is greatly reduced, the initial stripping of the chip is excited, the deformation of the middle part of the chip is limited, and the chip is prevented from being broken due to overlarge deformation. Then, the nested thimble is further jacked, the suction nozzle is changed from downward pressing to upward suction lifting, and the jacking of the thimble and the suction lifting of the suction nozzle jointly act to realize the acceleration expansion of the fracture of the bonding layer until the chip is separated from the film surface. The method can greatly reduce the failure influence of chip deformation overlarge and fragmentation caused by overlarge adhesive moment in the peeling process, reduces the difficulty of initiating the initial peeling through the migration of the peeling jacking force point, greatly improves the success rate and reliability of the high-speed peeling of the large-size ultrathin chip, and also ensures the stable posture of the chip in peeling.
The above disclosure is only a preferred embodiment of the present invention, and it is needless to say that the scope of the invention is not limited thereto, and therefore, the equivalent changes according to the claims of the present invention still fall within the scope of the present invention.
Claims (10)
1. The staged high-speed stripping device for the large-size ultrathin chips is characterized by comprising a rotating motor, a motor fixing plate, an eccentric wheel, a fixing seat, a thimble connecting rod mechanism, a sleeve, a sub thimble cover and a mother thimble cover;
the rotating motor is fixedly connected with the motor fixing plate, the eccentric wheel is fixedly arranged at the output end of the rotating motor, and the fixing seat is fixedly connected with the motor fixing plate;
the thimble connecting rod mechanism comprises a steel ball, a thimble connecting rod, a lock nut, a stripping sleeve, a first compression reset spring and a thimble, wherein the steel ball is arranged in a groove at the bottom of the thimble connecting rod, the steel ball is in contact fit with the periphery of the eccentric wheel, the thimble connecting rod penetrates through a center hole of the fixing seat until the thimble connecting rod is arranged in the sub thimble cover and the mother thimble cover, the lock nut fixedly arranges the thimble on the top of the thimble connecting rod, the stripping sleeve is vertically arranged on the top of the thimble connecting rod in a sliding manner, the thimble is sleeved in the stripping sleeve, and the first compression reset spring is arranged between the stripping sleeve and the top of the thimble connecting rod; the ejector pin cover is fixedly arranged on the sleeve in an airtight manner, the sub ejector pin cover is fixedly sleeved on the ejector pin cover, a hole site which enables the stripping sleeve to extend out is formed in the top of the sub ejector pin cover, the ejector pin cover is provided with an air passage which is communicated to a vacuumizing negative pressure air passage connecting piece arranged on the sleeve, the ejector pin connecting rod mechanism is provided with a top dead center and a bottom dead center, when the ejector pin connecting rod mechanism is positioned at the bottom dead center, the first compression reset spring is in a compressed state, the upper end face of the stripping sleeve is flush with the top end face of the sub ejector pin cover, when the ejector pin connecting rod mechanism is switched from the bottom dead center to the top dead center, the sub ejector pin cover is provided with a hole path which enables the negative pressure to adsorb a base film, and a suction nozzle arranged on the upper portion of the sub ejector pin cover is in common with the upper and lower contact with a chip, the stripping sleeve is upwards jacked up, the suction nozzle is used for being matched with the stripping sleeve up and down to form a coupling opposite force surface to limit the deformation of the middle part of the chip, a bonding layer near the edge of the chip is in a rupture initial stage, the ejector pin cover is used for lifting the stripping sleeve, and the stripping sleeve is in a compression stage, when the first compression reset spring is in the lifting stage, and the chip is expanded, and the chip is in the compression stage of the compression stage and the chip is expanded, and the top of the chip is in advance.
2. The large-size ultrathin chip staged high-speed stripping device according to claim 1, further comprising a guide slide block mechanism, wherein the guide slide block mechanism comprises a slide block, a guide shaft, a second compression return spring and a compression return spring fixing plate, the slide block is fixedly arranged at the lower part of the ejector pin connecting rod, the guide shaft is fixedly arranged below the fixing seat, the slide block is in sliding connection with the guide shaft, the top of the second compression return spring is fixedly arranged at the lower end of the fixing seat through the compression return spring fixing plate, and the bottom acts on the ejector pin connecting rod.
3. The large-size ultrathin chip staged high-speed stripping device according to claim 2, wherein a first O-shaped sealing ring is arranged between the compression return spring fixing plate and the fixing seat, and a second O-shaped sealing ring is arranged between the female thimble cover and the sleeve.
4. The large-size ultra-thin chip staged high-speed peeling device according to claim 1, wherein the top of the fixing seat is provided with a boss, and the boss is arranged in the central through hole of the sleeve.
5. The large-size ultra-thin chip staged high speed peeling device according to claim 4, wherein a third O-ring is provided between the boss and the sleeve.
6. The staged high speed peeling device for large size ultra thin chips as defined in any one of claims 1-5, wherein the top of the ejector pin connecting rod is in a plurality of valve structures, the ejector pin is arranged in the middle of the valve structures, and the lock nut is locked on the screw threads outside the valve structures.
7. The staged high-speed stripping device for large-size ultrathin chips as recited in claim 6, wherein the stripping sleeve comprises an upper sleeve and a lower sleeve which are fixedly connected up and down, the lower sleeve is provided with an inner convex edge, and the plurality of flaps are structurally and fixedly provided with baffle plates arranged above the bosses respectively.
8. A method for chip separation using the large-size ultra-thin chip staged high speed separation device according to any one of claims 1-7, comprising the steps of:
s1: the suction nozzle and the ejector pin connecting rod mechanism which use negative pressure are cooperatively matched to respectively act on the upper surface and the lower surface of the base film adhered with the chip to form coupled opposite force, so that the adhesive layer near the edge of the chip is promoted to complete initial excitation of rupture;
s2: and the ejector pins of the ejector pin connecting rod mechanism are continuously used for lifting and jacking the chip, and the bonding layer enters a fracture expansion stage through the lifting and jacking actions of the ejector pins and the suction lifting actions of the suction nozzle.
9. The method for chip detachment by a large-size ultra-thin chip staged high-speed detachment apparatus according to claim 8, wherein in the step S1, a sub-ejector pin cover of the ejector pin link mechanism and an inner cavity of the mother ejector pin cover form a negative pressure.
10. The method for chip detachment by a large-size ultra-thin chip staged high speed detachment apparatus according to claim 9, characterized in that the coupled opposing force is generated by the mutual press fit of the detachment sleeve of the ejector pin link mechanism and the suction nozzle.
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| CN110112093B (en) * | 2019-06-14 | 2024-02-09 | 深圳市哈德胜精密科技股份有限公司 | Flexible ejector pin operating device and system for inverted packaging chip |
| CN111584398B (en) * | 2020-05-12 | 2023-06-27 | 武汉国创科光电装备有限公司 | Efficient chip mounting equipment for flexible electronic manufacturing |
| CN114933167A (en) * | 2022-04-27 | 2022-08-23 | 泉州兰姆达仪器设备有限公司 | Ejector pin mechanism of laser chip testing and sorting machine and working method thereof |
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