TWM626383U - Substrate Bonding Mechanism - Google Patents

Abstract

The new model provides a substrate bonding mechanism, which comprises a stage, three first alignment units, three second alignment units, a pressing plate and two flat edge alignment units. The carrying surface of the stage has a placement area for placing a first substrate, wherein the first alignment unit, the second alignment unit and the flat edge alignment unit are arranged around the placement area. The first alignment unit is used for positioning the first substrate and carrying a second substrate. The second alignment unit is used for positioning the second substrate, and the flat edge alignment unit is used for contacting the flat edges of the first and second substrates to align the angles of the first substrate and the second substrate. The pressing plate faces the bearing surface of the carrier, and is used for pressing the first and second substrates aligned on the bearing surface, and the flat edge alignment unit moves up and down relative to the carrier along with the pressing plate.

Description

Substrate Bonding Mechanism

The utility model relates to a substrate bonding mechanism, which can quickly and accurately align the positions and angles of the first and second substrates, and bond the aligned first and second substrates.

With the advancement of semiconductor technology, the thickness of wafers has been continuously reduced to facilitate subsequent wafer dicing and packaging processes. In addition, the thinning of the wafer is also beneficial to the advantages of reducing the size of the chip, reducing the resistance, speeding up the operation speed and prolonging the service life. However, the structure of the thinned wafer is very fragile, and the wafer is prone to warpage or breakage in the subsequent process, thereby reducing the yield of the product.

In order to avoid the above problems, the wafer is generally temporarily bonded on the carrier substrate, and the thinned wafer is supported by the carrier substrate to avoid warpage or breakage of the thinned wafer during the manufacturing process.

Specifically, the surface of the carrier substrate and the wafer can be coated with adhesive, and then the carrier substrate and the wafer can be moved to the substrate bonding mechanism for alignment, and the temperature of the carrier substrate and the wafer can be increased for bonding. After the bonding is completed, the wafer can be thinned, etched, and metallized, and finally the wafer and the carrier substrate can be peeled off.

Although the bonding of the wafer and the carrier substrate can be completed through the above steps, the alignment mechanism of the general substrate bonding mechanism still has the problems of poor accuracy and low alignment efficiency, which affects the efficiency and yield of the process. cause a certain impact.

In order to solve the above problems, the present invention proposes a substrate bonding mechanism, which can be used to align a plurality of substrates in position and angle, and then press the aligned substrates through a pressing mechanism to complete the bonding of the plurality of substrates. , which can effectively improve the alignment and bonding efficiency of multiple substrates.

An object of the present invention is to provide a substrate bonding mechanism, which mainly includes three first alignment units, three second alignment units and at least two flat edge alignment units on the stage, wherein the flat edge alignment unit The first and second alignment units are used for aligning the first and second substrates respectively, so that the first substrate is aligned with the second substrate.

The pressing mechanism faces the bearing surface of the carrier, and can be displaced relative to the carrier, wherein the pressing plate of the pressing mechanism can be used to press the first and second substrates placed on the carrier after alignment, and the flat side The quasi-unit will move up and down with the pressing plate of the pressing mechanism relative to the bearing surface of the carrier.

The flat edge alignment unit or the missing corner alignment unit can be an alignment rod body, wherein the alignment rod body can be extended and retracted in the direction parallel to the bearing surface of the carrier, and used to contact and align the first and the second with different sizes. The flat sides of the two substrates make the substrate bonding mechanism suitable for aligning the first and second substrates of different sizes.

The flat edge alignment unit or the missing corner alignment unit can also be an alignment pin, wherein two or more groups of alignment pins can be arranged on the bearing surface of the carrier. A set of alignment pins are arranged on the inner side of the bearing surface of the stage, and are suitable for aligning the flat sides of the first and second substrates with smaller dimensions. Another set of alignment pins is arranged on the outer side of the bearing surface of the carrier, and is suitable for aligning the flat sides of the first and second substrates with larger dimensions.

An object of the present invention is to provide a substrate bonding mechanism, which mainly includes three first alignment units, three second alignment units and at least one missing corner alignment unit on the stage, wherein the missing corner alignment unit uses The first and second alignment units are used for aligning the first and second substrates respectively, so that the first substrate is aligned with the second substrate.

In order to achieve the above-mentioned purpose, the present invention proposes a substrate bonding mechanism, which includes: a stage including a bearing surface for carrying a first substrate, wherein the bearing surface has a placement area, and the first substrate includes a first angle Identification feature, wherein the first angle identification feature is a first flat edge or a first missing angle; three first alignment units are arranged around the placement area of the bearing surface to be close to or away from the placement area to Positioning the first substrate and carrying a second substrate, wherein the second substrate includes a second angle identification feature, the second angle identification feature is a second flat edge or a second missing corner, wherein the first alignment unit includes a convex The protruding part protrudes from the bottom toward the direction of the placement area, the bottom is closer to the bearing surface of the stage than the protruding part, and the first substrate is positioned with the bottom of the first alignment unit; three second alignment The unit is arranged around the placement area of the bearing surface, and is used to be close to or away from the placement area to position the second substrate carried by the first alignment unit; The stage is displaced, wherein the pressing plate is used for pressing the first substrate and the second substrate stacked on the carrier; and a plurality of flat edge alignment units are located around the placement area of the carrier surface for contacting the first substrate The flat edge and the second flat edge of the second substrate, wherein the flat edge alignment unit moves up and down with the pressing plate relative to the bearing surface of the carrier.

The present invention proposes another substrate bonding mechanism, comprising: a stage including a bearing surface for carrying a first substrate, wherein the bearing surface has a placement area, and the first substrate includes a first missing corner; three third An alignment unit is arranged around the placement area of the bearing surface for approaching or away from the placement area to locate the first substrate and carry a second substrate, the second substrate includes a second recess corner, wherein the first alignment unit includes a protruding part and a bottom, the protruding part protrudes from the bottom toward the direction of the placement area, the bottom is closer to the bearing surface of the stage than the protruding part, and the bottom of the first alignment unit The first substrate is positioned; three second alignment units are arranged around the placement area of the bearing surface, and are used to be close to or away from the placement area to locate the second substrate carried by the first alignment unit; The bearing surface of the carrier is displaced relative to the carrier, wherein the pressing plate is used for pressing the first substrate and the second substrate stacked on the carrier; and at least one missing corner alignment unit is used for contacting the first substrate. The first missing corner and the second missing corner of the second substrate, wherein the missing corner alignment unit moves up and down with the pressing plate relative to the bearing surface of the carrier.

The present invention proposes another substrate bonding mechanism, comprising: a stage including a bearing surface for carrying a first substrate, wherein the bearing surface has a placement area, the first substrate includes a first angle identification feature, wherein the first substrate is An angle identification feature is a first flat edge or a first missing corner; three alignment units are arranged around the placement area of the bearing surface to be close to or away from the placement area to locate the first substrate and a first substrate Two substrates, wherein the second substrate includes a second angle identification feature, and the second angle identification feature is a second flat edge or a second missing corner; three bearing units are arranged around the placement area of the bearing surface, using The carrying unit is used to carry the second substrate so as to be close to or away from the placing area, wherein the alignment unit is displaced toward the direction of the placing area to position the second substrate carried by the carrying unit, wherein the carrying unit includes a protruding part and a bottom, the protruding part is The outgoing part protrudes from the bottom toward the placing area, and the bottom is closer to the bearing surface of the carrier than the protruding part; a pressing plate faces the bearing surface of the carrier and is displaced relative to the carrier, wherein the pressing plate is used for pressing the load a first substrate and a second substrate stacked on the stage; and a plurality of flat edge alignment units located around the placement area of the bearing surface for contacting the first flat edge of the first substrate and the second flat edge of the second substrate , wherein the flat edge alignment unit will move up and down with the lamination plate relative to the bearing surface of the carrier.

The substrate bonding mechanism includes at least one missing corner alignment unit for contacting the first missing corner of the first substrate and the second missing corner of the second substrate, wherein the missing corner alignment unit will be aligned with the pressing plate relative to the second missing corner. The bearing surface of the stage is raised and lowered.

In the substrate bonding mechanism, the flat edge alignment unit includes two first flat edge alignment pins and two second flat edge alignment pins arranged on the bearing surface of the carrier, and the missing corner alignment unit includes A first missing corner alignment pin and a second missing corner alignment pin are arranged on the bearing surface of the carrier, the first missing corner alignment pin is located between the two first flat edge alignment pins, and the second missing corner alignment pin The alignment pins are located between the two first flat side alignment pins, the first flat side alignment pins and the first missing corner alignment pins are close to the inner side of the bearing surface of the carrier, and the second flat side alignment pins and the second missing corner alignment pins are located close to the inner side of the bearing surface of the carrier. The angular alignment pins are located near the outside of the carrier surface of the carrier.

The substrate bonding mechanism includes a lifting unit that connects two flat edge alignment units or missing corner alignment units, and drives the two flat edge alignment units or missing corner alignment units to lift and lower relative to the bearing surface of the carrier. .

The substrate bonding mechanism includes at least one elastic unit connecting two flat-edge alignment units or missing corner alignment units, wherein the pressing plate contacts the two flat-edge alignment units or missing corner alignment units and faces the mounting platform. When the bearing surface approaches, the elastic unit will deform, and drive the two flat edge alignment units, the missing corner alignment unit and the pressing plate to move up and down relative to the bearing surface of the carrier platform synchronously.

The substrate bonding mechanism, wherein the missing corner alignment unit comprises a first missing corner alignment pin and a second missing corner alignment pin arranged on the bearing surface of the carrier, and the first missing corner alignment pin is close to the carrier The inner side of the bearing surface of the carrier, and the second missing corner alignment pin is close to the outer side of the bearing surface of the carrier.

10: Substrate bonding mechanism

100: Alignment Mechanism

11: Carrier

111: Bearing surface

113: Placement area

115: Groove

117: First Piercing

119: Second Piercing

121: The first substrate

1211: First flat edge

123: Second substrate

1231: Second flat edge

13: The first alignment unit

131: The first connecting pin

132: Bottom

133: The first alignment rod

134: Projection

141: Elastic unit

143: Lifting unit

145: Drive unit

15: Second alignment unit

151: Second connecting pin

153: Second alignment rod

161: Box

163: Cover

171: Flat edge alignment unit

173: Cracked corner alignment unit

181: First flat edge alignment pin

183: First missing corner alignment pin

185: Second flat edge alignment pin

187: Second missing corner alignment pin

19: Press-fit mechanism

191: plywood

193: connecting rod

195: Linear Actuators

197:Drive rod body

2211: First missing corner

2231: Second missing corner

23: Bearing unit

25: Alignment unit

[FIG. 1] is a three-dimensional schematic diagram of an embodiment of a novel substrate bonding mechanism.

2 is a perspective view of an embodiment of an alignment mechanism of the novel substrate bonding mechanism.

3 is a perspective view of an embodiment of the alignment mechanism of the novel substrate bonding mechanism positioning the first substrate.

4 is a schematic cross-sectional view of an embodiment of the novel first alignment unit.

5 is a perspective view of an embodiment of the alignment mechanism of the novel substrate bonding mechanism positioning the second substrate.

FIG. 6 is a perspective view of an embodiment of the missing corner alignment unit of the novel alignment mechanism aligning the missing corner of the substrate.

FIG. 7 is a perspective view of another embodiment of the alignment mechanism of the novel substrate bonding mechanism.

8 is a perspective view of an embodiment of the flat edge alignment unit of the novel alignment mechanism aligning the flat edge of the substrate.

9 is a perspective view of another embodiment of the missing corner alignment unit of the novel alignment mechanism aligning the missing corner of the substrate.

Please refer to FIG. 1 and FIG. 2 , which are a three-dimensional schematic diagram of an embodiment of a novel substrate bonding mechanism and a three-dimensional schematic diagram of an embodiment of an alignment mechanism of the substrate bonding mechanism, respectively. As shown in the figure, the substrate bonding mechanism 10 mainly includes an alignment mechanism 100 and a pressing mechanism 19 , wherein the alignment mechanism 100 includes a stage 11 , at least three first alignment units 13 , and at least three second alignment units 19 . Alignment unit 15 and at least two flat edge alignment units 171 . The pressing mechanism 19 is located above the alignment mechanism 100 and faces the bearing surface 111 of the stage 11 of the alignment mechanism 100 .

As shown in FIG. 1 and FIG. 2 , the first alignment unit 13 , the second alignment unit 15 and the flat edge alignment unit 171 are arranged in the area near the edge or the periphery of the carrier 11 , for example, on a carrier of the carrier 11 . A placement area 113 is defined on the surface 111 . The carrying surface 111 and the placing area 113 are used for placing the substrate, and the placing area 113 is located in the central area of the carrying surface 111 . The first alignment unit 13 , the second alignment unit 15 and the flat edge alignment unit 171 are arranged around the placement area 113 .

As shown in FIG. 2 , the first alignment units 13 and the second alignment units 15 are alternately and spaced apart around the placement area 113 of the bearing surface 111 . As shown in the figure, the component with the hatched line is the first alignment unit 13 , and is arranged around the placement area 113 . The first and second alignment units 13 / 15 can be moved closer to or away from the placement area 113 , for example, the first and second alignment units 13 / 15 can be displaced along the radial direction of the bearing surface 111 .

The alignment mechanism 100 is positioned on a first substrate 121 and a second substrate 123 above the stage 11 through the first alignment unit 13 and the second alignment unit 15 respectively, so that the first substrate 121 and the second substrate 123 overlap, The second substrate 123 is aligned with the first substrate 121 .

The minimum distance between each of the first alignment units 13 and the minimum distance between each of the second alignment units 15 can be adjusted according to the dimensions of the first substrate 121 and the second substrate 123 , respectively. Specifically, the first substrate 121 and the second substrate 123 are approximately disc-shaped, wherein the circle formed by the three first alignment units 13 in the aligned state is similar in size to the first substrate 121 , while the circle formed by the three first alignment units 13 in the aligned state is similar in size to the first substrate 121 . The circle formed by the three second alignment units 15 in the alignment state is similar to the size of the second substrate 123 .

As shown in FIG. 2 , in an embodiment of the present invention, the first alignment unit 13 includes three first connecting pins 131 and three first alignment rods 133 . The first alignment rod body 133 is connected to the first connecting pin 131 , and drives the first alignment rod body 133 to move along the direction parallel and perpendicular to the bearing surface 111 of the carrier 11 via the first connecting pin 131 . The second alignment unit 15 includes three second connecting pins 151 and three third Two alignment rod bodies 153 , wherein the second alignment rod body 153 is fixed on the second connecting pin 151 . In practical application, according to the size of the first substrate 121 and the second substrate 123 , the first alignment rod body 133 and the second alignment rod body 153 with different lengths can be selected, and the selected first and second alignment rods can be aligned respectively. The rod body 133/153 is sleeved on the first and second connecting pins 131/151.

As shown in FIG. 3 , FIG. 4 and FIG. 5 , the first substrate 121 and the second substrate 123 may be wafers, and the first substrate 121 and the second substrate 123 respectively have first and second angle identification features, wherein the first and second The second angle identifying feature may be a flat edge or a notch on the wafer. As shown in FIG. 3 and FIG. 5 , the first substrate 121 has a first flat side 1211 , and the second substrate 123 has a second flat side 1231 , and can be obtained through the first flat side 1211 and the second flat side 1231 The angles of the first substrate 121 and the second substrate 123 are known.

As shown in FIG. 3 and FIG. 5 , the flat edge alignment unit 171 is disposed around the placement area 113 , and the two flat edge alignment units 171 contact and abut against the first flat edge 1211 of the first substrate 121 and the second substrate The second flat side 1231 of the 123 is used to align the angle or orientation of the first substrate 121 and the second substrate 123 . Through the use of the first alignment unit 13 , the second alignment unit 15 and the flat edge alignment unit 171 , the positions and angles of the first and second substrates 121 / 123 can be positioned.

As shown in FIG. 3 , when the alignment and bonding of the first substrate 121 and the second substrate 123 are performed, the first substrate 121 may be placed on the bearing surface 111 of the stage 11 first, wherein the first substrate 121 The flat edge 1211 faces the flat edge alignment unit 171 . The first alignment unit 13 is close to the placement area 113 along a direction parallel to the bearing surface 111 to position the first substrate 121 placed on the bearing surface 111 of the carrier 11 or the placement area 113 . For example, a positioning center may be defined in the carrying surface 111 and/or the placement area 113 of the stage 11 , and the first alignment unit 13 may be radially displaced toward the positioning center, and approach or move away from the placement area 113 to position the first substrate 121 .

Specifically, after the first substrate 121 is placed in the placement area 113 of the stage 11 , the first substrate 121 is usually not accurately positioned in the placement area 113 . The three first alignment units 13 may be displaced in the direction of the placement area 113 synchronously or asynchronously, and contact the first substrate 121 in the placement area 113 . At this time, the first flat edge 1211 of the first substrate 121 will contact the flat edge alignment unit 171 to locate the angle and position of the first substrate 121 so that the first substrate 121 is accurately placed in the placement area 113 .

In an embodiment of the present invention, as shown in FIG. 4 , the first alignment unit 13 includes a bottom 132 and a protruding portion 134 , wherein the bottom 132 is closer to the bearing surface 111 of the stage 11 than the protruding portion 134 , and the protruding portion 132 The protruding portion 134 protrudes from the bottom portion 132 toward the placement area 113 of the stage 11 . When the first alignment unit 13 approaches the placement area 113 and the first substrate 121 , the bottom 132 of the first alignment unit 13 pushes against and positions the first substrate 121 .

As shown in FIG. 5 , after the positioning of the first substrate 121 is completed, the second substrate 123 can be placed above the placement area 113 with the second flat edge 1231 of the second substrate 123 facing the flat edge alignment unit 171 . At this time, the first alignment unit 13 will remain at the position where the first substrate 121 is positioned, and at the same time is used to support the second substrate 123 , for example, the protruding portion 134 of the first alignment unit 13 supports the second substrate 123 .

As shown in FIG. 5 , the second alignment unit 15 then approaches the placement area 113 and the second substrate 123 , and the second alignment unit 15 pushes against and positions the second substrate carried by the first alignment unit 13 123 , for example, the second alignment unit 15 can be displaced along the radial direction of the bearing surface 111 . At this time, the second flat edge 1231 of the second substrate 123 will contact the flat edge alignment unit 171 to position the angle and position of the second substrate 123 so that the first substrate 121 is aligned with the second substrate 123 . In practical application, the second alignment unit 15 is not used to carry the substrate, so the second alignment unit 15 can be a columnar body with any geometric shape, and it is not necessary to provide the protruding part 134 of the first alignment unit 13 .

After the above-mentioned alignment steps, the second substrate 123 will be aligned with the first substrate 121 , and the second substrate 123 will still be placed on the first alignment unit 13 . Then the first alignment unit 13 is moved away from the first substrate 121 , the second substrate 123 and/or the placement area 113 , for example, along the radial direction of the stage 11 , wherein the second substrate 123 is placed on the first alignment unit 13 . dropped and placed on the first substrate 121 .

In practical application, the three first alignment units 13 may be moved away from the second substrate 123 in an asynchronous manner. For example, one of the first alignment units 13 may be moved away from the second substrate 123 first, while the other two first alignment units may be moved away from the second substrate 123 first. 13 is kept still, so that the second substrate 123 is placed on the first substrate 121 obliquely, and then the other two first alignment units 13 are kept away from the second substrate 123 to lay the second substrate 123 flat on the first substrate 121 superior.

In an embodiment of the present invention, when the first alignment unit 13 is far away from the second substrate 123 , the second alignment unit 15 can remain stationary, so as to avoid the displacement of the first alignment unit 13 relative to the second substrate 123 . The two substrates 123 are displaced relative to the first substrate 121 .

As shown in FIG. 1 , the pressing mechanism 19 includes a pressing plate 191 , a connecting rod 193 and at least one linear actuator 195 , for example, the linear actuator 195 may be a pneumatic cylinder or a motor. The pressing plate 191 faces the bearing surface 111 of the carrier 11 , and the linear actuator 195 connects the pressing plate 191 through the connecting rod 193 , and drives the pressing plate 191 to move toward the bearing surface 111 of the carrier 11 , so as to press the above-mentioned pressing plate 191 The stacked first substrate 121 and the second substrate 123 . In practical application, a heater may be disposed on the stage 11 and/or the pressing plate 191 , wherein the heater is used to heat the first substrate 121 and the second substrate 123 and the adhesive therebetween.

The flat edge aligning unit 171 of the present invention will move up and down with the pressing mechanism 19 relative to the bearing surface 111 of the carrier 11 , and the carrier surface 111 of the carrier 11 also has a concave corresponding to the flat edge aligning unit 171 . Slot 115. For example, when the linear actuator 195 drives the pressing plate 191 to approach the bearing surface 111 of the carrier 11 , the flat edge alignment unit 171 will descend into the groove 115 as the pressing plate 191 descends relative to the bearing surface 111 of the carrier 11 . The height of the alignment unit 171 will be lower than the carrier surface 111 , so that the pressing plate 191 can press the aligned first substrate 121 and the second substrate 123 on the carrier 11 .

As shown in FIG. 6 , in different embodiments, the angle identification feature on the wafer may be a missing corner, wherein the first substrate 121 has a first missing corner 2211 , and the second substrate 123 has a second missing corner 2231 . In this embodiment, the flat edge alignment unit 171 is replaced with a missing corner alignment unit 173 . When contacting the first substrate 121 and the second substrate 123 through the missing corner alignment unit 173, the first missing corners 2211 and the second missing corners 2231 are embedded to locate the angle or orientation of the first and second substrates 121/123, wherein the missing corners The alignment unit 173 will move up and down with the movement of the pressing plate 191 relative to the bearing surface 111 of the stage 11 .

In an embodiment of the present invention, as shown in FIG. 2 , the flat edge alignment unit 171 and/or the cut corner alignment unit 173 may be connected to an elastic unit 141 , for example, the elastic unit 141 may be a spring. When the pressing plate 191 approaches the bearing surface 111 of the stage 11 and contacts the flat edge alignment unit 171 , the elastic unit 141 will be deformed by the external force, so that the flat edge alignment unit 171 and/or the missing corner alignment unit 173 will follow the The pressing plate 191 descends with respect to the bearing surface 111 of the stage 11 . When the pressing plate 191 is disengaged so that the flat edge alignment unit 171 and/or the missing corner alignment unit 173 is not subjected to external force, the restoring force of the elastic unit 141 will cause the flat edge alignment unit 171 and/or the missing corner alignment unit 173 The bearing surface 111 of the stage 11 protrudes so that the flat edge alignment unit 171 can be used to align the first and second flat edges 1211/1231 of the first and second substrates 121/123, and the cutaway alignment unit 173 The first and second missing corners 2211/2231 of the first and second substrates 121/123 can be aligned.

In another embodiment of the present invention, the flat edge alignment unit 171 and/or the cut corner alignment unit 173 can be connected to a lift unit 143, for example, the lift unit 143 can be a pneumatic cylinder or a motor, and is used to The moving flat edge alignment unit 171 and/or the cut corner alignment unit 173 ascends or descends relative to the bearing surface 111 of the stage 11 . Specifically, when the pressing plate 191 approaches or contacts the flat edge aligning unit 171 and/or the notch aligning unit 173 toward the bearing surface 111 of the carrier 11 , the lifting unit 143 drives the flat edge aligning unit 171 and/or the flat edge aligning unit 173 . The notch alignment unit 173 descends with respect to the bearing surface 111 of the stage 11 . The speed at which the lifting unit 143 drives the flat edge aligning unit 171 and/or the corner aligning unit 173 to descend can be synchronized with the pressing plate 191. In different embodiments, the lifting unit 143 can first drive the flat edge aligning unit 171 and/or The notch alignment unit 173 descends, and then the pressing plate 191 approaches and presses the first and second substrates 121 / 123 .

In an embodiment of the present invention, the flat edge alignment unit 171 and/or the notch alignment unit 173 can be a long alignment rod, and the carrier 11 is provided with a plurality of grooves 115 , such as a long bar. The flat edge alignment unit 171 and/or the missing corner alignment unit 173 are arranged in the groove 115 and can be raised and lowered relative to the bearing surface 111 of the stage 11 along the groove 115 .

The elastic unit 141 and the lifting unit 143 are disposed on the side of the stage 11 and are connected to the flat edge alignment unit 171 and/or the cut corner alignment unit 173 . In addition, the flat edge alignment unit 171 and/or the missing corner alignment unit 173 with different lengths can be fixed to the elastic unit 141 and the lifting unit 143, so that the flat edge alignment unit 171 and/or the missing corner alignment unit 173 are suitable for alignment Standardize the flat edges of substrates of different sizes. In different embodiments, the flat edge alignment unit 171 and/or the missing corner alignment unit 173 may be provided with a plurality of fixing holes or elongated through holes, wherein the flat edge alignment unit 171 and/or the missing corner alignment unit 173 The elastic unit 141 and the lifting unit 143 can be connected through different fixing holes, so that the flat edge aligning unit 171 and/or the corner aligning unit 173 can expand and contract along the direction parallel to the bearing surface 111 of the stage 11 , and the flat edge can also be The alignment unit 171 and/or the notch alignment unit 173 are suitable for positioning substrates of different sizes.

As shown in FIG. 1 , the substrate bonding mechanism 10 may include a box body 161 and a cover body 163 . The cover body 163 faces the box body 161 , and the cover body 163 can be used to connect the box body 161 and form a closed space therebetween. The alignment mechanism 100 is provided in the box body 161 , and the pressing plate 191 is located in the cover body 163 .

When the cover body 163 is connected to the box body 161 , the alignment mechanism 100 and the pressing plate 191 are located in the closed space formed by the box body 161 and the cover body 163 . The box body 161 or the cover body 163 can be connected to a suction device, such as a pump, and the gas in the closed space formed by the box body 161 and the cover body 163 can be extracted through the suction device.

As shown in FIG. 1 , in an embodiment of the present invention, the linear actuator 195 can connect to the cover body 163 through the driving rod body 197 , and drive the cover body 163 to approach the box body 161 through the driving rod body 197 , so that the cover body 163 The box body 161 is connected. For example, the driving rod body 197 can be a hollow cylinder, and the connecting rod 193 is disposed inside the driving rod body 197 . In different embodiments, the connecting rod 193 may not be disposed inside the driving rod body 197 , and the connecting rod 193 and the driving rod body 197 can be driven respectively through different linear actuators 195 .

In practical application, the cover body 163 can be driven to connect the box body 161 first, and the airtight space between the cover body 163 and the box body 161 can be evacuated, and then the alignment and keying of the first substrate 121 and the second substrate 123 can be performed. Combine steps.

When the flat edge alignment unit 171 and the notch alignment unit 173 are elongated alignment rods, three grooves 115 can be provided in the area of the bearing surface 111 of the stage 11 close to the edge, wherein two flat edges are aligned with each other. The alignment units 171 are arranged in the two outer grooves 115 respectively, as shown in FIG. 2 , and the missing corner alignment units 173 are arranged in the middle groove 115 , as shown in FIG. 6 .

When replacing two flat edge alignment units 171 with one missing corner alignment unit 173, one of the flat edge alignment units 171 can be removed, and the other flat edge alignment unit 171 can be adjusted to the center The grooves 115 are formed as the missing corner alignment units 173 . In practical application, the elastic unit 141 or the lifting unit 143 can be arranged on the slide rail, and the elastic unit 141 or the lifting unit 143 can be connected through a driving unit 145 to drive the flat edge alignment unit 171 and/or the missing corner alignment The unit 173 is displaced between the three grooves 115 .

In different embodiments, only two grooves 115 may be provided on the bearing surface 111 of the carrier 11 for accommodating two flat edge alignment units 171 respectively, one of the grooves 115 and one flat edge alignment unit 171 is aligned with the center of the first flat side 1211 of the first substrate 121 . When switching the flat edge alignment unit 171 to the missing corner alignment unit 173, it is only necessary to remove the flat edge alignment unit 171 that is not aligned with the center of the first flat edge 1211, so that the original alignment of the first flat edge 1211 can be achieved. The flat edge alignment unit 171 at the center of the flat edge 1211 becomes the missing corner alignment unit 173 .

As shown in FIGS. 7 , 8 and 9 , in another embodiment of the present invention, the flat edge alignment unit 171 and the missing corner alignment unit 173 may be a flat edge alignment pin and a missing corner alignment pin, respectively. Two sets of through holes may be provided on the bearing surface 111 of the carrier 11 , which are three first through holes 117 and a third second through hole 119 . The three first through holes 117 are closer to the inner side of the bearing surface 111 , and the three second through holes 119 are closer to the outer side of the bearing surface 111 . Each of the three first through holes 117 and the three second through holes 119 is provided with an alignment pin, wherein the alignment pin can expand and contract relative to the bearing surface 111 along the first through holes 117 and the second through holes 119 .

As shown in FIG. 8 , two first flat edge alignment pins 181 may be provided in the two first through holes 117 located on both sides. When the two first flat edge alignment pins 181 protrude from the bearing surface 111 of the stage 11 , they can be used to contact and align the first flat edge 1211 of the first substrate 121 and/or the second flat edge 1231 of the second substrate 123 .

As shown in FIG. 9 , a first missing corner alignment pin 183 may be provided in a first through hole 117 located in the middle. The first missing corner alignment pin 183 is located between the two first flat edge alignment pins 181, the first When the missing corner alignment pins 183 protrude from the bearing surface 111 of the stage 11 , they can be used to contact and align the first missing corners 2211 of the first substrate 121 and/or the second missing corners 2231 of the second substrate 123 .

As shown in FIG. 7 , in addition, two second flat edge alignment pins 185 can be provided in the two second through holes 119 located on both sides, and a second missing corner can be located in the one second through hole 119 located in the middle Align pin 187. The second cutaway alignment pin 187 is located between the two second flat edge alignment pins 185 . The first flat edge alignment pins 181 and the first missing corner alignment pins 183 are close to the inner side of the bearing surface 111 of the carrier 11 , while the second flat side alignment pins 185 and the second missing corner alignment pins 187 are near the carrier table 11 . the outer side of the bearing surface 111.

The first flat edge alignment pin 181 , the first missing corner alignment pin 183 , the second flat edge alignment pin 185 and the second missing corner alignment pin 187 can be connected to the elastic unit arranged inside or below the stage 11 and can be lifted and lowered. unit so that the first flat edge alignment pin 181 , the first missing corner alignment pin 183 , the second flat edge alignment pin 185 and the second missing corner alignment pin 187 can be synchronized with the pressing plate 191 relative to the stage 11 . The bearing surface 111 is raised and lowered.

In another embodiment of the present invention, the first alignment unit 13 of FIGS. 1 to 9 may be a carrier unit 23, and the second alignment unit 15 may be an alignment unit 25, wherein the carrier unit 23 and the alignment unit 23 The number, placement and configuration of the units 25 are similar to the first and second alignment units 13/15.

The three bearing units 23 and the three alignment units 25 are disposed around the placement area 113 of the bearing surface 111 , and are used to be close to or away from the placement area 113 . In the novel embodiment, the first substrate 121 and the second substrate 123 are both aligned by the alignment unit 25 , and the second substrate 123 is supported by the carrier unit 23 .

In practical application, the first substrate 121 can be placed on the placement area 113 of the bearing surface 111 of the stage 11 , and the three alignment units 25 will approach the first substrate 121 and the placement area 113 , so that the first substrate 121 is aligned The placement area 113 of the stage 11 .

After the positioning of the first substrate 121 is completed, the three carrying units 23 will approach the first substrate 121 and the placement area 113 , while the three alignment units 25 will be far away from the first substrate 121 . Then, the second substrate 123 is placed on the carrier unit 23 , wherein the second substrate 123 is supported by the carrier unit 23 and does not contact the first substrate 121 . Specifically, the structure of the carrying unit 23 is similar to that of the first alignment unit 13 , and can be used to carry the second substrate 123 .

Then the alignment unit 25 will approach the second substrate 123 , and the three alignment units 25 will contact and position the second substrate 123 carried by the carrier unit 23 so that the second substrate 123 is aligned with the first substrate 121 and/or the carrier 11 placement area 113.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Modifications should be included in the scope of the patent application of the present invention.

10: Substrate bonding mechanism

100: Alignment Mechanism

11: Carrier

13: The first alignment unit

15: Second alignment unit

161: Box

163: Cover

171: Flat edge alignment unit

19: Press-fit mechanism

191: plywood

193: connecting rod

195: Linear Actuators

197:Drive rod body

23: Bearing unit

25: Alignment unit

Claims (12)

A substrate bonding mechanism, comprising: a stage including a bearing surface for carrying a first substrate, wherein the bearing surface has a placement area, the first substrate includes a first angle identification feature, wherein the first The angle identification feature is a first flat edge or a first missing corner; three first alignment units are arranged around the placement area of the bearing surface to be close to or away from the placement area to locate the first alignment unit. a substrate and carrying a second substrate, wherein the second substrate includes a second angle identification feature, the second angle identification feature is a second flat edge or a second missing corner; three second alignment units surround is arranged around the placement area of the bearing surface, and is used to be close to or away from the placement area to position the second substrate carried by the first alignment unit; a pressing plate facing the bearing surface of the platform, and is displaced relative to the carrier, wherein the pressing plate is used for pressing the first substrate and the second substrate stacked on the carrier; at least three grooves or at least three perforations are located on the carrier of the carrier surface, and located around the placement area; and two flat edge alignment units, respectively disposed in the two grooves or the two through holes on both sides, for contacting the first flat edge of the first substrate and the second flat edge of the second substrate, wherein the flat edge alignment unit moves up and down with the pressing plate relative to the carrying surface of the carrier. The substrate bonding mechanism according to claim 1, comprising a missing corner alignment unit disposed in the groove or the through hole in the middle, and used for contacting the first missing corner of the first substrate and the second substrate The second missing corner, wherein the missing corner alignment unit will move up and down with the pressing plate relative to the bearing surface of the carrier. The substrate bonding mechanism of claim 2, wherein the through holes include three first through holes and three second through holes, the three first through holes are closer to the inner side of the bearing surface than the three second through holes, the The flat edge alignment unit includes two first flat edge alignment pins and two second flat edge alignment pins, and the missing corner alignment unit includes a first missing corner alignment pin and a second missing corner pair Alignment pins, the first missing corner alignment pins are arranged in the first hole in the middle, the second missing corner alignment pins are arranged in the second hole in the middle, and the two first flat edge alignment pins are respectively The two first through holes are arranged on both sides, and the two second flat edge alignment pins are respectively arranged on the two second through holes on both sides. The substrate bonding mechanism according to claim 1, comprising a lifting unit connecting the two flat edge alignment units, and driving the two flat edge alignment units to lift and lower relative to the bearing surface of the carrier. The substrate bonding mechanism of claim 1, comprising at least one elastic unit connecting the two flat edge alignment units, wherein the pressing plate contacts the two flat edge alignment units and approaches the bearing surface of the carrier When the elastic unit is deformed, the two flat edge alignment units and the pressing plate move up and down relative to the bearing surface of the carrier synchronously. A substrate bonding mechanism, comprising: a stage including a bearing surface for carrying a first substrate, wherein the bearing surface has a placement area, the first substrate includes a first missing corner; three first pairs a quasi-unit, arranged around the placement area of the bearing surface, for approaching or away from the placement area to position the first substrate and carry a second substrate, the second substrate includes a second missing corner; three a second alignment unit, arranged around the placement area of the bearing surface, and used to be close to or away from the placement area to position the second substrate carried by the first alignment unit; a pressing plate facing the placement area The bearing surface of the carrier is displaced relative to the carrier, wherein the pressing plate is used for pressing the first substrate and the second substrate stacked on the carrier; at least one groove or at least one through hole is located in the bearing surface of the stage and located around the placement area; and At least one missing corner alignment unit is disposed in the groove or the through hole and used to contact the first missing corner of the first substrate and the second missing corner of the second substrate, wherein the missing corner alignment unit The lamination plate moves up and down with respect to the bearing surface of the carrier. The substrate bonding mechanism of claim 6, comprising a lifting unit connected to the missing corner alignment unit, and driving the missing corner alignment unit to lift and lower relative to the bearing surface of the carrier. The substrate bonding mechanism of claim 6, comprising at least one elastic unit connected to the missing corner alignment unit, wherein when the pressing plate contacts the missing corner alignment unit and approaches the bearing surface of the carrier, the elastic The unit will be deformed, so that the notch alignment unit and the pressing plate move up and down relative to the bearing surface of the carrier synchronously. The substrate bonding mechanism of claim 6, wherein the through hole includes a first through hole and a second through hole, the first through hole is closer to the inner side of the bearing surface than the second through hole, and the corner aligning unit includes a A first missing corner alignment pin and a second missing corner alignment pin, the first missing corner alignment pin is arranged in the first hole, and the second missing corner alignment pin is arranged in the second hole . A substrate bonding mechanism, comprising: a stage including a bearing surface for carrying a first substrate, wherein the bearing surface has a placement area, the first substrate includes a first angle identification feature, wherein the first The angle identification feature is a first flat edge or a first missing corner; three alignment units are arranged around the placement area of the bearing surface to be close to or away from the placement area to position the first substrate and a second substrate, wherein the second substrate includes a second angle identification feature, the second angle identification feature is a second flat edge or a second missing corner; three bearing units, arranged around the bearing surface The surrounding of the placement area is used for approaching or away from the placement area, the carrying unit is used for carrying the second substrate, wherein the alignment unit is displaced towards the direction of the placement area to position the second substrate carried by the carrying unit ; a pressing plate facing the bearing surface of the carrier and displaced relative to the carrier, wherein the pressing plate is used for pressing the first substrate and the second substrate stacked on the carrier; at least three concave a groove or at least three perforations located on the bearing surface of the carrier and around the placement area; and two flat edge alignment units respectively disposed in the two grooves or two perforations located on both sides, for contacting the first flat edge of the first substrate and the second flat edge of the second substrate, wherein the flat edge alignment unit moves up and down with the pressing plate relative to the bearing surface of the carrier. The substrate bonding mechanism according to claim 10, comprising a missing corner alignment unit disposed in the groove or the through hole in the middle, and used for contacting the first missing corner of the first substrate and the second substrate The second missing corner, wherein the missing corner alignment unit will move up and down with the pressing plate relative to the bearing surface of the carrier. The substrate bonding mechanism of claim 10, comprising at least one elastic unit connecting the two flat edge alignment units, wherein the pressing plate contacts the two flat edge alignment units and approaches the bearing surface of the carrier When the elastic unit is deformed, the two flat edge alignment units and the pressing plate move up and down relative to the bearing surface of the carrier synchronously.

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