TWM626383U - Substrate Bonding Mechanism - Google Patents

Substrate Bonding Mechanism Download PDF

Info

Publication number
TWM626383U
TWM626383U TW110214007U TW110214007U TWM626383U TW M626383 U TWM626383 U TW M626383U TW 110214007 U TW110214007 U TW 110214007U TW 110214007 U TW110214007 U TW 110214007U TW M626383 U TWM626383 U TW M626383U
Authority
TW
Taiwan
Prior art keywords
substrate
alignment
bearing surface
flat edge
unit
Prior art date
Application number
TW110214007U
Other languages
Chinese (zh)
Inventor
林俊成
張容華
張茂展
Original Assignee
天虹科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 天虹科技股份有限公司 filed Critical 天虹科技股份有限公司
Priority to TW110214007U priority Critical patent/TWM626383U/en
Publication of TWM626383U publication Critical patent/TWM626383U/en

Links

Images

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

本新型提供一種基板鍵合機構,包括一載台、三個第一對準單元、三個第二對準單元、一壓合板及兩個平邊對準單元。載台的承載面具有一放置區用以放置一第一基板,其中第一對準單元、第二對準單元及平邊對準單元設置在放置區周圍。第一對準單元用以定位第一基板,並承載一第二基板。第二對準單元用以定位第二基板,而平邊對準單元則用以接觸第一及第二基板的平邊,以對準第一基板及第二基板的角度。壓合板面對載台的承載面,並用以壓合承載面上經過對位的第一及第二基板,而平邊對準單元則會隨著壓合板相對於載台升降。 The new model provides a substrate bonding mechanism, which comprises a stage, three first alignment units, three second alignment units, a pressing plate and two flat edge alignment units. The carrying surface of the stage has a placement area for placing a first substrate, wherein the first alignment unit, the second alignment unit and the flat edge alignment unit are arranged around the placement area. The first alignment unit is used for positioning the first substrate and carrying a second substrate. The second alignment unit is used for positioning the second substrate, and the flat edge alignment unit is used for contacting the flat edges of the first and second substrates to align the angles of the first substrate and the second substrate. The pressing plate faces the bearing surface of the carrier, and is used for pressing the first and second substrates aligned on the bearing surface, and the flat edge alignment unit moves up and down relative to the carrier along with the pressing plate.

Description

基板鍵合機構 Substrate Bonding Mechanism

本新型有關於一種基板鍵合機構,可快速且準確的對準第一及第二基板的位置及角度,並對經過對準的第一及第二基板進行鍵合。 The utility model relates to a substrate bonding mechanism, which can quickly and accurately align the positions and angles of the first and second substrates, and bond the aligned first and second substrates.

隨著半導體技術的進步,晶圓的厚度亦不斷的被減薄,以利於進行後續的晶圓切割及封裝製程。此外晶圓的薄化亦有利於縮小晶片的體積、降低電阻、加快運算速度及延長使用壽命的優點。然而經過減薄的晶圓的構造十分脆弱,容易在後續的製程中發生晶圓翹曲或斷裂,進而降低產品的良率。 With the advancement of semiconductor technology, the thickness of wafers has been continuously reduced to facilitate subsequent wafer dicing and packaging processes. In addition, the thinning of the wafer is also beneficial to the advantages of reducing the size of the chip, reducing the resistance, speeding up the operation speed and prolonging the service life. However, the structure of the thinned wafer is very fragile, and the wafer is prone to warpage or breakage in the subsequent process, thereby reducing the yield of the product.

為了避免上述的問題發生,一般會選擇將晶圓臨時鍵合在承載基板上,並透過承載基板支撐薄化的晶圓,以避免薄化的晶圓在製程中發生翹曲或斷裂的情形。 In order to avoid the above problems, the wafer is generally temporarily bonded on the carrier substrate, and the thinned wafer is supported by the carrier substrate to avoid warpage or breakage of the thinned wafer during the manufacturing process.

具體而言,可以在承載基板及晶圓的表面塗佈黏合劑,而後將承載基板及晶圓移動到基板鍵合機構進行對位,並提高承載基板及晶圓的溫度進行鍵合。在完成鍵合後可對晶圓進行減薄、蝕刻及金屬化等製程,最後再將晶圓與承載基板剝離。 Specifically, the surface of the carrier substrate and the wafer can be coated with adhesive, and then the carrier substrate and the wafer can be moved to the substrate bonding mechanism for alignment, and the temperature of the carrier substrate and the wafer can be increased for bonding. After the bonding is completed, the wafer can be thinned, etched, and metallized, and finally the wafer and the carrier substrate can be peeled off.

透過上述的步驟雖然可以完成晶圓與承載基板的鍵合,然而一般的基板鍵合機構的對準機構仍存在準確度不佳及對準效率不高的問題,而對製程的效率及良率造成一定的影響。 Although the bonding of the wafer and the carrier substrate can be completed through the above steps, the alignment mechanism of the general substrate bonding mechanism still has the problems of poor accuracy and low alignment efficiency, which affects the efficiency and yield of the process. cause a certain impact.

為了解決上述的問題,本新型提出一種基板鍵合機構,可用以對複數個基板進行位置及角度的對位,而後透過壓合機構壓合經過對位的基板,並完成複數個基板的鍵合,可有效提高複數個基板的對位及鍵合效率。 In order to solve the above problems, the present invention proposes a substrate bonding mechanism, which can be used to align a plurality of substrates in position and angle, and then press the aligned substrates through a pressing mechanism to complete the bonding of the plurality of substrates. , which can effectively improve the alignment and bonding efficiency of multiple substrates.

本新型的一目的,在於提供一種基板鍵合機構,主要於載台上設置三個第一對準單元、三個第二對準單元至少兩個平邊對準單元,其中平邊對準單元用以接觸第一及第二基板的平邊,而第一及第二對準單元則分別用以對位第一及第二基板,以使得第一基板對準第二基板。 An object of the present invention is to provide a substrate bonding mechanism, which mainly includes three first alignment units, three second alignment units and at least two flat edge alignment units on the stage, wherein the flat edge alignment unit The first and second alignment units are used for aligning the first and second substrates respectively, so that the first substrate is aligned with the second substrate.

壓合機構面對載台的承載面,並可相對於載台位移,其中壓合機構的壓合板可用以壓合放置在載台上經過對位的第一及第二基板,而平邊對準單元則會隨著壓合機構的壓合板相對於載台的承載面升降。 The pressing mechanism faces the bearing surface of the carrier, and can be displaced relative to the carrier, wherein the pressing plate of the pressing mechanism can be used to press the first and second substrates placed on the carrier after alignment, and the flat side The quasi-unit will move up and down with the pressing plate of the pressing mechanism relative to the bearing surface of the carrier.

平邊對準單元或缺角對準單元可以是一對準桿體,其中對準桿體可沿著平行載台的承載面的方向伸縮,並用以接觸及對準不同尺寸的第一及第二基板的平邊,使得基板鍵合機構適用於對準不同尺寸的第一及第二基板。 The flat edge alignment unit or the missing corner alignment unit can be an alignment rod body, wherein the alignment rod body can be extended and retracted in the direction parallel to the bearing surface of the carrier, and used to contact and align the first and the second with different sizes. The flat sides of the two substrates make the substrate bonding mechanism suitable for aligning the first and second substrates of different sizes.

平邊對準單元或缺角對準單元亦可以是一對準銷,其中載台的承載面上可設置兩組或兩組以上的對準銷。一組對準銷設置在載台的承載面的內側,並適用於對位尺寸較小的第一及第二基板的平邊。另一組對準銷則設置在載台的承載面的外側,並適用於對位尺寸較大的第一及第二基板的平邊。 The flat edge alignment unit or the missing corner alignment unit can also be an alignment pin, wherein two or more groups of alignment pins can be arranged on the bearing surface of the carrier. A set of alignment pins are arranged on the inner side of the bearing surface of the stage, and are suitable for aligning the flat sides of the first and second substrates with smaller dimensions. Another set of alignment pins is arranged on the outer side of the bearing surface of the carrier, and is suitable for aligning the flat sides of the first and second substrates with larger dimensions.

本新型的一目的,在於提供一種基板鍵合機構,主要於載台上設置三個第一對準單元、三個第二對準單元至少一缺角對準單元,其中缺角對準單元用以接觸第一及第二基板的缺角,而第一及第二對準單元則分別用以對位第一及第二基板,以使得第一基板對準第二基板。 An object of the present invention is to provide a substrate bonding mechanism, which mainly includes three first alignment units, three second alignment units and at least one missing corner alignment unit on the stage, wherein the missing corner alignment unit uses The first and second alignment units are used for aligning the first and second substrates respectively, so that the first substrate is aligned with the second substrate.

為了達到上述的目的,本新型提出一種基板鍵合機構,包括:一載台,包括一承載面,用以承載一第一基板,其中承載面具有一放置區,第一基板包括一第一角度識別特徵,其中第一角度識別特徵為一第一平邊或一第一缺角;三個第一對準單元,環繞設置在承載面的放置區的周圍,用以靠近或遠離放置區,以定位第一基板及承載一第二基板,其中第二基板包括一第二角度識別特徵,第二角度識別特徵為一第二平邊或一第二缺角,其中第一對準單元包括一凸出部及一底部,凸出部朝放置區的方向凸出底部,底部較凸出部靠近載台的承載面,並以第一對準單元的底部定位第一基板;三個第二對準單元,環繞設置在承載面的放置區的周圍,並用以靠近或遠離放置區,以定位第一對準單元承載的第二基板;一壓合板,面對載台的承載面,並相對於載台位移,其中壓合板用以壓合載台上層疊的第一基板及第二基板;及複數個平邊對準單元,位於承載面的放置區的周圍,用以接觸第一基板的第一平邊及第二基板的第二平邊,其中平邊對準單元隨著壓合板相對於載台的承載面升降。 In order to achieve the above-mentioned purpose, the present invention proposes a substrate bonding mechanism, which includes: a stage including a bearing surface for carrying a first substrate, wherein the bearing surface has a placement area, and the first substrate includes a first angle Identification feature, wherein the first angle identification feature is a first flat edge or a first missing angle; three first alignment units are arranged around the placement area of the bearing surface to be close to or away from the placement area to Positioning the first substrate and carrying a second substrate, wherein the second substrate includes a second angle identification feature, the second angle identification feature is a second flat edge or a second missing corner, wherein the first alignment unit includes a convex The protruding part protrudes from the bottom toward the direction of the placement area, the bottom is closer to the bearing surface of the stage than the protruding part, and the first substrate is positioned with the bottom of the first alignment unit; three second alignment The unit is arranged around the placement area of the bearing surface, and is used to be close to or away from the placement area to position the second substrate carried by the first alignment unit; The stage is displaced, wherein the pressing plate is used for pressing the first substrate and the second substrate stacked on the carrier; and a plurality of flat edge alignment units are located around the placement area of the carrier surface for contacting the first substrate The flat edge and the second flat edge of the second substrate, wherein the flat edge alignment unit moves up and down with the pressing plate relative to the bearing surface of the carrier.

本新型提出另一種基板鍵合機構,包括:一載台,包括一承載面,用以承載一第一基板,其中承載面具有一放置區,第一基板包括一第一缺角;三個第一對準單元,環繞設置在承載面的放置區的周圍,用以靠近或遠離放置區,以定位第一基板及承載一第二基板,第二基板包括一第二缺 角,其中第一對準單元包括一凸出部及一底部,凸出部朝放置區的方向凸出底部,底部較凸出部靠近載台的承載面,並以第一對準單元的底部定位第一基板;三個第二對準單元,環繞設置在承載面的放置區的周圍,並用以靠近或遠離放置區,以定位第一對準單元承載的第二基板;一壓合板,面對載台的承載面,並相對於載台位移,其中壓合板用以壓合載台上層疊的第一基板及第二基板;及至少一缺角對準單元,用以接觸第一基板的第一缺角及第二基板的第二缺角,其中缺角對準單元會隨著壓合板相對於載台的承載面升降。 The present invention proposes another substrate bonding mechanism, comprising: a stage including a bearing surface for carrying a first substrate, wherein the bearing surface has a placement area, and the first substrate includes a first missing corner; three third An alignment unit is arranged around the placement area of the bearing surface for approaching or away from the placement area to locate the first substrate and carry a second substrate, the second substrate includes a second recess corner, wherein the first alignment unit includes a protruding part and a bottom, the protruding part protrudes from the bottom toward the direction of the placement area, the bottom is closer to the bearing surface of the stage than the protruding part, and the bottom of the first alignment unit The first substrate is positioned; three second alignment units are arranged around the placement area of the bearing surface, and are used to be close to or away from the placement area to locate the second substrate carried by the first alignment unit; The bearing surface of the carrier is displaced relative to the carrier, wherein the pressing plate is used for pressing the first substrate and the second substrate stacked on the carrier; and at least one missing corner alignment unit is used for contacting the first substrate. The first missing corner and the second missing corner of the second substrate, wherein the missing corner alignment unit moves up and down with the pressing plate relative to the bearing surface of the carrier.

本新型提出另一種基板鍵合機構,包括:一載台,包括一承載面,用以承載一第一基板,其中承載面具有一放置區,第一基板包括一第一角度識別特徵,其中第一角度識別特徵為一第一平邊或一第一缺角;三個對準單元,環繞設置在承載面的放置區的周圍,用以靠近或遠離放置區,以定位第一基板及一第二基板,其中第二基板包括一第二角度識別特徵,第二角度識別特徵為一第二平邊或一第二缺角;三個承載單元,環繞設置在承載面的放置區的周圍,用以靠近或遠離放置區,承載單元用以承載第二基板,其中對準單元朝放置區的方向位移,以定位承載單元承載的第二基板,其中承載單元包括一凸出部及一底部,凸出部朝放置區的方向凸出底部,底部較凸出部靠近載台的承載面;一壓合板,面對載台的承載面,並相對於載台位移,其中壓合板用以壓合載台上層疊的第一基板及第二基板;及複數個平邊對準單元,位於承載面的放置區的周圍,用以接觸第一基板的第一平邊及第二基板的第二平邊,其中平邊對準單元會隨著壓合板相對於載台的承載面升降。 The present invention proposes another substrate bonding mechanism, comprising: a stage including a bearing surface for carrying a first substrate, wherein the bearing surface has a placement area, the first substrate includes a first angle identification feature, wherein the first substrate is An angle identification feature is a first flat edge or a first missing corner; three alignment units are arranged around the placement area of the bearing surface to be close to or away from the placement area to locate the first substrate and a first substrate Two substrates, wherein the second substrate includes a second angle identification feature, and the second angle identification feature is a second flat edge or a second missing corner; three bearing units are arranged around the placement area of the bearing surface, using The carrying unit is used to carry the second substrate so as to be close to or away from the placing area, wherein the alignment unit is displaced toward the direction of the placing area to position the second substrate carried by the carrying unit, wherein the carrying unit includes a protruding part and a bottom, the protruding part is The outgoing part protrudes from the bottom toward the placing area, and the bottom is closer to the bearing surface of the carrier than the protruding part; a pressing plate faces the bearing surface of the carrier and is displaced relative to the carrier, wherein the pressing plate is used for pressing the load a first substrate and a second substrate stacked on the stage; and a plurality of flat edge alignment units located around the placement area of the bearing surface for contacting the first flat edge of the first substrate and the second flat edge of the second substrate , wherein the flat edge alignment unit will move up and down with the lamination plate relative to the bearing surface of the carrier.

所述的基板鍵合機構,包括至少一缺角對準單元用以接觸第一基板的第一缺角及第二基板的第二缺角,其中缺角對準單元會隨著壓合板相對於載台的承載面升降。 The substrate bonding mechanism includes at least one missing corner alignment unit for contacting the first missing corner of the first substrate and the second missing corner of the second substrate, wherein the missing corner alignment unit will be aligned with the pressing plate relative to the second missing corner. The bearing surface of the stage is raised and lowered.

所述的基板鍵合機構,其中平邊對準單元包括兩個第一平邊對準銷及兩個第二平邊對準銷設置於載台的承載面,而缺角對準單元則包括一個第一缺角對準銷及一個第二缺角對準銷設置於載台的承載面,第一缺角對準銷位於兩個第一平邊對準銷之間,第二缺角對準銷位於兩個第一平邊對準銷之間,第一平邊對準銷及第一缺角對準銷靠近載台的承載面內側,而第二平邊對準銷及第二缺角對準銷則靠近載台的承載面外側。 In the substrate bonding mechanism, the flat edge alignment unit includes two first flat edge alignment pins and two second flat edge alignment pins arranged on the bearing surface of the carrier, and the missing corner alignment unit includes A first missing corner alignment pin and a second missing corner alignment pin are arranged on the bearing surface of the carrier, the first missing corner alignment pin is located between the two first flat edge alignment pins, and the second missing corner alignment pin The alignment pins are located between the two first flat side alignment pins, the first flat side alignment pins and the first missing corner alignment pins are close to the inner side of the bearing surface of the carrier, and the second flat side alignment pins and the second missing corner alignment pins are located close to the inner side of the bearing surface of the carrier. The angular alignment pins are located near the outside of the carrier surface of the carrier.

所述的基板鍵合機構,包括一升降單元連接兩個平邊對準單元或缺角對準單元,並帶動兩個平邊對準單元或缺角對準單元相對於載台的承載面升降。 The substrate bonding mechanism includes a lifting unit that connects two flat edge alignment units or missing corner alignment units, and drives the two flat edge alignment units or missing corner alignment units to lift and lower relative to the bearing surface of the carrier. .

所述的基板鍵合機構,包括至少一彈性單元連接兩個平邊對準單元或缺角對準單元,其中壓合板接觸兩個平邊對準單元或缺角對準單元並朝載台的承載面靠近時,彈性單元會產生變形,並帶動兩個平邊對準單元、缺角對準單元與壓合板同步相對於載台的承載面升降。 The substrate bonding mechanism includes at least one elastic unit connecting two flat-edge alignment units or missing corner alignment units, wherein the pressing plate contacts the two flat-edge alignment units or missing corner alignment units and faces the mounting platform. When the bearing surface approaches, the elastic unit will deform, and drive the two flat edge alignment units, the missing corner alignment unit and the pressing plate to move up and down relative to the bearing surface of the carrier platform synchronously.

所述的基板鍵合機構,其中缺角對準單元包括一第一缺角對準銷及一第二缺角對準銷設置於載台的承載面,第一缺角對準銷靠近載台的承載面內側,而第二缺角對準銷則靠近載台的承載面外側。 The substrate bonding mechanism, wherein the missing corner alignment unit comprises a first missing corner alignment pin and a second missing corner alignment pin arranged on the bearing surface of the carrier, and the first missing corner alignment pin is close to the carrier The inner side of the bearing surface of the carrier, and the second missing corner alignment pin is close to the outer side of the bearing surface of the carrier.

10:基板鍵合機構 10: Substrate bonding mechanism

100:對準機構 100: Alignment Mechanism

11:載台 11: Carrier

111:承載面 111: Bearing surface

113:放置區 113: Placement area

115:凹槽 115: Groove

117:第一穿孔 117: First Piercing

119:第二穿孔 119: Second Piercing

121:第一基板 121: The first substrate

1211:第一平邊 1211: First flat edge

123:第二基板 123: Second substrate

1231:第二平邊 1231: Second flat edge

13:第一對準單元 13: The first alignment unit

131:第一連接銷 131: The first connecting pin

132:底部 132: Bottom

133:第一對準桿體 133: The first alignment rod

134:凸出部 134: Projection

141:彈性單元 141: Elastic unit

143:升降單元 143: Lifting unit

145:驅動單元 145: Drive unit

15:第二對準單元 15: Second alignment unit

151:第二連接銷 151: Second connecting pin

153:第二對準桿體 153: Second alignment rod

161:盒體 161: Box

163:蓋體 163: Cover

171:平邊對準單元 171: Flat edge alignment unit

173:缺角對準單元 173: Cracked corner alignment unit

181:第一平邊對準銷 181: First flat edge alignment pin

183:第一缺角對準銷 183: First missing corner alignment pin

185:第二平邊對準銷 185: Second flat edge alignment pin

187:第二缺角對準銷 187: Second missing corner alignment pin

19:壓合機構 19: Press-fit mechanism

191:壓合板 191: plywood

193:連接桿 193: connecting rod

195:線性致動器 195: Linear Actuators

197:驅動桿體 197:Drive rod body

2211:第一缺角 2211: First missing corner

2231:第二缺角 2231: Second missing corner

23:承載單元 23: Bearing unit

25:對準單元 25: Alignment unit

[圖1]為本新型基板鍵合機構一實施例的立體示意圖。 [FIG. 1] is a three-dimensional schematic diagram of an embodiment of a novel substrate bonding mechanism.

[圖2]為本新型基板鍵合機構的對準機構一實施例的立體示意圖。 2 is a perspective view of an embodiment of an alignment mechanism of the novel substrate bonding mechanism.

[圖3]為本新型基板鍵合機構的對準機構定位第一基板一實施例的立體示意圖。 3 is a perspective view of an embodiment of the alignment mechanism of the novel substrate bonding mechanism positioning the first substrate.

[圖4]為本新型第一對準單元一實施例的剖面示意圖。 4 is a schematic cross-sectional view of an embodiment of the novel first alignment unit.

[圖5]為本新型基板鍵合機構的對準機構定位第二基板一實施例的立體示意圖。 5 is a perspective view of an embodiment of the alignment mechanism of the novel substrate bonding mechanism positioning the second substrate.

[圖6]為本新型對準機構的缺角對準單元對準基板的缺角一實施例的立體示意圖。 FIG. 6 is a perspective view of an embodiment of the missing corner alignment unit of the novel alignment mechanism aligning the missing corner of the substrate.

[圖7]為本新型基板鍵合機構的對準機構又一實施例的立體示意圖。 FIG. 7 is a perspective view of another embodiment of the alignment mechanism of the novel substrate bonding mechanism.

[圖8]為本新型對準機構的平邊對準單元對準基板的平邊一實施例的立體示意圖。 8 is a perspective view of an embodiment of the flat edge alignment unit of the novel alignment mechanism aligning the flat edge of the substrate.

[圖9]為本新型對準機構的缺角對準單元對準基板的缺角又一實施例的立體示意圖。 9 is a perspective view of another embodiment of the missing corner alignment unit of the novel alignment mechanism aligning the missing corner of the substrate.

請參閱圖1及圖2,分別為本新型基板鍵合機構一實施例的立體示意圖及基板鍵合機構的對準機構一實施例的立體示意圖。如圖所示,基板鍵合機構10主要包括一對準機構100及一壓合機構19,其中對準機構100包括一載台11、至少三個第一對準單元13、至少三個第二對準單元15及至少兩個平邊對準單元171。壓合機構19位於對準機構100的上方,並面對對準機構100的載台11的承載面111。 Please refer to FIG. 1 and FIG. 2 , which are a three-dimensional schematic diagram of an embodiment of a novel substrate bonding mechanism and a three-dimensional schematic diagram of an embodiment of an alignment mechanism of the substrate bonding mechanism, respectively. As shown in the figure, the substrate bonding mechanism 10 mainly includes an alignment mechanism 100 and a pressing mechanism 19 , wherein the alignment mechanism 100 includes a stage 11 , at least three first alignment units 13 , and at least three second alignment units 19 . Alignment unit 15 and at least two flat edge alignment units 171 . The pressing mechanism 19 is located above the alignment mechanism 100 and faces the bearing surface 111 of the stage 11 of the alignment mechanism 100 .

如圖1與圖2所示,第一對準單元13、第二對準單元15及平邊對準單元171設置在載台11靠近邊緣或外圍的區域,例如可於載台11的一承載面111上定義一放置區113。承載面111及放置區113用以放置基板,且放置區113位於承載面111的中央區域。第一對準單元13、第二對準單元15及平邊對準單元171環繞設置在放置區113周圍。 As shown in FIG. 1 and FIG. 2 , the first alignment unit 13 , the second alignment unit 15 and the flat edge alignment unit 171 are arranged in the area near the edge or the periphery of the carrier 11 , for example, on a carrier of the carrier 11 . A placement area 113 is defined on the surface 111 . The carrying surface 111 and the placing area 113 are used for placing the substrate, and the placing area 113 is located in the central area of the carrying surface 111 . The first alignment unit 13 , the second alignment unit 15 and the flat edge alignment unit 171 are arranged around the placement area 113 .

如圖2所示,第一對準單元13及第二對準單元15交錯地間隔設置在承載面111的放置區113的周圍。如圖所示具有剖面線的構件為第一對準單元13,並環繞設置在放置區113的周圍。第一及第二對準單元13/15可移動靠近或遠離放置區113,例如第一及第二對準單元13/15可沿著承載面111的徑向位移。 As shown in FIG. 2 , the first alignment units 13 and the second alignment units 15 are alternately and spaced apart around the placement area 113 of the bearing surface 111 . As shown in the figure, the component with the hatched line is the first alignment unit 13 , and is arranged around the placement area 113 . The first and second alignment units 13 / 15 can be moved closer to or away from the placement area 113 , for example, the first and second alignment units 13 / 15 can be displaced along the radial direction of the bearing surface 111 .

對準機構100分別透過第一對準單元13及第二對準單元15定位於載台11上方的一第一基板121及一第二基板123,使得第一基板121與第二基板123重疊,其中第二基板123會對準第一基板121。 The alignment mechanism 100 is positioned on a first substrate 121 and a second substrate 123 above the stage 11 through the first alignment unit 13 and the second alignment unit 15 respectively, so that the first substrate 121 and the second substrate 123 overlap, The second substrate 123 is aligned with the first substrate 121 .

各個第一對準單元13之間的最小間距及各個第二對準單元15之間的最小間距,可分別依據第一基板121及第二基板123的尺寸調整。具體而言,第一基板121及第二基板123近似圓盤狀,其中處在對準狀態的三個第一對準單元13所構成的圓與第一基板121的大小相近,而處在對準狀態的三個第二對準單元15所構成的圓與第二基板123的大小相近。 The minimum distance between each of the first alignment units 13 and the minimum distance between each of the second alignment units 15 can be adjusted according to the dimensions of the first substrate 121 and the second substrate 123 , respectively. Specifically, the first substrate 121 and the second substrate 123 are approximately disc-shaped, wherein the circle formed by the three first alignment units 13 in the aligned state is similar in size to the first substrate 121 , while the circle formed by the three first alignment units 13 in the aligned state is similar in size to the first substrate 121 . The circle formed by the three second alignment units 15 in the alignment state is similar to the size of the second substrate 123 .

如圖2所示,在本新型一實施例中,第一對準單元13包括三個第一連接銷131及三個第一對準桿體133。第一對準桿體133連接第一連接銷131,並經由第一連接銷131帶動第一對準桿體133沿著平行及垂直載台11的承載面111的方向位移。第二對準單元15包括三個第二連接銷151及三個第 二對準桿體153,其中第二對準桿體153固定在第二連接銷151上。在實際應用時可依據第一基板121及第二基板123的尺寸,選擇不同長度的第一對準桿體133及第二對準桿體153,並分別將選擇的第一及第二對準桿體133/153套設在第一及第二連接銷131/151上。 As shown in FIG. 2 , in an embodiment of the present invention, the first alignment unit 13 includes three first connecting pins 131 and three first alignment rods 133 . The first alignment rod body 133 is connected to the first connecting pin 131 , and drives the first alignment rod body 133 to move along the direction parallel and perpendicular to the bearing surface 111 of the carrier 11 via the first connecting pin 131 . The second alignment unit 15 includes three second connecting pins 151 and three third Two alignment rod bodies 153 , wherein the second alignment rod body 153 is fixed on the second connecting pin 151 . In practical application, according to the size of the first substrate 121 and the second substrate 123 , the first alignment rod body 133 and the second alignment rod body 153 with different lengths can be selected, and the selected first and second alignment rods can be aligned respectively. The rod body 133/153 is sleeved on the first and second connecting pins 131/151.

如圖3、圖4與圖5所示,第一基板121及第二基板123可以是晶圓,第一基板121及第二基板123分別具有第一及第二角度識別特徵,其中第一及第二角度識別特徵可以是晶圓上的平邊或缺角(notch)。如圖3及圖5所示,第一基板121具有一第一平邊1211,而第二基板123則具有一第二平邊1231,並可經由第一平邊1211及第二平邊1231得知第一基板121及第二基板123的角度。 As shown in FIG. 3 , FIG. 4 and FIG. 5 , the first substrate 121 and the second substrate 123 may be wafers, and the first substrate 121 and the second substrate 123 respectively have first and second angle identification features, wherein the first and second The second angle identifying feature may be a flat edge or a notch on the wafer. As shown in FIG. 3 and FIG. 5 , the first substrate 121 has a first flat side 1211 , and the second substrate 123 has a second flat side 1231 , and can be obtained through the first flat side 1211 and the second flat side 1231 The angles of the first substrate 121 and the second substrate 123 are known.

如圖3與圖5所示,平邊對準單元171設置在放置區113的周圍,透過兩個平邊對準單元171接觸並抵頂第一基板121的第一平邊1211及第二基板123的第二平邊1231,以對位第一基板121及第二基板123的角度或方位。透過第一對準單元13、第二對準單元15及平邊對準單元171的使用,可以定位第一及第二基板121/123的位置及角度。 As shown in FIG. 3 and FIG. 5 , the flat edge alignment unit 171 is disposed around the placement area 113 , and the two flat edge alignment units 171 contact and abut against the first flat edge 1211 of the first substrate 121 and the second substrate The second flat side 1231 of the 123 is used to align the angle or orientation of the first substrate 121 and the second substrate 123 . Through the use of the first alignment unit 13 , the second alignment unit 15 and the flat edge alignment unit 171 , the positions and angles of the first and second substrates 121 / 123 can be positioned.

如圖3所示,在進行第一基板121及第二基板123的對位及鍵合時,可先將第一基板121放置在載台11的承載面111,其中第一基板121的第一平邊1211朝向平邊對準單元171。第一對準單元13沿著平行承載面111的方向靠近放置區113,以定位放置在載台11的承載面111或放置區113的第一基板121。例如載台11的承載面111及/或放置區113中可定義一定位中心,而第一對準單元13可朝向該定位中心徑向位移,並靠近或遠離放置區113以定位第一基板121。 As shown in FIG. 3 , when the alignment and bonding of the first substrate 121 and the second substrate 123 are performed, the first substrate 121 may be placed on the bearing surface 111 of the stage 11 first, wherein the first substrate 121 The flat edge 1211 faces the flat edge alignment unit 171 . The first alignment unit 13 is close to the placement area 113 along a direction parallel to the bearing surface 111 to position the first substrate 121 placed on the bearing surface 111 of the carrier 11 or the placement area 113 . For example, a positioning center may be defined in the carrying surface 111 and/or the placement area 113 of the stage 11 , and the first alignment unit 13 may be radially displaced toward the positioning center, and approach or move away from the placement area 113 to position the first substrate 121 .

具體而言,在將第一基板121放置在載台11的放置區113後,第一基板121通常不會準確的位在放置區113內。三個第一對準單元13可同步或不同步朝放置區113的方向位移,並接觸放置區113內的第一基板121。此時第一基板121的第一平邊1211會接觸平邊對準單元171,以定位第一基板121的角度及位置,使得第一基板121準確的放置在放置區113內。 Specifically, after the first substrate 121 is placed in the placement area 113 of the stage 11 , the first substrate 121 is usually not accurately positioned in the placement area 113 . The three first alignment units 13 may be displaced in the direction of the placement area 113 synchronously or asynchronously, and contact the first substrate 121 in the placement area 113 . At this time, the first flat edge 1211 of the first substrate 121 will contact the flat edge alignment unit 171 to locate the angle and position of the first substrate 121 so that the first substrate 121 is accurately placed in the placement area 113 .

在本新型一實施例中,如圖4所示,第一對準單元13包括一底部132及一凸出部134,其中底部132較凸出部134靠近載台11的承載面111,而凸出部134則朝載台11的放置區113的方向凸出底部132。當第一對準單元13朝放置區113及第一基板121的方向靠近時,第一對準單元13的底部132會推抵並定位第一基板121。 In an embodiment of the present invention, as shown in FIG. 4 , the first alignment unit 13 includes a bottom 132 and a protruding portion 134 , wherein the bottom 132 is closer to the bearing surface 111 of the stage 11 than the protruding portion 134 , and the protruding portion 132 The protruding portion 134 protrudes from the bottom portion 132 toward the placement area 113 of the stage 11 . When the first alignment unit 13 approaches the placement area 113 and the first substrate 121 , the bottom 132 of the first alignment unit 13 pushes against and positions the first substrate 121 .

如圖5所示,在完成第一基板121的定位後,可將第二基板123放置在放置區113的上方,並使得第二基板123的第二平邊1231朝向平邊對準單元171。此時第一對準單元13會保持在定位第一基板121的位置,並同時用以承載第二基板123,例如以第一對準單元13的凸出部134承載第二基板123。 As shown in FIG. 5 , after the positioning of the first substrate 121 is completed, the second substrate 123 can be placed above the placement area 113 with the second flat edge 1231 of the second substrate 123 facing the flat edge alignment unit 171 . At this time, the first alignment unit 13 will remain at the position where the first substrate 121 is positioned, and at the same time is used to support the second substrate 123 , for example, the protruding portion 134 of the first alignment unit 13 supports the second substrate 123 .

如圖5所示,而後第二對準單元15會朝放置區113及第二基板123的方向靠近,並以第二對準單元15推抵及定位第一對準單元13承載的第二基板123,例如第二對準單元15可沿著承載面111的徑向位移。此時第二基板123的第二平邊1231會接觸平邊對準單元171,以定位第二基板123的角度及位置,使得第一基板121對準第二基板123。在實際應用時,第二對準單元15並不用以承載基板,因此第二對準單元15可以是任意幾何形狀的柱狀體,而不需要設置如第一對準單元13的凸出部134。 As shown in FIG. 5 , the second alignment unit 15 then approaches the placement area 113 and the second substrate 123 , and the second alignment unit 15 pushes against and positions the second substrate carried by the first alignment unit 13 123 , for example, the second alignment unit 15 can be displaced along the radial direction of the bearing surface 111 . At this time, the second flat edge 1231 of the second substrate 123 will contact the flat edge alignment unit 171 to position the angle and position of the second substrate 123 so that the first substrate 121 is aligned with the second substrate 123 . In practical application, the second alignment unit 15 is not used to carry the substrate, so the second alignment unit 15 can be a columnar body with any geometric shape, and it is not necessary to provide the protruding part 134 of the first alignment unit 13 .

經過上述的對準步驟之後,第二基板123將會對準第一基板121,其中第二基板123仍會放置在第一對準單元13上。而後第一對準單元13會遠離第一基板121、第二基板123及/或放置區113,例如沿著載台11的徑向遠離,其中第二基板123會由第一對準單元13上落下,並放置在第一基板121上。 After the above-mentioned alignment steps, the second substrate 123 will be aligned with the first substrate 121 , and the second substrate 123 will still be placed on the first alignment unit 13 . Then the first alignment unit 13 is moved away from the first substrate 121 , the second substrate 123 and/or the placement area 113 , for example, along the radial direction of the stage 11 , wherein the second substrate 123 is placed on the first alignment unit 13 . dropped and placed on the first substrate 121 .

在實際應用時,三個第一對準單元13可以不同步的方式遠離第二基板123,例如其中一個第一對準單元13可先遠離第二基板123,而另外兩個第一對準單元13則保持不動,使得第二基板123斜放在第一基板121上,而後另外兩個第一對準單元13才會遠離第二基板123,以將第二基板123平放在第一基板121上。 In practical application, the three first alignment units 13 may be moved away from the second substrate 123 in an asynchronous manner. For example, one of the first alignment units 13 may be moved away from the second substrate 123 first, while the other two first alignment units may be moved away from the second substrate 123 first. 13 is kept still, so that the second substrate 123 is placed on the first substrate 121 obliquely, and then the other two first alignment units 13 are kept away from the second substrate 123 to lay the second substrate 123 flat on the first substrate 121 superior.

在本新型一實施例中,第一對準單元13遠離第二基板123時,第二對準單元15可保持不動,可避免第一對準單元13相對於第二基板123位移時,造成第二基板123相對於第一基板121位移。 In an embodiment of the present invention, when the first alignment unit 13 is far away from the second substrate 123 , the second alignment unit 15 can remain stationary, so as to avoid the displacement of the first alignment unit 13 relative to the second substrate 123 . The two substrates 123 are displaced relative to the first substrate 121 .

如圖1所示,壓合機構19包括一壓合板191、一連接桿193及至少一線性致動器195,例如線性致動器195可以是氣壓缸或馬達。壓合板191朝向載台11的承載面111,而線性致動器195透過連接桿193連接壓合板191,並驅動壓合板191朝載台11的承載面111位移,以透過壓合板191壓合上述層疊的第一基板121及第二基板123。在實際應用時,載台11及/或壓合板191上可設置一加熱器,其中加熱器用以加熱第一基板121及第二基板123及兩者之間的黏合劑。 As shown in FIG. 1 , the pressing mechanism 19 includes a pressing plate 191 , a connecting rod 193 and at least one linear actuator 195 , for example, the linear actuator 195 may be a pneumatic cylinder or a motor. The pressing plate 191 faces the bearing surface 111 of the carrier 11 , and the linear actuator 195 connects the pressing plate 191 through the connecting rod 193 , and drives the pressing plate 191 to move toward the bearing surface 111 of the carrier 11 , so as to press the above-mentioned pressing plate 191 The stacked first substrate 121 and the second substrate 123 . In practical application, a heater may be disposed on the stage 11 and/or the pressing plate 191 , wherein the heater is used to heat the first substrate 121 and the second substrate 123 and the adhesive therebetween.

本新型所述的平邊對準單元171會隨著壓合機構19相對於載台11的承載面111升降,載台11的承載面111上也有相應於平邊對準單元171的凹 槽115。例如當線性致動器195驅動壓合板191朝載台11的承載面111靠近時,平邊對準單元171會隨著壓合板191相對於載台11的承載面111下降進入凹槽115中。對準單元171的高度將低於承載面111,使得壓合板191可以壓合載台11上經過對準的第一基板121及第二基板123。 The flat edge aligning unit 171 of the present invention will move up and down with the pressing mechanism 19 relative to the bearing surface 111 of the carrier 11 , and the carrier surface 111 of the carrier 11 also has a concave corresponding to the flat edge aligning unit 171 . Slot 115. For example, when the linear actuator 195 drives the pressing plate 191 to approach the bearing surface 111 of the carrier 11 , the flat edge alignment unit 171 will descend into the groove 115 as the pressing plate 191 descends relative to the bearing surface 111 of the carrier 11 . The height of the alignment unit 171 will be lower than the carrier surface 111 , so that the pressing plate 191 can press the aligned first substrate 121 and the second substrate 123 on the carrier 11 .

如圖6所示,在不同實施例中,晶圓上的角度識別特徵可為缺角,其中第一基板121具有一第一缺角2211,而第二基板123則具有一第二缺角2231。在此實施例中,平邊對準單元171更換為缺角對準單元173。透過缺角對準單元173接觸第一基板121與第二基板123時嵌入第一缺角2211及第二缺角2231,以定位第一及第二基板121/123的角度或方位,其中缺角對準單元173會隨著壓合板191相對於載台11的承載面111的移動而升降。 As shown in FIG. 6 , in different embodiments, the angle identification feature on the wafer may be a missing corner, wherein the first substrate 121 has a first missing corner 2211 , and the second substrate 123 has a second missing corner 2231 . In this embodiment, the flat edge alignment unit 171 is replaced with a missing corner alignment unit 173 . When contacting the first substrate 121 and the second substrate 123 through the missing corner alignment unit 173, the first missing corners 2211 and the second missing corners 2231 are embedded to locate the angle or orientation of the first and second substrates 121/123, wherein the missing corners The alignment unit 173 will move up and down with the movement of the pressing plate 191 relative to the bearing surface 111 of the stage 11 .

在本新型一實施例中,如圖2所示,平邊對準單元171及/或缺角對準單元173可連接一彈性單元141,例如彈性單元141可為彈簧。當壓合板191朝載台11的承載面111靠近並接觸平邊對準單元171時,彈性單元141會受到外力作用產生形變,使得平邊對準單元171及/或缺角對準單元173隨著壓合板191相對於載台11的承載面111下降。當壓合板191脫離使得平邊對準單元171及/或缺角對準單元173未受到外力作用時,彈性單元141的恢復力會使得平邊對準單元171及/或缺角對準單元173凸出載台11的承載面111,使得平邊對準單元171可用以對準第一及第二基板121/123的第一及第二平邊1211/1231,而缺角對準單元173則可用以對準準第一及第二基板121/123的第一及第二缺角2211/2231。 In an embodiment of the present invention, as shown in FIG. 2 , the flat edge alignment unit 171 and/or the cut corner alignment unit 173 may be connected to an elastic unit 141 , for example, the elastic unit 141 may be a spring. When the pressing plate 191 approaches the bearing surface 111 of the stage 11 and contacts the flat edge alignment unit 171 , the elastic unit 141 will be deformed by the external force, so that the flat edge alignment unit 171 and/or the missing corner alignment unit 173 will follow the The pressing plate 191 descends with respect to the bearing surface 111 of the stage 11 . When the pressing plate 191 is disengaged so that the flat edge alignment unit 171 and/or the missing corner alignment unit 173 is not subjected to external force, the restoring force of the elastic unit 141 will cause the flat edge alignment unit 171 and/or the missing corner alignment unit 173 The bearing surface 111 of the stage 11 protrudes so that the flat edge alignment unit 171 can be used to align the first and second flat edges 1211/1231 of the first and second substrates 121/123, and the cutaway alignment unit 173 The first and second missing corners 2211/2231 of the first and second substrates 121/123 can be aligned.

在本新型另一實施例中,平邊對準單元171及/或缺角對準單元173可連接一升降單元143,例如升降單元143可為氣壓缸或馬達,並用以帶 動平邊對準單元171及/或缺角對準單元173相對於載台11的承載面111上升或下降。具體而言,當壓合板191朝載台11的承載面111靠近或接觸平邊對準單元171及/或缺角對準單元173時,升降單元143會帶動平邊對準單元171及/或缺角對準單元173對於載台11的承載面111下降。升降單元143帶動平邊對準單元171及/或缺角對準單元173下降的速度可與壓合板191同步,在不同實施例中,升降單元143可先帶動平邊對準單元171及/或缺角對準單元173下降,而後壓合板191才會靠近並壓合第一及第二基板121/123。 In another embodiment of the present invention, the flat edge alignment unit 171 and/or the cut corner alignment unit 173 can be connected to a lift unit 143, for example, the lift unit 143 can be a pneumatic cylinder or a motor, and is used to The moving flat edge alignment unit 171 and/or the cut corner alignment unit 173 ascends or descends relative to the bearing surface 111 of the stage 11 . Specifically, when the pressing plate 191 approaches or contacts the flat edge aligning unit 171 and/or the notch aligning unit 173 toward the bearing surface 111 of the carrier 11 , the lifting unit 143 drives the flat edge aligning unit 171 and/or the flat edge aligning unit 173 . The notch alignment unit 173 descends with respect to the bearing surface 111 of the stage 11 . The speed at which the lifting unit 143 drives the flat edge aligning unit 171 and/or the corner aligning unit 173 to descend can be synchronized with the pressing plate 191. In different embodiments, the lifting unit 143 can first drive the flat edge aligning unit 171 and/or The notch alignment unit 173 descends, and then the pressing plate 191 approaches and presses the first and second substrates 121 / 123 .

在本新型一實施例中,平邊對準單元171及/或缺角對準單元173可為長條狀的對準桿,而載台11上則設置複數個凹槽115,例如長條狀的凹槽,其中平邊對準單元171及/或缺角對準單元173設置於凹槽115內,並可沿著凹槽115相對於載台11的承載面111升降。 In an embodiment of the present invention, the flat edge alignment unit 171 and/or the notch alignment unit 173 can be a long alignment rod, and the carrier 11 is provided with a plurality of grooves 115 , such as a long bar. The flat edge alignment unit 171 and/or the missing corner alignment unit 173 are arranged in the groove 115 and can be raised and lowered relative to the bearing surface 111 of the stage 11 along the groove 115 .

彈性單元141及升降單元143設置在載台11的側邊,並連接平邊對準單元171及/或缺角對準單元173。此外可將不同長度的平邊對準單元171及/或缺角對準單元173固定在彈性單元141及升降單元143,使得平邊對準單元171及/或缺角對準單元173適用於對準不同尺寸的基板的平邊。在不同實施例中,平邊對準單元171及/或缺角對準單元173上可設置複數個固定孔或長條狀穿孔,其中平邊對準單元171及/或缺角對準單元173可經由不同的固定孔連接彈性單元141及升降單元143,使得平邊對準單元171及/或缺角對準單元173沿著平行載台11的承載面111的方向伸縮,同樣可使得平邊對準單元171及/或缺角對準單元173適用於定位不同尺寸的基板。 The elastic unit 141 and the lifting unit 143 are disposed on the side of the stage 11 and are connected to the flat edge alignment unit 171 and/or the cut corner alignment unit 173 . In addition, the flat edge alignment unit 171 and/or the missing corner alignment unit 173 with different lengths can be fixed to the elastic unit 141 and the lifting unit 143, so that the flat edge alignment unit 171 and/or the missing corner alignment unit 173 are suitable for alignment Standardize the flat edges of substrates of different sizes. In different embodiments, the flat edge alignment unit 171 and/or the missing corner alignment unit 173 may be provided with a plurality of fixing holes or elongated through holes, wherein the flat edge alignment unit 171 and/or the missing corner alignment unit 173 The elastic unit 141 and the lifting unit 143 can be connected through different fixing holes, so that the flat edge aligning unit 171 and/or the corner aligning unit 173 can expand and contract along the direction parallel to the bearing surface 111 of the stage 11 , and the flat edge can also be The alignment unit 171 and/or the notch alignment unit 173 are suitable for positioning substrates of different sizes.

如圖1所示,基板鍵合機構10可包括一盒體161及一蓋體163。蓋體163面對盒體161,且蓋體163可用以連接盒體161,並在兩者之間形成一密閉空間。對準機構100設置在盒體161內,而壓合板191則位於蓋體163內。 As shown in FIG. 1 , the substrate bonding mechanism 10 may include a box body 161 and a cover body 163 . The cover body 163 faces the box body 161 , and the cover body 163 can be used to connect the box body 161 and form a closed space therebetween. The alignment mechanism 100 is provided in the box body 161 , and the pressing plate 191 is located in the cover body 163 .

當蓋體163連接盒體161時,對準機構100及壓合板191會位於盒體161及蓋體163形成的密閉空間內。盒體161或蓋體163可連接一抽氣裝置,例如幫浦,並透過抽氣裝置抽出盒體161及蓋體163形成的密閉空間內的氣體。 When the cover body 163 is connected to the box body 161 , the alignment mechanism 100 and the pressing plate 191 are located in the closed space formed by the box body 161 and the cover body 163 . The box body 161 or the cover body 163 can be connected to a suction device, such as a pump, and the gas in the closed space formed by the box body 161 and the cover body 163 can be extracted through the suction device.

如圖1所示,在本新型一實施例中,線性致動器195可透過驅動桿體197連接蓋體163,並透過驅動桿體197驅動蓋體163朝盒體161靠近,使得蓋體163連接盒體161。例如驅動桿體197可為空心柱體,而連接桿193則設置在驅動桿體197內部。在不同實施例中,連接桿193亦可不設置在驅動桿體197內部,並可透過不同的線性致動器195分別驅動連接桿193及驅動桿體197。 As shown in FIG. 1 , in an embodiment of the present invention, the linear actuator 195 can connect to the cover body 163 through the driving rod body 197 , and drive the cover body 163 to approach the box body 161 through the driving rod body 197 , so that the cover body 163 The box body 161 is connected. For example, the driving rod body 197 can be a hollow cylinder, and the connecting rod 193 is disposed inside the driving rod body 197 . In different embodiments, the connecting rod 193 may not be disposed inside the driving rod body 197 , and the connecting rod 193 and the driving rod body 197 can be driven respectively through different linear actuators 195 .

在實際應用時,可先驅動蓋體163連接盒體161,並對蓋體163及盒體161之間的密閉空間抽氣,而後再進行第一基板121及第二基板123的對準及鍵合步驟。 In practical application, the cover body 163 can be driven to connect the box body 161 first, and the airtight space between the cover body 163 and the box body 161 can be evacuated, and then the alignment and keying of the first substrate 121 and the second substrate 123 can be performed. Combine steps.

當平邊對準單元171及缺角對準單元173為長條狀的對準桿時,可於載台11的承載面111靠近邊緣的區域設置三個凹槽115,其中兩個平邊對準單元171設置分別設置在位於外側的兩個凹槽115內,如圖2所示,而缺角對準單元173則設置在位於中間的凹槽115內,如圖6所示。 When the flat edge alignment unit 171 and the notch alignment unit 173 are elongated alignment rods, three grooves 115 can be provided in the area of the bearing surface 111 of the stage 11 close to the edge, wherein two flat edges are aligned with each other. The alignment units 171 are arranged in the two outer grooves 115 respectively, as shown in FIG. 2 , and the missing corner alignment units 173 are arranged in the middle groove 115 , as shown in FIG. 6 .

在將兩個平邊對準單元171更換為一個缺角對準單元173時,可將其中一個平邊對準單元171卸下,並將另一個平邊對準單元171調整至中央 的凹槽115以成為缺角對準單元173。在實際應用時,可將彈性單元141或升降單元143設置在滑軌上,並透過一驅動單元145連接彈性單元141或升降單元143,以帶動平邊對準單元171及/或缺角對準單元173在三個凹槽115之間位移。 When replacing two flat edge alignment units 171 with one missing corner alignment unit 173, one of the flat edge alignment units 171 can be removed, and the other flat edge alignment unit 171 can be adjusted to the center The grooves 115 are formed as the missing corner alignment units 173 . In practical application, the elastic unit 141 or the lifting unit 143 can be arranged on the slide rail, and the elastic unit 141 or the lifting unit 143 can be connected through a driving unit 145 to drive the flat edge alignment unit 171 and/or the missing corner alignment The unit 173 is displaced between the three grooves 115 .

在不同實施例中,載台11的承載面111上亦可僅設置兩個凹槽115,分別用以容置兩個平邊對準單元171,其中一個凹槽115及一個平邊對準單元171對準第一基板121的第一平邊1211的正中心。在將平邊對準單元171切換為缺角對準單元173時,僅需要將未對準第一平邊1211的正中心的平邊對準單元171卸下,便可使得原本對準第一平邊1211正中心的平邊對準單元171成為缺角對準單元173。 In different embodiments, only two grooves 115 may be provided on the bearing surface 111 of the carrier 11 for accommodating two flat edge alignment units 171 respectively, one of the grooves 115 and one flat edge alignment unit 171 is aligned with the center of the first flat side 1211 of the first substrate 121 . When switching the flat edge alignment unit 171 to the missing corner alignment unit 173, it is only necessary to remove the flat edge alignment unit 171 that is not aligned with the center of the first flat edge 1211, so that the original alignment of the first flat edge 1211 can be achieved. The flat edge alignment unit 171 at the center of the flat edge 1211 becomes the missing corner alignment unit 173 .

如圖7、圖8及圖9所示,在本新型另一實施例中,平邊對準單元171及缺角對準單元173可分別為平邊對準銷及缺角對準銷。載台11的承載面111上可設置兩組穿孔,分別為三個第一穿孔117及第三個第二穿孔119。三個第一穿孔117較靠近承載面111的內側,而三個第二穿孔119則較靠近承載面111的外側。三個第一穿孔117及三個第二穿孔119內皆設置一對準銷,其中對準銷可沿著第一穿孔117及第二穿孔119相對於承載面111伸縮。 As shown in FIGS. 7 , 8 and 9 , in another embodiment of the present invention, the flat edge alignment unit 171 and the missing corner alignment unit 173 may be a flat edge alignment pin and a missing corner alignment pin, respectively. Two sets of through holes may be provided on the bearing surface 111 of the carrier 11 , which are three first through holes 117 and a third second through hole 119 . The three first through holes 117 are closer to the inner side of the bearing surface 111 , and the three second through holes 119 are closer to the outer side of the bearing surface 111 . Each of the three first through holes 117 and the three second through holes 119 is provided with an alignment pin, wherein the alignment pin can expand and contract relative to the bearing surface 111 along the first through holes 117 and the second through holes 119 .

如圖8所示,位於兩側的兩個第一穿孔117內可設置兩個第一平邊對準銷181。兩個第一平邊對準銷181凸出載台11的承載面111時,可用以接觸及對準第一基板121的第一平邊1211及/或第二基板123的第二平邊1231。 As shown in FIG. 8 , two first flat edge alignment pins 181 may be provided in the two first through holes 117 located on both sides. When the two first flat edge alignment pins 181 protrude from the bearing surface 111 of the stage 11 , they can be used to contact and align the first flat edge 1211 of the first substrate 121 and/or the second flat edge 1231 of the second substrate 123 .

如圖9所示,位於中間的一個第一穿孔117內則可設置一個第一缺角對準銷183。第一缺角對準銷183位於兩個第一平邊對準銷181之間,第一 缺角對準銷183凸出載台11的承載面111時,可用以接觸及對準第一基板121的第一缺角2211及/或第二基板123的第二缺角2231。 As shown in FIG. 9 , a first missing corner alignment pin 183 may be provided in a first through hole 117 located in the middle. The first missing corner alignment pin 183 is located between the two first flat edge alignment pins 181, the first When the missing corner alignment pins 183 protrude from the bearing surface 111 of the stage 11 , they can be used to contact and align the first missing corners 2211 of the first substrate 121 and/or the second missing corners 2231 of the second substrate 123 .

如圖7所示,此外,位於兩側的兩個第二穿孔119內可設置兩個第二平邊對準銷185,而位於中間的一個第二穿孔119內則可設置一個第二缺角對準銷187。第二缺角對準銷187位於兩個第二平邊對準銷185之間。第一平邊對準銷181及第一缺角對準銷183靠近載台11的承載面111內側,而第二平邊對準銷185及第二缺角對準銷187則靠近載台11的承載面111外側。 As shown in FIG. 7 , in addition, two second flat edge alignment pins 185 can be provided in the two second through holes 119 located on both sides, and a second missing corner can be located in the one second through hole 119 located in the middle Align pin 187. The second cutaway alignment pin 187 is located between the two second flat edge alignment pins 185 . The first flat edge alignment pins 181 and the first missing corner alignment pins 183 are close to the inner side of the bearing surface 111 of the carrier 11 , while the second flat side alignment pins 185 and the second missing corner alignment pins 187 are near the carrier table 11 . the outer side of the bearing surface 111.

第一平邊對準銷181、第一缺角對準銷183、第二平邊對準銷185及第二缺角對準銷187可連接設置在載台11內部或下方的彈性單元及升降單元,使得第一平邊對準銷181、第一缺角對準銷183、第二平邊對準銷185及第二缺角對準銷187可與壓合板191同步相對於載台11的承載面111升降。 The first flat edge alignment pin 181 , the first missing corner alignment pin 183 , the second flat edge alignment pin 185 and the second missing corner alignment pin 187 can be connected to the elastic unit arranged inside or below the stage 11 and can be lifted and lowered. unit so that the first flat edge alignment pin 181 , the first missing corner alignment pin 183 , the second flat edge alignment pin 185 and the second missing corner alignment pin 187 can be synchronized with the pressing plate 191 relative to the stage 11 . The bearing surface 111 is raised and lowered.

在本新型另一實施例中,圖1至圖9的第一對準單元13可以是一承載單元23,而第二對準單元15可以是一對準單元25,其中承載單元23及對準單元25的數量、設置位置及構造類似第一及第二對準單元13/15。 In another embodiment of the present invention, the first alignment unit 13 of FIGS. 1 to 9 may be a carrier unit 23, and the second alignment unit 15 may be an alignment unit 25, wherein the carrier unit 23 and the alignment unit 23 The number, placement and configuration of the units 25 are similar to the first and second alignment units 13/15.

三個承載單元23及三個對準單元25環繞設置在承載面111的放置區113周圍,並用以靠近或遠離放置區113。在本新型實施例中,第一基板121及第二基板123都是由對準單元25進行對準,並以承載單元23承載第二基板123。 The three bearing units 23 and the three alignment units 25 are disposed around the placement area 113 of the bearing surface 111 , and are used to be close to or away from the placement area 113 . In the novel embodiment, the first substrate 121 and the second substrate 123 are both aligned by the alignment unit 25 , and the second substrate 123 is supported by the carrier unit 23 .

在實際應用時可將第一基板121放置在載台11的承載面111的放置區113,而後三個對準單元25會朝第一基板121及放置區113靠近,使得第一基板121對準載台11的放置區113。 In practical application, the first substrate 121 can be placed on the placement area 113 of the bearing surface 111 of the stage 11 , and the three alignment units 25 will approach the first substrate 121 and the placement area 113 , so that the first substrate 121 is aligned The placement area 113 of the stage 11 .

在完成第一基板121的定位後,三個承載單元23會朝第一基板121及放置區113靠近,而三個對準單元25則會遠離第一基板121。而後,將第二基板123放置在承載單元23上,其中第二基板123被承載單元23所支撐,並未接觸第一基板121。具體而言,承載單元23的構造與第一對準單元13相似,可用以承載第二基板123。 After the positioning of the first substrate 121 is completed, the three carrying units 23 will approach the first substrate 121 and the placement area 113 , while the three alignment units 25 will be far away from the first substrate 121 . Then, the second substrate 123 is placed on the carrier unit 23 , wherein the second substrate 123 is supported by the carrier unit 23 and does not contact the first substrate 121 . Specifically, the structure of the carrying unit 23 is similar to that of the first alignment unit 13 , and can be used to carry the second substrate 123 .

而後對準單元25會朝第二基板123靠近,三個對準單元25會接觸並定位承載單元23承載的第二基板123,使得第二基板123對準第一基板121及/或載台11的放置區113。 Then the alignment unit 25 will approach the second substrate 123 , and the three alignment units 25 will contact and position the second substrate 123 carried by the carrier unit 23 so that the second substrate 123 is aligned with the first substrate 121 and/or the carrier 11 placement area 113.

以上所述者,僅為本新型之一較佳實施例而已,並非用來限定本新型實施之範圍,即凡依本新型申請專利範圍所述之形狀、構造、特徵及精神所為之均等變化與修飾,均應包括於本新型之申請專利範圍內。 The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Modifications should be included in the scope of the patent application of the present invention.

10:基板鍵合機構 10: Substrate bonding mechanism

100:對準機構 100: Alignment Mechanism

11:載台 11: Carrier

13:第一對準單元 13: The first alignment unit

15:第二對準單元 15: Second alignment unit

161:盒體 161: Box

163:蓋體 163: Cover

171:平邊對準單元 171: Flat edge alignment unit

19:壓合機構 19: Press-fit mechanism

191:壓合板 191: plywood

193:連接桿 193: connecting rod

195:線性致動器 195: Linear Actuators

197:驅動桿體 197:Drive rod body

23:承載單元 23: Bearing unit

25:對準單元 25: Alignment unit

Claims (12)

一種基板鍵合機構,包括:一載台,包括一承載面,用以承載一第一基板,其中該承載面具有一放置區,該第一基板包括一第一角度識別特徵,其中該第一角度識別特徵為一第一平邊或一第一缺角;三個第一對準單元,環繞設置在該承載面的該放置區的周圍,用以靠近或遠離該放置區,以定位該第一基板及承載一第二基板,其中該第二基板包括一第二角度識別特徵,該第二角度識別特徵為一第二平邊或一第二缺角;三個第二對準單元,環繞設置在該承載面的該放置區的周圍,並用以靠近或遠離該放置區,以定位該第一對準單元承載的該第二基板;一壓合板,面對該載台的該承載面,並相對於該載台位移,其中該壓合板用以壓合該載台上層疊的該第一基板及該第二基板;至少三個凹槽或至少三個穿孔,位於該載台的該承載面,並位於該放置區周圍;及兩個平邊對準單元,分別設置在位於兩側的該兩個凹槽或該兩個穿孔內,用以接觸該第一基板的該第一平邊及該第二基板的該第二平邊,其中該平邊對準單元隨著該壓合板相對於該載台的該承載面升降。 A substrate bonding mechanism, comprising: a stage including a bearing surface for carrying a first substrate, wherein the bearing surface has a placement area, the first substrate includes a first angle identification feature, wherein the first The angle identification feature is a first flat edge or a first missing corner; three first alignment units are arranged around the placement area of the bearing surface to be close to or away from the placement area to locate the first alignment unit. a substrate and carrying a second substrate, wherein the second substrate includes a second angle identification feature, the second angle identification feature is a second flat edge or a second missing corner; three second alignment units surround is arranged around the placement area of the bearing surface, and is used to be close to or away from the placement area to position the second substrate carried by the first alignment unit; a pressing plate facing the bearing surface of the platform, and is displaced relative to the carrier, wherein the pressing plate is used for pressing the first substrate and the second substrate stacked on the carrier; at least three grooves or at least three perforations are located on the carrier of the carrier surface, and located around the placement area; and two flat edge alignment units, respectively disposed in the two grooves or the two through holes on both sides, for contacting the first flat edge of the first substrate and the second flat edge of the second substrate, wherein the flat edge alignment unit moves up and down with the pressing plate relative to the carrying surface of the carrier. 如請求項1所述的基板鍵合機構,包括一缺角對準單元設置在位於中間的該凹槽或該穿孔內,並用以接觸該第一基板的該第一缺角及該第二基板的該第二缺角,其中該缺角對準單元會隨著該壓合板相對於該載台的該承載面升降。 The substrate bonding mechanism according to claim 1, comprising a missing corner alignment unit disposed in the groove or the through hole in the middle, and used for contacting the first missing corner of the first substrate and the second substrate The second missing corner, wherein the missing corner alignment unit will move up and down with the pressing plate relative to the bearing surface of the carrier. 如請求項2所述的基板鍵合機構,其中該穿孔包括三個第一穿孔及三個第二穿孔,該三個第一穿孔較該三個第二穿孔靠近該承載面的內側,該 平邊對準單元包括兩個第一平邊對準銷及兩個第二平邊對準銷,而該缺角對準單元則包括一第一缺角對準銷及一第二缺角對準銷,該第一缺角對準銷設置在位於中間的該第一穿孔,該第二缺角對準銷設置在位於中間的該第二穿孔,該兩個第一平邊對準銷分別設置在位於兩側的該兩個第一穿孔,而該兩個第二平邊對準銷則分別設置在位於兩側的該兩個第二穿孔。 The substrate bonding mechanism of claim 2, wherein the through holes include three first through holes and three second through holes, the three first through holes are closer to the inner side of the bearing surface than the three second through holes, the The flat edge alignment unit includes two first flat edge alignment pins and two second flat edge alignment pins, and the missing corner alignment unit includes a first missing corner alignment pin and a second missing corner pair Alignment pins, the first missing corner alignment pins are arranged in the first hole in the middle, the second missing corner alignment pins are arranged in the second hole in the middle, and the two first flat edge alignment pins are respectively The two first through holes are arranged on both sides, and the two second flat edge alignment pins are respectively arranged on the two second through holes on both sides. 如請求項1所述的基板鍵合機構,包括一升降單元連接該兩個平邊對準單元,並帶動該兩個平邊對準單元相對於該載台的該承載面升降。 The substrate bonding mechanism according to claim 1, comprising a lifting unit connecting the two flat edge alignment units, and driving the two flat edge alignment units to lift and lower relative to the bearing surface of the carrier. 如請求項1所述的基板鍵合機構,包括至少一彈性單元連接該兩個平邊對準單元,其中該壓合板接觸該兩個平邊對準單元並朝該載台的該承載面靠近時,該彈性單元會產生變形,使得該兩個平邊對準單元與該壓合板同步相對於該載台的該承載面升降。 The substrate bonding mechanism of claim 1, comprising at least one elastic unit connecting the two flat edge alignment units, wherein the pressing plate contacts the two flat edge alignment units and approaches the bearing surface of the carrier When the elastic unit is deformed, the two flat edge alignment units and the pressing plate move up and down relative to the bearing surface of the carrier synchronously. 一種基板鍵合機構,包括:一載台,包括一承載面,用以承載一第一基板,其中該承載面具有一放置區,該第一基板包括一第一缺角;三個第一對準單元,環繞設置在該承載面的該放置區的周圍,用以靠近或遠離該放置區,以定位該第一基板及承載一第二基板,該第二基板包括一第二缺角;三個第二對準單元,環繞設置在該承載面的該放置區的周圍,並用以靠近或遠離該放置區,以定位該第一對準單元承載的該第二基板;一壓合板,面對該載台的該承載面,並相對於該載台位移,其中該壓合板用以壓合該載台上層疊的該第一基板及該第二基板;至少一凹槽或至少一穿孔,位於該載台的該承載面,並位於該放置區周圍;及 至少一缺角對準單元,設置在該凹槽或該穿孔內,用以接觸該第一基板的該第一缺角及該第二基板的該第二缺角,其中該缺角對準單元會隨著該壓合板相對於該載台的該承載面升降。 A substrate bonding mechanism, comprising: a stage including a bearing surface for carrying a first substrate, wherein the bearing surface has a placement area, the first substrate includes a first missing corner; three first pairs a quasi-unit, arranged around the placement area of the bearing surface, for approaching or away from the placement area to position the first substrate and carry a second substrate, the second substrate includes a second missing corner; three a second alignment unit, arranged around the placement area of the bearing surface, and used to be close to or away from the placement area to position the second substrate carried by the first alignment unit; a pressing plate facing the placement area The bearing surface of the carrier is displaced relative to the carrier, wherein the pressing plate is used for pressing the first substrate and the second substrate stacked on the carrier; at least one groove or at least one through hole is located in the bearing surface of the stage and located around the placement area; and At least one missing corner alignment unit is disposed in the groove or the through hole and used to contact the first missing corner of the first substrate and the second missing corner of the second substrate, wherein the missing corner alignment unit The lamination plate moves up and down with respect to the bearing surface of the carrier. 如請求項6所述的基板鍵合機構,包括一升降單元連接該缺角對準單元,並帶動該缺角對準單元相對於該載台的該承載面升降。 The substrate bonding mechanism of claim 6, comprising a lifting unit connected to the missing corner alignment unit, and driving the missing corner alignment unit to lift and lower relative to the bearing surface of the carrier. 如請求項6所述的基板鍵合機構,包括至少一彈性單元連接該缺角對準單元,其中該壓合板接觸該缺角對準單元並朝該載台的該承載面靠近時,該彈性單元會產生變形,使得該缺角對準單元與該壓合板同步相對於該載台的該承載面升降。 The substrate bonding mechanism of claim 6, comprising at least one elastic unit connected to the missing corner alignment unit, wherein when the pressing plate contacts the missing corner alignment unit and approaches the bearing surface of the carrier, the elastic The unit will be deformed, so that the notch alignment unit and the pressing plate move up and down relative to the bearing surface of the carrier synchronously. 如請求項6所述的基板鍵合機構,其中該穿孔包括一第一穿孔及一第二穿孔,該第一穿孔較該第二穿孔靠近該承載面的內側,該缺角對準單元包括一第一缺角對準銷及一第二缺角對準銷,該第一缺角對準銷設置於該第一穿孔內,而該第二缺角對準銷則設置於該第二穿孔內。 The substrate bonding mechanism of claim 6, wherein the through hole includes a first through hole and a second through hole, the first through hole is closer to the inner side of the bearing surface than the second through hole, and the corner aligning unit includes a A first missing corner alignment pin and a second missing corner alignment pin, the first missing corner alignment pin is arranged in the first hole, and the second missing corner alignment pin is arranged in the second hole . 一種基板鍵合機構,包括:一載台,包括一承載面,用以承載一第一基板,其中該承載面具有一放置區,該第一基板包括一第一角度識別特徵,其中該第一角度識別特徵為一第一平邊或一第一缺角;三個對準單元,環繞設置在該承載面的該放置區的周圍,用以靠近或遠離該放置區,以定位該第一基板及一第二基板,其中該第二基板包括一第二角度識別特徵,該第二角度識別特徵為一第二平邊或一第二缺角;三個承載單元,環繞設置在該承載面的該放置區的周圍,用以靠近或遠離該放置區,該承載單元用以承載該第二基板,其中該對準單元朝該放置區的方向位移,以定位該承載單元承載的該第二基板; 一壓合板,面對該載台的該承載面,並相對於該載台位移,其中該壓合板用以壓合該載台上層疊的該第一基板及該第二基板;至少三個凹槽或至少三個穿孔,位於該載台的該承載面,並位於該放置區周圍;及兩個平邊對準單元,分別設置在位於兩側的該兩個凹槽或兩個穿孔內,用以接觸該第一基板的該第一平邊及該第二基板的該第二平邊,其中該平邊對準單元會隨著該壓合板相對於該載台的該承載面升降。 A substrate bonding mechanism, comprising: a stage including a bearing surface for carrying a first substrate, wherein the bearing surface has a placement area, the first substrate includes a first angle identification feature, wherein the first The angle identification feature is a first flat edge or a first missing corner; three alignment units are arranged around the placement area of the bearing surface to be close to or away from the placement area to position the first substrate and a second substrate, wherein the second substrate includes a second angle identification feature, the second angle identification feature is a second flat edge or a second missing corner; three bearing units, arranged around the bearing surface The surrounding of the placement area is used for approaching or away from the placement area, the carrying unit is used for carrying the second substrate, wherein the alignment unit is displaced towards the direction of the placement area to position the second substrate carried by the carrying unit ; a pressing plate facing the bearing surface of the carrier and displaced relative to the carrier, wherein the pressing plate is used for pressing the first substrate and the second substrate stacked on the carrier; at least three concave a groove or at least three perforations located on the bearing surface of the carrier and around the placement area; and two flat edge alignment units respectively disposed in the two grooves or two perforations located on both sides, for contacting the first flat edge of the first substrate and the second flat edge of the second substrate, wherein the flat edge alignment unit moves up and down with the pressing plate relative to the bearing surface of the carrier. 如請求項10所述的基板鍵合機構,包括一缺角對準單元設置在位於中間的該凹槽或該穿孔內,並用以接觸該第一基板的該第一缺角及該第二基板的該第二缺角,其中該缺角對準單元會隨著該壓合板相對於該載台的該承載面升降。 The substrate bonding mechanism according to claim 10, comprising a missing corner alignment unit disposed in the groove or the through hole in the middle, and used for contacting the first missing corner of the first substrate and the second substrate The second missing corner, wherein the missing corner alignment unit will move up and down with the pressing plate relative to the bearing surface of the carrier. 如請求項10所述的基板鍵合機構,包括至少一彈性單元連接該兩個平邊對準單元,其中該壓合板接觸該兩個平邊對準單元並朝該載台的該承載面靠近時,該彈性單元會產生變形,使得該兩個平邊對準單元與該壓合板同步相對於該載台的該承載面升降。 The substrate bonding mechanism of claim 10, comprising at least one elastic unit connecting the two flat edge alignment units, wherein the pressing plate contacts the two flat edge alignment units and approaches the bearing surface of the carrier When the elastic unit is deformed, the two flat edge alignment units and the pressing plate move up and down relative to the bearing surface of the carrier synchronously.
TW110214007U 2021-11-25 2021-11-25 Substrate Bonding Mechanism TWM626383U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW110214007U TWM626383U (en) 2021-11-25 2021-11-25 Substrate Bonding Mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW110214007U TWM626383U (en) 2021-11-25 2021-11-25 Substrate Bonding Mechanism

Publications (1)

Publication Number Publication Date
TWM626383U true TWM626383U (en) 2022-05-01

Family

ID=82559163

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110214007U TWM626383U (en) 2021-11-25 2021-11-25 Substrate Bonding Mechanism

Country Status (1)

Country Link
TW (1) TWM626383U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI819611B (en) * 2022-05-18 2023-10-21 天虹科技股份有限公司 Bonding machine for warped substrates

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI819611B (en) * 2022-05-18 2023-10-21 天虹科技股份有限公司 Bonding machine for warped substrates

Similar Documents

Publication Publication Date Title
KR20070059994A (en) Attaching means and attaching apparatus for supporting plate, and attaching method for supporting
TWM609527U (en) Alignment mechanism of bonding machine
CN112309945A (en) Alignment mechanism and alignment method of bonding machine
TWM626383U (en) Substrate Bonding Mechanism
TWI732700B (en) Alignment mechanism and alignment method of bonding machine
KR20190032180A (en) Apparatus for manufacturing semiconductor, method of manufacturing semiconductor device and collet
CN216528754U (en) Wafer bonding mechanism
TWI769957B (en) Substrate bonding mechanism
US11961753B2 (en) Substrate-bonding device
CN215644434U (en) Alignment mechanism of bonder
WO2023189648A1 (en) Substrate bonding apparatus and substrate bonding method
US11869792B2 (en) Alignment mechanism and alignment method of bonding machine
TWM631923U (en) Bonding mechanism for warped substrates
CN116169041A (en) Wafer bonding machine
CN215988691U (en) Substrate alignment mechanism and bonding machine table applying same
TWI776665B (en) Alignment mechanism and bonding machine using the alignment mechanism
CN214068706U (en) Alignment mechanism of bonding machine
TW202145430A (en) Limit jig and limit pressing device to be applied to the pressing operation of various sizes of workpieces, and reduce the dimensional accuracy requirements of the workpiece aligning port
TWI792447B (en) Alignment mechanism and alignment method of bonding machine
CN115763338A (en) Alignment mechanism and bonding machine table using same
US20240006196A1 (en) Bonding machine for warped substrates
CN217507273U (en) Bonding mechanism applied to warped substrate
KR102455166B1 (en) Vacuum chuck and driving method of vacuum chuck
US12040215B2 (en) Bonding machine with movable suction modules
TWM622888U (en) Substrate alignment mechanism and bonding machine using the same