TWI819611B - Bonding machine for warped substrates - Google Patents

Abstract

The present invention is a bonding machine for warping substrates, which includes a first cavity, a second cavity, a pressing unit, a carrier and a plurality of flattening devices. The first cavity is used for connecting with the second cavity, and a closed space is formed therebetween. The pressing unit is arranged in the first cavity, and the carrier is arranged in the second cavity. The pressing unit faces the carrier and is used for bonding the substrates placed on the carrier. The flattening device is arranged on the carrier, and includes a plurality of flattening units and a plurality of telescopic rotating motors, wherein the flattening units are located around the substrate. The telescopic rotation motor is connected to drive the flattening unit to rotate and lift, and the flattening unit flattens the substrate placed on the carrier to improve the accuracy of aligning the substrate.

Description

Bonding machine suitable for warped substrates

The present invention relates to a bonding machine suitable for warped substrates. It mainly uses a flattening unit to flatten the substrate placed on the carrier to improve the accuracy of aligning the substrate.

The development of integrated circuit technology has matured, and electronic products are currently developing towards the trend of being light, thin, short, high-performance, high-reliability and intelligent. The wafers in electronic products can have an important impact on the performance of the electronic products, and the aforementioned performance is partly related to the thickness of the wafer. For example, thinner wafers can improve heat dissipation efficiency, increase mechanical properties, improve electrical properties, and reduce package size and weight.

In the semiconductor manufacturing process, a thinning process, a through-hole etching process, and a back metallization process are usually performed on the back side (i.e., the lower surface) of the wafer. Generally speaking, a bonding process is performed before the wafer thinning process. The adhesive layer is mainly placed between the wafer and the carrier (for example, sapphire glass), and the laminated components are pressed together through the pressing unit and the carrier. wafer and carrier to complete the bonding of wafer and carrier. After completing the wafer thinning process, a debonding process is performed to separate the wafer from the carrier.

However, the expansion coefficients of each material layer of the wafer are different, so the wafer often produces wafer warpage after undergoing a high-temperature process. In addition, each wafer may have different warpage shapes, such as saddle-shaped, hill-shaped protrusions, etc., which is not conducive to the subsequent alignment of the stacked wafers during the bonding process, and is prone to inaccurate alignment. situation.

In order to solve the problems faced by the prior art, the present invention proposes a novel bonding machine suitable for warped substrates, which can flatten the warped substrate placed on the bearing surface of the carrier through a plurality of flattening devices, so as to flatten the warped substrate. The warped substrate is flattened, and then the flattened substrate is aligned to improve the accuracy of aligning the warped substrate.

One object of the present invention is to provide a bonding machine suitable for warped substrates, which mainly includes a first cavity, a second cavity, a pressing unit, a carrier, and a plurality of flattening devices, wherein The first cavity is used to connect the second cavity and form a closed space therebetween.

A plurality of flattening devices are arranged on the stage and include a telescopic rotating motor and a flattening unit, wherein the flattening unit is arranged around the substrate. The telescopic rotary motor is connected to and drives the flattening unit to rise, fall or rotate relative to the bearing surface of the stage.

In practical applications, the substrate can be placed on the bearing surface of the stage, and the telescopic rotating motor will drive the extended flattening unit to rotate, so that part of the flattening unit is located above the substrate. When the telescopic rotary motor drives the flattening unit to rotate, there is a gap between the flattening unit and the substrate to prevent the substrate from being worn during the rotation. The telescopic rotating motor will drive the flattening unit to retract and approach the substrate to flatten the warped substrate, and then align the substrate through a plurality of alignment units.

During the process of the alignment unit aligning the substrate, the flattening unit will continue to press the substrate and keep the substrate flat, so that the alignment unit can align the flat substrate to improve the accuracy of aligning the substrate.

One object of the present invention is to provide a bonding machine suitable for warped substrates, which is mainly provided with a plurality of flattening devices, a plurality of alignment units and a plurality of air extraction lines on the bearing surface of the carrier. The air extraction pipeline is connected to the bearing surface of the stage and is located under the substrate to absorb warped substrates. The flattening device and the alignment unit are located around the substrate, and the flattening unit lifts, lowers, and rotates relative to the substrate to flatten the warped substrate. The alignment unit is close to the substrate along the radial direction of the bearing surface to align the flattened substrate.

In order to achieve the above object, the present invention proposes a bonding machine suitable for warping substrates, including: a first cavity; a second cavity facing the first cavity, wherein the first cavity is used for connection a second cavity, and forms a closed space between the first cavity and the second cavity; a pressing unit, connected to the first cavity, and located in the closed space; a carrier, connected to the second cavity, and Located in a closed space, the carrier includes a bearing surface facing the lamination unit, wherein the bearing surface includes a placement area for bearing a first substrate, and placing a second substrate on the first substrate; and a plurality of flattening devices, including : A plurality of flattening units are located around the placement area of the stage; a plurality of telescopic rotary motors are connected to the flattening unit and drive the flattening unit to rise, fall and swing relative to the bearing surface of the stage, so that the flattening unit is placed flat area on the first substrate.

In at least one embodiment of the present invention, a plurality of air extraction lines are provided on the carrier and connected to the placement area of the carrier, wherein the plurality of air extraction lines are used to form negative pressure to adsorb the first substrate placed in the placement area. .

In at least one embodiment of the present invention, it includes an air extraction device and a plurality of valves, wherein the air extraction device is connected to a plurality of air extraction pipelines, so that the air extraction pipelines connected to the placement area form a negative pressure, and the plurality of valves are respectively connected to a plurality of air extraction pipelines. air extraction pipeline, and used to switch whether multiple air extraction pipelines generate negative pressure.

In at least one embodiment of the present invention, a plurality of rods are included to pass through the carrier, and a plurality of telescopic rotary motors are located outside the enclosed space and are respectively connected to a plurality of flattening units through the plurality of rods to drive the flattening unit relative to the carrier. The bearing surface of the platform rises, falls or swings.

In at least one embodiment of the present invention, a plurality of alignment units are provided on the bearing surface of the carrier and surround the placement area. The alignment units are used to align the first substrate and the second substrate. The alignment units During the process of aligning the first substrate or the second substrate, the air extraction pipeline will not adsorb the first substrate.

In at least one embodiment of the present invention, the telescopic rotary motor is used to drive the flattening unit to swing in a first position and a second position. The flattening unit operating in the first position is located outside the placement area, and the flattening unit operating in the third position is located outside the placement area. The flattening unit in the second position will enter the placement area.

In at least one embodiment of the present invention, the telescopic rotating motor is used to drive the flattening unit to move at a first height and a second height, and the first height is higher than the second height.

In at least one embodiment of the present invention, there is a distance between the flattening unit operating at the first height and the bearing surface of the stage, and the distance is greater than the thickness of the first substrate, and the flattening unit operating at the second height is It will contact and flatten the first substrate placed on the load-bearing surface.

In at least one embodiment of the present invention, a plurality of distance measuring units are provided on the lamination unit and used to measure the distance between each distance measuring unit and the first substrate to determine whether it is placed on the bearing surface of the carrier. of the first substrate is warped.

In at least one embodiment of the present invention, the distance measurement unit is a laser range finder.

Please refer to FIGS. 1 and 2 , which are respectively a perspective view and a cross-sectional view of an embodiment of a bonding machine suitable for warped substrates according to the present invention. As shown in the figure, the bonding machine 10 suitable for warped substrates includes a first cavity 111, a second cavity 113, a pressing unit 13, a carrier 15 and a plurality of flattening devices 17, wherein The first cavity 111 faces the second cavity 113 , and the first cavity 111 is displaceable relative to the second cavity 113 .

As shown in FIG. 2 , the pressing unit 13 is located in the first cavity 111 and connected to the first cavity 111 . The stage 15 is located in the second cavity 113 and connected to the second cavity 113 . The bearing surface 151 of the carrier 15 faces the pressing unit 13 . After the first cavity 111 is connected to the second cavity 113, a closed space 112 is formed between the two, and the pressing unit 13 and the carrier 15 are located in the closed space 112.

As shown in FIG. 1 , in an embodiment of the present invention, the first cavity 111 can be connected to a cavity driver 191 , wherein the cavity driver 191 is located outside the closed space 112 and connected to the first cavity 111 . The cavity driver 191 is used to drive the displacement of the first cavity 111 relative to the second cavity 113. For example, the cavity driver 191 may be a linear actuator.

In addition, the pressing unit driver 193 is located outside the closed space 112 and is connected to the pressing unit 13 . For example, the pressing unit driver 193 may be a linear actuator to drive the pressing unit 13 toward or away from the stage 15 . After the alignment of the first substrate 121 and the second substrate 123 is completed, the pressing unit driver 193 can drive the pressing unit 13 to approach the bearing surface 151 of the carrier 15 and press the first substrate 121 and the second substrate 121 carried by the carrier 15 . two substrates 123 to complete the bonding of the first substrate 121 and the second substrate 123.

As shown in FIG. 2 , the first cavity 111 or the second cavity 113 can be provided with an air extraction motor 16 , wherein the air extraction motor 16 is fluidly connected to the sealed space 112 and is used to extract the gas in the sealed space 112 to reduce the pressure in the enclosed space. The pressure within 112 maintains the closed space 112 in a vacuum or low-pressure state.

As shown in FIG. 3 , the carrying surface 151 of the stage 15 is used to carry a stacked first substrate 121 and a second substrate 123 . For example, the first substrate 121 is a carrying substrate, and the second substrate 123 is a wafer. The first substrate 121 is a wafer. There is an adhesive layer between the first substrate 121 and the second substrate 123 to adhere the first substrate 121 and the second substrate 123 . In different embodiments, the first substrate 121 and the second substrate 123 may also be wafers that have undergone a semiconductor process.

The pressing unit 13 includes a pressing plate 131 , a connecting plate 133 and a plurality of fixed rods 135 , wherein the connecting plate 133 is connected to the pressing plate 131 through the fixed rods 135 . The pressing plate 131 faces the bearing surface 151 of the carrier 15 and is used to press the first substrate 121 and the second substrate 123 placed on the carrier 15 . The pressing unit 13 including the pressing plate 131, the connecting plate 133 and the fixed rod 135 is only an embodiment of the present invention and does not limit the scope of the present invention.

In an embodiment of the present invention, a first heating unit 152 can be provided in the stage 15 , and a second heating unit 132 can be provided in the pressing unit 13 . The first heating unit 152 and the second heating unit 132 can heat the first substrate 121 , the second substrate 123 and the adhesive layer between the pressing unit 13 and the stage 15 during the bonding process, so that the first substrate 121 and The second substrates 123 are bonded to each other.

As shown in FIGS. 2 and 4 , the flattening device 17 includes a telescopic rotary motor 171 and a flattening unit 173 , wherein the telescopic rotary motor 171 is connected to and drives the flattening unit 173 to rise and fall relative to the bearing surface 151 of the stage 15 and/or or swing.

In an embodiment of the present invention, the telescopic rotary motor 171 may include a linear actuator 1711 and a rotary motor 1713, wherein the linear actuator 1711 is connected to the flattening unit 173 through the rotary motor 1713. The linear actuator 1711 can be used to drive the rotating motor 1713 and the flattening unit 173 to move up and down relative to the bearing surface 151 of the carrier 15 , and the rotating motor 1713 can be used to drive the flattening unit 173 to swing relative to the bearing surface 151 of the carrier 15 .

The telescopic rotating motor 171 is located outside the closed space 112 , and the flattening unit 173 is located within the closed space 112 . In one embodiment of the present invention, the telescopic rotating motor 171 can be connected through a rod 175 to drive the flattening unit 173 to lift or swing, wherein the rod 175 passes through the second cavity 113 and/or the stage 15 . In addition, a shaft seal and/or bearing can be provided between the rod 175 and the second cavity 113 and/or the carrier 15, so that the rod 175 can rotate and telescope relative to the second cavity 113 and/or the carrier 15, and Maintain the low pressure and vacuum state in the enclosed space 112.

The flattening unit 173 can be disposed on the bearing surface 151 of the carrier 15 , wherein the flattening unit 173 can be a plate body of any geometric shape and has a flat lower surface. In practical applications, the first substrate 121 placed on the bearing surface 151 of the stage 15 can be flattened through the flat lower surface of the flattening unit 173 to make the warped first substrate 121 flat.

As shown in FIG. 5 , a plurality of flattening devices 17 are located in the closed space 112 and are arranged on the bearing surface 151 of the stage 15 . In one embodiment of the present invention, a placement area 153 can be defined on the bearing surface 151 of the carrier 15 , where the area and/or shape of the placement area 153 is approximately similar to the first substrate 121 and smaller than or equal to the bearing surface 151 .

When the first substrate 121 is placed on the carrying surface 151 of the stage 15 , the first substrate 121 will be located in the placement area 153 , and a plurality of flattening units 173 are arranged around the placement area 153 .

As shown in FIGS. 5 and 6 , the telescopic rotating motor 171 can drive the flattening unit 173 to swing in a direction parallel to the bearing surface 151 of the stage 15 . In one embodiment of the present invention, the telescopic rotating motor 171 can drive the flattening unit 173 to swing between a first position and a second position.

Specifically, the flattening unit 173 operating in the first position is located outside the placement area 153 of the stage 15 without overlapping or interfering with the first substrate 121 in the placement area 153, as shown in FIG. 5 . The flattening unit 173 operating in the second position will enter the placement area 153 of the stage 15 and be located above the first substrate 121 in the placement area 153, as shown in FIG. 6 .

As shown in FIG. 4 , during the process of placing the first substrate 121 on the bearing surface 151 of the stage 15 , the flattening unit 173 will be located at the first position. This prevents the flattening unit 173 from interfering with the placement area 153 of the carrying surface 151 , thereby facilitating placement of the first substrate 121 in the placement area 153 of the carrier 15 through the robot arm.

As shown in FIGS. 7 and 8 , the telescopic rotating motor 171 can drive the flattening unit 173 to move along the axial direction of the parallel bearing surface 151 and adjust the distance between the flattening unit 173 and the bearing surface 151 and/or the first substrate 121 distance. In one embodiment of the present invention, the telescopic rotating motor 171 can drive the flattening unit 173 to move between a first height and a second height, where the first height is higher than the second height, for example, the flattening unit is located at the second height. 173 is closer to the bearing surface 151 of the carrier 15 than the first height.

As shown in FIG. 7 , the telescopic rotation motor 171 drives the flattening unit 173 to move along the axial direction of the bearing surface 151 , so that the flattening unit 173 is away from the bearing surface 151 of the stage 15 and operates at the first height. There is a distance G between the flattening unit 173 and the carrying surface 151 , where the distance G is greater than the thickness of the first substrate 121 . Then, the telescopic rotation motor 171 drives the flattening unit 173 to swing in a direction parallel to the bearing surface 151 , so that part of the flattening unit 173 is located above the placement area 153 and the first substrate 121 .

As shown in FIG. 8 , the telescopic rotation motor 171 drives the flattening unit 173 to move along the axial direction of the bearing surface 151 , so that the flattening unit 173 approaches the bearing surface 151 of the carrier 15 and operates at the second height. The flattening unit 173 will contact and flatten the first substrate 121 placed on the placement area 153 of the bearing surface 151, so that the first substrate 121 is placed flatly on the bearing surface 151.

As shown in FIGS. 5 and 6 , a plurality of alignment units 14 can be provided on the bearing surface 151 of the carrier 15 . The alignment units 14 surround the placement area 153 of the carrier 15 and can be close to or far away from the placement area 153 and /or the first substrate 121 to align the first substrate 121 and/or the second substrate 123. For example, the alignment unit 14 can be rod-shaped and can be raised and lowered relative to the bearing surface 151 of the carrier 15. After the alignment unit 14 protrudes from the bearing surface 151, it can approach the placement area 153 along the radial direction of the bearing surface 151. During the displacement process, the positioning unit 14 will contact and align the first substrate 121 to position the first substrate 121 at a fixed position in the placement area 153 .

During the process of the above-mentioned alignment unit 14 aligning the first substrate 121 , the flattening unit 173 will continue to contact and flatten the first substrate 121 , and can improve the accuracy of the alignment unit 14 aligning the first substrate 121 .

In an embodiment of the present invention, as shown in Figures 2 and 3, a plurality of distance measurement units 18 can be provided on the pressing unit 13. For example, the distance measurement unit 18 can be a laser range finder. The distance measurement unit 18 is used to project the measurement beam onto the first substrate 121 placed on the bearing surface 151 of the stage 15 and measure the distance between the first substrate 121 and each distance measurement unit 18 to determine the first substrate 121 Is it warped? In different embodiments, the pressing unit 13 can also be disposed on the stage 15 , and the distance from the first substrate 121 is measured from the lower surface of the first substrate 121 .

Specifically, if the distance between each distance measuring unit 18 and the first substrate 121 is close, it can be determined that the first substrate 121 is not warped, and the first substrate 121 can be directly aligned through the alignment unit 14 . Then the second substrate 123 is placed on the first substrate 121, and the first substrate 121 and the second substrate 123 are bonded through the pressing unit 13 without the need to flatten the first substrate 121 through the flattening device 17.

On the contrary, if the distance difference between each distance measuring unit 18 and the first substrate 121 is greater than a threshold value, it means that the first substrate 121 is warped, and the first substrate 121 needs to be flattened through the flattening device 17, for example Carry out the flattening steps of Figure 4, Figure 7 and Figure 8 described above.

After completing the flattening and positioning of the first substrate 121 , the flattening unit 173 can leave the first substrate 121 and the placement area 153 , as shown in FIG. 6 and FIG. 4 . When the flattening unit 173 leaves the first substrate 121 and the placement area 153, the telescopic rotary motor 171 will extend and drive the flattening unit 173 to leave the first substrate 121 along the axial direction of the bearing surface 151, and then the telescopic rotary motor 171 will The flattening unit 173 is driven to swing, so that the flattening unit 173 leaves the top of the first substrate 121 and/or the placement area 153 .

After completing the alignment step of the first substrate 121, the second substrate 123 can be placed on the first substrate 121, and the second substrate 123 can be aligned with the alignment unit 14, and then the first substrate 121 can be bonded through the pressing unit 13. and the second substrate 123.

In the drawings of the present invention, the rod 175 or the telescopic rotation motor 171 of the flattening device 17 passes through the second cavity 113 and the carrier 15 and is connected to the flattening unit 173 provided on the bearing surface 151 of the carrier 15 . In another embodiment of the present invention, the rod body 175, the telescopic rotation motor 171 and/or the flattening unit 173 can be arranged around the stage 15, and the telescopic rotation motor 171 and/or the rod body 175 only pass through the second cavity 113 without passing through the stage 15 .

At this time, the flattening unit 173 operating in the first position will be located outside the bearing surface 151 and/or the placement area 153 of the stage 15 without overlapping or interfering with the bearing surface 151 and the first substrate 121 . The flattening unit 173 operating in the second position will enter the bearing surface 151 and/or the placement area 153 of the carrier 15 and be located above the bearing surface 151 and the first substrate 121 to flatten the bearing surface 151 placed on the carrier 15 the first substrate 121 on.

As shown in FIGS. 5 , 6 and 9 , the carrier 15 may include a plurality of air extraction lines 155 , wherein the air extraction lines 155 are disposed on the carrier 15 , for example, passing through the carrier 15 , and one end of the air extraction pipeline 155 is connected to the carrier. The bearing surface 151 and/or the placement area 153 of the platform 15. The air extraction pipeline 155 can be connected to an air extraction device 157, such as an air extraction motor. When the air extraction device 157 is air-extracting, the air extraction device 157 connected to the bearing surface 151 and/or the placement area 153 will form a negative pressure to absorb and place the air. The first substrate 121 is in the placement area 153 of the carrier 15 .

In an embodiment of the present invention, each air extraction pipeline 155 can generate negative pressure at the same time and adsorb the first substrate 121 in the placement area 153 . In one embodiment of the present invention, each air extraction pipeline 155 can be connected to a valve 154 respectively, wherein the valve 154 is used to switch whether each air extraction pipeline 155 generates negative pressure, and can control the air extraction pipelines 155 to generate negative pressure in sequence. For example, the air extraction pipeline 155 located on the inside first generates negative pressure and adsorbs the inside of the first substrate 121 , and then controls other air extraction lines 155 to generate negative pressure in sequence along the center of the placement area 153 toward the edge to adsorb the second substrate 121 . The outside of a substrate 121 .

Specifically, the flattening unit 173 is mainly used to flatten the side or outer edge of the first substrate 121 , and the negative pressure generated by the air extraction line 155 can be used to absorb the inside of the first substrate 121 . Through the combination of the flattening unit 173 and the air extraction pipeline 155, the flatness of the flattened first substrate 121 can be further improved, and the positioning accuracy of the first substrate 121 can be improved. In addition, during the process of aligning the first substrate 121 and/or the second substrate 123 through the alignment unit 14, the air extraction device 157 will stop air extraction, and the air extraction pipeline 155 will not adsorb the first substrate 121, so that the alignment The unit 14 can move or push the first substrate 121 on the bearing surface 151 of the stage 15 and perform alignment of the first substrate 121 .

The above is only one of the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention. That is, all changes in shape, structure, characteristics and spirit described in the patent scope of the present invention may be equal to those described above. Modifications should be included in the patentable scope of the present invention.

10: Bonding machine suitable for warped substrates

111:First cavity

112:Confined space

113:Second cavity

121: First substrate

123: Second substrate

13: Pressing unit

131:Plywood

132: Second heating unit

133:Connection board

135: Fixed rod body

14: Counterpoint unit

15: Carrier platform

151: Bearing surface

152: First heating unit

153:Placement area

154:Valve

155:Exhaust pipeline

157:Air extraction device

16:Extraction motor

17: Flattening device

171:Telescopic rotating motor

1711: Linear actuator

1713:Rotating motor

173: Flattening unit

175:rod body

18: Distance measurement unit

191: Cavity driver

193: Press unit driver

G: spacing

[Fig. 1] is a schematic three-dimensional view of an embodiment of a bonding machine suitable for warped substrates according to the present invention.

[Fig. 2] is a schematic cross-sectional view of an embodiment of a bonding machine suitable for warped substrates according to the present invention.

[Fig. 3] is a partial cross-sectional schematic diagram of another embodiment of a bonding machine suitable for warped substrates according to the present invention.

[Fig. 4] is a schematic three-dimensional cross-sectional view of an embodiment of the stage and flattening device of a bonding machine suitable for warped substrates according to the present invention.

[Fig. 5] is a top view of an embodiment of the stage and flattening unit of a bonding machine suitable for warped substrates according to the present invention.

[Fig. 6] is a top view of another embodiment of the stage and flattening unit of a bonding machine suitable for warped substrates according to the present invention.

[Fig. 7] is a schematic three-dimensional cross-sectional view of a stage and a flattening device of a bonding machine suitable for warped substrates according to another embodiment of the present invention.

[Fig. 8] is a schematic three-dimensional cross-sectional view of another embodiment of the stage and flattening device of a bonding machine suitable for warped substrates according to the present invention.

[Fig. 9] is a schematic cross-sectional view of an embodiment of the stage, flattening device and air extraction pipeline of a bonding machine suitable for warped substrates according to the present invention.

10: Bonding machine suitable for warped substrates

111:First cavity

112:Confined space

113:Second cavity

13: Pressing unit

15: Carrier platform

16:Extraction motor

17: Flattening device

18: Distance measurement unit

Claims (9)

A bonding machine suitable for warping substrates, including: a first cavity; a second cavity facing the first cavity, wherein the first cavity is used to connect the second cavity, and A closed space is formed between the first cavity and the second cavity; a pressing unit is connected to the first cavity and located in the closed space; a carrier is connected to the second cavity and located In the enclosed space, the carrier includes a bearing surface facing the pressing unit, wherein the bearing surface includes a placing area for bearing a first substrate, and placing a second substrate on the first substrate; and a plurality of pressing The flattening device includes: a plurality of flattening units located around the placement area of the carrier; a plurality of telescopic rotating motors connected to the flattening unit and driving the flattening unit to rise and fall relative to the bearing surface of the carrier and swing, so that the flattening unit flattens the first substrate on the placement area, wherein the telescopic rotating motor is used to drive the flattening unit to swing at a first position and a second position, operating in the first position The flattening unit is located outside the placement area, and the flattening unit operating in the second position will enter the placement area. The bonding machine suitable for warped substrates as described in claim 1, including a plurality of air extraction pipelines disposed on the carrier and connected to the placement area of the carrier, wherein the plurality of air extraction pipelines are used to form Negative pressure is used to adsorb the first substrate on the placement area. The bonding machine suitable for warped substrates as described in claim 2 includes an air extraction device and a plurality of valves, wherein the air extraction device is connected to the plurality of air extraction pipelines so that the air extraction in the placement area is connected. The pipeline forms a negative pressure, and the plurality of valves are respectively connected to the plurality of air extraction pipelines and used to switch whether the plurality of air extraction pipelines generate negative pressure. The bonding machine platform suitable for warped substrates as described in claim 2, includes a plurality of alignment units disposed on the bearing surface of the carrier and surrounding the placement area, and the alignment units are used to During the process of aligning the first substrate and the second substrate by the alignment unit, the exhaust pipeline will not adsorb the first substrate. The bonding machine platform suitable for warping substrates as described in claim 1, including a plurality of rods passing through the carrier, and the plurality of telescopic rotating motors are located outside the closed space and are respectively connected through the plurality of rods. The plurality of flattening units are used to drive the flattening units to rise, fall or swing relative to the bearing surface of the stage. The bonding machine suitable for warped substrates as described in claim 1, wherein the telescopic rotary motor is used to drive the flattening unit to move at a first height and a second height, and the first height is higher than the third height. Two heights. The bonding machine suitable for warped substrates as described in claim 6, wherein there is a distance between the flattening unit operating at the first height and the bearing surface of the stage, and the distance is greater than the first The thickness of the substrate, and the flattening unit operating at the second height will contact and flatten the first substrate placed on the bearing surface. The bonding machine suitable for warped substrates as described in claim 1, including a plurality of distance measuring units disposed on the laminating unit and used to measure the distance between each of the distance measuring units and the first substrate. distance to determine whether the first substrate placed on the bearing surface of the stage is warped. The bonding machine suitable for warped substrates as described in claim 8, wherein the distance measurement unit is a laser range finder.

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