TWI818552B - Bonding machine for improving alignment accuracy - Google Patents

Abstract

The invention is a bonding machine for improving alignment accuracy, which mainly includes a pressing unit, a carrier and a plurality of movable suction modules. The pressing unit faces the carrier and is used for bonding the substrates placed on the carrier. The movable suction module includes a frame body, a suction unit, a rolling module and a suction unit driver, wherein the suction unit driver is connected to the frame body and drives the suction unit to rise and fall through the frame body. The rolling module is located between the frame body and the suction unit, so that the suction unit can be displaced relative to the frame body. During the process of aligning the substrates, the movable suction module can continuously suck and level the substrate, so as to improve the accuracy of aligning the substrates.

Description

Bonding machine that can improve alignment accuracy

The invention relates to a bonding machine that can improve alignment accuracy. During the process of aligning a substrate, a movable adsorption module can continuously adsorb and flatten the substrate, thereby improving the accuracy of aligning the substrate.

The development of integrated circuit technology has matured, and electronic products are currently developing towards the trend of being light, thin, short, high-performance, high-reliability and intelligent. The wafers in electronic products can have an important impact on the performance of the electronic products, and the aforementioned performance is partly related to the thickness of the wafer. For example, thinner wafers can improve heat dissipation efficiency, increase mechanical properties, improve electrical properties, and reduce package size and weight.

In the semiconductor manufacturing process, a thinning process, a through-hole etching process, and a back metallization process are usually performed on the back side (i.e., the lower surface) of the wafer. Generally speaking, a bonding process is performed before the wafer thinning process. The adhesive layer is mainly placed between the wafer and the carrier (for example, sapphire glass), and the laminated components are pressed together through the pressing unit and the carrier. Wafer and carrier, the bonding of wafer and carrier has been completed. After completing the wafer thinning process, a debonding process is performed to separate the wafer from the carrier.

However, the expansion coefficients of each material layer of the wafer are different, so the wafer often produces wafer warpage after undergoing a high-temperature process. In addition, each wafer may have different warpage shapes, such as saddle-shaped, hill-shaped, etc., which is not conducive to the subsequent alignment of the stacked wafers during the bonding process, and inaccurate alignment is prone to occur.

In order to solve the problems faced by the prior art, the present invention proposes a novel bonding machine that can improve alignment accuracy and can absorb warped substrates placed on the bearing surface of the carrier through a plurality of movable adsorption modules. and flatten warped substrates. During the process of aligning the substrate by the alignment unit, the movable adsorption module will continue to adsorb the substrate and displace as the substrate moves relative to the bearing surface of the stage, so that the alignment unit can align the flat substrate, which is beneficial to Improve the accuracy of substrate alignment.

An object of the present invention is to provide a bonding machine that can improve alignment accuracy, which mainly includes a first cavity, a second cavity, a pressing unit, a carrier and a plurality of movable adsorption molds. A group in which the first cavity is used to connect the second cavity and form a closed space between the two.

The movable adsorption module is arranged on the stage and includes a frame, an adsorption unit, a rolling module and an adsorption unit driver. The adsorption unit driver is connected through the frame and drives the adsorption unit relative to the bearing surface of the stage. Lift. Specifically, the adsorption unit driver can drive the adsorption unit to rise and adsorb the warped substrate. The adsorption unit driver will then drive the adsorption unit down to flatten the warped part of the substrate.

The rolling module is located between the frame and the adsorption unit, so that the adsorption unit can be displaced relative to the frame in a direction parallel to the bearing surface of the stage. While the alignment unit is aligning the substrate, the adsorption unit will continue to adsorb the substrate, and the alignment unit will drive the adsorption unit to move relative to the bearing surface of the stage through the substrate. Therefore, during the alignment process, the substrate will not return to its original warped state, which is beneficial to improving the accuracy of substrate alignment.

One object of the present invention is to provide a bonding machine that can improve alignment accuracy. It mainly provides a rolling module or a deformation unit between the adsorption unit and the frame to facilitate the displacement of the adsorption unit relative to the frame. Through the setting of the rolling module or the deformation unit, the friction between the adsorption unit and the frame can be reduced to avoid the generation of pollution particles when the adsorption unit and the frame are displaced relative to each other.

In order to achieve the above object, the present invention proposes a bonding machine that can improve alignment accuracy, including: a first cavity; a second cavity facing the first cavity, wherein the first cavity is used to Connect the second cavity and form a closed space between the first cavity and the second cavity; a pressing unit is connected to the first cavity and is located in the closed space; a carrier is connected to the second cavity, And located in a closed space, the carrier includes a bearing surface facing the pressing unit, the bearing surface is used to carry a first substrate, and a second substrate is placed on the first substrate, wherein a plurality of placement recesses are provided on the bearing surface of the carrier. groove; and a plurality of movable adsorption modules, including: a frame, which is arranged in a groove on the bearing surface; an adsorption unit connected to the frame, wherein the adsorption unit is used to adsorb particles placed on the bearing surface of the stage The first substrate; a rolling module located between the frame and the adsorption unit, causing the adsorption unit to move relative to the frame; an adsorption unit driver connected to the frame, and driving the adsorption unit relative to the bearing surface of the stage through the frame Lifting and lowering causes the adsorption unit to flatten the adsorbed first substrate.

The present invention provides another bonding machine that can improve alignment accuracy, including: a first cavity; a second cavity, facing the first cavity, wherein the first cavity is used to connect the second cavity , and forms a closed space between the first cavity and the second cavity; a pressing unit is connected to the first cavity and is located in the closed space; a carrier is connected to the second cavity and is located in the closed space, The carrier includes a bearing surface facing the pressing unit. The bearing surface is used to carry a first substrate and place a second substrate on the first substrate. The bearing surface of the carrier is provided with a plurality of grooves; and a plurality of grooves are provided on the bearing surface. The movable adsorption module includes: a frame, which is arranged in a groove on the bearing surface; an adsorption unit connected to Connected to the frame, the adsorption unit is used to adsorb the first substrate placed on the bearing surface of the stage; a deformation unit is located between the frame and the adsorption unit, so that the adsorption unit is displaced relative to the frame; an adsorption unit driver, The frame is connected, and the adsorption unit is driven to rise and fall relative to the bearing surface of the stage through the frame, so that the adsorption unit flattens the adsorbed first substrate.

In at least one embodiment of the present invention, a plurality of distance measurement units are provided on the lamination unit and used to measure the distance between the plurality of distance measurement units and the first substrate placed on the bearing surface of the carrier. .

In at least one embodiment of the present invention, the adsorption unit driver adjusts the rising height of the adsorption unit according to the measurement result of the distance measurement unit, so that the adsorption unit adsorbs the first substrate.

In at least one embodiment of the present invention, the adsorption unit includes an adsorption port and an air extraction line. The air extraction line is fluidly connected to the adsorption port and is used to form a negative pressure on the adsorption port, so that the adsorption port adsorbs the third object placed on the bearing surface. A substrate.

In at least one embodiment of the present invention, the frame includes an accommodating space for accommodating the adsorption unit, and the cross-sectional area of the accommodating space is larger than the cross-sectional area of the adsorption unit, so that the adsorption unit is in the accommodating space relative to the stage. Loading surface displacement.

In at least one embodiment of the present invention, the accommodation space of the frame includes at least one connecting bottom surface, and at least one through hole is provided on the connecting bottom surface. The rolling module is located on the connecting bottom surface, and a fastener is connected through the through hole on the connecting bottom surface. An adsorption unit in which the cross-sectional area of the perforation is greater than the cross-sectional area of a shank of the fastener.

In at least one embodiment of the present invention, the rolling module includes a base, a plurality of balls and a connecting seat. The base is connected to the frame, the connecting seat is connected to the adsorption unit, and the plurality of balls are located between the base and the connecting seat.

In at least one embodiment of the present invention, a plurality of elastic units are included, located between the frame and the adsorption unit.

In at least one embodiment of the present invention, a plurality of alignment units are located on the bearing surface of the stage and are used to align the first substrate and the second substrate. In the process of aligning the first substrate by the alignment unit, a third substrate is passed through the alignment unit. A substrate drives the adsorption unit to move relative to the bearing surface of the stage in the accommodation space of the frame.

10: Bonding machine that can improve alignment accuracy

111:First cavity

112:Confined space

113:Second cavity

121: First substrate

123: Second substrate

13: Pressing unit

14: Counterpoint unit

15: Carrier platform

151: Bearing surface

153: Set the groove

155:Exhaust port

16:Extraction motor

17: Movable adsorption module

171: Adsorption unit driver

172: Accommodation space

1721:First opening

1723:Second opening

1725: Connect the bottom surface

173:Adsorption unit

1731:Adsorption port

1732:Fixing hole

1733:Elastic unit

1735:Exhaust pipeline

174: Interval space

175:Fasteners

1751:Head

1753:Rod

177:frame

1771:Perforation

179:Scrolling module

1791: base

1792: Groove

1793: Connector

1794:Connection hole

1795: Ball

18: Distance measurement unit

191: Cavity driver

193: Press unit driver

[Fig. 1] is a three-dimensional schematic diagram of an embodiment of a bonding machine that can improve alignment accuracy according to the present invention.

[Fig. 2] is a schematic cross-sectional view of an embodiment of a bonding machine that can improve alignment accuracy according to the present invention.

[Fig. 3] is a schematic three-dimensional view of an embodiment of the pressing unit and the carrier of a bonding machine that can improve alignment accuracy according to the present invention.

[Fig. 4] is a schematic three-dimensional cross-sectional view of an embodiment of the movable adsorption module of the bonding machine according to the present invention, which can improve the alignment accuracy.

[Fig. 5] is a three-dimensional exploded schematic diagram of an embodiment of the adsorption unit and frame of a bonding machine that can improve alignment accuracy according to the present invention.

[Fig. 6] is a three-dimensional perspective view of an embodiment of the adsorption unit and frame of a bonding machine according to the present invention, which can improve alignment accuracy.

[Fig. 7] is a schematic cross-sectional view of an embodiment of the adsorption unit, frame and rolling module of a bonding machine that can improve alignment accuracy according to the present invention.

[Fig. 8] is a perspective view of a rolling module of a bonding machine that can improve alignment accuracy according to an embodiment of the present invention.

[Fig. 9] is a schematic cross-sectional view of an embodiment of the present invention in which a bonding machine platform lifts up and absorbs a substrate, which can improve alignment accuracy.

[Fig. 10] is a schematic cross-sectional view of an embodiment of the present invention in which a bonding machine that can improve alignment accuracy absorbs and flattens a substrate.

Please refer to FIGS. 1 and 2 , which are respectively a three-dimensional schematic diagram and a cross-sectional schematic diagram of an embodiment of a bonding machine that can improve alignment accuracy according to the present invention. As shown in the figure, the bonding machine 10 that can improve alignment accuracy includes a first cavity 111, a second cavity 113, a pressing unit 13, a carrier 15 and a plurality of movable adsorption modules. 17, wherein the first cavity 111 faces the second cavity 113, and the first cavity 111 is displaceable relative to the second cavity 113.

As shown in FIG. 2 , the pressing unit 13 is located in the first cavity 111 and connected to the first cavity 111 . The stage 15 is located in the second cavity 113 and connected to the second cavity 113 . The bearing surface 151 of the carrier 15 faces the pressing unit 13 . After the first cavity 111 is connected to the second cavity 113, a closed space 112 is formed between the two, and the pressing unit 13 and the carrier 15 are located in the closed space 112. The carrying surface 151 of the stage 15 is used to carry a first substrate 121, and a second substrate 123 can be placed on the first substrate 121.

As shown in FIG. 1 , in an embodiment of the present invention, the first cavity 111 can be connected to a cavity driver 191 , wherein the cavity driver 191 is located outside the closed space 112 and connected to the first cavity 111 . The cavity driver 191 is used to drive the displacement of the first cavity 111 relative to the second cavity 113. For example, the cavity driver 191 may be a linear actuator.

In addition, the pressing unit driver 193 is located outside the closed space 112 and is connected to the pressing unit 13 . For example, the pressing unit driver 193 may be a linear actuator to drive the pressing unit 13 toward or away from the stage 15 . After the alignment of the first substrate 121 and the second substrate 123 is completed, the pressing unit driver 193 can drive the pressing unit 13 to approach the bearing surface 151 of the carrier 15 and press the first substrate 121 and the second substrate 121 carried by the carrier 15 . two substrates 123 to complete the bonding of the first substrate 121 and the second substrate 123.

As shown in FIG. 2 , the first cavity 111 or the second cavity 113 can be provided with an air extraction motor 16 , wherein the air extraction motor 16 is fluidly connected to the sealed space 112 and is used to extract the gas in the sealed space 112 to reduce the pressure in the enclosed space. The pressure within 112 maintains the closed space 112 in a vacuum or low-pressure state.

The carrying surface 151 of the stage 15 is used to carry a stacked first substrate 121 and a second substrate 123. For example, the first substrate 121 is a carrying substrate, and the second substrate 123 is a wafer. The first substrate 121 and the second substrate 123 are wafers. There is an adhesive layer between the substrates 123 to adhere the first substrate 121 and the second substrate 123 . In different embodiments, the first substrate 121 and the second substrate 123 may also be wafers that have undergone a semiconductor process.

As shown in FIGS. 3 and 4 , the movable adsorption module 17 is located in the second cavity 113 and is disposed on the carrier 15 . In one embodiment of the present invention, a plurality of installation grooves 153 can be provided on the bearing surface 151 of the carrier 15, and the movable adsorption module 17 can be provided in each of the installation grooves 153, wherein the movable adsorption module 17 can It rises and falls relative to the bearing surface 151 of the carrier 15 and can be displaced in a direction parallel to the bearing surface 151 of the carrier 15 .

As shown in FIGS. 5 and 6 , the movable adsorption module 17 includes an adsorption unit driver 171 , an adsorption unit 173 , a frame 177 and a rolling module 179 . The frame 177 is disposed in the groove 153 of the stage 15 and includes a receiving space 172 for accommodating the adsorption units 173 , in which part of the adsorption units 173 can protrude from the frame 177 . The suction unit driver 171 is connected to the frame 177 and via The frame 177 is connected to and drives the adsorption unit 173 to rise and fall relative to the bearing surface 151 of the stage 15 . For example, the adsorption unit driver 171 may be a linear actuator.

The rolling module 179 is located between the frame 177 and the adsorption unit 173 to facilitate the displacement of the adsorption unit 173 relative to the frame 177 in the accommodation space 172 . In one embodiment of the present invention, the accommodation space 172 of the frame 177 includes at least one connecting bottom surface 1725, and the rolling module 179 is disposed on the connecting bottom surface 1725. The adsorption unit 173 is placed in the accommodation space 172 of the frame 177 so that the connecting bottom surface 1725 of the frame 177 is connected to and carries the adsorption unit 173 through the rolling module 179 .

At least one through hole 1771 can be provided on the connecting bottom surface 1725 of the frame 177 , and a fastener 175 can pass through the through hole 1771 on the connecting bottom surface 1725 and be connected to the fixing hole 1732 at the bottom of the adsorption unit 173 . For example, the fastener 175 can be a screw, and the fixing hole 1732 can be a screw hole.

Specifically, the lateral cross-sectional area of the adsorption unit 173 can be smaller than the lateral cross-sectional area of the accommodation space 172. When the adsorption unit 173 is disposed in the accommodation space 172 of the frame 177, the adsorption unit 173 will not completely fill the accommodation space 172. And there is an interval space 174 between the adsorption unit 173 and the frame 177, so that the adsorption unit 173 can be displaced relative to the frame 177 and/or the bearing surface 151 of the stage 15 in the accommodation space 172, for example, in parallel with the stage. 15 direction displacement of the bearing surface 151.

The fasteners 175 do not completely fix the adsorption unit 173 and the frame 177 , so that the adsorption unit 173 can be displaced relative to the frame 177 . Specifically, the fastener 175 may include a head 1751 and a stem 1753. The cross-sectional area of the head 1751 is larger than that of the stem 1753. For example, the stem 1753 is a screw. The rod portion 1753 of the fastener 175 is used to connect the fixing hole 1732 of the adsorption unit 173, and there is a slight gap between the head 1751 of the fastener 175 and the frame 177. In addition, the cross-sectional area of the rod portion 1753 of the fastener 175 may be smaller than the cross-sectional area of the through hole 1771 of the frame 177 , so that the rod portion 1753 of the fastener 175 may be relative to the frame 177 within the through hole 1771 .

In an embodiment of the present invention, a plurality of elastic units 1733, such as springs, may be provided between the adsorption unit 173 and the frame 177, wherein the elastic units 1733 are located in the separation space 174.

As shown in Figures 7 and 8, the rolling module 179 includes a base 1791, a connecting seat 1793 and at least one ball 1795, wherein the ball 1795 is located between the base 1791 and the connecting seat 1793, such that there is a gap between the base 1791 and the connecting seat 1793. There is a gap to prevent the connecting seat 1793 from directly contacting the base 1791. The connecting seat 1793 can be displaced relative to the base 1791 and drive the ball 1795 between the two to roll.

The base 1791 of the rolling module 179 is connected to the frame 177 , and the connecting seat 1793 is connected to the adsorption unit 173 . In addition, a groove 1792 can be provided on the surface of the base 1791 facing the connecting seat 1793, and the ball 1795 is placed in the groove 1792, so that the ball 1795 rolls in the groove 1792. Through the arrangement of the rolling module 179, the friction force when the adsorption unit 173 is displaced relative to the frame 177 can be reduced, and the generation of particles during the displacement process can be prevented.

In another embodiment of the present invention, the above-mentioned rolling module 179 can also be replaced by a deformation unit, and is located between the adsorption unit 173 and the frame 177 through the deformation unit. For example, the deformation unit can be a spring or an elastic gasket. Specifically, the deformation unit may be disposed on the connection bottom surface 1725 of the frame 177 so that the connection bottom surface 1725 of the frame 177 carries and connects the adsorption unit 173 via the deformation unit. When the adsorption unit 173 is displaced relative to the frame 177, the deformation unit will be deformed. Through the arrangement of the deformation unit, direct contact between the adsorption unit 173 and the frame 177 can also be avoided, and friction generated when the adsorption unit 173 and the frame 177 are displaced relative to each other can be prevented.

In one embodiment of the present invention, the base 1791 and the connecting base 1793 can be annular bodies, and a connecting hole 1794 is provided on the base 1791 and the connecting base 1793. The groove 1792 provided on the base 1791 can be an annular groove, and a plurality of balls 1795 can be arranged in the annular groove. scroll The connecting hole 1794 of the module 179 can be aligned with the fixing hole 1732 of the adsorption unit 173 and the through hole 1771 of the frame 177 , and the rod 1753 of the fastener 175 can pass through the through hole of the frame 177 and the connecting hole 1794 of the rolling module 179 , and is fixed on the fixing hole 1732 of the adsorption unit 173, where the cross-sectional area of the rod portion 1753 of the fastener 175 is smaller than the cross-sectional area of the connecting hole 1794.

As shown in FIG. 3 , a plurality of alignment units 14 can be provided on the bearing surface 151 of the carrier 15 . The alignment units 14 are placed around the first substrate 121 and/or the second substrate 123 of the carrier 15 and can be close to each other. Or away from the center of the first substrate 121 , the second substrate 123 and/or the carrying surface 151 to align the first substrate 121 and the second substrate 123 . For example, the alignment unit 14 can be rod-shaped and can be telescopic relative to the bearing surface 151 of the stage 15 . After the alignment unit 14 protrudes from the bearing surface 151 , it can be displaced toward the first substrate 121 along the radial direction of the bearing surface 151 . , the alignment unit 14 will contact and align the first substrate 121 during the displacement process, so as to position the first substrate 121 at a fixed position on the carrying surface 151 .

During the process of aligning the substrate, the alignment unit 14 may push the first substrate 121 to move relative to the bearing surface 151 of the stage 15 , and drive the adsorption unit 173 through the first substrate 121 in the accommodation space 172 of the frame 177 The bearing surface 151 is displaced relative to the stage 15 to compress and/or elongate the elastic unit 1733 located between the adsorption unit 173 and the frame 177 . Specifically, the first substrate 121 and the adsorption unit 173 will be displaced in a direction parallel to the bearing surface 151 .

When the adsorption unit 173 does not adsorb the first substrate 121 , for example, the first substrate 121 and the second substrate 123 have been bonded, the elastic unit 1733 will return to its original length, so that the adsorption unit 173 returns to the length of the accommodation space 172 . Fixed position.

As shown in FIGS. 4 , 5 and 6 , the adsorption unit 173 includes at least one adsorption port 1731 and an air extraction line 1735 . The air extraction line 1735 is fluidly connected to the adsorption port 1731 . Specifically, the adsorption unit At least one fluid channel can be provided in 173, and the suction line 1735 is connected to the adsorption port 1731 through the fluid channel.

The air extraction line 1735 is used to connect an air extraction device, such as a motor. When the air extraction device is started, a negative pressure will be formed on the adsorption port 1731 of the adsorption unit 173 through the air extraction line 1735, and the second object placed on the bearing surface 151 will be adsorbed. A substrate 121.

In an embodiment of the present invention, the accommodation space 172 of the frame 177 has a first opening 1721 and a second opening 1723. The first opening 1721 is located at the top of the frame 177 . When the frame 177 is placed in the installation groove 153 of the carrier 15 , the first opening 1721 will be located on the bearing surface 151 of the carrier 15 . The air extraction line 1735 can be connected to the air extraction device through the second opening 1723 , for example, the second opening 1723 is located at the bottom of the frame 177 .

The air extraction line 1735 may be a flexible air extraction line. When the adsorption unit 173 is displaced relative to the frame 177 , the adsorption unit 173 may bend the air extraction line 1735 .

In an embodiment of the present invention, as shown in FIG. 3 , a plurality of distance measurement units 18 can be provided on the pressing unit 13 . For example, the distance measurement unit 18 can be a laser rangefinder. The distance measurement unit 18 is used to project the generated measurement beam onto the first substrate 121 to measure the distance between each distance measurement unit 18 and the first substrate 121 .

The distance measured by each distance measuring unit 18 can determine the warpage degree or height of the first substrate 121 . Then, based on the measurement results, the adsorption unit driver 171 can be controlled to adjust the lifting height of the adsorption unit 173 and/or the frame 177 so that the adsorption unit 173 contacts and adsorbs the first substrate 121 .

The distance measuring unit 18 can be disposed above the pressing unit 13 , and a plurality of through holes are provided on the pressing unit 13 . The measurement beam generated by the distance measurement unit 18 can pass through the pressing unit 13 through holes projected onto the first substrate 121 . In an embodiment of the present invention, the position of each distance measuring unit 18 may correspond to each movable adsorption module 17 , for example, toward the adsorption unit 173 of each movable adsorption module 17 .

In one embodiment of the present invention, as shown in FIG. 9 , the adsorption unit driver 171 can drive the adsorption unit 173 to rise, so that the adsorption unit 173 protrudes from the bearing surface 151 of the carrier 15 and adsorbs the upwardly warped first substrate. 121. As shown in FIG. 10 , the adsorption unit driver 171 drives the adsorption unit 173 to descend. For example, the height of the adsorption unit 173 is approximately close to the bearing surface 151 . When the adsorption unit 173 descends, it will pull the adsorbed first substrate 121 and flatten the upwardly warped first substrate 121 .

A plurality of air extraction ports 155 can be provided on the bearing surface 151 of the carrier 15 . The air exhaust port 155 is fluidly connected to an air extraction device. When the air extraction device exhausts air, a negative pressure will be formed in the air extraction port 155 to absorb the objects placed on the carrier 15 . The first substrate 121 is placed on the carrying surface 151 . Specifically, the air extraction port 155 provided on the bearing surface 151 can be located inside the movable adsorption module 17 and used to adsorb the inside of the first substrate 121 , while the movable adsorption module 17 is used to adsorb the first substrate 121 to improve the flatness of the first substrate 121 . In addition, when the first substrate 121 is aligned through the alignment unit 14 , the air extraction port 155 on the bearing surface 151 will stop generating negative pressure, so that the alignment unit 14 can push the first substrate 121 and the adsorption unit 173 relative to the stage 15 151 displacement of the bearing surface.

In the drawings of the present invention, the movable adsorption module 17 is disposed outside the first substrate 121 and/or the load-bearing surface 151. In practical applications, the movable adsorption module 17 can also be disposed on the first substrate 121 and/or the load-bearing surface 151. The inner side of the surface 151 , for example, part or all of the air extraction ports 155 in FIGS. 3 , 9 and 10 may be a movable adsorption module 17 .

The above is only one of the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention. That is, all changes in shape, structure, characteristics and spirit described in the patent scope of the present invention may be equal to those described above. Modifications should be included in the patentable scope of the present invention.

13: Pressing unit

14: Counterpoint unit

15: Carrier platform

151: Bearing surface

153: Set the groove

155:Exhaust port

17: Movable adsorption module

18: Distance measurement unit

Claims (10)

A bonding machine that can improve alignment accuracy includes: a first cavity; a second cavity facing the first cavity, wherein the first cavity is used to connect the second cavity, And a closed space is formed between the first cavity and the second cavity; a pressing unit is connected to the first cavity and is located in the closed space; a carrier is connected to the second cavity, and Located in the closed space, the carrier includes a bearing surface facing the pressing unit, the bearing surface is used to carry a first substrate, and a second substrate is placed on the first substrate, wherein the bearing surface of the carrier A plurality of setting grooves are provided on the top; and a plurality of movable adsorption modules include: a frame, which is set in the setting groove of the bearing surface; an adsorption unit connected to the frame, wherein the adsorption unit is used to Adsorb the first substrate placed on the bearing surface of the stage; a rolling module is located between the frame and the adsorption unit, so that the adsorption unit is displaced relative to the frame; an adsorption unit driver is connected The frame body drives the adsorption unit to rise and fall relative to the bearing surface of the stage through the frame body, so that the adsorption unit flattens the adsorbed first substrate. The bonding machine that can improve alignment accuracy as described in claim 1 includes a plurality of distance measuring units disposed on the laminating unit and used to measure the distance between the plurality of distance measuring units and the position placed on the carrier. The distance between the first substrate on the bearing surface of the stage. The bonding machine that can improve alignment accuracy as described in claim 2, wherein the adsorption unit driver adjusts the rising height of the adsorption unit based on the measurement result of the distance measurement unit, so that the adsorption unit adsorbs the third A substrate. The bonding machine that can improve alignment accuracy as described in claim 1, wherein the adsorption unit includes an adsorption port and an air extraction line. The air extraction line is fluidly connected to the adsorption port and is used to form the adsorption port on the adsorption port. The negative pressure causes the adsorption port to adsorb the first substrate placed on the carrying surface. The bonding machine that can improve alignment accuracy as described in claim 1, wherein the frame includes a receiving space to accommodate the adsorption unit, and the cross-sectional area of the receiving space is larger than the cross-sectional area of the adsorption unit. , so that the adsorption unit is displaced relative to the bearing surface of the stage in the accommodation space. The bonding machine that can improve alignment accuracy as described in claim 5, wherein the accommodation space of the frame includes at least one connection bottom surface, and at least one through hole is provided on the connection bottom surface, and the rolling module is located On the connecting bottom surface, a fastener passes through the through hole on the connecting bottom surface to connect to the adsorption unit, wherein the cross-sectional area of the through hole is larger than the cross-sectional area of a rod portion of the fastener. The bonding machine that can improve alignment accuracy as described in claim 5, wherein the rolling module includes a base, a plurality of balls and a connecting seat, the base is connected to the frame, and the connecting seat is connected to the adsorption unit , and the plurality of balls are located between the base and the connecting seat. The bonding machine that can improve alignment accuracy as described in claim 1 includes a plurality of elastic units located between the frame and the adsorption unit. The bonding machine platform that can improve alignment accuracy as described in claim 5 includes a plurality of alignment units located on the bearing surface of the carrier platform and used to align the first substrate and the second substrate. During the process of aligning the first substrate by the alignment unit, the adsorption unit will be driven by the first substrate to be displaced relative to the bearing surface of the stage in the accommodation space of the frame. A bonding machine that can improve alignment accuracy includes: a first cavity; a second cavity facing the first cavity, wherein the first cavity is used to connect the second cavity and form a sealed space between the first cavity and the second cavity; a A pressing unit is connected to the first cavity and located in the closed space; a carrier is connected to the second cavity and located in the closed space. The carrier includes a bearing surface facing the pressing unit, and the bearing surface Used to carry a first substrate and place a second substrate on the first substrate, wherein a plurality of setting grooves are provided on the bearing surface of the carrier; and a plurality of movable adsorption modules, including: a frame The body is arranged in the groove of the bearing surface; an adsorption unit is connected to the frame, wherein the adsorption unit is used to adsorb the first substrate placed on the bearing surface of the stage; a deformation unit, Located between the frame and the adsorption unit, the adsorption unit is displaced relative to the frame; an adsorption unit driver is connected to the frame and drives the adsorption unit relative to the bearing surface of the stage through the frame Lifting and lowering causes the adsorption unit to flatten the adsorbed first substrate.

Images