TWM631936U - Bonding equipment with movable suction module - Google Patents

Abstract

The new type is a bonding equipment with movable adsorption modules, which mainly includes a first cavity, a second cavity, a pressing unit, a carrier and a plurality of movable adsorption modules. The first cavity is used for connecting with the second cavity, and a closed space is formed between the two. The pressing unit is arranged in the first cavity, and the carrier is arranged in the second cavity. The lamination unit faces the stage and is used for bonding the substrates placed on the stage. The movable suction module is arranged in a plurality of setting grooves on the bearing surface of the carrier, and is used for sucking and leveling the substrate placed on the bearing surface. The movable adsorption module can be displaced along the bearing surface of the stage, and can continuously adsorb and flatten the substrate during the process of aligning the substrate, so as to improve the accuracy of the substrate alignment.

Description

Bonding equipment with movable adsorption module

The present invention relates to a bonding device with a movable adsorption module. During the process of aligning the substrate, the movable adsorption module can continuously adsorb and flatten the substrate, so as to improve the accuracy of the substrate alignment.

The development of integrated circuit technology has matured, and electronic products are currently developing towards the trend of light, thin, short, high performance, high reliability and intelligence. The wafer in an electronic product can have a significant impact on the performance of the electronic product, which is partly related to the thickness of the wafer. For example, thinner wafers can improve thermal efficiency, increase mechanical performance, improve electrical performance, and reduce package size and weight.

In the semiconductor manufacturing process, a thinning process, a via etching process and a backside metallization process are usually performed on the backside (ie, lower surface) of the wafer. Generally speaking, a bonding process is performed before the wafer thinning process, and the bonding layer is mainly disposed between the wafer and the carrier (eg, sapphire glass), and is laminated through the lamination unit and the carrier. Wafer and carrier, the bonding of wafer and carrier has been completed. After the wafer thinning process is completed, a debonding process is performed to separate the wafer from the carrier.

However, the expansion coefficients of the material layers of the wafer are different, so the wafer is often subject to warpage after a high temperature process. In addition, each wafer may have different warpage shapes, such as saddle shape, hill shape, etc., which is not conducive to the subsequent alignment of stacked wafers in the bonding process, and is prone to inaccurate alignment.

In order to solve the problems faced by the prior art, the present invention proposes a novel bonding equipment with movable adsorption modules, which can adsorb the warped substrate placed on the bearing surface of the stage through a plurality of movable adsorption modules, and Flatten warped substrates. During the process of aligning the substrate by the alignment unit, the movable adsorption module will continue to adsorb the substrate, and with the displacement of the substrate relative to the bearing surface of the stage, the alignment unit can align the flat substrate, which is beneficial to Improve the accuracy of substrate alignment.

An object of the present invention is to provide a bonding device with a movable adsorption module, which mainly includes a first cavity, a second cavity, a pressing unit, a carrier and a plurality of movable adsorption modules , wherein the first cavity is used to connect the second cavity, and a closed space is formed between the two.

The movable adsorption module is arranged on the bearing surface of the carrier, and includes an adsorption unit and a linear actuator, wherein the linear actuator is used to drive the adsorption unit to move up and down relative to the carrier surface of the carrier. The linear actuator can drive the suction unit to lift and absorb the warped substrate. Then, the linear actuator will drive the adsorption unit to descend to level the warped part of the substrate.

After the adsorption unit flattens the warped substrate, the substrate can be aligned through the alignment unit. During the process of aligning the substrate by the alignment unit, the adsorption unit will continue to adsorb the substrate, so that the substrate will not return to the original warped state, and is beneficial to improve the accuracy of the alignment of the substrate.

An object of the present invention is to provide a bonding device with a movable adsorption module, wherein a plurality of setting grooves are provided on the bearing surface of the carrier, and the adsorption unit of the movable adsorption module is placed in the setting grooves. The cross-sectional area of the suction unit is smaller than that of the setting groove, so that the suction unit can move with the substrate in the setting groove, so as to continuously suction and level the substrate with the suction unit during the process of aligning the substrate.

In order to achieve the above purpose, the present invention proposes a bonding device with a movable adsorption module, comprising: a first cavity; a second cavity facing the first cavity, wherein the first cavity is used for connecting The second cavity forms a closed space between the first cavity and the second cavity; a pressing unit is connected to the first cavity and located in the closed space; a carrier is connected to the second cavity, and Located in a closed space, the carrier includes a bearing surface facing the pressing unit, the bearing surface is used to carry a first substrate, and a second substrate is placed on the first substrate, wherein a plurality of setting grooves are arranged on the bearing surface of the carrier ; and a plurality of movable adsorption modules, including: a plurality of adsorption units, which are arranged in a plurality of setting grooves on the bearing surface and can be displaced relative to the bearing surface of the carrier, wherein the adsorption units are used for adsorption and placement on the carrier. The first substrate on the carrier surface of the carrier; a plurality of adsorption unit drivers are connected to the plurality of adsorption units and used to drive the adsorption units to rise and fall relative to the carrier surface of the carrier, so that the adsorption units level the adsorbed first substrate.

In at least one embodiment of the present invention, a plurality of distance measuring units are provided on the pressing unit, and are used to measure the distance between the plurality of distance measuring units and the first substrate placed on the bearing surface of the carrier. .

In at least one embodiment of the present invention, the adsorption unit driver adjusts the rising height of the adsorption unit according to the measurement result of the distance measurement unit, so that the adsorption unit adsorbs the first substrate.

In at least one embodiment of the present invention, the movable adsorption module includes a frame body, the frame body includes an accommodating space for accommodating the adsorption unit, the adsorption unit driver is connected to the frame body, and drives the adsorption unit relative to the frame body through the frame body. The bearing surface of the stage is raised and lowered.

In at least one embodiment of the present invention, the adsorption unit includes an adsorption port and a suction line, and the suction line is fluidly connected to the adsorption port, and is used to form a negative pressure on the adsorption port, so that the adsorption port can adsorb the first suction placed on the bearing surface. a substrate.

In at least one embodiment of the present invention, the cross-sectional area of the accommodating space of the frame is larger than that of the adsorption unit, so that the adsorption unit can be displaced relative to the bearing surface of the carrier in the accommodating space.

In at least one embodiment of the present invention, the frame body includes at least one through hole, a fastener passes through the through hole of the frame body, and is connected to the adsorption unit, wherein the cross-sectional area of the through hole is larger than the cross-sectional area of a rod of the fastener.

In at least one embodiment of the present invention, a plurality of elastic units are included, which are located between the frame body and the adsorption unit.

In at least one embodiment of the present invention, a plurality of alignment units are located on the bearing surface of the carrier, and are used for alignment of the first substrate and the second substrate. During the alignment of the first substrate by the alignment units, the A base plate drives the adsorption unit in the accommodating space of the frame to displace relative to the bearing surface of the carrier.

In at least one embodiment of the present invention, a plurality of air suction ports are provided on the carrying surface of the carrying plate, and are located inside the plurality of movable suction modules, wherein the movable suction modules are used for suctioning the outside of the first substrate, and The plurality of air suction ports are used for sucking the inner side of the first substrate.

Please refer to FIG. 1 and FIG. 2 , which are a three-dimensional schematic diagram and a cross-sectional schematic diagram, respectively, of an embodiment of a novel bonding apparatus with a movable adsorption module. As shown in the figure, the bonding apparatus 10 with a movable adsorption module includes a first cavity 111 , a second cavity 113 , a pressing unit 13 , a carrier 15 and a plurality of movable adsorption modules 17 , wherein the first cavity 111 faces the second cavity 113 , and the first cavity 111 can be displaced relative to the second cavity 113 .

As shown in FIG. 2 , the pressing unit 13 is located in the first cavity 111 and is connected to the first cavity 111 . The carrier 15 is located in the second cavity 113 and connected to the second cavity 113 . The bearing surface 151 of the stage 15 faces the pressing unit 13 . After the first cavity 111 is connected to the second cavity 113 , a closed space 112 is formed therebetween, and the pressing unit 13 and the stage 15 are located in the closed space 112 . The carrying surface 151 of the stage 15 is used for carrying a first substrate 121 , and a second substrate 123 can be placed on the first substrate 121 .

As shown in FIG. 1 , in an embodiment of the present invention, the first cavity 111 can be connected to a cavity driver 191 , wherein the cavity driver 191 is located outside the closed space 112 and is connected to the first cavity 111 . The cavity driver 191 is used to drive the displacement of the first cavity 111 relative to the second cavity 113 , for example, the cavity driver 191 may be a linear actuator.

In addition, the pressing unit driver 193 is located outside the closed space 112 and is connected to the pressing unit 13 . After the alignment of the first substrate 121 and the second substrate 123 is completed, the pressing unit driver 193 can drive the pressing unit 13 to approach the bearing surface 151 of the carrier 15 and press the first substrate 121 and the second substrate carried by the carrier 15 Two substrates 123 to complete the bonding of the first substrate 121 and the second substrate 123 .

As shown in FIG. 2 , the first cavity 111 or the second cavity 113 can be provided with an air extraction motor 16 , wherein the air extraction motor 16 is fluidly connected to the enclosed space 112 and used to extract the gas in the enclosed space 112 to reduce the enclosed space The pressure in 112 keeps the closed space 112 in a vacuum or low pressure state.

The carrying surface 151 of the stage 15 is used for carrying a first substrate 121 and a second substrate 123 that are stacked. For example, the first substrate 121 is a carrier substrate, and the second substrate 123 is a wafer, wherein the first substrate 121 and the second substrate 123 are An adhesive layer is disposed between the substrates 123 for bonding the first substrate 121 and the second substrate 123 . In different embodiments, the first substrate 121 and the second substrate 123 may also be wafers that have undergone a semiconductor process.

As shown in FIG. 3 and FIG. 4 , the movable suction module 17 is located in the second cavity 113 and is arranged on the carrier 15 . The movable suction module 17 includes a suction unit driver 171 and a suction unit 173 , wherein the suction unit driver 171 is connected to the suction unit 173 , and the suction unit 173 is used for suctioning the first substrate placed on the bearing surface 151 of the stage 15 . 121. For example, the adsorption unit driver 171 may be a linear actuator, and is connected to and drives the adsorption unit 173 to move up and down relative to the bearing surface 151 of the carrier 15 .

In an embodiment of the present invention, a plurality of setting grooves 153 can be set on the bearing surface 151 of the carrier 15, and the movable suction module 17 is set in each setting groove 153, for example, the suction unit 173 is located in the setting groove within 153. The adsorption unit driver 171 can drive the adsorption unit 173 to move up and down relative to the bearing surface of the carrier 15 in the setting groove 153 .

As shown in FIG. 4 , the movable suction module 17 may include a frame body 177 , and the suction unit driver 171 is connected to the frame body 177 and drives the frame body 177 and/or the suction unit 173 to move up and down relative to the bearing surface 151 of the carrier 15 . .

In an embodiment of the present invention, as shown in FIGS. 5 and 6 , the frame body 177 includes an accommodating space 172 for accommodating the adsorption units 173 , and some of the adsorption units 173 can protrude from the frame body 177 . The suction unit driver 171 is connected to the frame body 177 , and is connected through the frame body 177 to drive the suction unit 173 to move up and down relative to the bearing surface 151 of the carrier 15 .

The frame body 177 can be provided with at least one through hole 1771 , and a fastener 175 can pass through the through hole 1771 of the frame body 177 and be connected to the fixing hole 1732 at the bottom of the adsorption unit 173 . For example, the fastener 175 can be a screw, and the fixing hole 1732 can be a screw hole.

In an embodiment of the present invention, the accommodating space 172 may include at least one connecting bottom 1725 , and a through hole 1771 is provided on the connecting bottom 1725 . The connection bottom 1725 can be used to carry the adsorption unit 173 , and the fastener 175 is connected to the adsorption unit 173 through the through hole 1771 of the connection bottom 1725 .

Specifically, the lateral cross-sectional area of the adsorption unit 173 may be smaller than the lateral cross-sectional area of the accommodating space 172 . When the adsorption unit 173 is disposed in the accommodating space 172 of the frame body 177 , the adsorption unit 173 will not completely fill the accommodating space 172 . And there is a space 174 between the adsorption unit 173 and the frame body 177 , so that the adsorption unit 173 can be displaced relative to the frame body 177 and/or the bearing surface 151 of the carrier 15 in the accommodating space 172 , for example, parallel to the carrier The direction of the bearing surface 151 of 15 is displaced.

The fasteners 175 do not completely fix the adsorption unit 173 and the frame body 177 , so that the adsorption unit 173 can be displaced relative to the frame body 177 . Specifically, the fastener 175 may include a head portion 1751 and a rod portion 1753. The cross-sectional area of the head portion 1751 is larger than that of the rod portion 1753. For example, the rod portion 1753 is a screw. The rod portion 1753 of the fastener 175 is used to connect to the fixing hole 1732 of the adsorption unit 173 , and there is a slight gap between the head 1751 of the fastener 175 and the frame body 177 . In addition, the cross-sectional area of the stem portion 1753 of the fastener 175 may be smaller than the cross-sectional area of the through hole 1771 of the frame body 177 , so that the stem portion 1753 of the fastener 175 may be relative to the frame body 177 within the through hole 1771 .

In an embodiment of the present invention, a plurality of elastic units 1733 , such as springs, may be disposed between the adsorption unit 173 and the frame body 177 , wherein the elastic units 1733 are located in the interval space 174 .

As shown in FIG. 3 , a plurality of alignment units 14 can be disposed on the bearing surface 151 of the carrier 15 . The alignment units 14 are placed around the first substrate 121 and/or the second substrate 123 of the carrier 15 and can be close to Or away from the center of the first substrate 121 , the second substrate 123 and/or the carrier surface 151 to align the first substrate 121 and the second substrate 123 . For example, the alignment unit 14 can be rod-shaped and can be extended and retracted relative to the bearing surface 151 of the carrier 15 . After the alignment unit 14 protrudes from the bearing surface 151 , it can be displaced toward the first substrate 121 along the radial direction of the bearing surface 151 . , the alignment unit 14 will contact and align the first substrate 121 during the displacement process, so as to position the first substrate 121 on the fixed position of the bearing surface 151 .

During the process of aligning the substrates, the alignment unit 14 may push the first substrate 121 to displace relative to the bearing surface 151 of the stage 15 , and then drives the adsorption unit 173 to the accommodating space 172 of the frame body 177 via the first substrate 121 . The elastic unit 1733 located between the adsorption unit 173 and the frame body 177 is displaced relative to the bearing surface 151 of the stage 15 to compress and/or elongate. Specifically, the first substrate 121 and the adsorption unit 173 are displaced along a direction parallel to the bearing surface 151 .

When the adsorption unit 173 does not adsorb the first substrate 121 , for example, the first substrate 121 and the second substrate 123 have been bonded, the elastic unit 1733 will return to the original length, so that the adsorption unit 173 will return to the accommodating space 172 . Fixed position.

As shown in FIG. 4 , FIG. 5 and FIG. 6 , the adsorption unit 173 includes at least one adsorption port 1731 and a suction line 1735 , and the suction line 1735 is fluidly connected to the adsorption port 1731 . Specifically, at least one fluid channel may be provided in the adsorption unit 173, and the suction line 1735 is connected to the adsorption port 1731 through the fluid channel.

The suction line 1735 is used to connect a suction device, such as a motor. When the suction device is activated, a negative pressure will be formed on the suction port 1731 of the adsorption unit 173 through the suction line 1735, and the first suction placed on the bearing surface 151 will be adsorbed. A substrate 121 .

In an embodiment of the present invention, the accommodating space 172 of the frame body 177 has a first opening 1721 and a second opening 1723 . The first opening 1721 is located at the top of the frame body 177 . When the frame body 177 is disposed in the setting groove 153 of the carrier 15 , the first opening 1721 will be located on the bearing surface 151 of the carrier 15 . The air extraction line 1735 can be connected to the air extraction device through the second opening 1723 , for example, the second opening 1723 is located at the bottom of the frame body 177 .

The air extraction line 1735 can be a flexible air extraction line. When the adsorption unit 173 is displaced relative to the frame body 177 , the adsorption unit 173 may bend the air extraction line 1735 .

In an embodiment of the present invention, as shown in FIG. 3 , a plurality of distance measuring units 18 may be disposed on the pressing unit 13 , for example, the distance measuring units 18 may be laser rangefinders. The distance measuring unit 18 is used for projecting the generated measuring beam on the first substrate 121 to measure the distance between each distance measuring unit 18 and the first substrate 121 .

The distances measured by each distance measuring unit 18 can determine the warpage degree or height of the first substrate 121 . Then, according to the measurement result, the suction unit driver 171 can be controlled to adjust the rising height of the suction unit 173 and/or the frame body 177 , so that the suction unit 173 contacts and suctions the first substrate 121 .

The distance measuring unit 18 can be arranged above the pressing unit 13 , and a plurality of through holes are arranged on the pressing unit 13 . The measuring beam generated by the distance measuring unit 18 can be projected onto the first substrate 121 through the through hole on the pressing unit 13 . In an embodiment of the present invention, the position of each distance measuring unit 18 may correspond to each movable adsorption module 17 , for example, toward the adsorption unit 173 of each movable adsorption module 17 .

In an embodiment of the present invention, as shown in FIG. 7 , the adsorption unit driver 171 can drive the adsorption unit 173 to rise, so that the adsorption unit 173 protrudes from the bearing surface 151 of the stage 15 and adsorbs the upwardly warped first substrate 121. As shown in FIG. 8 , the adsorption unit driver 171 drives the adsorption unit 173 to descend. For example, the height of the adsorption unit 173 is similar to the bearing surface 151 . When the adsorption unit 173 descends, it will pull the adsorbed first substrate 121 and flatten the upwardly warped first substrate 121 .

The bearing surface 151 of the carrier 15 can be provided with a plurality of air suction ports 155 , wherein the air suction ports 155 are fluidly connected to an air suction device. The first substrate 121 on the bearing surface 151 . Specifically, the suction port 155 disposed on the bearing surface 151 may be located inside the movable suction module 17 and used to suction the inside of the first substrate 121 , and the movable suction module 17 is used to suction the first substrate 121 to improve the flatness of the first substrate 121 . In addition, when the first substrate 121 is aligned through the alignment unit 14 , the suction port 155 on the carrier surface 151 will stop generating negative pressure, so that the alignment unit 14 can push the first substrate 121 and the adsorption unit 173 relative to the carrier 15 . The bearing surface 151 is displaced.

In the drawings of the present invention, the movable suction module 17 is disposed on the outer side of the first substrate 121 and/or the carrying surface 151 . In practical applications, the movable suction module 17 can also be disposed on the first substrate 121 and/or the carrying surface 151 . The inner side of the surface 151 , for example, some or all of the suction ports 155 in FIGS. 3 , 7 and 8 may be the movable adsorption module 17 .

Specifically, in the process of aligning the first substrate 121 by the alignment unit 14 of the present invention, the adsorption unit 173 will continue to adsorb and level the first substrate 121 , which can effectively improve the accuracy of the alignment unit 14 in aligning the first substrate 121 . Spend.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Modifications should be included in the scope of the patent application of the present invention.

10: Bonding equipment with movable adsorption module 111: The first cavity 112: Confined space 113: Second cavity 121: The first substrate 123: Second substrate 13: Press unit 14: Alignment unit 15: Carrier 151: Bearing surface 153: Setting grooves 155: exhaust port 16: Air extraction motor 17: Movable adsorption module 171: Adsorption unit driver 172: accommodating space 1721: The first opening 1723: Second Opening 1725: Connect Bottom 173: Adsorption unit 1731: adsorption port 1732:Fixing hole 1733: Elastic Unit 1735: Exhaust Line 174: Interval space 175: Fasteners 1751: Head 1753: Rod 177: Frame 1771: Piercing 18: Distance measurement unit 191: Cavity driver 193: Press unit driver

[FIG. 1] is a three-dimensional schematic diagram of an embodiment of a new type of bonding equipment with a movable adsorption module.

FIG. 2 is a schematic cross-sectional view of an embodiment of a new type of bonding equipment with a movable adsorption module.

3 is a perspective view of an embodiment of a pressing unit and a carrier of a new type of bonding equipment with a movable adsorption module.

4 is a schematic three-dimensional cross-sectional view of an embodiment of the novel movable adsorption module.

5 is a schematic exploded perspective view of an embodiment of an adsorption unit and a frame of a new type of bonding equipment with a movable adsorption module.

FIG. 6 is a perspective view of an embodiment of an adsorption unit and a frame of a new type of bonding equipment with a movable adsorption module.

FIG. 7 is a schematic cross-sectional view of an embodiment of a new type of bonding equipment with a movable adsorption module that lifts and adsorbs a substrate.

FIG. 8 is a schematic cross-sectional view of an embodiment of a new type of bonding equipment with a movable adsorption module to adsorb and level a substrate.

10: Bonding equipment with movable adsorption module

111: The first cavity

112: Confined space

113: Second cavity

121: The first substrate

123: Second substrate

13: Press unit

15: Carrier

151: Bearing surface

16: Air extraction motor

17: Movable adsorption module

18: Distance measurement unit

Claims (10)

A bonding device with a movable adsorption module, comprising: a first cavity; a second cavity facing the first cavity, wherein the first cavity is used to connect the second cavity and form a closed space between the first cavity and the second cavity; an air extraction motor, connected to the enclosed space, and used to extract the gas in the enclosed space; a pressing unit connected to the first cavity and located in the closed space; a carrier, connected to the second cavity, and located in the closed space, the carrier includes a bearing surface facing the pressing unit, the bearing surface is used for carrying a first substrate, and a first substrate is placed on the first substrate a second substrate, wherein a plurality of grooves are arranged on the bearing surface of the carrier; and Multiple movable adsorption modules, including: A plurality of suction units are arranged in the plurality of setting grooves of the bearing surface, and can be displaced relative to the bearing surface of the bearing platform, wherein the suction units are used for sucking the particles placed on the bearing surface of the bearing platform the first substrate; A plurality of suction unit drivers are connected to the plurality of suction units, and are used to drive the suction units to move up and down relative to the carrying surface of the stage, so that the suction units level the suctioned first substrate. The bonding equipment with a movable adsorption module as claimed in claim 1, comprising a plurality of distance measuring units disposed on the pressing unit for measuring the plurality of distance measuring units and placing them on the carrier the distance between the first substrates on the bearing surface. The bonding device with a movable adsorption module as claimed in claim 2, wherein the adsorption unit driver adjusts the rising height of the adsorption unit according to the measurement result of the distance measurement unit, so that the adsorption unit adsorbs the first adsorption unit. substrate. The bonding device with a movable adsorption module as claimed in claim 1, wherein the movable adsorption module includes a frame body, and the frame body includes an accommodating space for accommodating the adsorption unit, the adsorption unit driver The frame body is connected, and the suction unit is driven up and down relative to the bearing surface of the carrier through the frame body. The bonding device with a movable adsorption module as claimed in claim 4, wherein the adsorption unit comprises an adsorption port and a suction line, the suction line is fluidly connected to the adsorption port and used to form a negative electrode on the adsorption port pressing, so that the suction port suctions the first substrate placed on the bearing surface. The bonding device with a movable adsorption module as claimed in claim 4, wherein the cross-sectional area of the accommodating space of the frame body is larger than the cross-sectional area of the adsorption unit, so that the adsorption unit can face each other in the accommodating space Displacement on the bearing surface of the carrier. The bonding device with a movable adsorption module as claimed in claim 6, wherein the frame body comprises at least one through hole, and a fastener passes through the through hole of the frame body to connect the adsorption unit, wherein the cross-sectional area of the through hole is greater than The cross-sectional area of a shank of the fastener. The bonding device with a movable adsorption module as claimed in claim 4 includes a plurality of elastic units located between the frame body and the adsorption unit. The bonding equipment with a movable adsorption module as claimed in claim 4, comprising a plurality of alignment units located on the bearing surface of the carrier, and used for aligning the first substrate and the second substrate, the pair of alignment units During the process of positioning the first substrate by the positioning unit, the adsorption unit will be driven by the first substrate to displace relative to the bearing surface of the stage in the accommodating space of the frame body. The bonding device with movable adsorption modules as claimed in claim 1, comprising a plurality of air suction ports disposed on the carrying surface of the carrying plate and inside the plurality of movable adsorption modules, wherein the movable adsorption modules The adsorption module is used for adsorbing the outer side of the first substrate, and the plurality of air suction ports are used for adsorbing the inner side of the first substrate.

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