CN215644434U - Alignment mechanism of bonder - Google Patents
Alignment mechanism of bonder Download PDFInfo
- Publication number
- CN215644434U CN215644434U CN202121703715.5U CN202121703715U CN215644434U CN 215644434 U CN215644434 U CN 215644434U CN 202121703715 U CN202121703715 U CN 202121703715U CN 215644434 U CN215644434 U CN 215644434U
- Authority
- CN
- China
- Prior art keywords
- substrate
- alignment
- placing area
- unit
- carrying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides an alignment mechanism of a bonder, in particular to an alignment mechanism of a wafer bonder. The bearing surface of the bearing platform is provided with a placing area for placing a first substrate, wherein the first alignment unit and the second alignment unit are arranged around the placing area of the bearing surface in a surrounding mode. The first alignment unit comprises a bottom and a protrusion, wherein the protrusion protrudes out of the bottom towards the placing area. The bottom of the first aligning unit is used for positioning the first substrate, the bulge part of the first aligning unit is used for bearing a second substrate, and the second aligning unit is used for positioning the second substrate placed on the bulge part of the first aligning unit, so that the second substrate is aligned with the first substrate, and the bonding and overlapping of the first substrate and the second substrate are facilitated.
Description
Technical Field
The utility model relates to an alignment mechanism of a bonding machine, which can quickly and accurately align a wafer and a substrate so as to be beneficial to the subsequent bonding of the wafer and the substrate.
Background
With the progress of semiconductor technology, the thickness of the wafer is also continuously reduced, which is beneficial to the subsequent wafer cutting and packaging process. In addition, the thinning of the wafer is also beneficial to reducing the volume of the chip, reducing the resistance, accelerating the operation speed and prolonging the service life. However, the thinned wafer has a very fragile structure, and is prone to warping or breaking in subsequent processes, thereby reducing the yield of the product.
In order to avoid the above problems, it is generally selected to temporarily bond the wafer on the carrier substrate and support the thinned wafer through the carrier substrate, so as to avoid the situation that the thinned wafer is warped or broken during the manufacturing process.
Specifically, the adhesive can be coated on the surfaces of the carrier substrate and the wafer, and then the carrier substrate and the wafer are moved to a bonding machine for alignment and bonding is performed by increasing the temperature of the carrier substrate and the wafer. After bonding, the wafer can be thinned, etched, metalized and the like, and finally the wafer and the bearing substrate are stripped.
Although the bonding between the wafer and the carrier substrate can be completed through the above steps, the alignment mechanism of a general bonding machine still has the problems of poor accuracy and low alignment efficiency, which has a certain effect on the efficiency and yield of the process.
SUMMERY OF THE UTILITY MODEL
In order to solve the above problems, the present invention provides an alignment mechanism of a bonding machine, which can effectively improve the accuracy and efficiency of alignment between a wafer and a carrier substrate, and is beneficial to improving the efficiency and yield of the manufacturing process. In addition, the alignment mechanism of the present invention can save the cost for arranging a plurality of detectors on the machine.
An object of the present invention is to provide an alignment mechanism of a bonding machine, wherein three first alignment units and three second alignment units are disposed on a carrier, wherein the first alignment units and the second alignment units can move along a direction parallel to a carrying surface of the carrier and move closer to or away from a substrate on the carrier to align the substrate.
In the process of aligning the substrate, the first alignment unit and the second alignment unit only need to displace along the direction parallel to the bearing surface of the bearing platform, and do not need to lift relative to the bearing surface of the bearing platform, which is beneficial to simplifying the step of aligning the substrate and the mechanism of the machine platform.
An objective of the present invention is to provide an alignment mechanism of a bonding machine, in which three alignment units and three carrying units are disposed on a carrier, wherein the alignment units and the carrying units can move along a direction parallel to a carrying surface of the carrier.
When the aligning unit approaches towards the substrate, the substrate is contacted and pushed to complete the alignment of the substrate. The bearing unit is used for bearing the substrate when approaching the substrate, and the alignment unit can align the substrate borne by the bearing unit.
In order to achieve the above object, the present invention provides an alignment mechanism of a bonding machine, including: the carrying platform comprises a carrying surface and a first substrate, wherein the carrying surface is provided with a placing area; the three first alignment units are arranged around the placing area of the bearing surface in a surrounding manner and used for being close to or far away from the placing area so as to position a first substrate and bear a second substrate, wherein each first alignment unit comprises a protruding part and a bottom part, the protruding part protrudes the bottom part towards the placing area, the bottom part is close to the bearing surface of the bearing platform than the protruding part, and the first substrate is positioned by the bottom part of the first alignment unit; and three second alignment units surrounding the placing area of the carrying surface and used for being close to or far away from the placing area so as to position the second substrate carried by the first alignment unit, wherein the first alignment unit is displaced towards the direction far away from the placing area, and the carried second substrate is placed on the first substrate.
The utility model provides an alignment mechanism of another bonding machine, which comprises: the carrying platform comprises a carrying surface and a first substrate, wherein the carrying surface is provided with a placing area; the three alignment units are arranged around the placing area of the bearing surface in a surrounding manner and are used for being close to or far away from the placing area so as to position the first substrate and the second substrate; and the three bearing units are arranged around the placing area of the bearing surface in a surrounding manner and are used for being close to or far away from the placing area so as to bear the second substrate, wherein the aligning unit moves towards the direction of the placing area so as to position the second substrate borne by the bearing units, then the bearing units move towards the direction far away from the placing area so as to place the borne second substrate on the first substrate, the bearing units comprise a protruding part and a bottom part, the protruding part protrudes towards the direction of the placing area, and the bottom part is closer to the bearing surface of the bearing platform than the protruding part.
In the alignment mechanism of the bonding machine, the protruding portions of the first alignment unit and the carrying unit protrude along a radial direction of the carrying surface of the carrier and are used for carrying the second substrate, and the first alignment unit, the second alignment unit, the alignment unit and the carrying unit displace along the radial direction of the carrying surface and are close to or far away from the placing area.
In the alignment mechanism of the bonding machine, the first alignment unit and the protrusion of the bearing unit comprise an inclined surface inclined towards the bearing surface or the placing area of the carrier.
The alignment mechanism of the bonding machine comprises at least six connecting rods which are positioned on the bearing surface of the bearing platform and are arranged around the placing area of the bearing surface in a surrounding mode, and the first alignment unit, the second alignment unit, the alignment unit and the bearing unit comprise fixing holes which are used for being sleeved on the connecting rods.
The utility model has the beneficial effects that: the alignment accuracy and efficiency between the wafer and the carrier substrate can be improved, and the cost of installing multiple detectors on the machine can be saved.
Drawings
Fig. 1 is a perspective view of an alignment mechanism of a bonding machine according to an embodiment of the present invention.
Fig. 2 is a top view of an embodiment of an alignment mechanism of the bonder positioning the first substrate.
Fig. 3 is a top view of an embodiment of the alignment mechanism of the bonder carrying a second substrate according to the utility model.
Fig. 4 is a top view of an embodiment of an alignment mechanism of the bonder positioning the second substrate of the present invention.
Fig. 5 is a side view of an embodiment of the first alignment unit of the alignment mechanism of the bonding machine aligning the first substrate according to the present invention.
Fig. 6 is a side view of an embodiment of the first alignment unit of the alignment mechanism of the bonder carrying the second substrate.
Fig. 7 is a side view of an embodiment of the first alignment unit of the alignment mechanism of the bonder of the present invention placing the second substrate.
Fig. 8 is a side view of a first alignment unit of the alignment mechanism of the bonder of the present invention carrying a second substrate according to yet another embodiment.
Fig. 9 is a side view of another embodiment of the first alignment unit of the alignment mechanism of the bonder of the present invention placing the second substrate.
Description of reference numerals: 10-an alignment mechanism of a bonder; 11-a stage; 111-a carrying surface; 113-a placement area; 121-a first substrate; 123-a second substrate; 131-a first alignment unit; 1311-bottom; 1313-a projection; 1315-inclined plane; 133-a second alignment unit; 135-lift pins; 151-connecting rod; 153-fixation holes; 231-a carrying unit; 2311-bottom; 2313-a projection; 233-alignment unit.
Detailed Description
Fig. 1 is a schematic perspective view of an alignment mechanism of a bonding machine according to an embodiment of the present invention. As shown in the figure, the alignment mechanism 10 of the bonding machine mainly includes a carrier 11, at least three first alignment units 131 and at least three second alignment units 133, wherein the first alignment units 131 and the second alignment units 133 are disposed near the edge or the periphery of the carrier 11, for example, a placing area 113 may be defined on a carrying surface 111 of the carrier 11, and the carrying surface 111 and the placing area 113 are used for placing the substrate. The first alignment unit 131 and the second alignment unit 133 are disposed in a spaced manner, and the cross-hatched member is the first alignment unit 131 shown in fig. 1 and is disposed around the placing region 113, wherein the first and second alignment units 131/133 can be close to or far from the placing region 113.
The alignment mechanism 10 of the bonding machine positions the first substrate 121 and the second substrate 123 above the stage 11 through the first alignment unit 131 and the second alignment unit 133, respectively, so that the first substrate 121 overlaps the second substrate 123, wherein the second substrate 123 is aligned with the first substrate 121.
The minimum distance between the first alignment units 131 and the minimum distance between the second alignment units 133 may be adjusted according to the sizes of the first substrate 121 and the second substrate 123, respectively. Specifically, the first substrate 121 and the second substrate 123 have a disk shape, in which a circle formed by the first alignment unit 131 in an aligned state is similar to the size of the first substrate 121, and a circle formed by the second alignment unit 133 in an aligned state is similar to the size of the second substrate 123.
The carrying surface 111 of the carrier 11 can be used for carrying the first substrate 121, wherein the first substrate 121 can be placed in the placing region 113 of the carrying surface 111 or adjacent to the placing region 113, as shown in fig. 2. The first alignment unit 131 is disposed on the carrying surface 111 of the stage 11 and can be close to or far from the placing region 113 along a direction parallel to the carrying surface 111 to position the first substrate 121 on the carrying surface 111 or the placing region 113 of the stage 11. For example, the carrying surface 111 and/or the placing region 113 of the carrier 11 may be circular, and the first alignment unit 131 may be displaced along a radial direction of the carrying surface 111 and close to or far from the placing region 113 to position the first substrate 121.
Specifically, after the first substrate 121 is placed in the placement area 113 of the stage 11, the first substrate 121 is not normally accurately positioned in the placement area 113. The three first alignment units 131 may be synchronously or asynchronously displaced toward the placing region 113 and contact the first substrate 121 in the placing region 113 to position the first substrate 121 so that the first substrate 121 is accurately placed in the placing region 113.
In an embodiment of the utility model, as shown in fig. 5 to 7, the first alignment unit 131 includes a bottom portion 1311 and a protrusion 1313, wherein the bottom portion 1311 is closer to the carrying surface 111 of the stage 11 than the protrusion 1313, and the protrusion 1313 protrudes the bottom portion 1311 toward the placing region 113 of the stage 11, for example, the protrusion 1313 may protrude along the carrying surface 111 of the stage 11 and/or the radial direction of the placing region 113. When the first alignment unit 131 approaches in the direction of the placing region 113 and the first substrate 121, the bottom 1311 of the first alignment unit 131 pushes against and positions the first substrate 121.
After the positioning of the first substrate 121 is completed, the second substrate 123 may be placed over the placement region 113. At this time, the first alignment unit 131 is kept at the position for positioning the first substrate 121 and is used to carry the second substrate 123, for example, the protrusion 1313 of the first alignment unit 131 is used to carry the second substrate 123, as shown in fig. 3, 5 and 6.
Then, the second alignment unit 133 approaches toward the placing region 113 and the second substrate 123, and the second alignment unit 133 pushes and positions the second substrate 123 carried by the first alignment unit 131, for example, the second alignment unit 133 can be displaced along the radial direction of the carrying surface 111, as shown in fig. 4 and 6. In practical applications, the second alignment unit 133 is not used for carrying the substrate, so the second alignment unit 133 can be a column with any geometric shape, wherein the second alignment unit 133 does not need to be disposed to the protrusion 1313 of the first alignment unit 131.
After the above-mentioned alignment steps, the second substrate 123 is aligned with the first substrate 121, wherein the second substrate 123 is still disposed on the first alignment unit 131. Then, the first alignment unit 131 is separated from the first substrate 121, the second substrate 123 and/or the placing region 113, for example, along the radial direction of the stage 11, wherein the second substrate 123 falls off the first alignment unit 131 and is placed on the first substrate 121, as shown in fig. 7.
In practical applications, the three first alignment units 131 may be separated from the second substrate 123 in an asynchronous manner, for example, one of the first alignment units 131 may be separated from the second substrate 123 first, while the other two first alignment units 131 remain stationary, so that the second substrate 123 is placed on the first substrate 121 in an inclined manner, and then the other two first alignment units 131 are separated from the second substrate 123, so as to place the second substrate 123 on the first substrate 121.
In an embodiment of the utility model, when the first alignment unit 131 is far away from the second substrate 123, the second alignment unit 133 can be kept still, so as to prevent the second substrate 123 from being displaced relative to the first substrate 121 when the first alignment unit 131 is displaced relative to the second substrate 123.
As shown in fig. 8 and 9, the protrusion 1313 of the first alignment unit 131 may include an inclined surface 1315, wherein the inclined surface 1315 is inclined toward the carrying surface 111 and/or the placing region 113 of the stage 11, and the second substrate 123 is placed on the inclined surfaces 1315 of the protrusions 1313 of the three first alignment units 131. By providing the inclined surfaces 1315 on the protrusions 1313, the second substrate 123 carried by the protrusions 1313 can be guided to slide down the inclined surfaces 1315 onto the first substrate 121, and the second substrate 123 can be prevented from being displaced relative to the first substrate 121 when the first alignment unit 131 is displaced relative to the carried second substrate 123.
In an embodiment of the utility model, the alignment mechanism 10 of the bonding machine may include at least three lift pins 135 disposed on the carrying surface 111 of the stage 11, wherein the first alignment unit 131 and the second alignment unit 133 are disposed around the lift pins 135, for example, the lift pins 135 may be disposed in the placing area 113 of the stage 11. The lift pins 135 can be raised and lowered relative to the carrying surface 111 of the stage 11, the lift pins 135 can be used to receive and carry the first substrate 121 when raised, and the lift pins 135 can be used to place the carried first substrate 121 on the carrying surface 111 of the stage 11 when lowered. In addition, the lift pins 135 may be lowered synchronously or asynchronously, and place the first substrate 121 on the carrying surface 111 of the stage 11 in a flat or inclined manner. The lift pins 135 are not essential to the present invention, and in various embodiments, the first substrate 121 can be directly placed in the placing area 113 of the carrier 11.
In another embodiment of the present invention, the first alignment unit 131 of fig. 1 to 9 may be a carrying unit 231, and the second alignment unit 133 may be an alignment unit 233, wherein the number, arrangement position and configuration of the carrying unit 231 and the alignment unit 233 may be the same as those of the first and second alignment units 131/133.
The three supporting units 231 and the three aligning units 233 are disposed around the placing region 113 of the supporting surface 111 and are configured to be close to or far from the placing region 113. In the embodiment of the utility model, the first substrate 121 and the second substrate 123 are aligned by the alignment unit 233, and the second substrate 123 is carried by the carrying unit 231.
In practical applications, the first substrate 121 may be placed on the placing region 113 of the carrying surface 111 of the carrier 11, and then the three alignment units 233 are close to the first substrate 121 and the placing region 113, for example, the alignment units 233 may be displaced along the radial direction of the carrier 11. The three alignment units 233 contact and position the first substrate 121 such that the first substrate 121 is aligned with the placement area 113 of the stage 11.
After the positioning of the first substrate 121 is completed, the three carrying units 231 are close to the first substrate 121 and the placing region 113, and the three aligning units 233 are far from the first substrate 121. The alignment unit 233 may be separated from the first substrate 121 after the loading unit 231 reaches the positioning position, or the alignment unit 233 may be driven to separate from the first substrate 121 before the alignment unit 233 reaches the positioning position. Theoretically, the alignment unit 233 is not separated from the first substrate 121 until the carrying unit 231 is positioned, which can avoid the displacement of the first substrate 121 caused by the displacement of the alignment unit 233 relative to the first substrate 121.
After the alignment unit 233 leaves the first substrate 121, the second substrate 123 may be placed on the carrying unit 231, wherein the second substrate 123 is supported by the carrying unit 231 without contacting the first substrate 121. Specifically, the carrying unit 231 is similar to the first alignment unit 131, and includes a bottom 2311 and a protrusion 2313, wherein the protrusion 2313 is used for carrying the second substrate 123.
Then, the alignment unit 233 approaches the second substrate 123, for example, the alignment unit 233 can be displaced along the radial direction of the carrying surface 111 of the carrier 11. The three alignment units 233 contact and position the second substrate 123 carried by the carrying unit 231, so that the second substrate 123 is aligned with the first substrate 121 and/or the placing area 113 of the carrier 11.
After the alignment of the first substrate 121 and the second substrate 123 is completed, the supporting unit 231 is separated from the placing region 113, the first substrate 121 and/or the second substrate 123, wherein the second substrate 123 falls from the protrusion 2313 of the supporting unit 231 and is placed on the first substrate 121. When the carrying unit 231 leaves the second substrate 123, the alignment unit 233 can remain stationary and continuously contact the second substrate 123, so as to prevent the second substrate 123 from being displaced during the displacement of the carrying unit 231 relative to the second substrate 123.
In addition, the three carrying units 231 may leave the second substrate 123 in an asynchronous manner, for example, one of the carrying units 231 leaves the second substrate 123 first, and the other two carrying units 231 remain stationary, so that the second substrate 123 is placed on the first substrate 121 in an inclined manner. Then, the other two carrying units 231 leave the second substrate 123, and the second substrate 123 is flatly placed on the first substrate 121, so that the second substrate 123 is overlapped and aligned with the first substrate 121.
In the process of aligning or positioning the first substrate 121 and the second substrate 123 by the alignment mechanism 10 of the bonding machine of the present invention, the first alignment unit 131, the second alignment unit 133, the carrying unit 231, and/or the alignment unit 233 only need to be displaced along a direction parallel to the carrying surface 111 of the stage 11, and do not need to be lifted or lowered relative to the carrying surface 111 of the stage 11, which is beneficial to simplifying the steps and structures for aligning the first substrate 121 and the second substrate 123. In an embodiment of the utility model, the first alignment unit 131, the second alignment unit 133, the carrying unit 231 and/or the alignment unit 233 can move along a direction parallel to the carrying surface 111 of the stage 11, and can also move up and down along a direction perpendicular to the carrying surface 111.
In an embodiment of the utility model, as shown in fig. 1, six or more than six connecting rods 151 may be disposed on the carrying surface 111 of the carrier 11, and are disposed around the placing area 113 of the carrying surface 111. The first and second alignment units 131/133, the bearing unit 231 and the alignment unit 233 include a fixing hole 153, and are disposed on the connecting rod 151 through the fixing hole 153. In practical applications, the first and second alignment units 131/133, the carrying unit 231, and the alignment unit 233 with different types or sizes can be selectively fixed on the connecting rods 151 according to the sizes of the first substrate 121 and the second substrate 123, so that the alignment mechanism 10 of the bonding machine of the present invention can be used to align two or more substrates.
In one embodiment of the present invention, the first substrate 121 includes but is not limited to a wafer or a chip, and the second substrate 123 includes but is not limited to a sapphire carrier substrate.
The utility model has the advantages that:
the alignment accuracy and efficiency between the wafer and the bearing substrate can be effectively improved, and the efficiency and yield of the manufacturing process can be improved.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, i.e., all equivalent variations and modifications in the shape, structure, characteristics and spirit of the present invention described in the claims should be included in the scope of the present invention.
Claims (8)
1. An alignment mechanism for a bonder, comprising:
the carrying platform comprises a carrying surface and a first substrate, wherein the carrying surface is provided with a placing area;
three first alignment units, which are arranged around the placing area of the bearing surface in a surrounding manner and are used for being close to or far away from the placing area so as to position the first substrate and bear a second substrate, wherein each first alignment unit comprises a protruding part and a bottom part, the protruding part protrudes out of the bottom part towards the placing area, the bottom part is closer to the bearing surface of the bearing platform than the protruding part, and the first substrate is positioned by the bottom part of the first alignment unit; and
three second aligning units surrounding the placing area of the carrying surface and arranged in a staggered way with the first aligning units, wherein the second aligning units are used for approaching or departing from the placing area so as to position the second substrate carried by the first aligning units, and the first aligning units displace towards the direction departing from the placing area and place the carried second substrate on the first substrate.
2. The alignment mechanism of the bonding machine as claimed in claim 1, wherein the protrusion of the first alignment unit protrudes along a radial direction of the carrying surface of the stage for carrying the second substrate, and the first alignment unit and the second alignment unit are displaced along the radial direction of the carrying surface and close to or far from the placing area.
3. The alignment mechanism of the bonding machine as claimed in claim 2, wherein the protrusion of the first alignment unit includes an inclined surface inclined toward the carrying surface or the placing area of the carrier.
4. The alignment mechanism of the bonding machine as claimed in claim 1, wherein at least six connecting rods are disposed on the carrying surface of the carrier and around the placing area of the carrying surface, and the first alignment unit and the second alignment unit include a fixing hole for fitting over the connecting rods.
5. An alignment mechanism for a bonder, comprising:
the carrying platform comprises a carrying surface and a first substrate, wherein the carrying surface is provided with a placing area;
three aligning units surrounding the placing area of the bearing surface for being close to or far away from the placing area to position the first substrate and a second substrate; and
three bearing units, surround and set up around the placing area of the bearing surface, and stagger with the aligning unit, the bearing unit is used for being close to or far away from the placing area, and is used for bearing the second base plate, wherein the aligning unit moves towards the direction of the placing area, in order to position the second base plate borne by the bearing unit, then the bearing unit moves towards the direction far away from the placing area, in order to place the borne second base plate on the first base plate, wherein the bearing unit includes a bulge and a bottom, the bulge protrudes the bottom towards the direction of the placing area, the bottom is closer to the bearing surface of the carrying platform than the bulge.
6. The alignment mechanism of the bonding machine as claimed in claim 5, wherein the protrusion of the supporting unit protrudes along a radial direction of the supporting surface of the stage for supporting the second substrate, and the alignment unit and the supporting unit are displaced along the radial direction of the supporting surface and close to or far from the placing area.
7. The alignment mechanism of the bonding machine as claimed in claim 6, wherein the protrusion of the supporting unit includes an inclined surface inclined toward the supporting surface or the placing area of the carrier.
8. The alignment mechanism of the bonding machine as claimed in claim 5, wherein at least six connecting rods are disposed on the carrying surface of the carrier and around the placing area of the carrying surface, and the alignment unit and the carrying unit include a fixing hole for fitting over the connecting rods.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121703715.5U CN215644434U (en) | 2021-07-26 | 2021-07-26 | Alignment mechanism of bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121703715.5U CN215644434U (en) | 2021-07-26 | 2021-07-26 | Alignment mechanism of bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215644434U true CN215644434U (en) | 2022-01-25 |
Family
ID=79892218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121703715.5U Active CN215644434U (en) | 2021-07-26 | 2021-07-26 | Alignment mechanism of bonder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215644434U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117133708A (en) * | 2023-10-26 | 2023-11-28 | 迈为技术(珠海)有限公司 | Bonding device and semiconductor bonding equipment |
-
2021
- 2021-07-26 CN CN202121703715.5U patent/CN215644434U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117133708A (en) * | 2023-10-26 | 2023-11-28 | 迈为技术(珠海)有限公司 | Bonding device and semiconductor bonding equipment |
| CN117133708B (en) * | 2023-10-26 | 2024-01-30 | 迈为技术(珠海)有限公司 | Bonding device and semiconductor bonding equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1601005A2 (en) | Peeling device for chip detachment | |
| US20100252205A1 (en) | Device for thin die detachment and pick-up | |
| KR100436188B1 (en) | Chip pick up device and method for manufacturing semiconductor devices | |
| CN112309945A (en) | Alignment mechanism and alignment method of bonding machine | |
| US9039867B2 (en) | Method for detaching a semiconductor chip from a foil | |
| US8470130B2 (en) | Universal die detachment apparatus | |
| US20050260829A1 (en) | Manufacturing method of a semiconductor device | |
| US8221583B2 (en) | System for peeling semiconductor chips from tape | |
| KR19990029437A (en) | METHOD AND APPARATUS FOR MOUNTING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE SEPARATING APPARATUS | |
| CN215644434U (en) | Alignment mechanism of bonder | |
| TWM609527U (en) | Alignment mechanism of bonding machine | |
| JP2006191144A (en) | Pickup device and pickup method | |
| US20220122868A1 (en) | Alignment mechanism and alignment method of bonding machine | |
| KR20190032180A (en) | Apparatus for manufacturing semiconductor, method of manufacturing semiconductor device and collet | |
| US11869792B2 (en) | Alignment mechanism and alignment method of bonding machine | |
| CN216528754U (en) | Wafer bonding mechanism | |
| US11961753B2 (en) | Substrate-bonding device | |
| CN115692287A (en) | Alignment mechanism and alignment method of bonder | |
| TWM626383U (en) | Substrate Bonding Mechanism | |
| CN110660723A (en) | Manipulator, bonding cavity, wafer bonding system and bonding method | |
| TWI792447B (en) | Alignment mechanism and alignment method of bonding machine | |
| CN214068706U (en) | Alignment mechanism of bonding machine | |
| TWM620595U (en) | Alignment mechanism of bonding machine | |
| TWI769957B (en) | Substrate bonding mechanism | |
| US7985662B2 (en) | Method for manufacturing dies formed with a dielectric layer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |