TWM620595U - Alignment mechanism of bonding machine - Google Patents

Abstract

The invention provides an alignment mechanism of a bonding machine, in particular an alignment mechanism of a wafer bonding machine, which mainly includes a carrier, three first alignment units and three second alignment units. The carrier surface of the carrier has a placement area for placing a first substrate, wherein the first alignment unit and the second alignment unit are arranged around the placement area of the carrier surface. The first alignment unit includes a bottom and a protruding portion, wherein the protruding portion protrudes from the bottom in the direction of the placement area. The bottom of the first alignment unit is used to position the first substrate, and the protruding part of the first alignment unit is used to carry a second substrate. The second substrate on the exit portion makes the second substrate align with the first substrate to facilitate the bonding and overlap of the first substrate and the second substrate.

Description

Alignment mechanism of bonding machine

The present invention relates to an alignment mechanism of a bonding machine, which can quickly and accurately align wafers and substrates to facilitate subsequent bonding of wafers and substrates.

With the advancement of semiconductor technology, the thickness of wafers has been continuously reduced to facilitate subsequent wafer cutting and packaging processes. In addition, the thinning of the wafer is also conducive to reducing the size of the chip, reducing the resistance, accelerating the calculation speed and prolonging the service life. However, the structure of the thinned wafer is very fragile, and the wafer is prone to warp or break in the subsequent manufacturing process, thereby reducing the yield of the product.

In order to avoid the above-mentioned problems, it is generally selected to temporarily bond the wafer to the carrier substrate, and support the thinned wafer through the carrier substrate to avoid warping or fracture of the thinned wafer during the manufacturing process.

Specifically, an adhesive can be applied to the surface of the carrier substrate and the wafer, and then the carrier substrate and the wafer can be moved to the bonding machine for alignment, and the temperature of the carrier substrate and the wafer can be increased for bonding. After the bonding is completed, the wafer can be thinned, etched, and metalized, and finally the wafer and the carrier substrate can be peeled off.

Although the bonding of the wafer and the carrier substrate can be completed through the above steps, the alignment mechanism of the general bonding machine still has the problems of poor accuracy and low alignment efficiency, which affects the efficiency and yield of the process Certain influence.

In order to solve the above-mentioned problems, the present invention proposes an alignment mechanism of a bonding machine, which can effectively improve the accuracy and efficiency of the alignment between the wafer and the carrier substrate, and is beneficial to improve the efficiency and yield of the manufacturing process. In addition, through the alignment mechanism of the present invention, the cost of installing multiple detectors on the machine can also be saved.

An object of the present invention is to provide an alignment mechanism of a bonding machine, which mainly includes three first alignment units and three second alignment units on a carrier, wherein the first alignment unit and the second alignment unit are The unit can be displaced along the direction parallel to the bearing surface of the stage, and move closer to or away from the substrate on the stage to align the substrate.

In the process of aligning the substrate, the first alignment unit and the second alignment unit only need to be displaced along the direction parallel to the bearing surface of the stage, and do not need to be raised and lowered relative to the bearing surface of the stage, which is beneficial to simplify the alignment The steps of the substrate and the mechanism of the machine.

An object of the present invention is to provide an alignment mechanism of a bonding machine, which mainly includes three alignment units and three bearing units on the carrier, wherein the alignment unit and the bearing unit can be parallel to the bearing surface of the carrier The direction of displacement.

When the alignment unit approaches the substrate, it touches and pushes the substrate to complete the alignment of the substrate. When the carrying unit approaches the substrate, it is used to carry the substrate, and the substrate carried by the carrying unit can be aligned through the alignment unit.

In order to achieve the above-mentioned purpose, the present invention proposes an alignment mechanism for a bonding machine, which includes: a carrier, including a carrier surface, for carrying a first substrate, wherein the carrier mask has a placement area; three first pairs The quasi unit is arranged around the placement area of the carrying surface to be close to or far from the placement area to position a first substrate and support a second substrate, wherein the first aligning unit includes a protrusion and a bottom, The protruding part protrudes from the bottom in the direction of the placement area, and the bottom is closer to the carrying surface of the carrier than the protruding part, and the first substrate is positioned with the bottom of the first alignment unit; and three second alignment units are arranged around The periphery of the placement area of the bearing surface is used to approach or be far away from the placement area to position the second substrate carried by the first alignment unit, wherein the first alignment unit is displaced in a direction away from the placement area and moves the carried second substrate Place on the first substrate.

The present invention proposes another alignment mechanism of a bonding machine, which includes: a carrier, including a carrier surface, for carrying a first substrate, wherein the carrier mask has a placement area; three alignment units are arranged around The periphery of the placement area of the bearing surface is used to be close to or far away from the placement area to position the first substrate and a second substrate; and three bearing units are arranged around the placement area of the bearing surface to be placed near or far away Area to carry the second substrate, wherein the alignment unit is displaced in the direction of the placement area to position the second substrate carried by the carrying unit, and then the carrying unit is displaced in a direction away from the placement area to place the carried second substrate in the first On a substrate, the carrying unit includes a protruding part and a bottom. The protruding part protrudes from the bottom in the direction of the placement area, and the bottom is closer to the carrying surface of the carrier than the protruding part.

In the alignment mechanism of the bonding machine, the protrusions of the first alignment unit and the carrying unit protrude along a radial direction of the carrying surface of the carrier and are used to carry the second substrate, and the first alignment The unit, the second aligning unit, the aligning unit and the bearing unit are displaced along the radial direction of the bearing surface, and are close to or far away from the placement area.

In the alignment mechanism of the bonding machine, the protruding part of the first alignment unit and the carrying unit includes an inclined surface inclined in the direction of the carrying surface or the placement area of the carrier.

The alignment mechanism of the bonding machine includes at least six connecting rods located on the bearing surface of the carrier and arranged around the placement area of the bearing surface, and the first alignment unit, the second alignment unit, and the alignment The unit and the carrying unit include a fixing hole for sleeved on the connecting rod.

Please refer to FIG. 1, which is a perspective view of an embodiment of the alignment mechanism of the new bonding machine. As shown in the figure, the alignment mechanism 10 of the bonding machine mainly includes a carrier 11, at least three first alignment units 131 and at least three second alignment units 133, of which the first alignment unit 131 and the second alignment unit 131 The alignment unit 133 is disposed in an area near the edge or periphery of the carrier 11, for example, a placement area 113 may be defined on a carrier surface 111 of the carrier 11, wherein the carrier surface 111 and the placement area 113 are used to place the substrate. The first alignment unit 131 and the second alignment unit 133 are arranged in a spaced manner. As shown in FIG. And the second alignment unit 131/133 can be close to or far away from the placement area 113.

The alignment mechanism 10 of the bonding machine respectively uses the first alignment unit 131 and the second alignment unit 133 to position the first substrate 121 and the second substrate 123 above the stage 11, so that the first substrate 121 and the second substrate 123 Overlap, where the second substrate 123 will be aligned with the first substrate 121.

The minimum distance between each first alignment unit 131 and the minimum distance between each second alignment unit 133 can be adjusted according to the sizes of the first substrate 121 and the second substrate 123, respectively. Specifically, the first substrate 121 and the second substrate 123 are disk-shaped, and the circle formed by the first alignment unit 131 in the aligned state is similar to the size of the first substrate 121, but in the aligned state The circle formed by the second alignment unit 133 is similar to the size of the second substrate 123.

The carrying surface 111 of the carrier 11 can be used to carry the first substrate 121, wherein the first substrate 121 can be placed in or adjacent to the placing area 113 of the carrying surface 111, as shown in FIG. 2. The first alignment unit 131 is located on the carrying surface 111 of the carrier 11, and can be close to or away from the placing area 113 in a direction parallel to the carrying surface 111 to position the first substrate placed on the carrying surface 111 or the placing area 113 of the carrier 11 121. For example, the bearing surface 111 and/or the placement area 113 of the stage 11 may be circular, and the first alignment unit 131 may be displaced along the radial direction of the bearing surface 111 and move closer to or away from the placement area 113 to position the first substrate 121 .

Specifically, after the first substrate 121 is placed on the placement area 113 of the stage 11, the first substrate 121 is usually not accurately positioned in the placement area 113. The three first alignment units 131 can move synchronously or asynchronously in the direction of the placement area 113, and contact the first substrate 121 in the placement area 113 to locate the position of the first substrate 121, so that the first substrate 121 is accurately placed In the placement area 113.

In an embodiment of the present invention, as shown in FIGS. 5 to 7, the first alignment unit 131 includes a bottom portion 1311 and a protruding portion 1313, wherein the bottom portion 1311 is closer to the bearing surface 111 of the carrier 11 than the protruding portion 1313 is , And the protruding portion 1313 protrudes from the bottom 1311 in the direction of the placement area 113 of the carrier 11, for example, the protruding portion 1313 can protrude along the bearing surface 111 of the carrier 11 and/or the radial direction of the placement area 113. When the first alignment unit 131 approaches the placement area 113 and the first substrate 121, the bottom 1311 of the first alignment unit 131 will push against and position the first substrate 121.

After the positioning of the first substrate 121 is completed, the second substrate 123 can be placed above the placement area 113. At this time, the first alignment unit 131 will remain at the position where the first substrate 121 is positioned, and is used to carry the second substrate 123. For example, the protrusion 1313 of the first alignment unit 131 carries the second substrate 123, as shown in FIG. 3, Shown in Figure 5 and Figure 6.

Then the second alignment unit 133 will approach the placement area 113 and the second substrate 123, and the second alignment unit 133 pushes and positions the second substrate 123 carried by the first alignment unit 131, for example, the second pair The quasi unit 133 can be displaced along the radial direction of the bearing surface 111, as shown in FIGS. 4 and 6. In practical applications, the second alignment unit 133 is not used to carry the substrate, so the second alignment unit 133 can be a columnar body of any geometric shape, and the second alignment unit 133 does not need to be provided to the first alignment unit 131 of the protrusion 1313.

After the above-mentioned alignment steps, the second substrate 123 will be aligned with the first substrate 121, and the second substrate 123 will still be placed on the first alignment unit 131. Then, the first alignment unit 131 will be far away from the first substrate 121, the second substrate 123 and/or the placement area 113, for example along the radial direction of the stage 11, where the second substrate 123 will be placed on the first alignment unit 131 It is dropped and placed on the first substrate 121 as shown in FIG. 7.

In practical applications, the three first alignment units 131 can be away from the second substrate 123 in an asynchronous manner. For example, one of the first alignment units 131 can be away from the second substrate 123 first, and the other two first alignment units 131 is kept still, so that the second substrate 123 is placed on the first substrate 121 obliquely, and then the other two first alignment units 131 are far away from the second substrate 123, so that the second substrate 123 is placed flat on the first substrate 121 superior.

In an embodiment of the present invention, when the first alignment unit 131 is far away from the second substrate 123, the second alignment unit 133 can be kept still, which can prevent the first alignment unit 131 from being displaced relative to the second substrate 123, causing the The second substrate 123 is displaced relative to the first substrate 121.

As shown in FIGS. 8 and 9, the protruding portion 1313 of the first alignment unit 131 may include an inclined surface 1315, wherein the inclined surface 1315 is inclined toward the bearing surface 111 and/or the placement area 113 of the carrier 11, and The second substrate 123 is placed on the inclined surface 1315 of the protrusion 1313 of the three first alignment units 131. By providing the inclined surface 1315 on the protruding portion 1313, the second substrate 123 carried by the protruding portion 1313 can be guided to slide down onto the first substrate 121 along the inclined surface 1315, and the first alignment unit 131 can be prevented from being relative to the carrier. When the second substrate 123 is displaced, the second substrate 123 is displaced relative to the first substrate 121.

In an embodiment of the present invention, the alignment mechanism 10 of the bonding machine may include at least three lifting pins 135 arranged on the bearing surface 111 of the carrier 11, wherein the first alignment unit 131 and the second alignment unit 133 surround It is arranged around the uplifting pin 135, for example, the uplifting pin 135 can be arranged in the placement area 113 of the carrier 11. The lifting pin 135 can be raised and lowered relative to the carrying surface 111 of the stage 11, the lifting pin 135 can be used to receive and carry the first substrate 121 when it is raised, and the lifting pin 135 can be placed on the first substrate 121 when it is lowered The bearing surface 111 of the stage 11. In addition, the lifting pins 135 can be lowered synchronously or asynchronously, and the first substrate 121 is placed on the supporting surface 111 of the carrier 11 in a flat or inclined manner. The lifting pin 135 is not a necessary component of the present invention. In different embodiments, the first substrate 121 can also be directly placed in the placement area 113 of the carrier 11.

In another embodiment of the present invention, the first alignment unit 131 of FIGS. 1 to 9 may be a bearing unit 231, and the second alignment unit 133 may be an alignment unit 233, wherein the bearing unit 231 and the alignment unit 233 The number, location and structure of the units 233 can be the same as those of the first and second alignment units 131/133.

The three supporting units 231 and the three aligning units 233 are arranged around the placement area 113 of the supporting surface 111 and are used to be close to or away from the placement area 113. In the embodiment of the present invention, the first substrate 121 and the second substrate 123 are aligned by the alignment unit 233, and the second substrate 123 is carried by the carrying unit 231.

In practical applications, the first substrate 121 can be placed on the placement area 113 of the carrying surface 111 of the stage 11, and the next three alignment units 233 will approach the first substrate 121 and the placement area 113. For example, the alignment unit 233 can be placed along the The radial displacement of the carrier 11. The three alignment units 233 will contact and position the first substrate 121 so that the first substrate 121 is aligned with the placement area 113 of the stage 11.

After the positioning of the first substrate 121 is completed, the three carrying units 231 will approach the first substrate 121 and the placement area 113, and the three alignment units 233 will be far away from the first substrate 121. The alignment unit 233 may leave the first substrate 121 after the carrier unit 231 reaches the positioning, or it may drive the alignment unit 233 to leave the first substrate 121 before the alignment unit 233 reaches the positioning. Theoretically, the alignment unit 233 does not leave the first substrate 121 after the carrying unit 231 reaches the positioning, which can avoid the displacement of the first substrate 121 during the displacement of the alignment unit 233 relative to the first substrate 121.

After the alignment unit 233 leaves the first substrate 121, the second substrate 123 can be placed on the carrying unit 231, wherein the second substrate 123 is supported by the carrying unit 231 and does not contact the first substrate 121. Specifically, the structure of the carrying unit 231 is similar to that of the first alignment unit 131 and includes a bottom portion 2311 and a protruding portion 2313, wherein the protruding portion 2313 is used for supporting the second substrate 123.

Then the alignment unit 233 will approach the second substrate 123. For example, the alignment unit 233 can be displaced along the radial direction of the bearing surface 111 of the stage 11. The three alignment units 233 will contact and position the second substrate 123 carried by the carrying unit 231 so that the second substrate 123 is aligned with the first substrate 121 and/or the placement area 113 of the stage 11.

After the alignment of the first substrate 121 and the second substrate 123 is completed, the carrying unit 231 will leave the placement area 113, the first substrate 121 and/or the second substrate 123, and the second substrate 123 will be protruded from the carrying unit 231 The portion 2313 is dropped and placed on the first substrate 121. When the carrying unit 231 leaves the second substrate 123, the alignment unit 233 can remain stationary and continue to contact the second substrate 123, so as to avoid displacement of the second substrate 123 during the displacement of the carrying unit 231 relative to the second substrate 123.

In addition, the three carrying units 231 can leave the second substrate 123 in an asynchronous manner. For example, one of the carrying units 231 will leave the second substrate 123 first, and the other two carrying units 231 will remain stationary, so that the second substrate 123 is placed diagonally On the first substrate 121. Then the other two carrying units 231 leave the second substrate 123 and lay the second substrate 123 flat on the first substrate 121 so that the second substrate 123 overlaps and is aligned with the first substrate 121.

In the process of aligning or positioning the first substrate 121 and the second substrate 123 of the alignment mechanism 10 of the new bonding machine, the first alignment unit 131, the second alignment unit 133, the carrying unit 231 and/or the alignment The unit 233 only needs to be displaced along the direction parallel to the bearing surface 111 of the stage 11, and does not need to be raised and lowered relative to the bearing surface 111 of the stage 11, which is beneficial to simplify the steps and structure of aligning the first substrate 121 and the second substrate 123 . In an embodiment of the present invention, the first alignment unit 131, the second alignment unit 133, the bearing unit 231, and/or the alignment unit 233 can be displaced along the direction parallel to the bearing surface 111 of the stage 11, It can also be raised and lowered along the direction perpendicular to the bearing surface 111.

In an embodiment of the present invention, as shown in FIG. 1, six or more connecting rods 151 can be arranged on the carrying surface 111 of the carrying platform 11 to surround the placement area 113 of the carrying surface 111. The first and second alignment units 131/133, the carrying unit 231 and the alignment unit 233 include a fixing hole 153, and are sleeved on the connecting rod 151 through the fixing hole 153. In practical applications, according to the size of the first substrate 121 and the second substrate 123, the first and second alignment units 131/133, the carrying unit 231 and the alignment unit 233 of different forms or sizes can be selected to be fixed on the connecting rod 151 Above, the alignment mechanism 10 of the bonding machine of the present invention can be used to align two or more substrates.

In an embodiment of the present invention, the first substrate 121 includes but is not limited to a wafer or a chip, and the second substrate 123 includes but is not limited to a sapphire carrier substrate.

The foregoing is only one of the preferred embodiments of the present invention, and is not used to limit the scope of implementation of the present invention, that is, all the equivalent changes and changes in the shape, structure, characteristics and spirit described in the scope of the patent application of the present invention Modifications should be included in the scope of the patent application for this new model.

10: Alignment mechanism of bonding machine 11: Stage 111: bearing surface 113: drop zone 121: first substrate 123: second substrate 131: The first alignment unit 1311: bottom 1313: protrusion 1315: Inclined surface 133: The second alignment unit 135: Upsell 151: connecting rod 153: fixed hole 231: Carrying Unit 2311: bottom 2313: protrusion 233: alignment unit

[Figure 1] is a three-dimensional schematic diagram of an embodiment of the alignment mechanism of the new bonding machine.

[Fig. 2] is a top view of an embodiment of positioning the first substrate by the alignment mechanism of the new bonding machine.

[Fig. 3] is a top view of an embodiment of the alignment mechanism of the new bonding machine to carry the second substrate.

[Figure 4] is a top view of an embodiment of positioning the second substrate by the alignment mechanism of the new bonding machine.

[Figure 5] is a side view of an embodiment of the alignment of the first alignment unit of the alignment mechanism of the new bonding machine to the first substrate.

[Figure 6] is a side view of an embodiment of the second substrate carried by the first alignment unit of the alignment mechanism of the new bonding machine.

[Fig. 7] is a side view of an embodiment of the first alignment unit of the alignment mechanism of the new type bonding machine where the second substrate is placed.

[Figure 8] is a side view of another embodiment of the first alignment unit of the alignment mechanism of the new bonding machine that carries the second substrate.

[Figure 9] is a side view of another embodiment of the first alignment unit of the alignment mechanism of the new bonding machine where the second substrate is placed.

10: Alignment mechanism of bonding machine

11: Stage

111: bearing surface

113: drop zone

131: The first alignment unit

133: The second alignment unit

135: Upsell

151: connecting rod

153: fixed hole

231: Carrying Unit

233: alignment unit

Claims (8)

An alignment mechanism of a bonding machine includes: A carrier, including a carrier surface for carrying a first substrate, wherein the carrier surface has a placement area; Three first alignment units are arranged around the placement area on the carrying surface and are used to approach or be far away from the placement area to position the first substrate and carry a second substrate, wherein the first alignment unit It includes a protruding portion and a bottom. The protruding portion protrudes from the bottom in the direction of the placement area. The bottom is closer to the bearing surface of the carrier than the protruding portion. Positioning the first substrate at the bottom; and Three second alignment units are arranged around the placement area of the bearing surface and alternately arranged with the first alignment units. The second alignment units are used to move closer to or away from the placement area to position the placement area. The second substrate carried by the first alignment unit, wherein the first alignment unit is displaced in a direction away from the placement area, and the carried second substrate is placed on the first substrate. The alignment mechanism of the bonding machine according to claim 1, wherein the protruding portion of the first alignment unit protrudes along a radial direction of the carrying surface of the carrier, and is used to carry the second substrate , And the first alignment unit and the second alignment unit are displaced along the radial direction of the bearing surface, and are close to or away from the placement area. The alignment mechanism of the bonding machine according to claim 2, wherein the protruding portion of the first alignment unit includes an inclined surface that is inclined toward the bearing surface of the carrier or the placement area. The alignment mechanism of the bonding machine according to claim 1, including at least six connecting rods located on the bearing surface of the carrier and arranged around the placement area of the bearing surface, and the first alignment unit And the second alignment unit includes a fixing hole for sleeved on the connecting rod. An alignment mechanism of a bonding machine includes: A carrier, including a carrier surface for carrying a first substrate, wherein the carrier surface has a placement area; Three aligning units are arranged around the placement area of the carrying surface, and are used to approach or be far away from the placement area to position the first substrate and a second substrate; and Three load-bearing units are arranged around the placement area of the load-bearing surface and alternately arranged with the alignment unit. The load-bearing unit is used to be close to or far from the placement area and used to support the second substrate. The quasi-unit is displaced in the direction of the placement area to position the second substrate carried by the carrying unit, and then the carrying unit is displaced in a direction away from the placement area to place the carried second substrate on the first substrate , Wherein the carrying unit includes a protruding part and a bottom, the protruding part protrudes from the bottom in the direction of the placement area, and the bottom is closer to the carrying surface of the carrier than the protruding part. The alignment mechanism of the bonding machine according to claim 5, wherein the protruding portion of the carrying unit protrudes along a radial direction of the carrying surface of the carrier and is used to carry the second substrate, and The alignment unit and the bearing unit are displaced along the radial direction of the bearing surface, and are close to or far from the placement area. The alignment mechanism of the bonding machine according to claim 6, wherein the protruding portion of the carrying unit includes an inclined surface that is inclined toward the carrying surface of the carrier or the placement area. The alignment mechanism of the bonding machine according to claim 5, comprising at least six connecting rods located on the bearing surface of the carrier and arranged around the placement area of the bearing surface, and the alignment unit and the The bearing unit includes a fixing hole for sleeved on the connecting rod.

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