CN219716841U - Thimble device - Google Patents

Abstract

The utility model relates to the technical field of chip packaging, in particular to a thimble device. The utility model comprises the following steps: the wafer dicing device comprises a base, a thimble structure and a driving structure, wherein a mounting surface and a mounting cavity which is formed by inwards sinking the mounting surface are formed on the base, a wafer piece is carried on the mounting surface, and the wafer piece is diced and formed into a plurality of chips; the thimble structure is slidably arranged in the mounting cavity and comprises a first boss and a second boss, the first boss is provided with a mounting hole, the second boss is slidably arranged in the mounting hole, and the end surfaces of the first boss and the second boss, which are close to the mounting surface, are parallel to the mounting surface; the driving end of the driving structure is connected with the thimble structure, and drives the first boss and the second boss to jointly move towards the mounting surface to jack the chip, and drives the second boss to move towards the mounting surface to enable the chip to be completely separated from the wafer piece. The thimble structure is in surface contact with the chip, so that the possibility of cracking caused by single-point concentrated stress on the chip is reduced, and the yield of the chip is improved.

Description

Thimble device

Technical Field

The utility model relates to the technical field of chip packaging, in particular to a thimble device.

Background

The existing chip mounting is mainly to use a dicing film (DAF tape) with an adhesive layer, attach the wafer to the back of the wafer after the wafer is thinned, attach a separable semi-solid adhesive layer on the dicing film to the wafer, then manufacture a single chip 101 with the adhesive layer 201 (as shown in fig. 1) through processes such as dicing, picking, and the like, directly attach the chip 101 with the adhesive layer 201 to a chip carrier, and then improve the adhesion of the adhesive layer by curing the adhesive layer, so that the chip 101 is fixed on the chip carrier.

Specifically, as shown in fig. 2 to 5, when manufacturing the chip 101 with the adhesive layer 201, firstly, the wafer piece 10 is attached to the dicing film 20, then the dicing film 20 is fixed on the metal frame 30, then the wafer piece 10 is diced to form a plurality of independent chips 101 with the adhesive layer 201, finally, the metal frame 30 is fixed above the ejector mechanism by a manipulator, so that the target chip 101 corresponds to the ejector mechanism, a physical force is applied to the position of the dicing film 20 corresponding to the target chip 101 by the ejector mechanism, so that a slight step difference is formed between the target chip 101 and other chips 101, and the suction force of the target chip 101 is matched with the material taking mechanism 40, so that the target chip 101 is taken away from the dicing film 20, thereby completing the process.

As shown in fig. 6 and 7, the existing ejector mechanism is generally provided with an ejector base 1 and a driving structure 3, when in use, the wafer piece 10 is fixedly placed at a proper position of the ejector base 1, at this time, the target chip 101 corresponds to the ejector piece 50 in position, the ejector piece 50 is driven to move upwards by the driving structure 3, so that the ejector piece 50 has an upward pushing force on the position of the dicing film 20 corresponding to the target chip 101, and the pick-up mechanism 40 is matched with the upward suction force of the pick-up mechanism 40 on the target chip 101, so that the chip 101 with the adhesive layer 201 leaves the dicing film 20 and is picked up by the pick-up mechanism 40.

However, in the process of jacking the ejector mechanism, if the processed chip 101 is a thin embedded chip or other thin piece, the chip 101 is subjected to a single-point concentrated stress applied by the ejector 50 in the process of contacting the ejector 50 with the chip 101, so that the chip 101 is easily cracked, and the yield is affected.

Disclosure of Invention

Therefore, the utility model aims to solve the technical problem that the thimble structure in the prior art easily generates concentrated stress on the chip to damage the chip in the process of jacking the chip, and influences the defect of the chip yield, so as to provide the thimble device.

In order to solve the above problems, the present utility model provides a thimble device, including:

the base is provided with a mounting surface and a mounting cavity which is formed by inwards sinking the mounting surface, and the mounting surface is suitable for bearing wafer pieces which are diced to form a plurality of chips;

the thimble structure is slidably arranged in the mounting cavity of the base and comprises a first boss and a second boss, a mounting hole is formed in the first boss, the second boss is slidably arranged in the mounting hole, and the end faces, close to the mounting face, of the first boss and the second boss are parallel to the mounting face;

the driving end of the driving structure is connected with the thimble structure; the driving structure is suitable for driving the first boss and the second boss to move together towards the mounting surface so as to jack the chip, and is suitable for further driving the second boss to move towards the mounting surface so as to enable the chip corresponding to the thimble structure to be completely separated from the wafer piece.

Optionally, in the thimble device, along a direction perpendicular to a sliding direction of the thimble structure, a section of one side of the first boss, which is close to the mounting surface, is an annular surface, and a section of the second boss is a circular surface or a rectangular surface matched with the annular surface;

and the end face of the second boss close to the mounting surface is further provided with a pressure relief groove.

Optionally, in the above thimble device, along a sliding direction of the thimble structure, a central axis of the base, a central axis of the first boss, and a central axis of the second boss are overlapped.

Optionally, in the ejector pin device, an area of an end surface of the ejector pin structure, which is close to one side of the wafer piece, is smaller than an area of the chip.

Optionally, in the foregoing ejector pin device, the base further includes:

a receiving chamber adapted to communicate with an external pumping structure;

and the air suction holes are formed on the mounting surface of the base and are suitable for communicating the accommodating cavity with the external environment.

Optionally, the thimble device further includes a guide structure, where the guide structure includes:

the first guide part is formed on the inner side wall of the mounting cavity;

a second guide part formed on the outer circumference of the first boss;

in the first guide part and the second guide part, one of the first guide part and the second guide part is a chute, and the other one is a sliding block, and the sliding block is suitable for sliding in the chute relative to the chute.

Optionally, in the ejector pin device, a first elastic element is disposed in the chute, and two ends of the first elastic element are respectively connected with an inner wall of the chute and the slider.

Optionally, in the thimble device, the mounting hole is a through hole; the driving structure includes:

the mounting end of the first driving piece is mounted on the base, and the driving end of the first driving piece is connected with the first boss;

the installation end of the second driving piece is installed on the base, and the driving end of the second driving piece is connected with the second boss.

Optionally, in the thimble device, the mounting hole is a blind hole; the driving structure includes:

the mounting end of the first driving piece is mounted on the base, and the driving end of the first driving piece is connected with the first boss;

the installation end of the second driving piece is installed in the blind hole, and the driving end of the second driving piece is connected with the second boss.

Optionally, in the ejector pin device, the mounting hole is a through hole, one end of the second boss away from the mounting surface is formed by extending a clamping part on a plane perpendicular to the sliding direction of the ejector pin structure, and the clamping part and the first boss are arranged at intervals; the driving structure includes:

the driving end of the third driving piece is connected with the clamping part;

the second elastic piece is sleeved outside the second boss and is arranged between the clamping part and the first boss;

under the drive of the third driving piece, the second elastic piece has elastic force for driving the thimble structure to slide towards the mounting surface.

The utility model has the following advantages:

1. according to the thimble device provided by the utility model, the thimble structure and the driving structure are arranged on the base, the thimble structure comprises the first boss and the second boss, the first boss is sleeved outside the first boss in a sliding way, and when the thimble device works, the driving of the thimble structure by the driving structure can be divided into the following two steps: the driving structure drives the first boss and the second boss to synchronously slide upwards to realize preliminary jacking of the target chip placed on the mounting surface of the base, and then the driving structure independently drives the second boss to further slide upwards to facilitate the subsequent sucking of the target chip through the material taking mechanism, so that the separation of the target chip from other chips on the wafer piece is realized; in the process of jacking up the chip in two steps, the contact of thimble structure and chip is the face contact, has greatly reduced the chip and has received single-point concentrated stress and produce the possibility of crackle, improves the yields of chip, and the in-process that the chip was jacked up to suitable height also can be ensured to two steps, can not excessively drag peripheral scribing membrane, leads to its other chips of influence.

2. According to the thimble device provided by the utility model, the base, the mounting cavity, the first boss, the mounting hole and the second boss are coaxially arranged as far as possible, so that the uniformity of stress of the chip is ensured, the position of the upward acting force on the chip is not deviated when the first boss slides in the mounting cavity and the second boss slides in the mounting hole, and the probability of deformation and cracking of the chip in the stress process is reduced, so that the yield of the chip is further improved.

3. According to the thimble device provided by the utility model, the cross pressure relief groove is formed in the upper end face of the second boss, so that the device can be reset after one-time jacking, the working efficiency of the device is improved, the second boss can slide more smoothly, and the stability of the device is improved.

4. According to the ejector pin device provided by the utility model, the accommodating cavity and the plurality of air suction holes are formed in the base, the air suction structure is used for sucking air in the accommodating cavity, the scribing film is stably adsorbed on the mounting surface due to the existence of the air suction holes, the accurate force application of the subsequent ejector pin structure to the target chip is facilitated, and the adsorption force and the ejection force are simultaneously applied to the scribing film, so that the part of the scribing film, which is subjected to ejection deformation, is subjected to two forces in different directions, and the scribing film is easier to deform and is ejected upwards smoothly by the ejector pin structure.

5. According to the thimble device provided by the utility model, the guide structure is arranged between the base and the thimble structure, so that the sliding stability of the thimble structure in the base mounting cavity is improved; and set up first elastic component between the guide structure and be convenient for first boss smoothly reset, improve the work efficiency of thimble device.

6. According to the thimble device provided by the utility model, the driving structure drives the thimble structure, so that the stability of surface-to-surface contact during two-step jacking of the chip can be realized, and the use flexibility of the device can be enhanced.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present utility model, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.

FIG. 1 is a block diagram of a chip with an adhesive layer in the prior art;

FIG. 2 is a schematic view of a wafer attached to a dicing film according to the prior art;

FIG. 3 is a schematic view of a dicing film fixed on a metal frame in the prior art;

FIG. 4 is a schematic diagram of a wafer dicing structure according to the prior art;

FIG. 5 is a schematic diagram of a prior art structure with a single chip removed;

FIG. 6 is a schematic diagram of a prior art thimble mechanism;

FIG. 7 is a schematic diagram of a prior art ejector pin mechanism and a pick-up mechanism picking up a chip;

FIG. 8 is a schematic diagram of an ejector pin device according to an embodiment of the present utility model;

FIG. 9 is a schematic structural view of a ejector pin device after a target chip is extracted according to an embodiment of the present utility model;

FIG. 10 is a schematic diagram showing an initial state of the ejector pin device according to the embodiment of the present utility model for applying force to a target chip in the first embodiment;

FIG. 11 is a schematic diagram showing an intermediate state of the ejector pin device according to the embodiment of the present utility model for applying force to a target chip in the first embodiment;

FIG. 12 is a schematic diagram showing a final state of the ejector pin device according to the embodiment of the present utility model applying force to the target chip in the first embodiment;

FIG. 13 is a schematic view showing an initial state of the ejector pin device according to the embodiment of the present utility model for applying force to a target chip in a second embodiment;

FIG. 14 is a schematic view showing an intermediate state of the ejector pin device according to the embodiment of the present utility model for applying force to a target chip in a second embodiment;

FIG. 15 is a schematic diagram showing a final state of the ejector pin device according to the embodiment of the present utility model applying force to the target chip in the second embodiment;

FIG. 16 is a schematic view showing an initial state of the ejector pin structure according to the embodiment of the present utility model for applying force to a target chip in a third embodiment;

FIG. 17 is a schematic diagram showing an intermediate state of the ejector pin device according to the embodiment of the present utility model for applying force to a target chip in a third embodiment;

FIG. 18 is a schematic diagram showing a final state of the ejector pin device according to the embodiment of the present utility model applying force to the target chip in the third embodiment;

reference numerals illustrate:

10. a wafer member; 101. a chip; 20. dicing film; 201. an adhesive layer; 30. a metal frame; 40. a material taking mechanism; 50. a thimble member;

1. a base; 11. a mounting surface; 12. a mounting cavity; 13. a receiving chamber; 14. an air suction hole; 15. a communication hole;

2. a thimble structure; 21. a first boss; 211. a mounting hole; 22. a second boss; 221. a pressure relief groove; 222. a clamping part;

3. a driving structure; 31. a first driving member; 32. a second driving member; 33. a third driving member; 34. a second elastic member;

4. a guide structure; 41. a first guide part; 42. a second guide part;

5. a first elastic member.

Detailed Description

The following description of the embodiments of the present utility model will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the utility model are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In addition, the technical features of the different embodiments of the present utility model described below may be combined with each other as long as they do not collide with each other.

Example 1

Referring to fig. 8 to 18, the present embodiment provides a thimble device, including: the chip packaging structure comprises a base 1, a thimble structure 2 and a driving structure 3, wherein a mounting surface 11 and a mounting cavity 12 formed by inwards sinking the mounting surface 11 are formed on the base 1, and the mounting surface 11 is suitable for bearing a wafer piece 10 which is diced to form a plurality of chips 101; the thimble structure 2 is slidably arranged in the mounting cavity 12 of the base 1, the thimble structure 2 comprises a first boss 21 and a second boss 22, a mounting hole 211 is formed on the first boss 21, the second boss 22 is slidably arranged in the mounting hole 211, and the end surfaces of the first boss 21 and the second boss 22, which are close to the mounting surface 11, are parallel to the mounting surface 11; the driving end of the driving structure 3 is connected with the thimble structure 2, and the driving structure 3 is suitable for driving the first boss 21 and the second boss 22 to move together towards the mounting surface 11 so as to jack up the chip 101, and is suitable for further driving the second boss 22 to move towards the mounting surface 11 so as to enable the chip 101 corresponding to the thimble structure 2 to be completely separated from the wafer piece 10.

In the ejector pin device, referring to fig. 1 to 5, a wafer member 10 is connected to a dicing film 20 having an adhesive layer 201, and is horizontally mounted on a mounting surface 11 of a base 1 through a metal frame 30, and for convenience of description, a chip 101 opposite to the ejector pin structure 2 is referred to as a target chip 101; the thimble structure 2 is vertically arranged.

The ejector pin device of the present embodiment can eject the chip 101 of the wafer 10 by the following method: 1. as shown in fig. 8 and 10, in the initial state, the dicing film 20 of the ejector pin device is in a horizontal state and horizontally attached to the upper end surface of the base 1; 2. applying a driving force for synchronous upward movement to the first boss 21 and the second boss 22 simultaneously, as shown in fig. 11, the upper end face of the first boss 21 and the upper end face of the second boss 22 protrude out of the mounting face 11, slightly pulling the dicing film 20 upward to realize preliminary jacking of the target chip 101 above, at this time, the ejector pin device is in an intermediate state with a small vertical height difference between the target chip 101 and the mounting face 11, and in the process of converting the initial state into the intermediate state, the upper end face of the first boss 21 and the upper end face of the second boss 22 are kept flush; 3. the driving force of the upward movement is separately applied to the second boss 22, so that the upper end surface of the second boss 22 is higher than the upper end surface of the first boss 21, as shown in fig. 12, so that a step difference in height is formed between the target chip 101 and other chips 101 of the wafer part 10, and the target chip 101 is conveniently picked up by the picking mechanism 40 later, and at this time, the ejector pin device is in a final state of the jacking process.

Compared with the existing point-surface contact thimble mechanism shown in fig. 6 and 7, the two-step jacking separation is carried out on the chip 101 through the plane boss type thimble structure 2, and the thimble structure 2 and the chip 101 to be separated are in surface-surface contact in each step, so that concentrated stress is reduced, the possibility of cracking and other problems of the chip 101 in the jacking process is reduced, and the yield of the chip 101 is improved; meanwhile, the two-step jacking can ensure that the chip 101 is not excessively pulled to the peripheral dicing film 20 in the process of being jacked to be completely separated, so that the influence on the peripheral chip 101 is reduced.

Therefore, in the present embodiment, the cross section of the first boss 21 on the side close to the mounting surface 11 is an annular surface, and the cross section of the second boss 22 is a circular surface or a rectangular surface that mates with the annular surface, along the direction perpendicular to the sliding direction of the ejector pin structure 2.

Specifically, as shown in fig. 8 to 12, in the ejector pin structure 2 of the present embodiment, the first boss 21 adopts a cylindrical structure and slides in the mounting cavity 12 of the base 1. In the above description, "mated" means: in horizontal section, the cross-sectional shape and size of the first boss 21 should be adapted to the size and shape of the installation cavity 12; the mounting hole 211 of the first boss 21 is formed along the vertical axial direction of the first boss 21, the second boss 22 slides in the mounting hole 211, and the cross-section size and shape of the second boss 22 are matched with those of the mounting hole 211 along the horizontal direction; in this embodiment, the upper end section of the first boss 21 is shaped as a square ring, and the second boss 22 is arranged as a square column embedded in the square ring; if the upper end section of the first boss 21 is a circular ring, the second boss 22 is formed into a cylinder, so that stability and smoothness in relative sliding in the vertical direction are ensured.

Meanwhile, a pressure relief groove 221 is also formed in the upper end surface of the second boss 22. The pressure release groove 221 can avoid that the second boss 22 and the dicing film 20 are difficult to reset due to overlarge suction force after the chip 101 is jacked up, and improve the working efficiency of the device. The shape and size of the pressure relief groove 221 are not particularly limited, and can be determined according to the size and actual requirement of the second boss 22, and the cross shape is selected in this embodiment, so that the processing, the forming, and the installation and positioning are convenient.

As a preferable mode, the thimble device of the present embodiment is arranged such that the central axis of the base 1, the central axis of the mounting cavity 12 on the base 1, the central axis of the first boss 21, the central axis of the mounting hole 211 on the first boss 21, and the central axis of the second boss 22 overlap in the vertical direction, that is, along the sliding direction of the thimble structure 2. The central axes are overlapped, so that the chip 101 is stressed uniformly, the first boss 21 slides in the mounting cavity 12, the second boss 22 slides in the mounting hole 211, the position of the chip 101 acted by the upward acting force is not deviated, the probability of deformation and fracture of the chip 101 in the stress process is reduced, and the yield of the chip 101 is further improved.

In addition, the area of the end surface of the thimble structure 2 near the wafer piece 10 is smaller than the area of the chip 101. As shown in fig. 8 to 18, on a plane perpendicular to the sliding direction of the ejector pin structure 2, the cross-sectional area of the ejector pin structure 2 is smaller than the area of the target chip 101 to be lifted, that is, the sum of the areas of the upper end surfaces of the first bosses 21 and the upper end surfaces of the second bosses 22 is smaller than the area of the target chip 101 to be lifted. This arrangement helps to separate as much of the die 101 from the dicing film 20 as possible when the ejector pin structure 2 is moved upward to apply force to the die 101, facilitating the subsequent take-off mechanism 40 to take the die 101 off the dicing film 20.

As shown in fig. 8 and 9, the ejector pin device of the present embodiment further includes a pick-up mechanism 40 for subsequently picking up the chip 101. The base 1 is also provided with a containing cavity 13 and a plurality of suction holes 14, and the containing cavity 13 is suitable for being communicated with an external vacuum suction system through a communication hole 15, a communication pipe and the like; a plurality of suction holes 14 are vertically formed on the mounting surface 11 of the base 1 and are adapted to communicate the accommodating chamber 13 with the external environment. During operation, the dicing film 20 is placed on the mounting surface 11 of the base 1, the air in the accommodating cavity 13 is pumped through the pumping structures such as a vacuum pump, and under the action of negative pressure, the dicing film 20 is stably adsorbed on the mounting surface 11, so that the subsequent ejector pin structure 2 can more conveniently and accurately apply force to the target chip 101, and the adsorption force and the ejection force simultaneously act on the dicing film 20, so that the part of the dicing film 20, which is deformed by the ejection, is subjected to forces in two different directions, and the dicing film 20 is more easily deformed and is ejected upwards smoothly by the ejector pin structure 2. When the target chip 101 is taken away by the taking mechanism 40 and another chip 101 needs to be jacked up, the vacuum system is not used for pumping air any more, so that the dicing film 20 is not affected by negative pressure any more, at this time, the dicing film 20 can be moved relative to the base 1 until the next chip 101 to be taken on the dicing film 20 is aligned with the ejector pin structure 2, and preparation is made for taking the next material.

In order to facilitate the thimble structure 2 to improve the sliding stability of the thimble structure 2 in the mounting cavity 12 of the base 1, the thimble device is provided with the guiding structure 4 between the base 1 and the thimble structure 2, the guiding structure 4 comprises a first guiding portion 41 and a second guiding portion 42, the first guiding portion 41 is a sliding groove formed on the inner side wall of the mounting cavity 12, the second guiding portion 42 is a sliding block arranged on the outer wall surface of the first boss 21 towards the protrusion of the sliding groove, the sliding block slides relative to the sliding groove in the sliding groove, so that the thimble structure 2 integrally slides along a fixed track relative to the base 1, or the first boss 21 slides stably relative to the mounting cavity 12, thereby ensuring stable pushing of the target chip 101. In other embodiments, the second guide portion may be a sliding groove formed on an inner side wall of the first boss, and the first guide portion may be a slider protruding toward the sliding groove on an inner side wall of the mounting cavity.

On the basis of the scheme, in the embodiment, the first elastic piece 5 is arranged in the chute, and two ends of the first elastic piece 5 are respectively connected with the inner wall surface of the chute and the sliding block. Specifically, the first elastic piece 5 is a spring, and is arranged between the lower end surface of the sliding block and the lower end surface of the inner wall of the sliding groove, when the first boss 21 moves upwards, the first elastic piece 5 is stretched to have a pulling force for driving the sliding block and the first boss 21 to slide downwards, so that the first boss 21 can be reset more smoothly, and the slow reset can avoid collision, thereby being beneficial to prolonging the service life of the device. Of course, the first elastic member 5 may be disposed between the upper end surface of the slider and the upper end surface of the inner wall of the chute, and when the first boss 21 moves upward, the first elastic member 5 is compressed to have a thrust force for driving the slider and the first boss 21 to move downward for resetting, so that smooth resetting of the first boss 21 can be realized.

In the above-mentioned ejector pin device, as shown in the embodiment of fig. 10 to 12, the mounting hole 211 on the first boss 21 is formed as a through hole, the driving structure 3 includes two first driving members 31 and one second driving member 32, the mounting ends of the first driving member 31 and the second driving member 32 are both mounted on the base 1, the driving end of the first driving member 31 is connected with the lower end face of the first boss 21, and the driving end of the second driving member 32 is connected with the lower end face of the second boss 22. When the ejector pin structure 2 performs first-step ejection on the target chip 101, the first driving piece 31 and the second driving piece 32 synchronously drive the first boss 21 and the second boss 22, so that the speed of the first boss 21 and the speed of the second boss 22 sliding upwards are consistent, the upper end face of the first boss 21 and the upper end face of the second boss 22 are completely contacted with the scribing film 20, and the height deviation is avoided; the thimble structure 2 is simple to install and stable and reliable in driving. Of course, the number of the first driving members 31 and the second driving members 32 is not particularly limited.

Fig. 13 to 15 show a second embodiment of the thimble device, where the mounting hole 211 on the first boss 21 is formed as a blind hole, the driving structure 3 includes a first driving member 31 and a second driving member 32, the mounting end of the first driving member 31 is mounted on the base 1, the driving end is connected with the first boss 21, the mounting end of the second driving member 32 is mounted in the blind hole, and the driving end is connected with the second boss 22. The second driving piece 32 and the second boss 22 are correspondingly clamped in the blind hole, when the driving structure 3 drives the thimble structure 2 in the first step, the first driving piece 31 is started to drive the first boss 21 to move upwards, so that the second boss 22 can be synchronously driven upwards, and then the second driving piece 32 is started to drive the second boss 22 in the second step; the operation is simpler, and the synchronism is convenient to guarantee.

Fig. 16 to 18 show a third embodiment of the thimble device, in which the mounting hole 211 on the first boss 21 is formed as a through hole, and one end of the second boss 22 away from the mounting surface 11, that is, the lower end of the second boss 22 extends to form a clamping portion 222 on a plane perpendicular to the sliding direction of the thimble structure 2, and the clamping portion 222 is spaced from the first boss 21; the driving structure 3 includes: the driving end of the third driving piece 33 is connected with the clamping part 222; the second elastic member 34 is sleeved outside the second boss 22 and disposed between the clamping portion 222 and the first boss 21. The second elastic member 34 has an elastic force that drives the thimble structure 2 to slide toward the mounting surface 11 under the driving of the third driving member 33. Specifically, when in operation, the third driving member 33 applies force to the second boss 22 to compress the second elastic member 34, and transmits driving force to the first boss 21 through the second elastic member 34, so as to drive the first boss 21 and the second boss 22 to synchronously move upwards until the sliding block abuts against the upper wall surface of the sliding groove, and the first step of jacking the target chip 101 is completed, and at this time, the second elastic member 34 is in a stretched state; then, the third driving member 33 continues to apply force to the first boss 21, and the second boss 22 alone moves upward relative to the first boss 21 to complete the second step of jacking up the target chip 101, because the first boss 21 cannot continue to move upward. During resetting, the third driving member 33 drives the second boss 22 to fall back to the original height, and the first boss 21 is also pulled back to the original height under the action of the first elastic member 5, so as to be ready for the next jacking.

The first driving member 31, the second driving member 32, and the third driving member 33 described above may be any one of a linear motor, a hydraulic cylinder, an electric cylinder, an air cylinder, and the like, which provides axial power.

It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. While still being apparent from variations or modifications that may be made by those skilled in the art are within the scope of the utility model.

Claims (10)

1. A thimble device, comprising:

the base (1), the base (1) is formed with a mounting surface (11) and a mounting cavity (12) formed by inwards sinking the mounting surface (11), and the mounting surface (11) is suitable for bearing a wafer piece (10) which is diced to form a plurality of chips (101);

the thimble structure (2) is arranged in the mounting cavity (12) of the base (1) in a sliding manner, the thimble structure (2) comprises a first boss (21) and a second boss (22), a mounting hole (211) is formed in the first boss (21), the second boss (22) is arranged in the mounting hole (211) in a sliding manner, and the end faces, close to the mounting face (11), of the first boss (21) and the second boss (22) are parallel to the mounting face (11);

the driving end of the driving structure (3) is connected with the thimble structure (2); the driving structure (3) is suitable for driving the first boss (21) and the second boss (22) to move together towards the mounting surface (11) so as to jack up the chip (101), and is suitable for further driving the second boss (22) to move towards the mounting surface (11) so as to enable the chip (101) corresponding to the thimble structure (2) to be completely separated from the wafer piece (10).

2. Thimble device according to claim 1, characterized in that, along a direction perpendicular to the sliding direction of the thimble structure (2), the section of the side of the first boss (21) close to the mounting surface (11) is an annular surface, and the section of the second boss (22) is a circular or rectangular surface matching with the annular surface;

the second boss (22) is further provided with a pressure relief groove (221) formed on the end face close to the mounting face (11).

3. The thimble device according to claim 2, wherein the center axis of said base (1), the center axis of said first boss (21) and the center axis of said second boss (22) are arranged to coincide with each other along the sliding direction of said thimble structure (2).

4. A thimble device as claimed in claim 3, wherein the area of the end surface of the thimble structure (2) adjacent to the wafer member (10) is smaller than the area of the chip (101).

5. The thimble device according to claim 1, wherein said base (1) further comprises:

-a containment chamber (13), said containment chamber (13) being adapted to communicate with an external suction structure;

and a plurality of air suction holes (14) are formed on the mounting surface (11) of the base (1), and the air suction holes (14) are suitable for communicating the accommodating cavity (13) with the external environment.

6. The ejector pin device according to claim 1, further comprising a guiding structure (4), the guiding structure (4) comprising:

a first guide portion (41) formed on an inner side wall of the mounting chamber (12);

a second guide portion (42) formed on the outer periphery of the first boss (21);

in the first guide part (41) and the second guide part (42), one of the two guide parts is a sliding groove, and the other guide part is a sliding block, and the sliding block is suitable for sliding in the sliding groove relative to the sliding groove.

7. The thimble device according to claim 6, wherein a first elastic member (5) is disposed in the chute, and two ends of the first elastic member (5) are respectively connected with an inner wall of the chute and the slider.

8. The thimble device according to any one of claims 1-7, wherein said mounting hole (211) is a through hole; the driving structure (3) comprises:

the first driving piece (31), the installation end of the first driving piece (31) is installed on the base (1), and the driving end of the first driving piece (31) is connected with the first boss (21);

the second driving piece (32), the installation end of second driving piece (32) is installed on base (1), the drive end of second driving piece (32) with second boss (22) is connected.

9. The thimble device of any one of claims 1-7, wherein said mounting hole (211) is a blind hole; the driving structure (3) comprises:

the first driving piece (31), the installation end of the first driving piece (31) is installed on the base (1), and the driving end of the first driving piece (31) is connected with the first boss (21);

the mounting end of the second driving piece (32) is arranged in the blind hole, and the driving end of the second driving piece (32) is connected with the second boss (22).

10. The thimble device according to any one of claims 1-7, wherein said mounting hole (211) is a through hole, and a clamping portion (222) is formed by extending one end of said second boss (22) away from said mounting surface (11) on a plane perpendicular to a sliding direction of said thimble structure (2), said clamping portion (222) being spaced from said first boss (21); the driving structure (3) comprises:

the driving end of the third driving piece (33) is connected with the clamping part (222);

the second elastic piece (34) is sleeved outside the second boss (22), and is arranged between the clamping part (222) and the first boss (21);

under the drive of the third driving piece (33), the second elastic piece (34) has elastic force for driving the thimble structure (2) to slide towards the mounting surface (11).