CN220796668U - Force control type chip demoulding mechanism - Google Patents
Force control type chip demoulding mechanism Download PDFInfo
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- CN220796668U CN220796668U CN202322415354.XU CN202322415354U CN220796668U CN 220796668 U CN220796668 U CN 220796668U CN 202322415354 U CN202322415354 U CN 202322415354U CN 220796668 U CN220796668 U CN 220796668U
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- thimble
- force control
- fixed
- lifting
- sliding table
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- 239000010408 film Substances 0.000 description 17
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000000605 extraction Methods 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to the technical field of die bonding, and particularly discloses a force control type chip demoulding mechanism which comprises a fixed thimble cap for placing a wafer, a lifting thimble arranged in the fixed thimble cap, a force control motor for driving the lifting thimble to move up and down relative to the fixed thimble cap, and a lifting direct-drive mechanism for driving the lifting thimble and the force control motor to move up and down relative to the fixed thimble cap, wherein the driving speed of the lifting direct-drive mechanism is higher than that of the force control motor, and the force control precision of the force control motor is higher than that of the lifting direct-drive mechanism. The force control type chip demoulding mechanism provided by the utility model can effectively solve the problem that the speed and the force of the existing chip demoulding mechanism are difficult to consider when the existing chip demoulding mechanism is lifted.
Description
Technical Field
The utility model relates to the technical field of die bonding, in particular to a force control type chip demoulding mechanism.
Background
Referring to fig. 1, when the wafer 100 is fed, the wafer includes a carrier film 100a and a plurality of chip bodies 100b adhered to the carrier film 100a, and before the die bonding operation, the chip bodies 100b need to be lifted up one by using a die release mechanism, so that the chip bodies 100b are separated from the carrier film 100a. The existing chip demoulding mechanism comprises a thimble cap 1 for placing a wafer 100, a lifting thimble 2 arranged in the thimble cap 1 in a sliding manner, and a power module 3 for driving the lifting thimble 2 to move up and down.
When the crystal taking operation is carried out, the steps are as follows:
(1) firstly, placing a wafer 100 above an ejector pin cap 1;
(2) then, the mechanical arm 300 drives the suction nozzle 200 to move to a position right above the lifting thimble 2 and at a small distance from the chip body 100b;
(3) the power module 3 drives the lifting thimble 2 to move upwards, so that the upper end of the lifting thimble 2 pierces the bearing film 100a upwards, and the chip body 100b right above the lifting thimble 2 is lifted upwards to be sucked by the suction nozzle 200, thereby completing the crystal picking operation.
Generally, the power module 3 is a linear motor, and the linear motor currently on the market has the following problems: if the lifting speed of the linear motor is high, the strength control performance is poor, and the chip body 100b is easy to be damaged when the chip body 100b is lifted upwards; if the force control performance (force control precision) of the linear motor is good, the lifting speed is low, and the working efficiency is low.
Therefore, the existing chip demoulding mechanism needs to be improved so as to solve the problem that the speed and the strength of the existing chip demoulding mechanism are difficult to be compatible when the existing chip demoulding mechanism is lifted.
The above information disclosed in this background section is only included to enhance understanding of the background of the disclosure and therefore may contain information that does not form the prior art that is presently known to those of ordinary skill in the art.
Disclosure of Invention
The utility model aims to provide a force control type chip demoulding mechanism, which can effectively solve the problem that the speed and the force of the existing chip demoulding mechanism are difficult to be compatible when the existing chip demoulding mechanism is lifted.
In order to achieve the above purpose, the utility model provides a force control type chip demoulding mechanism, which comprises a fixed thimble cap used for placing a wafer, a lifting thimble arranged in the fixed thimble cap, a force control motor for driving the lifting thimble to move up and down relative to the fixed thimble cap, and a jacking direct-drive mechanism for driving the lifting thimble and the force control motor to move up and down relative to the fixed thimble cap;
the driving speed of the jacking direct-drive mechanism is greater than that of the force control motor, and the force control precision of the force control motor is greater than that of the jacking direct-drive mechanism.
Optionally, the method further comprises:
the force control motor is fixedly arranged on the fixed base;
the lifting sliding table is connected with the fixed base in an up-down sliding mode, and the driving end of the force control motor is connected with the lifting sliding table.
Optionally, the device also comprises a thimble sliding table;
the force control motor is fixedly arranged on the lifting sliding table, and the driving end of the force control motor is connected with the thimble sliding table and used for driving the thimble sliding table to slide up and down relative to the lifting sliding table.
Optionally, the unable adjustment base is equipped with protruding stretching to the fixed diaphragm of lift slip table top, fixed thimble cap install in on the fixed diaphragm.
Optionally, the lower end of the lifting thimble is fixed on the thimble sliding table, and the upper end of the lifting thimble penetrates through the fixed transverse plate and then stretches into the fixed thimble cap.
Optionally, the inside of fixed thimble cap is equipped with the accommodation chamber that holds the lift thimble, the top of fixed thimble cap is equipped with the intercommunication to the accommodation chamber and supplies the top of lift thimble passes the pinhole.
Optionally, a plurality of air suction holes communicated to the accommodating cavity are further formed in the top of the fixed thimble cap.
Optionally, each of the air suction holes is uniformly arranged around the through-needle hole.
Optionally, the fixing base is fixed on the cross sliding table.
Optionally, the jacking direct-drive mechanism and the force control motor are both voice coil motors.
The utility model has the beneficial effects that: the utility model provides a power accuse chip demoulding mechanism, jacking direct drive mechanism is responsible for controlling the jacking speed to guarantee efficiency, power accuse motor is through adjusting inside output parameter, make the lift thimble can provide invariable holding power to the lift thimble all the time, and then make the lift thimble can pass the thin film that bears with invariable presetting the jacking force slowly upwards, and jack up the chip body upwards, finally make the chip body break away from the thin film that bears, can accomplish the drawing of patterns operation from this, and can not damage the chip body.
Therefore, the force control type chip demoulding mechanism provided by the utility model can finish chip demoulding operation without damaging the chip body.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the utility model, and that other drawings can be obtained from these drawings without inventive faculty for a person skilled in the art.
FIG. 1 is a schematic diagram of a conventional die bonding mechanism according to the related art;
fig. 2 is a schematic structural diagram of a force control type chip demolding mechanism according to an embodiment;
FIG. 3 is a schematic diagram of a power module according to an embodiment;
FIG. 4 is a schematic cross-sectional view of a stationary thimble cap and a lift thimble according to an embodiment.
In the figure:
100. a wafer; 100a, a carrier film; 100b, a chip body;
200. a suction nozzle;
300. a mechanical arm;
1. fixing a thimble cap; 101. a receiving chamber; 102. passing through the pinholes; 103. an air suction hole;
2. lifting the thimble;
3. a power module; 301. a jacking direct-drive mechanism; 302. a force control motor; 303. a fixed base; 3031. fixing the transverse plate; 304. lifting the sliding table; 305. a thimble sliding table;
4. a cross sliding table.
Detailed Description
In order to make the objects, features and advantages of the present utility model more obvious and understandable, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the drawings in the embodiments of the present utility model, and it is apparent that the embodiments described below are only some embodiments of the present utility model, not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it will be understood that when one component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present.
Furthermore, the terms "long," "short," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship based on that shown in the drawings, for convenience of description of the present utility model, and are not intended to indicate or imply that the apparatus or elements referred to must have this particular orientation, operate in a particular orientation configuration, and thus should not be construed as limiting the utility model.
The present utility model will be described in detail below with reference to specific embodiments shown in the drawings. These embodiments are not intended to limit the utility model and structural, methodological, or functional modifications of these embodiments that may be made by one of ordinary skill in the art are included within the scope of the utility model.
The utility model provides a force control type chip demoulding mechanism which is suitable for an application scene of ejecting a chip body upwards to bear a film, and can effectively solve the problem that the speed and the force of the existing chip demoulding mechanism are difficult to be compatible when the existing chip demoulding mechanism is lifted.
Referring to fig. 2, in this embodiment, the force control chip demolding mechanism includes a fixed thimble cap 1 for placing a wafer, a lifting thimble 2 located in the fixed thimble cap 1, a force control motor 302 for driving the lifting thimble 2 to move up and down relative to the fixed thimble cap 1, and a lifting direct driving mechanism 301 for driving the lifting thimble 2 and the force control motor 302 to move up and down relative to the fixed thimble cap 1. The driving speed of the jacking direct-drive mechanism 301 is greater than that of the force control motor 302, and the force control precision of the force control motor 302 is greater than that of the jacking direct-drive mechanism 301.
Specifically, when demolding operation is performed, the lifting and direct-drive mechanism 301 rapidly lifts the lifting thimble 2 and the force control motor 302 upwards, so that the lifting thimble 2 lifts the carrier film 100a upwards; in this process, the lift pin 2 receives a reaction force of the carrier film 100a, the reaction force is detected by the force control motor 302, and the force control motor 302 adjusts an internal output parameter, so that the lift pin 2 can always provide a constant supporting force for the lift pin 2, and further, the lift pin 2 can slowly pass through the carrier film 100a upwards with a constant preset lifting force, and lift up the chip body 100b, and finally, the chip body 100b is separated from the carrier film 100a, thereby completing demolding operation without damaging the chip body 100b.
Specifically, referring to fig. 2 and 3, the force control type chip demoulding mechanism further comprises a fixed base 303, a lifting sliding table 304 and a thimble sliding table 305.
The force control motor 302 is fixedly arranged on the fixed base 303; the lifting sliding table 304 is connected with the fixed base 303 in a vertically sliding manner, and the driving end of the force control motor 302 is connected with the lifting sliding table 304.
The force control motor 302 is mounted and fixed on the lifting sliding table 304, and the driving end of the force control motor 302 is connected with the thimble sliding table 305, so as to drive the thimble sliding table 305 to slide up and down relative to the lifting sliding table 304.
The fixed base 303 is provided with a fixed transverse plate 3031 protruding above the lifting sliding table 304, and the fixed thimble cap 1 is mounted on the fixed transverse plate 3031.
The lower end of the lifting thimble 2 is fixed on the thimble sliding table 305, and the upper end passes through the fixed transverse plate 3031 and then stretches into the fixed thimble cap 1.
Referring to fig. 4, the inside of the fixed thimble cap 1 is provided with a receiving cavity 101 for receiving the lifting thimble 2, and the top of the fixed thimble cap 1 is provided with a passing pinhole 102 which is communicated with the receiving cavity 101 and is used for the top of the lifting thimble 2 to pass through.
The top of the fixed thimble cap 1 is also provided with a plurality of air suction holes 103 communicated with the accommodating cavity 101. Further, the suction holes 103 are uniformly arranged around the through-needle hole 102.
Optionally, the fixing base 303 is fixed on the cross sliding table 4.
The specific working process of the force control type chip demoulding mechanism provided by the embodiment is as follows:
s10: before demolding, the front, back, left and right positions of the fixed base 303 are adjusted through the cross sliding table 4, so that the fixed thimble cap 1 is positioned right below the suction nozzle 200;
s20: during demolding operation, the air extraction equipment communicated with the accommodating cavity 101 is started, and the bearing film 100a is tightly adsorbed downwards through the air suction hole 103;
s30: the lifting and direct-driving mechanism 301 lifts the lifting thimble 2 and the force control motor 302 upwards, so that the lifting thimble 2 lifts the carrying film 100a upwards;
in this process, the lift pin 2 receives a reaction force of the carrier film 100a, the reaction force is detected by the force control motor 302, and the force control motor 302 adjusts an internal output parameter, so that the lift pin 2 can always provide a constant supporting force for the lift pin 2, and further, the lift pin 2 can slowly pass through the carrier film 100a upwards with a constant preset lifting force, and lift up the chip body 100b, and finally, the chip body 100b is separated from the carrier film 100a, thereby completing demolding operation without damaging the chip body 100b.
Optionally, both the jacking direct-drive mechanism 301 and the force control motor 302 are voice coil motors. Of course, in some other embodiments, other types of motors may be used as the lift-up direct-drive mechanism 301 and the force-control motor 302, which is not limited by the present utility model.
To sum up, the force control type chip demolding mechanism provided by the embodiment has the following beneficial effects: the jacking direct-drive mechanism 301 is responsible for controlling the jacking speed to ensure the efficiency, and the force control motor 302 can always provide constant supporting force for the lifting thimble 2 by adjusting the internal output parameters, so that the lifting thimble 2 can slowly pass through the carrying film 100a upwards with constant preset jacking force, and jack up the chip body 100b upwards, and finally the chip body 100b is separated from the carrying film 100a, thereby completing the demolding operation without damaging the chip body 100b.
It should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is for clarity only, and that the skilled artisan should recognize that the embodiments may be combined as appropriate to form other embodiments that will be understood by those skilled in the art.
The above list of detailed descriptions is only specific to practical embodiments of the present utility model, and they are not intended to limit the scope of the present utility model, and all equivalent embodiments or modifications that do not depart from the spirit of the present utility model should be included in the scope of the present utility model.
Claims (10)
1. The force control type chip demoulding mechanism is characterized by comprising a fixed thimble cap (1) for placing a wafer, a lifting thimble (2) arranged in the fixed thimble cap (1), a force control motor (302) for driving the lifting thimble (2) to move up and down relative to the fixed thimble cap (1), and a jacking direct-drive mechanism (301) for driving the lifting thimble (2) and the force control motor (302) to move up and down relative to the fixed thimble cap (1);
the driving speed of the jacking direct-drive mechanism (301) is larger than that of the force control motor (302), and the force control precision of the force control motor (302) is larger than that of the jacking direct-drive mechanism (301).
2. The force controlled die release mechanism of claim 1, further comprising:
a fixed base (303), wherein the force control motor (302) is fixedly arranged on the fixed base (303);
the lifting sliding table (304), the lifting sliding table (304) is connected with the fixed base (303) in an up-down sliding way, and the driving end of the force control motor (302) is connected with the lifting sliding table (304).
3. The force-controlled chip demoulding mechanism according to claim 2, further comprising a thimble sliding table (305);
the force control motor (302) is installed and fixed on the lifting sliding table (304), and the driving end of the force control motor (302) is connected with the thimble sliding table (305) and used for driving the thimble sliding table (305) to slide up and down relative to the lifting sliding table (304).
4. A force-controlled chip demoulding mechanism according to claim 3, characterized in that the fixed base (303) is provided with a fixed transverse plate (3031) protruding above the lifting sliding table (304), and the fixed thimble cap (1) is mounted on the fixed transverse plate (3031).
5. The force control type chip demoulding mechanism according to claim 4, wherein the lower end of the lifting thimble (2) is fixed on the thimble sliding table (305), and the upper end of the lifting thimble penetrates through the fixed transverse plate (3031) and then stretches into the fixed thimble cap (1).
6. The force control type chip demoulding mechanism according to claim 1, wherein a containing cavity (101) for containing the lifting thimble (2) is arranged in the fixed thimble cap (1), and a pinhole (102) which is communicated to the containing cavity (101) and is used for allowing the top of the lifting thimble (2) to pass through is arranged at the top of the fixed thimble cap (1).
7. The force control type chip demoulding mechanism according to claim 6, wherein the top of the fixed thimble cap (1) is further provided with a plurality of air suction holes (103) communicated with the accommodating cavity (101).
8. The force controlled die release mechanism of claim 7, wherein each of the suction holes (103) is uniformly arranged around the through-needle hole (102).
9. The force control chip demoulding mechanism according to claim 2, wherein the fixing base (303) is fixed on the cross sliding table (4).
10. The force controlled chip demoulding mechanism according to claim 1, wherein the jacking direct drive mechanism (301) and the force controlled motor (302) are both voice coil motors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322415354.XU CN220796668U (en) | 2023-09-06 | 2023-09-06 | Force control type chip demoulding mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322415354.XU CN220796668U (en) | 2023-09-06 | 2023-09-06 | Force control type chip demoulding mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220796668U true CN220796668U (en) | 2024-04-16 |
Family
ID=90663236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322415354.XU Active CN220796668U (en) | 2023-09-06 | 2023-09-06 | Force control type chip demoulding mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220796668U (en) |
-
2023
- 2023-09-06 CN CN202322415354.XU patent/CN220796668U/en active Active
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