CN116469825A - Swing arm type force-controllable die bonding system and force-controllable die bonding method - Google Patents
Swing arm type force-controllable die bonding system and force-controllable die bonding method Download PDFInfo
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- CN116469825A CN116469825A CN202310422518.3A CN202310422518A CN116469825A CN 116469825 A CN116469825 A CN 116469825A CN 202310422518 A CN202310422518 A CN 202310422518A CN 116469825 A CN116469825 A CN 116469825A
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- 238000000034 method Methods 0.000 title claims abstract description 11
- 230000007246 mechanism Effects 0.000 claims abstract description 102
- 238000003825 pressing Methods 0.000 claims abstract description 7
- 238000001514 detection method Methods 0.000 claims abstract description 6
- 230000009977 dual effect Effects 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 239000003292 glue Substances 0.000 abstract description 5
- 238000011002 quantification Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 45
- 239000013078 crystal Substances 0.000 description 18
- 239000007787 solid Substances 0.000 description 18
- 238000009434 installation Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention provides a swing arm type power control die bonding system and a power control die bonding method, wherein the die bonding system comprises a die bonding arm, a suction nozzle, a rotary power mechanism, a die bonding arm lifting driving mechanism, a suction nozzle mounting seat and a power control voice coil motor, the power control voice coil motor is fixed on the die bonding arm, the suction nozzle mounting seat is fixedly connected with the power output end of the power control voice coil motor, the suction nozzle is fixed on the suction nozzle mounting seat, the power control voice coil motor has the functions of force control and pressure detection, and the power control voice coil motor drives the suction nozzle to press down with set force; when the force-controlled voice coil motor detects that the pressure borne by the wafer reaches the preset pressure, the die bonding arm lifting driving mechanism stops pressing down the suction nozzle, and die bonding is completed. Therefore, the die bonding system provided by the invention realizes quantification of die bonding pressure, the die bonding pressure is accurately controlled, the thickness control precision of the glue point after die bonding is finished is high, and the force control die bonding method provided by the invention can enable the two die bonding arms to work continuously and alternately, so that the die bonding efficiency is improved.
Description
Technical Field
The invention belongs to the field of semiconductor production equipment, and particularly relates to a swing arm type power-controllable die bonding system and a power-controllable die bonding method.
Background
Die bonding is an important packaging process in the semiconductor industry, and along with the maturation and massive popularization of a die bonder, the importance of die bonding in the whole packaging process is particularly outstanding. The traditional die bonder is divided into a linear die bonder with a force control device and a swing arm die bonder without the force control device, wherein the linear die bonder with the force control device adopts a working mode of moving straight, and has the advantages of high precision and low efficiency; the swing arm type die bonder without the force control device performs die bonding in a mode of elastic sheet deformation, and has the advantages of high speed, uncontrollable die bonding pressure and low accuracy of glue point thickness control after die bonding.
Disclosure of Invention
The invention aims to provide a swing arm type power-controllable die bonding system and a power-controllable die bonding method, and aims to solve the problems that in the prior art, die bonding pressure of a swing arm type die bonder is uncontrollable and the thickness control precision of a glue point is low after die bonding is finished.
The invention is realized in such a way that a swing arm type force-controllable crystal fixing system comprises a crystal fixing arm, a suction nozzle, a rotary power mechanism, a crystal fixing arm lifting driving mechanism, a suction nozzle mounting seat and a force-controllable voice coil motor; the die bonding arm is fixedly connected with a rotating shaft of the rotary power mechanism, the die bonding arm is fixedly connected with a power output end of the die bonding arm lifting driving mechanism, the rotary power mechanism can drive the die bonding arm to swing horizontally, and the die bonding arm lifting driving mechanism can drive the die bonding arm to vertically lift; the force control voice coil motor is fixed at the free end of the die bonding arm, the suction nozzle mounting seat is fixedly connected with the power output end of the force control voice coil motor, and the suction nozzle is fixed on the suction nozzle mounting seat; the force control voice coil motor has a force control and pressure detection function; when the force-controlled voice coil motor detects that the pressure born by the wafer reaches the preset wafer pressure, the die bonding arm lifting driving mechanism can stop pressing the suction nozzle to finish die bonding.
Further, the swing arm type force-controllable crystal solidification system further comprises a base, and the rotary power mechanism is fixed on the base.
Further, the swing arm type power control die bonding system further comprises a suction nozzle installation seat lifting slide block and a suction nozzle installation seat lifting slide groove, the suction nozzle installation seat lifting slide block is fixedly connected with the suction nozzle installation seat, the suction nozzle installation seat lifting slide groove is fixedly connected with the die bonding arm, and the power control voice coil motor can drive the suction nozzle installation seat lifting slide block to slide up and down relative to the suction nozzle installation seat lifting slide groove.
Further, the swing arm type force-controllable crystal fixing system further comprises a connecting seat, a crystal fixing arm lifting sliding block and a crystal fixing arm lifting sliding rail, and the top end of the connecting seat is fixedly connected with the rotating shaft of the rotating power mechanism; the die bonding arm is fixedly connected with the die bonding arm lifting slide block, and the die bonding arm lifting slide rail is fixedly connected with the connecting seat; the die bonding arm lifting driving mechanism can drive the die bonding arm lifting sliding block to slide up and down relative to the die bonding arm lifting sliding rail.
Further, the swing arm type force-controllable die bonding system further comprises a suction nozzle lifting original point sensor for detecting the original point height position of the suction nozzle.
Further, the swing arm type force-controllable crystal fixing system comprises at least one double crystal fixing unit, wherein the double crystal fixing unit comprises two crystal fixing arm lifting driving mechanisms, two crystal fixing arms, two suction nozzle mounting seats, two force-controllable voice coil motors and two suction nozzles; the two die bonding arms are axially and symmetrically arranged along the rotating shaft of the rotary power mechanism; the rotary power mechanism can drive the two die bonding arms to swing horizontally at the same time, and the two die bonding arm lifting driving mechanisms can independently drive the die bonding arms corresponding to the rotary power mechanism to vertically lift.
Further, the double die bonding unit further comprises two lifting transmission plates, a pull rod and a hollow shaft sleeve, wherein the pull rod is movably arranged in the hollow shaft sleeve in a penetrating manner; the power output end of the die bonding arm lifting driving mechanism is fixedly connected with one end of a lifting driving plate, and the other end of the lifting driving plate is fixedly connected with one die bonding arm through the pull rod; the power output end of the other die bonding arm lifting driving mechanism is fixedly connected with one end of the other lifting driving plate, and the other end of the other lifting driving plate is fixedly connected with the other die bonding arm through the hollow shaft sleeve.
Further, the dual die bonding unit further comprises two die bonding arm connecting plates, one end of one die bonding arm connecting plate is fixedly connected with one die bonding arm, the top of the other end extends out of the upper connecting part, and the upper connecting part is fixedly connected with the hollow shaft sleeve; one end of the other die bonding arm connecting plate is fixedly connected with the other die bonding arm, the bottom of the other end extends out of the lower connecting part, and the lower connecting part is fixedly connected with the pull rod.
In order to achieve the above object, the present invention further provides a method for implementing force-controlled die bonding by using the swing arm type force-controlled die bonding system, which comprises the following steps:
A. the rotary power mechanism drives the two die bonding arms to do rotary motion, and the first die bonding arm is rotated to the upper part of the wafer, so that a first suction nozzle on the first die bonding arm is aligned with the wafer to be sucked; at this time, the second die bonding arm is positioned above the position where die bonding is needed;
B. the first die bonding arm lifting driving mechanism drives the first die bonding arm to drive the first suction nozzle to move downwards to the upper surface of the wafer, after the first suction nozzle contacts the wafer, the first force control voice coil motor detects that the pressure on the first suction nozzle reaches a set value, the first die bonding arm lifting driving mechanism stops moving downwards, at the moment, the first suction nozzle generates vacuum to suck the wafer, and then the first die bonding arm lifting driving mechanism moves upwards to suck the wafer upwards;
C. the rotary power mechanism drives the first die bonding arm and the second die bonding arm to simultaneously perform rotary motion, and the second die bonding arm is rotated to the upper part of the wafer, so that a second suction nozzle on the second die bonding arm is aligned with the wafer to be sucked; at this time, the second die bonding arm is positioned above the position where die bonding is needed;
D. the first die bonding arm lifting driving mechanism drives the first suction nozzle to move downwards to the position above an object to be die bonded, after the first suction nozzle drives the wafer to contact the surface of the object, the first force control voice coil motor detects that the pressure on the first suction nozzle reaches a set value, the first die bonding arm lifting driving mechanism stops moving downwards, at the moment, the first suction nozzle releases vacuum, the wafer is separated from the first suction nozzle and is fixed on the surface of the object to be die bonded, and then the first die bonding arm lifting driving mechanism moves upwards to lift the first die bonding arm and the first suction nozzle upwards;
E. the first die bonding arm is used for bonding the die, and simultaneously, the second die bonding arm drives the second suction nozzle to move downwards to the upper surface of the wafer under the drive of the second die bonding arm lifting driving mechanism, after the second suction nozzle contacts the wafer, the second force control voice coil motor detects that the pressure on the second suction nozzle reaches a set value, the second die bonding arm lifting driving mechanism stops moving downwards, at the moment, the second suction nozzle generates vacuum to suck the wafer, and then the second die bonding arm lifting driving mechanism moves upwards to suck the wafer upwards;
F. the rotary power mechanism drives the first die bonding arm and the second die bonding arm to do rotary motion, the first die bonding arm rotates to the upper part of the wafer, and a first suction nozzle on the first die bonding arm is aligned with the wafer to be sucked; at this time, the second die bonding arm is positioned above the position where die bonding is needed; the actions of A-E are repeated, so that the first die bonding arm and the second die bonding arm work continuously and alternately, the pressure of each wafer during sucking and die bonding can be accurately controlled, and the die bonding force are ensured to be within the set range.
Compared with the prior art, the invention has the beneficial effects that:
the swing arm type force-controllable crystal fixing system comprises a suction nozzle mounting seat and a force-controllable voice coil motor, wherein a suction nozzle is fixed on the suction nozzle mounting seat, the force-controllable voice coil motor has the functions of force control and pressure detection, and the force-controllable voice coil motor drives the suction nozzle to press down with set force; when the force-controlled voice coil motor detects that the pressure borne by the wafer reaches the preset pressure, the die bonding arm lifting driving mechanism stops pressing down the suction nozzle, and die bonding is completed. Therefore, the swing arm type controllable die bonding system provided by the invention realizes quantification of die bonding pressure, the die bonding pressure is accurately controlled, and the thickness control precision of the glue point after die bonding is high.
According to the force control die bonding method, the two die bonding arms can simultaneously perform rotary motion through the rotary power mechanism, so that the two die bonding arms continuously and alternately work, the pressure of each wafer during suction and die bonding can be accurately controlled, the die bonding force and die bonding force are ensured to be within a set range, and the die bonding efficiency is improved while the force control die bonding is realized.
Drawings
Fig. 1 is a schematic structural diagram of a swing arm type force controllable die bonding system according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a portion of the swing arm type force controllable crystal solidification system shown in FIG. 1;
FIG. 3 is a schematic diagram of another part of the swing arm type die attach system shown in FIG. 1;
fig. 4 is a schematic structural diagram of the swing arm type force controllable die bonding system shown in fig. 1 before the inner nozzle mount and the inner die bonding arm are assembled.
The marks in the figure:
1-a rotary power mechanism, 2-a base, 3-a cooling fan and 4-a connecting seat;
51-outer die bonding arm lifting driving mechanism, 52-outer lifting driving plate, 53-outer die bonding arm, 54-outer suction nozzle lifting original point sensor, 55-outer suction nozzle mounting seat, 56-outer suction nozzle and 57-outer force control voice coil motor;
61-inner die bonding arm lifting driving mechanism, 62-inner lifting driving plate, 63-inner die bonding arm, 64-inner suction nozzle lifting original point sensor, 65-inner suction nozzle mounting seat, 66-inner suction nozzle and 67-inner force control voice coil motor.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
In the description of the present invention, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inner", "outer", etc., are based on those shown in the drawings, are merely for convenience of description and simplification of the description, and do not indicate or imply that the apparatus or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium, and can be the communication between the two parts. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Referring to fig. 1 and 2, a swing arm type power-controllable die bonding system provided in this embodiment includes a rotary power mechanism 1, a base 2, two cooling fans 3, a connection base 4, and at least one dual die bonding unit. The rotary power mechanism 1 is fixed on the base 2, two cooling fans 3 are respectively arranged on two sides of the rotary power mechanism 1, and the top end of the connecting seat 4 is fixedly connected with the rotating shaft of the rotary power mechanism 1.
In this embodiment, a dual die bonding unit is used as an example, and a technical scheme of the swing arm type controllable die bonding system of the present invention is described in detail:
the dual die bonding unit in this embodiment includes an outer die bonding unit and an inner die bonding unit, where the outer die bonding unit and the inner die bonding unit swing horizontally and lift independently at the same time, and alternately suck wafers and bond dies in sequence.
Specifically, referring to fig. 3, the external die bonding unit includes an external die bonding arm lifting driving mechanism 51, an external lifting driving plate 52, a hollow shaft sleeve, an external die bonding arm connecting plate, an external die bonding arm 53, an external die bonding arm lifting slider, an external die bonding arm lifting sliding rail, an external suction nozzle lifting original point sensor 54, an external suction nozzle mounting seat 55, an external suction nozzle 56, an external force control voice coil motor 57, an external suction nozzle mounting seat lifting slider and an external suction nozzle mounting seat lifting sliding chute.
The power output end of the outer die bonding arm lifting driving mechanism 51 is fixedly connected with one end of the outer lifting driving plate 52, and the other end of the outer lifting driving plate 52 is fixedly connected with the top end of the hollow shaft sleeve. The bottom of cavity axle sleeve and the upper junction fixed connection of outer solid brilliant arm connecting plate, the one end of outer solid brilliant arm 53 and the one side fixed connection of outer solid brilliant arm connecting plate, the opposite side of outer solid brilliant arm connecting plate and outer solid brilliant arm lift slider fixed connection, outer solid brilliant arm lift slider slip cap is established on outer solid brilliant arm lift slide rail, outer solid brilliant arm lift slide rail is fixed on one side of connecting seat 4.
The outer die bonding arm lifting driving mechanism 51 can drive the outer die bonding arm 53 to vertically lift. An external suction nozzle lifting origin sensor 54 is installed at the outer side of the external die bonding arm lifting driving mechanism 51 for detecting the origin height position of the external suction nozzle 56.
The external force accuse voice coil motor 57 is fixed on outer solid brilliant arm 53, and outer suction nozzle mount pad lift spout and outer solid brilliant arm 53 fixed connection, outer suction nozzle mount pad lift slider and outer suction nozzle mount pad 55 fixed connection, outer suction nozzle 56 are fixed on outer suction nozzle mount pad 55, and outer suction nozzle mount pad 55 and the power take off end fixed connection of external force accuse voice coil motor 57. The outer suction nozzle mounting seat lifting slide block is slidably embedded in the outer suction nozzle mounting seat lifting slide groove, and the outer force control voice coil motor 57 can drive the outer suction nozzle mounting seat 55 to slide up and down relative to the outer suction nozzle mounting seat lifting slide groove, so that the outer suction nozzle 56 is driven to vertically lift. The external force control voice coil motor 55 has a force control and pressure detection function, and the external force control voice coil motor 55 drives the external suction nozzle 56 to press down with a set force; when the external force-controlled voice coil motor 55 detects that the pressure applied to the wafer reaches the preset pressure, the external die bonding arm lifting driving mechanism 51 stops pressing the external suction nozzle 56, and die bonding is completed.
Specifically, referring to fig. 4 together, the internal die bonding unit includes an internal die bonding arm lifting driving mechanism 61, an internal lifting driving plate 62, a pull rod, an internal die bonding arm connecting plate, an internal die bonding arm 63, an internal die bonding arm lifting slider, an internal die bonding arm lifting sliding rail, an internal suction nozzle lifting original point sensor 64, an internal suction nozzle mounting seat 65, an internal suction nozzle 66, an internal force control voice coil motor 67, an internal suction nozzle mounting seat lifting slider and an internal suction nozzle mounting seat lifting sliding chute.
The power output end of the inner die fixing arm lifting driving mechanism 61 is fixedly connected with one end of the inner lifting driving plate 62, and the other end of the inner lifting driving plate 62 is fixedly connected with the top end of the pull rod. The bottom of pull rod and the lower connecting portion fixed connection of interior solid brilliant arm connecting plate, the one end of interior solid brilliant arm 63 and the one side fixed connection of interior solid brilliant arm connecting plate, the opposite side of interior solid brilliant arm connecting plate and interior solid brilliant arm lift slider fixed connection, interior solid brilliant arm lift slider slip cap is established on interior solid brilliant arm lift slide rail, interior solid brilliant arm lift slide rail is fixed on the another side of connecting seat 4.
The inner die bonding arm lifting driving mechanism 61 can drive the inner die bonding arm 63 to vertically lift. An inner nozzle lifting origin sensor 64 is installed outside the inner die bonding arm lifting driving mechanism 61 for detecting the origin height position of the inner nozzle 66.
The internal force control voice coil motor 67 is fixed on the internal die bonding arm 63, the internal suction nozzle mounting seat lifting sliding chute is fixedly connected with the internal die bonding arm 63, the internal suction nozzle mounting seat lifting sliding block is fixedly connected with the internal suction nozzle mounting seat 65, the internal suction nozzle 66 is fixed on the internal suction nozzle mounting seat 65, and the internal suction nozzle mounting seat 65 is fixedly connected with the power output end of the internal force control voice coil motor 67. The inner nozzle mount lifting slide block is slidably embedded in the inner nozzle mount lifting slide groove, and the inner force control voice coil motor 67 can drive the inner nozzle mount 65 to slide up and down relative to the inner nozzle mount lifting slide groove, so as to drive the inner nozzle 66 to vertically lift. The internal force control voice coil motor 67 has a force control and pressure detection function, and the internal force control voice coil motor 67 drives the internal suction nozzle 66 to press down with a set force; when the internal force control voice coil motor 67 detects that the pressure applied to the wafer reaches the preset pressure, the internal die bonding arm lifting driving mechanism 61 stops pressing the internal suction nozzle 66, and die bonding is completed.
Further, the outer die bonding arm 53 and the inner die bonding arm 63 are axially and symmetrically arranged along the rotating shaft of the rotary power mechanism 1, and one rotary power mechanism 1 can drive the outer die bonding arm 53 and the inner die bonding arm 63 to swing horizontally at the same time.
In summary, the external die bonding arm lifting driving mechanism 51 can independently drive the external die bonding arm 53 to vertically lift in a large range, and the external force-controlled voice coil motor 57 can independently drive the external suction nozzle 56 to vertically lift in a small range. The inner die bonding arm lifting driving mechanism 61 can independently drive the inner die bonding arm 63 to vertically lift in a large range, and the inner force control voice coil motor 67 can independently drive the inner suction nozzle 66 to vertically lift in a small range.
Compared with the traditional scheme of the linear die bonder with the force control device and the swing arm die bonder without the force control device, the swing arm type force-controllable double die bonder system of the embodiment has the following advantages:
1. because the force control voice coil motor is a tape force control device, the suction nozzle can be pressed down with set force in the die bonding process, the pressure applied to the wafer by the current suction nozzle can be detected in real time, and after the force control voice coil motor detects that the pressure borne by the wafer reaches the preset pressure, the force control voice coil motor can stop pressing down the suction nozzle to complete die bonding, thereby realizing quantification of die bonding pressure, controlling the die bonding pressure accurately, and controlling the thickness of the glue point after die bonding is completed with high precision.
2. The suction nozzle moves linearly in the vertical direction during the crystal suction and the crystal fixing, so that the crystal suction and the crystal fixing precision are improved.
3. The axial symmetrical arrangement of the two die bonding arms improves the stability of the two die bonding arms during high-speed rotation, and realizes the high-precision control of the wafer sucking position and the wafer bonding position.
4. The two die bonding arms are concentrically arranged and independently controlled to vertically move up and down, so that the die bonding efficiency and the stability of the die bonding position are greatly improved.
5. The two die bonding arms share one rotary power mechanism 1, so that the production part and assembly cost and the later maintenance cost of the client equipment are reduced.
In the present embodiment, a servo motor is used as the rotary power mechanism 1, and in other modes, other rotary mechanisms may be used. In this embodiment, the servo motor and the screw rod are adopted as the linear lifting driving mechanism of the die bonding arm, and in other modes, a cam mechanism, a linear motor, a voice coil, a hydraulic telescopic cylinder and other linear driving mechanisms can also be adopted.
The embodiment also provides a method for realizing force control die bonding by using the swing arm type force controllable die bonding system, which comprises the following steps:
A. the rotary power mechanism 1 drives the two die bonding arms to do rotary motion, the inner die bonding arm 63 is rotated above the wafer, and the inner suction nozzle 66 on the inner die bonding arm 63 is aligned with the wafer to be sucked; the outer die bonding arm 53 is positioned above the position where die bonding is needed;
B. the inner die bonding arm lifting driving mechanism 61 drives the inner suction nozzle 66 to move downwards to the upper surface of the wafer, after the inner suction nozzle 66 contacts the wafer, the inner force control voice coil motor 67 detects that the pressure of the inner suction nozzle 66 reaches a set value, the inner die bonding arm lifting driving mechanism 61 stops moving downwards, at the moment, the inner suction nozzle 66 generates vacuum to suck the wafer, and then the inner die bonding arm lifting driving mechanism 61 moves upwards to suck the wafer upwards;
C. the rotary power mechanism 1 drives the inner die bonding arm 63 and the outer die bonding arm 53 to simultaneously perform rotary motion, the outer die bonding arm 53 is rotated to the upper part of the wafer, and the outer suction nozzle 56 on the outer die bonding arm 53 is aligned with the wafer to be sucked; the outer die bonding arm 53 is positioned above the position where die bonding is needed;
D. the inner die bonding arm lifting driving mechanism 61 drives the inner suction nozzle 66 to move downwards to the upper part of an object to be die bonded, after the inner suction nozzle 66 drives the wafer to contact the surface of the object, the inner force control voice coil motor 67 detects that the pressure on the inner suction nozzle 66 reaches a set value, the inner die bonding arm lifting driving mechanism 61 stops moving downwards, at the moment, the inner suction nozzle 66 releases vacuum, the wafer is separated from the inner suction nozzle 66 and is fixed on the surface of the object to be die bonded, and then the inner die bonding arm lifting driving mechanism 61 moves upwards to lift the inner die bonding arm 63 and the inner suction nozzle 66 upwards;
E. the inner die bonding arm 63 bonds the die, and at the same time, the outer die bonding arm 53 drives the outer suction nozzle 56 to move downwards to the upper surface of the wafer under the drive of the outer die bonding arm lifting driving mechanism 61, after the outer suction nozzle 56 contacts the wafer, the outer force control voice coil motor 57 detects that the pressure on the outer suction nozzle 56 reaches a set value, the outer die bonding arm lifting driving mechanism 61 stops moving downwards, at the moment, the outer suction nozzle 56 generates vacuum to suck the wafer, and then the outer die bonding arm lifting driving mechanism 61 moves upwards to suck the wafer upwards;
F. the rotary power mechanism 1 drives the inner die bonding arm 63 and the outer die bonding arm 53 to do rotary motion, the inner die bonding arm 63 is rotated above the wafer, and the inner suction nozzle 66 on the inner die bonding arm 63 is aligned with the wafer to be sucked; the outer die bonding arm 53 is positioned above the position where die bonding is needed; the actions of A-E are repeated, so that the inner die bonding arm 63 and the outer die bonding arm 53 work continuously and alternately, the pressure of each wafer during suction and die bonding can be accurately controlled, and the die bonding force are ensured to be within the set range.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (9)
1. A swing arm type force-controllable die bonding system, a die bonding arm and a suction nozzle; the device is characterized by further comprising a rotary power mechanism, a die bonding arm lifting driving mechanism, a suction nozzle mounting seat and a force control voice coil motor; the die bonding arm is fixedly connected with a rotating shaft of the rotary power mechanism, the die bonding arm is fixedly connected with a power output end of the die bonding arm lifting driving mechanism, the rotary power mechanism can drive the die bonding arm to swing horizontally, and the die bonding arm lifting driving mechanism can drive the die bonding arm to vertically lift; the force control voice coil motor is fixed at the free end of the die bonding arm, the suction nozzle mounting seat is fixedly connected with the power output end of the force control voice coil motor, and the suction nozzle is fixed on the suction nozzle mounting seat; the force control voice coil motor has a force control and pressure detection function; and after the force-controlled voice coil motor detects that the pressure born by the wafer reaches the preset wafer pressure, the die bonding arm lifting driving mechanism stops pressing the suction nozzle to finish die bonding.
2. The swing arm type force controllable die attach system of claim 1, further comprising a base, said rotary power mechanism being secured to said base.
3. The swing arm type power controllable die bonding system according to claim 1, further comprising a nozzle mount lifting slide block and a nozzle mount lifting slide groove, wherein the nozzle mount lifting slide block is fixedly connected with the nozzle mount, the nozzle mount lifting slide groove is fixedly connected with the die bonding arm, and the power controllable voice coil motor can drive the nozzle mount lifting slide block to slide up and down relative to the nozzle mount lifting slide groove.
4. The swing arm type power-controllable die bonding system according to claim 1, further comprising a connecting seat, a die bonding arm lifting slide block and a die bonding arm lifting slide rail, wherein the top end of the connecting seat is fixedly connected with a rotating shaft of the rotating power mechanism; the die bonding arm is fixedly connected with the die bonding arm lifting slide block, and the die bonding arm lifting slide rail is fixedly connected with the connecting seat; the die bonding arm lifting driving mechanism can drive the die bonding arm lifting sliding block to slide up and down relative to the die bonding arm lifting sliding rail.
5. The swing arm type force controllable die attach system of claim 1, further comprising a nozzle lift home sensor for detecting a height position of said nozzle home.
6. The swing arm type force controllable die bonding system according to any one of claims 1 to 5, comprising at least one dual die bonding unit comprising two die bonding arm lifting driving mechanisms, two die bonding arms, two suction nozzle mounting seats, two force controllable voice coil motors and two suction nozzles; the two die bonding arms are axially and symmetrically arranged along the rotating shaft of the rotary power mechanism; the rotary power mechanism can drive the two die bonding arms to swing horizontally at the same time, and the two die bonding arm lifting driving mechanisms can independently drive the die bonding arms corresponding to the rotary power mechanism to vertically lift.
7. The swing arm type power controllable die bonding system according to claim 6, wherein the double die bonding units further comprise two lifting transmission plates, a pull rod and a hollow shaft sleeve, and the pull rod is movably arranged in the hollow shaft sleeve in a penetrating manner; the power output end of the die bonding arm lifting driving mechanism is fixedly connected with one end of a lifting driving plate, and the other end of the lifting driving plate is fixedly connected with one die bonding arm through the pull rod; the power output end of the other die bonding arm lifting driving mechanism is fixedly connected with one end of the other lifting driving plate, and the other end of the other lifting driving plate is fixedly connected with the other die bonding arm through the hollow shaft sleeve.
8. The swing arm type power controllable die bonding system according to claim 7, wherein the dual die bonding units further comprise two die bonding arm connecting plates, one end of one die bonding arm connecting plate is fixedly connected with one die bonding arm, the top of the other end extends to the outside to form an upper connecting part, and the upper connecting part is fixedly connected with the hollow shaft sleeve; one end of the other die bonding arm connecting plate is fixedly connected with the other die bonding arm, the bottom of the other end extends out of the lower connecting part, and the lower connecting part is fixedly connected with the pull rod.
9. A method for implementing force-controlled die bonding by using the swing arm type force-controlled die bonding system as claimed in claim 6, comprising the following steps:
A. the rotary power mechanism drives the two die bonding arms to do rotary motion, and the first die bonding arm is rotated to the upper part of the wafer, so that a first suction nozzle on the first die bonding arm is aligned with the wafer to be sucked; at this time, the second die bonding arm is positioned above the position where die bonding is needed;
B. the first die bonding arm lifting driving mechanism drives the first die bonding arm to drive the first suction nozzle to move downwards to the upper surface of the wafer, after the first suction nozzle contacts the wafer, the first force control voice coil motor detects that the pressure on the first suction nozzle reaches a set value, the first die bonding arm lifting driving mechanism stops moving downwards, at the moment, the first suction nozzle generates vacuum to suck the wafer, and then the first die bonding arm lifting driving mechanism moves upwards to suck the wafer upwards;
C. the rotary power mechanism drives the first die bonding arm and the second die bonding arm to simultaneously perform rotary motion, and the second die bonding arm is rotated to the upper part of the wafer, so that a second suction nozzle on the second die bonding arm is aligned with the wafer to be sucked; at this time, the second die bonding arm is positioned above the position where die bonding is needed;
D. the first die bonding arm lifting driving mechanism drives the first suction nozzle to move downwards to the position above an object to be die bonded, after the first suction nozzle drives the wafer to contact the surface of the object, the first force control voice coil motor detects that the pressure on the first suction nozzle reaches a set value, the first die bonding arm lifting driving mechanism stops moving downwards, at the moment, the first suction nozzle releases vacuum, the wafer is separated from the first suction nozzle and is fixed on the surface of the object to be die bonded, and then the first die bonding arm lifting driving mechanism moves upwards to lift the first die bonding arm and the first suction nozzle upwards;
E. the first die bonding arm is used for bonding the die, and simultaneously, the second die bonding arm drives the second suction nozzle to move downwards to the upper surface of the wafer under the drive of the second die bonding arm lifting driving mechanism, after the second suction nozzle contacts the wafer, the second force control voice coil motor detects that the pressure on the second suction nozzle reaches a set value, the second die bonding arm lifting driving mechanism stops moving downwards, at the moment, the second suction nozzle generates vacuum to suck the wafer, and then the second die bonding arm lifting driving mechanism moves upwards to suck the wafer upwards;
F. the rotary power mechanism drives the first die bonding arm and the second die bonding arm to do rotary motion, the first die bonding arm is rotated to the upper part of the wafer, and a first suction nozzle on the first die bonding arm is aligned with the wafer to be sucked; at this time, the second die bonding arm is positioned above the position where die bonding is needed; the actions of A-E are repeated, so that the first die bonding arm and the second die bonding arm work continuously and alternately, the pressure of each wafer during sucking and die bonding can be accurately controlled, and the die bonding force are ensured to be within the set range.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117238830A (en) * | 2023-10-23 | 2023-12-15 | 广州诺顶智能科技有限公司 | Flip-chip structure of die bonder |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117238830A (en) * | 2023-10-23 | 2023-12-15 | 广州诺顶智能科技有限公司 | Flip-chip structure of die bonder |
| CN117238830B (en) * | 2023-10-23 | 2024-04-02 | 广州诺顶智能科技有限公司 | Flip-chip structure of die bonder |
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