CN103915368A - Chip picking and placing device - Google Patents
Chip picking and placing device Download PDFInfo
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- CN103915368A CN103915368A CN201410132958.6A CN201410132958A CN103915368A CN 103915368 A CN103915368 A CN 103915368A CN 201410132958 A CN201410132958 A CN 201410132958A CN 103915368 A CN103915368 A CN 103915368A
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- chip
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- bearing
- absorbent module
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
Abstract
The invention provides a chip picking and placing device which comprises a chip adsorbing component, a cam transmission component, a Z-direction driving component, an air gap bearing, an air buffering component and a W-direction rotation driving component, wherein the cam transmission component comprises a cam lever and a cam which are connected, the Z-direction driving component is connected with the upper end of the cam lever and used for driving the chip adsorbing component fixed inside the cam to move vertically along the Z axis, the air buffering component is installed inside the cam and used for absorbing the impact force borne by the chip adsorbing component, the W-direction rotation driving component is connected to the lateral side of the chip adsorbing component and used for driving the chip adsorbing component to rotate in the W direction, the air gap bearing is located outside the chip adsorbing component and arranged at the lower end of the air buffering component in a sleeved mode, and the inner ring of the bearing is suspended by introducing air into the space between the inner ring and outer ring of the air gap bearing so that the chip adsorbing component can be assisted in rotation in the W direction. The device is simple and compact in structure, high in production efficiency and yield, long in service life, and high in working reliability.
Description
Technical field
The present invention relates to a kind of chip pick-and-place device, be specifically related to a kind of for the chip pickup in chip package process, the device that shifts and be placed with.
Background technology
Radio-frequency (RF) identification (RFID, Radio Frequency Identification), claim again electronic tag, radio frequency identification, it is a kind of communication technology, can identify specific objective and read and write related data by radio signals, and without setting up machinery between recognition system and specific objective or optics contacts.It is an information technology of tool future and application prospect in 21 century.
RFID label INLAY produces that equipment generally includes that substrate is carried, some glue, mount, hot pressing and five modules of detection, the function that mounts operation is the exactitude position that ensures chip and antenna, is indispensable important step.The chip pick-and-place device that mounts module takes off for chip is coiled from wafer, also being accurately placed with antenna bond pad point has the position of glue.Mount the key link of module as a whole set of sealed in unit, kinematic accuracy and rate request are high, but composition amount of parts and the degree of freedom are more, and relative motion is loaded down with trivial details, is the exploitation difficult point of whole chip encapsulating device.Wherein, chip pick-and-place device is one of important composition mounting module.
As Fig. 1, the total Z-direction of chip pick-and-place device and W be to two degrees of freedom, and major function is as Fig. 2, is placed with chip after being pick-up chip, correcting chip position and angle, arrival pad.
As shown in Figure 2, the motion flow of chip pick-and-place device: the suction nozzle of chip pickup moves downward along Z axis, in the time dropping to chip pickup height, vacuum generator is opened, and by chip sticking, suction nozzle resets and moves to apparent place; On adopt after figure depending on camera, carry out visual processes, calculate deviation post and the deviation angle of chip, suction nozzle rotates around Z axis, and angular deflection is proofreaied and correct; Then chip pick-and-place device is moved to patch location by XY worktable motion, and suction nozzle moves downward along Z axis, drops to while mounting height, and vacuum is closed, and malleation is opened, and chip is discharged into patch location, and malleation is closed, and suction nozzle resets; Last chip pick-and-place device returns to chip and supplies with position, prepares to mount next time.
Chip pick-and-place device is as the crucial execution unit that mounts module, its emphasis that is designed to mount module.According to the replaceable suction nozzle size of the size of chip, carry out the absorption of different size chip.Just, because the chip size of chip pick-and-place device effect is all less, be even less than 1mm*1mm, so Z-direction precision of rectilinear motion and the running accuracy of chip pick-and-place device are had relatively high expectations.In the work of chip pick-and-place device, be no matter Position Control and rotational angle control, the control of elliptical gear power, or structural design, all affect chip package reliability.The packaging efficiency of module is determined by kinetic characteristic, response time and the planning of module sequential of execution unit.
In the design of traditional chip pick-and-place device, Z-direction drives to be had the servomotor of employing to add screw mandrel module to carry out, because leading screw modular volume is larger, thus cause chip pick-and-place device assembly structure comparatively complicated, and the power of motor of selecting is larger, and total efficiency is lower.The straight-line type of drive of Z-direction, except conventional motor, also has solenoid actuated, as Chinese patent CN03113988,200910108476.6 and 200910108478.5 etc., the bad control of this class scheme response speed; Have air cylinder driven, as Chinese patent 200610089487.0, air cylinder driven is simple in structure, but pressure regulates and is difficult for, and pneumatic action has certain hysteresis quality conventionally, and response speed is fast not; And pneumatic actuator declines with larger speed, make to bear larger impulsive force in the process of chip and substrate contacts, affect chip package quality.
Part sealed in unit adopts the design of multiple chip pick-and-place devices, although improved to a certain extent efficiency, makes mechanical structure comparatively complicated, the performance of control element is put forward to excessive demand simultaneously; According to the operating mode demand to chip pickup, transfer in RFID, need to carry out personalized specific design.
Existing chip pick-and-place device is some problems of ubiquity also, as the wearing and tearing of picker shaft lower surface, cause suction nozzle can't suck; Picker shaft coordinates the wearing and tearing of endoporus with suction nozzle, cause gas leakage, inhales incessantly; The fatigue life of spring is low, and number of times that can be is by compression few, follows the string, little without mounting power or mounting power; The wearing and tearing of picker shaft bearing, lose precision.
Along with the extensive use of micro element and close distant element, present electronic product is had higher requirement to chip pick-and-place device picking up aspect precision.In industry, accuracy standard is the trend of 0.05mm (chip element) and 0.025mm (IC element).Chip pick-and-place device speed and precision are restrictions mutually, in many suction nozzles mounting device, pick up station fewer, and the speed of service is shaken less more slowly, and picking up precision can be higher; Pick up station more, the speed of picking up is just faster, and picking up precision can be lower.Speed, vision system that pickup velocity is mainly respectively produced to the speed of service, vacuum by sequential planning, chip pickup running part X, Y, Z are adopted the factor such as figure and image processing speed and are determined.Pick up precision and depend primarily on assembling and the precision of navigation system.
Summary of the invention
The object of the invention is for deficiency of the prior art, a kind of chip pick-and-place device is provided, simplify the structure, improve actual production efficiency and yields, long service life, functional reliability is high.
A kind of chip pick-and-place device, comprises chip absorbent module, cam drive assembly, Z-direction driven unit, air gap bearing, gas Buffer Unit and W rotary drive assembly;
Cam drive assembly comprises the cam lever and the cam that join, and the upper end of cam lever connects Z-direction driven unit, by Z-direction driven unit driving cam Z-direction rectilinear motion, thereby drives the chip absorbent module that is fixed on cam inside to move up and down along Z axis; Gas Buffer Unit is installed on cam inside, for absorbing impulsive force that chip absorbent module is subject to so that chip is carried out to preventing collision protection; W rotary drive assembly is connected in the side of chip absorbent module, for driving chip absorbent module along W to rotatablely moving, so that the chip of absorption is entangled to appearance leveling; Gap bearing is positioned at the outside of chip absorbent module and cover and is put in the lower end of gas Buffer Unit, and by importing gas between the inside and outside circle to air gap bearing, to make bearing inner race be suspended state, thereby companion chip absorbent module W is to rotatablely moving.
Further, described W rotary drive assembly comprises that W is to motor and magnetic transmission driving wheel and driven pulley, driving wheel connects the output shaft of W to motor, and driven pulley connects chip absorbent module, and W drives chip absorbent module W to rotatablely moving to motor by driving wheel, the driven pulley of magnetic drive.
Further, described gas Buffer Unit comprises gas buffer compression cylinder and degree adjustment valve, the upper end of gas buffer compression cylinder and cam forms gas cushion chamber, degree adjustment valve communicates with gas cushion chamber, gas buffer compression cylinder bottom face has groove for the input of air-flow, and when chip absorbent module is impacted, its band buffer compression cylinder of taking offence moves upward together, compression air chamber in gas buffer compression cylinder produces anti-force, thereby plays cushioning effect; Regulate the aperture size of degree adjustment valve, can carry out the adjusting of gas cushion chamber internal gas pressure, thereby realize the change of cushion effect.
Further, described air gap bearing is installed on the lower end of gas buffer compression cylinder, realizes the suspension of bearing inner race by the pressure air importing, and ensures the precisely rotation at a high speed of chip absorbent module; Air-gap shaft is contracted and is drawn together bearing inner race and bearing outer ring, bearing inner race cover is put in chip absorbent module, bearing outer ring inner surface coordinates with bearing inner race outer surface, between inside and outside circle, there is the gap for blowing air, this gap is communicated with the first gas-tpe fitting that is located at cam outside by the perforate on bearing outer ring, bearing outer ring outer surface and cam inner surface interference fit, the inner surface of bearing outer ring has 8 word air drains.
Further, described chip absorbent module comprises rotation major axis, taper adapter sleeve, nozzle body and the suction nozzle of the second gas-tpe fitting, hollow, the upper end of rotation major axis connects the second gas-tpe fitting, and the second gas-tpe fitting connects the gas tube orifice of external vacuum generator through cam sidewall; Nozzle body inserts the lower end of rotation major axis, and the upper end outer surface of nozzle body is processed with tapered thread vertical slot, and the inner ring of taper adapter sleeve is processed with the tapered thread being mated, thereby nozzle body is anchored on to rotation major axis lower end; The lower end of nozzle body connects suction nozzle.
Further, also comprise limit sensors and height sensor, be respectively used to height and the angle study of chip, so that the height of chip and angle control.
Further, also comprise fairlead, cover is put in the outside of described cam, and the surface of fairlead has gathering sill, and at the outer wall of cam, guide finger is installed, and it coordinates with the gathering sill of fairlead, to limit the rotation of cam, ensures the rectilinear motion of its Z direction.
Technique effect of the present invention is embodied in:
(1) the Z-direction transmission of chip pick-and-place device of the present invention, is realized by Z-direction driven unit driving cam transmission mechanism, fast response time, control convenience, compact conformation;
(2) be provided with air gap bearing, realize the suspension of inner ring by the pressure air importing in bearing bore, companion chip absorbent module is high-speed, pinpoint accuracy ground rotates, and ensures the accurate control that chip absorption end rotatablely moves, and realizes the leveling of chip and entangles appearance;
(3) gas buffer unit is installed on bearing upper end; adjustable opening size; in the time that pick process chips is subject to impacting; air chamber volume changes generation reaction force by compression; the impact of guarantee effect on chip is flexible, and chip is carried out to preventing collision protection, pick device itself also had to buffer protection function simultaneously; in the extension device life-span, ensure functional reliability.
(4), as optimal way, the transmission that W rotary drive assembly adopts Electric Machine Control non-contact type magnetic drive to be rotated, reduces axial installation accuracy requirement, has without advantages such as friction energy loss, stable drive, efficiency is high, reliability is high, overload protections.When work, driving wheel can drive driven pulley revolution by magneticaction, makes transmission keep fixing and rotates ratio, and allow in the axial direction principal and subordinate wheel to have certain dislocation (5～10mm), and therefore drive motors and driving wheel can independently be installed, and alleviate the load of Z axis motor.
(5) as optimal way, chip absorbent module adopts fluting holder to be fixed chip suction nozzle, and the link closely tapered tread on suction nozzle top of circular cone nut, is buckled on axle suction nozzle energy jail, ensures the reliability of the absorption of chip.
(6) as optimal way, limit sensors device is realized lower end Z axis rotary stopper, realizes chip rotation and entangles appearance function; Height sensor is realized the function of chip height study.Both pass to host computer by the information of collection and carry out the control of Z axis angle and height.
(7), as optimal way, cam is fixed in fairlead to ensure rectilinear motion accurately.
Generally speaking, the problems such as chip pick-and-place device of the present invention has solved that prior art is bulky, complex structure, efficiency are low, low precision, suction nozzle is not firm, reliability is not high, simplify the structure of pick and place device, volume obviously reduces, efficiency improves, in the useful life of elongated component, improve actual production efficiency and yields.
Brief description of the drawings
Fig. 1 is the degree of freedom schematic diagram of chip pick-and-place device;
Fig. 2 is the workflow diagram of chip pick-and-place device;
Fig. 3 is the tomograph of chip pick-and-place device of the present invention;
Fig. 4 is the three-dimensional structure exploded view of cam drive assembly;
Fig. 5 is the three-dimensional structure profile of cam;
Fig. 6 is the three-dimensional structure exploded view of air gap bearing;
Fig. 7 is the tomograph of air-gap shaft bearing outer-ring;
Fig. 8 is the three-dimensional structure exploded view of W rotary drive assembly;
Fig. 9 is the three-dimensional structure exploded view of chip absorbent module.
Wherein, in figure, be denoted as:
10-Z is to driven unit, 20-cam drive assembly, 21-cam lever, 22-fairlead, 23-cam, the cylindrical cam groove of 231-upper cavity, 232-middle part cavity, 233-cylindrical cavity, 24-degree adjustment valve, 25-base plate, 26-limit sensors, 30-air gap bearing, 31-sealing ring, 32-gas buffer compression cylinder, 33-bearing inner race, 34-bearing outer ring, 341-8 word gas, 342-perforate, 35-the first gas-tpe fitting, 40-W rotary drive assembly, 41-W is to motor, 42-motor cabinet, 43-driving wheel, 50-gas Buffer Unit, 60-chip absorbent module, 61-the second gas-tpe fitting, 62-Airtight gasket, 63-rotates major axis, 65-driven pulley, 66-taper adapter sleeve, 67-suction nozzle sealing ring, 68-nozzle body, 69-suction nozzle.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.In addition,, in each execution mode of described the present invention, involved technical characterictic just can combine mutually as long as do not form each other conflict.
Now preferred embodiment by reference to the accompanying drawings explanation the present invention.
As shown in Figure 3, chip pick-and-place device of the present invention mainly comprises Z-direction driven unit 10, cam drive assembly 20, air gap bearing 30, W rotary drive assembly 40, gas Buffer Unit 50 and chip absorbent module 60, and whole device is fixed on backboard.
Z-direction driven unit 10 comprises shaft coupling and Z-direction motor, and Z-direction motor connects cam drive assembly 20 by shaft coupling.
Referring to Figure 4 and 5, cam drive assembly 20 comprises the cam lever 21 and the cam 23 that join.When installation, cam lever 21 upper ends are connected with Z-direction motor by shaft coupling, and cam lever 21 lower ends coordinate with the cylindrical cam groove 231 of the upper cavity of cam 23, and cam 23 is fixed on base plate 25.Z-direction driven by motor cam lever 21 rotates, and the rotation of cam lever 21 is converted into moving up and down of cam 23, thereby drives the chip absorbent module being located thereon to move up and down along Z axis.If Fig. 4, Fig. 5 are the tomographs of cam 23, cam 23 is divided into three cavitys, and upper cavity is cylindrical cam groove 231, coordinates with cam lever 21; Cavity 232 bottom surfaces, middle part have two hole I and II, be connected into respectively the second gas-tpe fitting 61 and degree adjustment valve 24 is installed, bottom is divided into cylindrical cavity 233, air gap bearing 50 is installed fixing, top vestibule III is equipped with sealing ring 31, lower end is gas cushion chamber, is realized the isolation of intracavity gas by gas buffer compression cylinder 32.Set up fairlead 22 in the outside of cam 23, Surface Machining one gathering sill of fairlead 22, and at the outer wall of cam 23, guide finger is installed, it coordinates with the gathering sill of fairlead 22, limits the rotation of cylindrical cam, ensures the rectilinear motion of its Z direction.Guide finger can be the cylindrical of line contact, the spherical surface body shape of preferred point contact.
Gas Buffer Unit is installed on cam inside, for absorbing impulsive force that chip absorbent module is subject to so that chip is carried out to preventing collision protection.In general chip pick-and-place technique, can adopt the mode of bullet pad or spring to cushion, there is the problems such as rigidity is unadjustable, reliability is not high, and gas buffering method rigidity is regulatable, can be by regulating exhaust velocity, reach the object that changes rigidity, buffering effect, and there is good stability and vibration isolating effect.The present invention proposes a kind of preferred embodiments, concrete structure is referring to Fig. 6, gas Buffer Unit comprises gas buffer compression cylinder 32 and degree adjustment valve 24, degree adjustment valve 24 is installed in one of them hole of middle part cavity 232 of cam, gas buffer compression cylinder 32 is installed on rotation major axis 63 upper ends of chip absorbent module, forms cushion chamber with cam cavity of resorption 233 upper surfaces.Gas buffer compression cylinder 32 bottom surfaces have groove for the input of air-flow, and when chip absorbent module is impacted, its band buffer compression cylinder 32 of taking offence moves upward together, and the compression air chamber of gas buffer compression cylinder 32 produces anti-force, thereby plays cushioning effect; Degree adjustment valve 24 is installed in cam 23 internal holes II, communicates with gas cushion chamber.Regulate the size of degree adjustment valve 24, the adjustable gas flow that overflows, carries out the adjusting of the air pressure in chamber, thereby realizes the buffering under change and the different air pressure of cushion effect.The source of the gas of the gas buffer unit here comes from the gas of air gap bearing output, if consider, air pressure size is unstable, also can be in 232 chamber inner bottom part fluting ventilations separately.Cylindrical cavity 233 upper ends are extruded with a circular recess sealing ring 31 are housed, and buffer unit is carried out to hermetic seal.
Referring to Fig. 6 and 7, air gap bearing is installed on the lower end of gas buffer compression cylinder 32, air-gap shaft is contracted and is drawn together bearing inner race 33 and bearing outer ring 34, bearing inner race 33 covers are put in the outer surface of the rotation major axis 63 of chip absorbent module, bearing outer ring 34 inner surfaces coordinate with bearing inner race 33 outer surfaces, in, between outer ring, exist certain gap for blowing air, this gap is communicated with by the perforate 342 of offering on bearing outer ring 34 the first gas-tpe fitting 35 that is located at cam outside, outer ring 34 outer surfaces of air gap bearing and cam inner surface interference fit, the inner surface of bearing outer ring 34 has 8 word air drains 341, endless groove ensures that air-flow inflow has fixing direction and uniform, and can make air gap bearing enclose have stable draught head, in suspended state.Bearing seal pad 36 is for the sealing of air gap bearing bottom.
W rotary drive assembly is used for driving chip absorbent module along W to rotatablely moving, so that the chip of absorption is entangled to appearance leveling.Traditional rotary actuation scheme often adopts the transmission scheme of the contact such as gear drive, belt pulley transmission, complex structure, load are large and the axial installation accuracy of principal and subordinate's actuation mechanism is had relatively high expectations, and preferably driven by motor non-contact type magnetic drive rotation mode of the present invention, reduce axial installation accuracy requirement, allow the dislocation of principal and subordinate wheel in Z-direction has certain limit, therefore can depart from Z-direction driven unit installs separately, reduce Z axis motor and drive load, ensured to rotate the stable of ratio, and robust motion, reliability are higher.Concrete structure is referring to Fig. 8, and W rotary drive assembly comprises that W is to motor 41 and magnetic drive.W is fixed by screws on motor cabinet 42 to motor 41, is the actuator rotatablely moving.The driving wheel 43 of magnetic drive connects the output shaft of W to motor 41, the driven pulley 65 of magnetic drive connects the rotation major axis 63 of chip absorbent module, W drives the driving wheel 43 of magnetic drive to rotate to motor 41, driving wheel 43 drives driven pulley 65 to rotate, thereby drives the W of chip absorbent module to rotatablely move.
It is firm fixing that chip absorbent module adopts fluting holder to carry out chip absorption suction nozzle, avoids the wearing and tearing of suction nozzle lower surface and endoporus cause suction nozzle can't suck and leak gas.Referring to Fig. 9, chip absorbent module comprises rotation major axis 63, taper adapter sleeve 66, nozzle body 68 and the suction nozzle 69 of the second gas-tpe fitting 61, hollow.Second gas-tpe fitting 61 one end are connected with the upper end of rotation major axis 63, and the other end connects external vacuum generator through the hole I at cam 23 middle parts; The lower end that nozzle body 68 inserts rotation major axis 63, the upper end of nozzle body 68 has the vertical slot that outer surface is tapered thread, and it coordinates with the tapered thread of the inner ring of taper adapter sleeve 66, realizes adsorption element and is fastened on rotation major axis 63 lower ends; The lower end of nozzle body 68 connects suction nozzle 69.In order to ensure air-tightness, can between the rotation upper end of major axis 63 and the second gas-tpe fitting 61, lay Airtight gasket 62, separately establish suction nozzle sealing ring 67 and be positioned over the centre bore inside of nozzle body 68, while preventing work, leak gas.When work, vacuum is inputted the second gas-tpe fitting 61, produces negative pressure in tracheae, suction nozzle, realizes the absorption function of chip; Vacuum is cut off and is passed into malleation, and that realizes chip blows sheet function.Spacing shielding plate 64 coordinates with limit sensors 26, realizes the learning functionality of chip angle.
Also can, at the fixing limit sensors 26 of base plate 25 bottom righthand sides, realize the learning functionality of chip angle, and the information of collection be passed to host computer and carry out the control of angle, complete chip rotation and entangle appearance process.Near chip absorbent module place, height sensor is set, preferably proximity sensor, for gathering ten elevation informations while putting chip to complete highly control.
Described Z-direction motor can adopt the servomotor or the stepping motor that exchange to motor 41 with W, also can adopt direct current machine.
The motion flow of whole chip pick-and-place device is: Z-direction driven unit drives the suction nozzle of chip pickup to move downward along Z axis, and in the time dropping to chip pickup height, vacuum generator is opened, and by chip pick-up, suction nozzle resets and moves to apparent place; On adopt after figure depending on camera, carry out visual processes, calculate deviation post and the deviation angle of chip, W rotary drive assembly drives the suction nozzle major axes being fixed in air gap bearing to rotate around Z axis, and angular deflection is proofreaied and correct; Simultaneously whole chip pick-and-place device is with working table movement to patch location, and suction nozzle moves downward along Z axis, drop to height sensor default mount height time, vacuum is closed, malleation is opened, and chip is discharged into patch location, malleation is closed, suction nozzle resets; Chip pickup and being placed with in process, suction nozzle all may have certain impact power to chip, and now gas buffer unit inner chamber air compressing produces cushion effect, protection chip; Last chip pick-and-place device returns to chip and supplies with position, prepares to mount next time.
Those skilled in the art will readily understand; the foregoing is only preferred embodiment of the present invention; not in order to limit the present invention, all any amendments of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.
Claims (7)
1. a chip pick-and-place device, is characterized in that, comprises chip absorbent module, cam drive assembly, Z-direction driven unit, air gap bearing, gas Buffer Unit and W rotary drive assembly;
Cam drive assembly comprises the cam lever and the cam that join, and the upper end of cam lever connects Z-direction driven unit, by Z-direction driven unit driving cam Z-direction rectilinear motion, thereby drives the chip absorbent module that is fixed on cam inside to move up and down along Z axis; Gas Buffer Unit is installed on cam inside, for absorbing impulsive force that chip absorbent module is subject to so that chip is carried out to preventing collision protection; W rotary drive assembly is connected in the side of chip absorbent module, for driving chip absorbent module along W to rotatablely moving, so that the chip of absorption is entangled to appearance leveling; Air gap bearing is positioned at the outside of chip absorbent module and cover and is put in the lower end of gas Buffer Unit, and by importing gas between the inside and outside circle to air gap bearing, to make bearing inner race be suspended state, thereby companion chip absorbent module W is to rotatablely moving.
2. chip pick-and-place device according to claim 1, it is characterized in that, described W rotary drive assembly comprises that W is to motor (41) and magnetic transmission driving wheel (43) and driven pulley (65), driving wheel (43) connects the output shaft of W to motor (41), driven pulley (65) connects chip absorbent module, and W drives chip absorbent module W to rotatablely moving to motor (41) by driving wheel (43), the driven pulley (65) of magnetic drive.
3. chip pick-and-place device according to claim 1, it is characterized in that, described gas Buffer Unit comprises gas buffer compression cylinder (32) and degree adjustment valve (24), gas buffer compression cylinder (32) forms gas cushion chamber with the upper end of cam (23), degree adjustment valve (24) communicates with gas cushion chamber, gas buffer compression cylinder (32) bottom surface has the input of groove for air-flow, when chip absorbent module is impacted, its band buffer compression cylinder (32) of taking offence moves upward together, compression air chamber in gas buffer compression cylinder (32) produces anti-force, thereby play cushioning effect, regulate the aperture size of degree adjustment valve (24), can carry out the adjusting of gas cushion chamber internal gas pressure, thereby realize the change of cushion effect.
4. chip pick-and-place device according to claim 3, is characterized in that, described air gap bearing is installed on the lower end of gas buffer compression cylinder (32), realizes the suspension of bearing inner race by the pressure air importing, and ensures the precisely rotation at a high speed of chip absorbent module; Air-gap shaft is contracted and is drawn together bearing inner race (33) and bearing outer ring (34), bearing inner race (33) cover is put in chip absorbent module, bearing outer ring (34) inner surface and bearing inner race (33) outer surface matched in clearance, between inside and outside circle, there is the gap for blowing air, this gap is communicated with the first gas-tpe fitting (35) that is located at cam outside by the perforate (342) on bearing outer ring (34), bearing outer ring (34) outer surface and cam inner surface interference fit, the inner surface of bearing outer ring (34) has 8 word air drains.
5. according to the chip pick-and-place device described in claim 1 or 2 or 3 or 4, it is characterized in that, described chip absorbent module comprises rotation major axis (63), taper adapter sleeve (66), nozzle body (68) and the suction nozzle (69) of the second gas-tpe fitting (61), hollow, the upper end of rotation major axis (63) connects the second gas-tpe fitting (61), and the second gas-tpe fitting (61) is through the gas tube orifice that connects external vacuum generator; Nozzle body (68) inserts the lower end of rotation major axis (63), the upper end outer surface of nozzle body (68) is processed with tapered thread vertical slot, the inner ring of taper adapter sleeve (66) is processed with the tapered thread being mated, thereby nozzle body (68) is anchored on to rotation major axis (63) lower end; The lower end of nozzle body (68) connects suction nozzle (69).
6. according to the chip pick-and-place device described in claim 1 or 2 or 3 or 4, it is characterized in that, also comprise limit sensors and height sensor, be respectively used to height and the angle study of chip, so that the height of chip and angle control.
7. according to the chip pick-and-place device described in claim 1 or 2 or 3 or 4, it is characterized in that, also comprise fairlead (22), cover is put in the outside of described cam, the surface of fairlead (22) has gathering sill, and at the outer wall of cam (23), guide finger is installed, and it coordinates with the gathering sill of fairlead (22), with the rotation of restriction cam, ensure the rectilinear motion of its Z direction.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410132958.6A CN103915368B (en) | 2014-04-02 | 2014-04-02 | A kind of chip pick-and-place device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410132958.6A CN103915368B (en) | 2014-04-02 | 2014-04-02 | A kind of chip pick-and-place device |
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| CN103915368A true CN103915368A (en) | 2014-07-09 |
| CN103915368B CN103915368B (en) | 2016-08-31 |
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| CN105070670A (en) * | 2015-07-17 | 2015-11-18 | 北京中电科电子装备有限公司 | Bonding head device and chip packaging device |
| CN106711079A (en) * | 2017-02-24 | 2017-05-24 | 爱立发自动化设备（上海）有限公司 | Picking and placing device |
| CN108333537A (en) * | 2018-04-20 | 2018-07-27 | 成都工业学院 | The debugging apparatus and adjustment method of cast sensor for measurement of magnetic field |
| CN108391414A (en) * | 2018-01-29 | 2018-08-10 | 梁瑞城 | A kind of SPEED VISION flexible PCB placement equipment |
| CN108550548A (en) * | 2018-06-07 | 2018-09-18 | 江苏华兴激光科技有限公司 | A kind of depth of parallelism adjustable chip suction head apparatus in upside-down mounting metal bonding |
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| CN109037124A (en) * | 2018-09-30 | 2018-12-18 | 汕头大学 | A kind of large-size ultra-thin chip stage high speed stripping off device and its method |
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| CN111799212A (en) * | 2020-07-17 | 2020-10-20 | 王洪君 | Chip picking device |
| CN113053792A (en) * | 2019-12-27 | 2021-06-29 | 致茂电子(苏州)有限公司 | Rotatable buffer taking and placing device |
| CN113451480A (en) * | 2021-06-18 | 2021-09-28 | 深圳市炫鼎光电科技有限公司 | CSP LED die bonding and surface mounting process |
| CN113460674A (en) * | 2021-06-28 | 2021-10-01 | 大连佳峰自动化股份有限公司 | Chip pick-up head assembly and chip pick-up device |
| CN113692137A (en) * | 2021-10-22 | 2021-11-23 | 苏州联讯仪器有限公司 | Automatic chip mounter of communication chip |
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| CN108697045A (en) * | 2017-03-30 | 2018-10-23 | 韩华精密机械株式会社 | component holding head |
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| CN109037124A (en) * | 2018-09-30 | 2018-12-18 | 汕头大学 | A kind of large-size ultra-thin chip stage high speed stripping off device and its method |
| CN109037124B (en) * | 2018-09-30 | 2023-10-20 | 汕头大学 | Staged high-speed stripping device and method for large-size ultrathin chips |
| CN109588039A (en) * | 2019-01-22 | 2019-04-05 | 北京中电科电子装备有限公司 | A kind of rotation placement head mechanism |
| CN109979872A (en) * | 2019-03-27 | 2019-07-05 | 深圳市奈士迪技术研发有限公司 | A kind of pick device with anti-drop function for chip manufacture |
| CN109860093A (en) * | 2019-03-28 | 2019-06-07 | 深圳市奈士迪技术研发有限公司 | A kind of pick device with angle regulating function for chip manufacture |
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| CN113053792B (en) * | 2019-12-27 | 2024-03-12 | 致茂电子(苏州)有限公司 | Rotatable buffering taking and placing device |
| CN111563572A (en) * | 2020-05-15 | 2020-08-21 | 贵州中晟泰科智能技术有限公司 | Electronic tag and chip packaging structure thereof |
| CN111563572B (en) * | 2020-05-15 | 2023-09-08 | 中山恒达智能科技有限公司 | Electronic tag and chip packaging structure thereof |
| CN111799212A (en) * | 2020-07-17 | 2020-10-20 | 王洪君 | Chip picking device |
| CN111799212B (en) * | 2020-07-17 | 2022-09-20 | 河南辰芯科技有限公司 | Chip picking device |
| CN113451480A (en) * | 2021-06-18 | 2021-09-28 | 深圳市炫鼎光电科技有限公司 | CSP LED die bonding and surface mounting process |
| CN113460674B (en) * | 2021-06-28 | 2022-11-04 | 大连佳峰自动化股份有限公司 | Chip pick-up head assembly and chip pick-up device |
| CN113460674A (en) * | 2021-06-28 | 2021-10-01 | 大连佳峰自动化股份有限公司 | Chip pick-up head assembly and chip pick-up device |
| CN113692137B (en) * | 2021-10-22 | 2022-01-04 | 苏州联讯仪器有限公司 | Automatic chip mounter of communication chip |
| CN113692137A (en) * | 2021-10-22 | 2021-11-23 | 苏州联讯仪器有限公司 | Automatic chip mounter of communication chip |
| CN116864439A (en) * | 2023-09-04 | 2023-10-10 | 恩纳基智能科技无锡有限公司 | Chip adsorption mechanism based on air bearing |
| CN116864439B (en) * | 2023-09-04 | 2023-12-26 | 恩纳基智能科技无锡有限公司 | Chip adsorption mechanism based on air bearing |
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