CN102938983B - Suction nozzle, chip mounter with suction nozzle and mounting method of chip mounter - Google Patents
Suction nozzle, chip mounter with suction nozzle and mounting method of chip mounter Download PDFInfo
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- CN102938983B CN102938983B CN201210450595.1A CN201210450595A CN102938983B CN 102938983 B CN102938983 B CN 102938983B CN 201210450595 A CN201210450595 A CN 201210450595A CN 102938983 B CN102938983 B CN 102938983B
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Abstract
The invention discloses a chip mounter with a suction nozzle and a mounting method of the chip mounter. The chip mounter includes a main machine, a mounting head fixed on the main machine, and the suction nozzle installed on the mounting head for sucking a bare chip to be mounted. The suction nozzle comprises a sucking disk and a suction nozzle vacuum channel which is arranged on the outer surface of the bottom of the sucking disk, the suction nozzle vacuum channel penetrates into the bottom of the sucking disk to be communicated with the inside of the sucking disk, and at least one nick is formed on the edge of the sucking disk. The mounting head includes a fixed base fixed on the main machine, a ball screw with both ends housed in the fixed base, a sliding block sleeving the ball screw, a fixed piece with one end fixed on the sliding block, and a suction nozzle mounting base and a vacuumizing channel fixed on the other end of the fixed piece. The suction nozzle mounting base is used for housing the suction nozzle vacuum channel and is provided with a guide hole communicated with the suction nozzle vacuum channel. TH vacuumizing channel covers an opening of the guide hole. The impact force damaging the bare chip is not generated and the damage for the chip is avoided. The invention also discloses the mouting method of the chip mounter.
Description
Technical field
The present invention relates to and a kind of there is the chip mounter of suction nozzle and the attaching method of this chip mounter.
Background technology
In the bare chip attachment process of high density integrated circuit, attachment process to be drawn from GEL-PAK box by bare chip by the suction nozzle of its mounting head end by chip mounter and takes on the tram of the substrate of required attachment.
This suction nozzle is generally smooth, the smooth contact-making surface in a front end, a duct is offered at its center, by suction nozzle mount pad with vacuumize air flue and be connected, bare chip is sucked up by vacuumizing generation suction force when contacting bare chip, it is placed on substrate tram again and compresses, release vacuum, then blows down chip.But, along with the further increasing of integrated circuit density, often there is the key position such as circuit or air bridges in bare chip edge, suction nozzle flush edge, without pooling feature, when carrying out attachment action, if nozzle height corrects slightly error, suction nozzle can cause chip cracks and suction nozzle to damage with during larger impulsive force contact bare chip, smooth edge may collapse the air bridges pressure being in bare chip edge, thus puzzlement is caused to equipment user, reduce production efficiency, affect product reliability.
Summary of the invention
In view of this, be necessary that providing a kind of has the chip mounter of suction nozzle and the attaching method of this chip mounter, it can protect high density integrated circuit chip.
The present invention realizes like this, a kind of chip mounter, it suction nozzle for drawing bare chip to be mounted comprising main frame, fix mounting head on the host and be arranged on this mounting head, this bare chip to be mounted is housed in absorption packing box, this suction nozzle comprises sucker and is arranged on the apparent suction nozzle vacuum road of trying to get to the heart of a matter of this sucker, this suction nozzle vacuum road penetrates trying to get to the heart of a matter of this sucker and communicates with in this sucker, and the rim of this sucker is provided with at least one gap.This mounting head comprises: holder, and it is fixing on the host; Ball-screw, its two ends are housed in this holder and can rotate relative to this holder; Slide block, it to be set on this ball-screw and to be spirally connected with this ball-screw, and this ball-screw is moved along this ball-screw by this slide block of rotary actuation; Fixture, its one end is fixed on this slide block; Suction nozzle mount pad, it is fixed on the other end of this fixture, and this suction nozzle is fixed on this suction nozzle mount pad for accommodating this suction nozzle vacuum road by this suction nozzle mount pad, and this suction nozzle mount pad offers the guide hole communicated with this suction nozzle vacuum road; Vacuumize air flue, the opening of its this guide hole coated is to communicate with this suction nozzle vacuum road by this guide hole.
As the further improvement of such scheme, this mounting head also comprises:
Dynamometry elastic component, its one end is fixed on this fixture, and its other end is fixed on this sucker, and this fixture is connect in succession by this dynamometry elastic component and this interambulacrum;
Inductive switch, its one end is fixed on this fixture, and its other end can contact with this dynamometry elastic component when this dynamometry elastic component does not produce deformation.
As the further improvement of such scheme, this dynamometry elastic component is L-shaped.
As the further improvement of such scheme, this mounting head also comprises the balancing spring parallel with this ball-screw, and one end of this balancing spring is fixing on the host, and its other end is fixed on this fixture.
The present invention also discloses another kind of chip mounter, it suction nozzle for drawing bare chip to be mounted comprising main frame, fix mounting head on the host and be arranged on this mounting head, this bare chip to be mounted is housed in absorption packing box, this suction nozzle comprises sucker and is arranged on the apparent suction nozzle vacuum road of trying to get to the heart of a matter of this sucker, this suction nozzle vacuum road penetrates trying to get to the heart of a matter of this sucker and communicates with in this sucker, and the rim of this sucker is provided with at least one gap.This suction nozzle vacuum road and this sucker one-body molded.This mounting head comprises: holder, and it is fixing on the host; Ball-screw, its two ends are housed in this holder and can rotate relative to this holder; Slide block, it to be set on this ball-screw and to be spirally connected with this ball-screw, and this ball-screw is moved along this ball-screw by this slide block of rotary actuation; Fixture, its one end is fixed on this slide block; Suction nozzle mount pad, it is fixed on the other end of this fixture, and this suction nozzle is fixed on this suction nozzle mount pad for accommodating this suction nozzle vacuum road by this suction nozzle mount pad, and this suction nozzle mount pad offers the guide hole communicated with this suction nozzle vacuum road; Vacuumize air flue, the opening of its this guide hole coated is to communicate with this suction nozzle vacuum road by this guide hole.
As the further improvement of such scheme, this mounting head also comprises:
Dynamometry elastic component, its one end is fixed on this fixture, and its other end is fixed on this sucker, and this fixture is connect in succession by this dynamometry elastic component and this interambulacrum;
Inductive switch, its one end is fixed on this fixture, and its other end can contact with this dynamometry elastic component when this dynamometry elastic component does not produce deformation.
As the further improvement of such scheme, this dynamometry elastic component is L-shaped.
As the further improvement of such scheme, this mounting head also comprises the balancing spring parallel with this ball-screw, and one end of this balancing spring is fixing on the host, and its other end is fixed on this fixture.The present invention also discloses another chip mounter, it suction nozzle for drawing bare chip to be mounted comprising main frame, fix mounting head on the host and be arranged on this mounting head, this bare chip to be mounted is housed in absorption packing box, this suction nozzle comprises sucker and is arranged on the apparent suction nozzle vacuum road of trying to get to the heart of a matter of this sucker, this suction nozzle vacuum road penetrates trying to get to the heart of a matter of this sucker and communicates with in this sucker, and the rim of this sucker is provided with at least one gap.When the quantity of gap is multiple, gap is symmetric.This mounting head comprises: holder, and it is fixing on the host; Ball-screw, its two ends are housed in this holder and can rotate relative to this holder; Slide block, it to be set on this ball-screw and to be spirally connected with this ball-screw, and this ball-screw is moved along this ball-screw by this slide block of rotary actuation; Fixture, its one end is fixed on this slide block; Suction nozzle mount pad, it is fixed on the other end of this fixture, and this suction nozzle is fixed on this suction nozzle mount pad for accommodating this suction nozzle vacuum road by this suction nozzle mount pad, and this suction nozzle mount pad offers the guide hole communicated with this suction nozzle vacuum road; Vacuumize air flue, the opening of its this guide hole coated is to communicate with this suction nozzle vacuum road by this guide hole.
As the further improvement of such scheme, this mounting head also comprises:
Dynamometry elastic component, its one end is fixed on this fixture, and its other end is fixed on this sucker, and this fixture is connect in succession by this dynamometry elastic component and this interambulacrum;
Inductive switch, its one end is fixed on this fixture, and its other end can contact with this dynamometry elastic component when this dynamometry elastic component does not produce deformation.
As the further improvement of such scheme, this dynamometry elastic component is L-shaped.
As the further improvement of such scheme, this mounting head also comprises the balancing spring parallel with this ball-screw, and one end of this balancing spring is fixing on the host, and its other end is fixed on this fixture.
The invention still further relates to a kind of attaching method, it is applied to chip mounter, the suction nozzle for drawing bare chip to be mounted that this chip mounter comprises main frame, fixes mounting head on the host and be arranged on this mounting head, this bare chip to be mounted is housed in absorption packing box, this suction nozzle comprises sucker and is arranged on the apparent suction nozzle vacuum road of trying to get to the heart of a matter of this sucker, this suction nozzle vacuum road penetrates trying to get to the heart of a matter of this sucker and communicates with in this sucker, the rim of this sucker is provided with at least one gap, this mounting head comprises: holder, and it is fixing on the host; Ball-screw, its two ends are housed in this holder and can rotate relative to this holder; Slide block, it to be set on this ball-screw and to be spirally connected with this ball-screw, and this ball-screw is moved along this ball-screw by this slide block of rotary actuation; Fixture, its one end is fixed on this slide block; Suction nozzle mount pad, it is fixed on the other end of this fixture, and this suction nozzle is fixed on this suction nozzle mount pad for accommodating this suction nozzle vacuum road by this suction nozzle mount pad, and this suction nozzle mount pad offers the guide hole communicated with this suction nozzle vacuum road; Vacuumize air flue, the opening of its this guide hole coated is to communicate with this suction nozzle vacuum road by this guide hole.This attaching method comprises the steps:
Swing roller leading screw drives this slide block to move along this ball-screw, makes this suction nozzle near this absorption packing box;
When contacting the bare chip to be mounted in this absorption packing box when the sucker of this suction nozzle, and when there is deformation because of this bare chip to be mounted of this sucker pressure holding in this dynamometry elastic component, this dynamometry elastic component tilts and isolates with this inductive switch, and therefore this inductive switch is triggered and send triggering signal;
According to this triggering signal, control the movement of this slide block on this ball-screw preset distance;
Vacuumize air flue vacuumize to pick up this bare chip to be mounted to this suction nozzle by this.
As the further improvement of such scheme, this mounting head also comprises the balancing spring parallel with this ball-screw, and one end of this balancing spring is fixing on the host, and its other end is fixed on this fixture, and this balancing spring keeps the balance of this slide block by deformation.
Compared with prior art, suction nozzle, there is the chip mounter of this suction nozzle and the attaching method of this chip mounter avoids suction nozzle contact with key components such as bare chip air bridges thus produce the impulsive force destroying bare chip by the mode of the open and clear mouth of suction nozzle, avoid the damage to chip; Simultaneously by controlling the speed of ball-screw lifting, be down to fast in suction process after tolerance distance at a slow speed close to the bare chip in absorption packing box (i.e. GEL-PAK box), to be separated with dynamometry elastic component at inductive switch and to determine that suction nozzle end face contacts with chip surface, now, suction nozzle pole continues at a slow speed to press down, when the contact force that dynamometry elastic component measures arrives settings, vacuum is opened, and rises fast after drawing bare chip; Be placed with after being down to tolerance distance fast in process at a slow speed close to being placed with position, determine that suction nozzle end face contacts with chip surface when inductive switch is separated with dynamometry elastic component, now, then suction nozzle pole slow depression, stop vacuumizing when the contact force that dynamometry elastic component measures arrives settings, blow after placing bare chip and rise fast, while raising product yield, ensure that paster speed.
Accompanying drawing explanation
The partial sectional view of the chip mounter that Fig. 1 provides for embodiment of the present invention.
Fig. 2 is the structure for amplifying schematic diagram in Fig. 1.
Primary symbols illustrates: holder 1, ball-screw 2, slide block 3, balancing spring 4, fixture 5, dynamometry elastic component 6, inductive switch 7, suction nozzle mount pad 9, vacuumize air flue 10, gap 11, bare chip 12 to be mounted, suction nozzle vacuum road 13, main frame 14, sucker 15, protruding 16.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
This bare chip to be mounted, for the bare chip to be mounted in absorption packing box, is then placed on the position thus convenient attachment that need attachment, improves the accurate rate of attachment by the chip mounter that embodiment of the present invention provides.In the present embodiment, describe in detail for the process of bare chip to be mounted in absorption absorption packing box and illustrate.
See also Fig. 1 and Fig. 2, chip mounter comprising main frame 14, being fixed on the mounting head on this main frame 14 and being arranged on the suction nozzle 8 for drawing bare chip 12 to be mounted on this mounting head, and this bare chip 12 to be mounted is housed in absorption packing box (not shown).
Suction nozzle 8 comprises sucker 15 and suction nozzle vacuum road 13, what suction nozzle vacuum road 13 was arranged on this sucker 15 tries to get to the heart of a matter in appearance, suction nozzle vacuum road 13 penetrates trying to get to the heart of a matter and communicating with in sucker 15 of sucker 15, and in the present embodiment, sucker 15 and suction nozzle vacuum road 13 are formed in one structure.The rim of sucker 15 is provided with at least one gap 11, and when the quantity of gap 11 is multiple, gap 11 can symmetrically or mal-distribution.In the present embodiment, be illustrated for four gap 11, four gap 11 are symmetric.
This mounting head comprises holder 1, ball-screw 2, slide block 3, balancing spring 4, fixture 5, dynamometry elastic component 6, inductive switch 7, suction nozzle mount pad 9 and vacuumizes air flue 10.
Holder 1 is fixed on this main frame 14, ball-screw 2 two ends are housed in this holder 1, ball-screw 2 just can be driven to rotate by the motor (not shown) controlling to be connected with ball-screw 2, thus ball-screw 2 can rotate relative to this holder 1, in Fig. 1, illustrate only two parts of holder 1.
Slide block 3 to be set on this ball-screw 2 and to be spirally connected with this ball-screw 2, and this ball-screw 2 is moved along this ball-screw 2 by this slide block 3 of rotary actuation.
One end of fixture 5 is fixed on this slide block 3, and the other end of fixture 5 is fixed with dynamometry elastic component 6 and inductive switch 7.Dynamometry elastic component 6 extends along the direction of upright mounts 5, and its elongated end is fixed with suction nozzle mount pad 9.This suction nozzle 8 is fixed on this suction nozzle mount pad 9 for accommodating this suction nozzle vacuum road 13 by suction nozzle mount pad 9, thus fixture 5 is connected with this suction nozzle 8 indirectly by this dynamometry elastic component 6.This suction nozzle mount pad 9 offers the guide hole (sign) communicated with this suction nozzle vacuum road 13.
One end of inductive switch 7 is fixed on this fixture 5, and its other end can contact with this dynamometry elastic component 6 when this dynamometry elastic component 6 does not produce deformation.In the present embodiment, dynamometry elastic component 6 is all L-shaped with inductive switch 7, and dynamometry elastic component 6 is parallel with the main part of inductive switch 7, and inductive switch 7 contacts with dynamometry elastic component 6 by protruding 16.
Vacuumize the opening of air flue 10 this guide hole coated to be communicated with this suction nozzle vacuum road 13 by this guide hole.One end of balancing spring 4 is fixed on this main frame 14, and its other end is fixed on this fixture 5, and balancing spring 4 keeps the balance of this slide block 3 by deformation.
Chip mounter is when mounting, and the process of the bare chip 12 to be mounted in its absorption absorption packing box is as follows.
Swing roller leading screw 2 drives this slide block 3 to move along this ball-screw 2, makes this suction nozzle 8 near this absorption packing box.This is realized by the motor controlling swing roller leading screw 2, and the program of motor can by people for arranging.
When contacting the bare chip 12 to be mounted in this absorption packing box when the sucker 15 of this suction nozzle 8, and when there is deformation because of this bare chip 12 to be mounted of this sucker 15 pressure holding in this dynamometry elastic component 6, this dynamometry elastic component 6 tilts and isolates with this inductive switch 7, and therefore this inductive switch 7 is triggered and send triggering signal.
Balancing spring 4 keeps the balance of this slide block 3 by deformation.
According to this triggering signal, control the movement of this slide block 3 on this ball-screw 2 preset distance.This preset distance by experiment data obtains, its be the best of bare chip 12 to be mounted stressed time distance value.This triggering signal is sent to motor, and the rotating speed of motor and then control ball-screw 2, controls this preset distance indirectly.
Vacuumize air flue 10 vacuumize to pick up this bare chip to be mounted 12 to this suction nozzle 8 by this.The other end vacuumizing air flue 10 connects external equipment and realizes vacuumizing.
Compared with prior art, suction nozzle 8, there is the chip mounter of this suction nozzle 8 and the attaching method of this chip mounter avoid by the mode of the open and clear mouth of suction nozzle 11 key components such as the air bridges of suction nozzle 8 and bare chip 12 to be mounted contact thus produce the impulsive force destroying bare chip 12 to be mounted, avoid the damage to bare chip 12 to be mounted; Simultaneously by controlling the speed that ball-screw 2 is elevated, be down to fast in suction process after tolerance distance at a slow speed close to the bare chip 12 to be mounted in absorption packing box (i.e. GEL-PAK box), to be separated with dynamometry elastic component 6 at inductive switch 7 and to determine that suction nozzle 8 end face contacts with bare chip 12 surface to be mounted, now, suction nozzle 8 pole continues at a slow speed to press down, when the contact force that dynamometry elastic component 6 measures arrives settings, vacuum is opened, and rises fast after drawing bare chip 12 to be mounted; Be placed with after being down to tolerance distance fast in process at a slow speed close to being placed with position, determine that suction nozzle 8 end face contacts with bare chip 12 surface to be mounted when inductive switch 7 is separated with dynamometry elastic component 6, now, then suction nozzle 8 pole slow depression, stop vacuumizing when the contact force that dynamometry elastic component 7 measures arrives settings, blow after placing bare chip 12 to be mounted and rise fast, while raising product yield, ensure that paster speed.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (8)
1. a chip mounter, it suction nozzle for drawing bare chip to be mounted comprising main frame, fix mounting head on the host and be arranged on this mounting head, this bare chip to be mounted is housed in absorption packing box, this suction nozzle comprises sucker and is arranged on the apparent suction nozzle vacuum road of trying to get to the heart of a matter of this sucker, this suction nozzle vacuum road penetrates trying to get to the heart of a matter of this sucker and communicates with in this sucker, and the rim of this sucker is provided with at least one gap; It is characterized in that: this mounting head comprises:
Holder, it is fixing on the host;
Ball-screw, its two ends are housed in this holder and can rotate relative to this holder;
Slide block, it to be set on this ball-screw and to be spirally connected with this ball-screw, and this ball-screw is moved along this ball-screw by this slide block of rotary actuation;
Fixture, its one end is fixed on this slide block;
Suction nozzle mount pad, it is fixed on the other end of this fixture, and this suction nozzle is fixed on this suction nozzle mount pad for accommodating this suction nozzle vacuum road by this suction nozzle mount pad, and this suction nozzle mount pad offers the guide hole communicated with this suction nozzle vacuum road;
Vacuumize air flue, the opening of its this guide hole coated is to communicate with this suction nozzle vacuum road by this guide hole.
2. a chip mounter, it suction nozzle for drawing bare chip to be mounted comprising main frame, fix mounting head on the host and be arranged on this mounting head, this bare chip to be mounted is housed in absorption packing box, this suction nozzle comprises sucker and is arranged on the apparent suction nozzle vacuum road of trying to get to the heart of a matter of this sucker, this suction nozzle vacuum road penetrates trying to get to the heart of a matter of this sucker and communicates with in this sucker, and the rim of this sucker is provided with at least one gap; It is characterized in that: this suction nozzle vacuum road and this sucker one-body molded, this mounting head comprises:
Holder, it is fixing on the host;
Ball-screw, its two ends are housed in this holder and can rotate relative to this holder;
Slide block, it to be set on this ball-screw and to be spirally connected with this ball-screw, and this ball-screw is moved along this ball-screw by this slide block of rotary actuation;
Fixture, its one end is fixed on this slide block;
Suction nozzle mount pad, it is fixed on the other end of this fixture, and this suction nozzle is fixed on this suction nozzle mount pad for accommodating this suction nozzle vacuum road by this suction nozzle mount pad, and this suction nozzle mount pad offers the guide hole communicated with this suction nozzle vacuum road;
Vacuumize air flue, the opening of its this guide hole coated is to communicate with this suction nozzle vacuum road by this guide hole.
3. a chip mounter, it suction nozzle for drawing bare chip to be mounted comprising main frame, fix mounting head on the host and be arranged on this mounting head, this bare chip to be mounted is housed in absorption packing box, this suction nozzle comprises sucker and is arranged on the apparent suction nozzle vacuum road of trying to get to the heart of a matter of this sucker, this suction nozzle vacuum road penetrates trying to get to the heart of a matter of this sucker and communicates with in this sucker, the rim of this sucker is provided with at least one gap, when the quantity of gap is multiple, gap symmetrically or mal-distribution; It is characterized in that: this mounting head comprises:
Holder, it is fixing on the host;
Ball-screw, its two ends are housed in this holder and can rotate relative to this holder;
Slide block, it to be set on this ball-screw and to be spirally connected with this ball-screw, and this ball-screw is moved along this ball-screw by this slide block of rotary actuation;
Fixture, its one end is fixed on this slide block;
Suction nozzle mount pad, it is fixed on the other end of this fixture, and this suction nozzle is fixed on this suction nozzle mount pad for accommodating this suction nozzle vacuum road by this suction nozzle mount pad, and this suction nozzle mount pad offers the guide hole communicated with this suction nozzle vacuum road;
Vacuumize air flue, the opening of its this guide hole coated is to communicate with this suction nozzle vacuum road by this guide hole.
4. the chip mounter as described in claim 1 or 2 or 3, is characterized in that: this mounting head also comprises:
Dynamometry elastic component, its one end is fixed on this fixture, and its other end is fixed on this sucker, and this fixture is connect in succession by this dynamometry elastic component and this interambulacrum;
Inductive switch, its one end is fixed on this fixture, and its other end can contact with this dynamometry elastic component when this dynamometry elastic component does not produce deformation.
5. chip mounter as claimed in claim 4, is characterized in that: this dynamometry elastic component is L-shaped.
6. chip mounter as claimed in claim 4, is characterized in that: this mounting head also comprises the balancing spring parallel with this ball-screw, and one end of this balancing spring is fixing on the host, and its other end is fixed on this fixture.
7. an attaching method, it is applied to chip mounter as claimed in claim 4, it is characterized in that, it comprises the steps:
Swing roller leading screw drives this slide block to move along this ball-screw, makes this suction nozzle near this absorption packing box;
When contacting the bare chip to be mounted in this absorption packing box when the sucker of this suction nozzle, and when there is deformation because of this bare chip to be mounted of this sucker pressure holding in this dynamometry elastic component, this dynamometry elastic component tilts and isolates with this inductive switch, and therefore this inductive switch is triggered and send triggering signal;
According to this triggering signal, control the movement of this slide block on this ball-screw preset distance;
Vacuumize air flue vacuumize to pick up this bare chip to be mounted to this suction nozzle by this.
8. attaching method as claimed in claim 7, it is characterized in that: this mounting head also comprises the balancing spring parallel with this ball-screw, one end of this balancing spring is fixing on the host, and its other end is fixed on this fixture, and this balancing spring keeps the balance of this slide block by deformation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210450595.1A CN102938983B (en) | 2012-11-12 | 2012-11-12 | Suction nozzle, chip mounter with suction nozzle and mounting method of chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210450595.1A CN102938983B (en) | 2012-11-12 | 2012-11-12 | Suction nozzle, chip mounter with suction nozzle and mounting method of chip mounter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102938983A CN102938983A (en) | 2013-02-20 |
| CN102938983B true CN102938983B (en) | 2015-05-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210450595.1A Active CN102938983B (en) | 2012-11-12 | 2012-11-12 | Suction nozzle, chip mounter with suction nozzle and mounting method of chip mounter |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104485307A (en) * | 2014-09-30 | 2015-04-01 | 无锡市羊尖盛裕机械配件厂 | Material slice suction device |
| CN108714908A (en) * | 2018-05-20 | 2018-10-30 | 佛山市高芯科技服务有限公司 | A kind of automobile triangular window glass production feeding robot |
| CN109515004B (en) * | 2018-12-28 | 2020-05-05 | 北海绩迅电子科技有限公司 | Ink box chip mounter and chip mounting control method applied to ink box |
| CN110430691B (en) * | 2019-07-05 | 2020-12-25 | 深圳德森精密设备有限公司 | Wafer mounting apparatus and control method |
| CN110718485A (en) * | 2019-10-09 | 2020-01-21 | 深圳市盛世智能装备有限公司 | Material taking device and die bonder |
| CN117042437B (en) * | 2023-08-29 | 2024-06-18 | 翼龙半导体设备(无锡)有限公司 | Chip mounting mechanism and chip mounting method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201000881Y (en) * | 2006-12-28 | 2008-01-02 | 佛山市蓝箭电子有限公司 | Welding head pressure numerical control device for automatic die bonder |
| CN202353951U (en) * | 2011-11-30 | 2012-07-25 | 歌尔声学股份有限公司 | Chip mounter suction nozzle |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5147984B2 (en) * | 2011-11-12 | 2013-02-20 | 賢造 堀江 | Fine hole electric discharge machining apparatus and fine hole electric discharge machining method |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201000881Y (en) * | 2006-12-28 | 2008-01-02 | 佛山市蓝箭电子有限公司 | Welding head pressure numerical control device for automatic die bonder |
| CN202353951U (en) * | 2011-11-30 | 2012-07-25 | 歌尔声学股份有限公司 | Chip mounter suction nozzle |
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| CN102938983A (en) | 2013-02-20 |
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