CN202353951U - Chip mounter suction nozzle - Google Patents
Chip mounter suction nozzle Download PDFInfo
- Publication number
- CN202353951U CN202353951U CN2011204899579U CN201120489957U CN202353951U CN 202353951 U CN202353951 U CN 202353951U CN 2011204899579 U CN2011204899579 U CN 2011204899579U CN 201120489957 U CN201120489957 U CN 201120489957U CN 202353951 U CN202353951 U CN 202353951U
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- China
- Prior art keywords
- chip
- suction
- suction nozzle
- nozzle
- corners
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920001342 Bakelite® Polymers 0.000 claims abstract description 8
- 239000004637 bakelite Substances 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 9
- 238000009434 installation Methods 0.000 claims description 5
- 239000002994 raw material Substances 0.000 abstract description 5
- 239000012528 membrane Substances 0.000 abstract 4
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000010521 absorption reaction Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Abstract
The utility model discloses a chip mounter suction nozzle which comprises a connecting part with a hollow gas pipeline, wherein a suction nozzle part is mounted at one end of the connecting part; a suction head is arranged at the suction nozzle part to suck a chip; suction stands protruding outwards are arranged at four corners of the square end surface of the suction head; and vacuum suction holes in connection with the gas pipeline are respectively formed on the suction stands. According to the utility model, the vacuum suction holes are formed at four corners of the suction head, the nozzle only sucks the four corners of the chip rather than a membrane, so that the chip is prevented from being damaged; the boss structures are arranged at the corners, so that the membrane on the chip is arranged in the gap among the four lug bosses; the membrane is always in communication with the atmosphere, so that the over larger negative pressure is avoided, and further the membrane is prevented from being damaged; and the nozzle part is made of Bakelite which has better mechanical strength and smaller rigidity, and is easy to manufacture, the bonding pad of the chip is prevented from being damaged by press during sucking the chip, and the utilization ratio of the raw material is improved.
Description
Technical field
The utility model relates to PCB wiring board patch device, relates in particular to a kind of chip mounter suction nozzle.
Background technology
In the prior art, the suction nozzle that pasting chip is used generally adopts the single hole suction nozzle of wolfram steel material, and during chip attachment, suction nozzle adsorbs chip and chip is moved on the pcb board corresponding position and mounts.
When carrying out the mounting of MEMS chip owing to have diaphragm on the MEMS chip, when the absorption chip, if the absorption position of inhaling the hole and diaphragm too near or directly be drawn onto diaphragm, can make diaphragm breakage; When the absorption chip, because the material of suction nozzle is a wolfram steel, the hardness of wolfram steel is higher; Therefore in the process of absorption chip, the phenomenon that chip bonding pad is weighed wounded often appears, more than several kinds of phenomenons; The capital is damaged the MEMS chip and can't normally be used, and has caused a large amount of raw-material wastes.Therefore, the suction nozzle of bonding equipment is improved accordingly imperative.
Summary of the invention
The utility model technical problem to be solved is: a kind of chip mounter suction nozzle is provided, and this chip mounter suction nozzle can prevent that chip from because of the breakage that the absorption of suction nozzle causes, improving raw-material utilance.
For solving the problems of the technologies described above; The technical scheme of the utility model is: chip mounter suction nozzle; Comprise a connecting portion with gas path pipe of hollow, an end of said connecting portion is equipped with nozzle section, and said nozzle section is provided with the suction nozzle that is used to adsorb chip; The end surface shape of said suction nozzle is square and four bights of suction nozzle end face are provided with outwards outstanding suction platform, is respectively equipped with the vacuum that is connected with said gas path pipe on the said suction platform and inhales the hole.
As a kind of improvement, said nozzle section is the nozzle section of bakelite material.
As a kind of improvement, also be provided with the limiting stand of the said suction nozzle of restriction installation site on the said connecting portion.
Owing to adopted technique scheme, when drawing the MEMS chip, the utility model is inhaled the hole owing to be provided with vacuum in four bights of suction nozzle; Avoided the position of chip upper diaphragm, avoided being adsorbed onto diaphragm and cause chip to damage, and the bight is provided with the structure of boss; Surrounded a umbilicate gap between four boss; The position of chip upper diaphragm is in four gaps between the boss, and diaphragm communicates with atmospheric pressure all the time, has avoided in adsorption process; Because negative pressure is too big, makes diaphragm impaired.
Because nozzle section is the nozzle section of bakelite material, the bakelite material have higher mechanical strength and hardness less, be easy to processing and fabricating, when drawing chip, bonding pads is weighed wounded, improved raw-material utilance.
Owing to be provided with the installation that limiting stand has made things convenient for suction nozzle on the connecting portion.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the utility model is further specified.
Fig. 1 is the structural representation of the utility model embodiment;
Fig. 2 is the structure cutaway view of the utility model embodiment;
Fig. 3 is the right view of Fig. 1;
Among the figure: the 1-nozzle section; The 11-suction nozzle; 111-inhales platform; The 112-vacuum is inhaled the hole; The 2-connecting portion; The 21-gas path pipe; The 22-limiting stand.
Embodiment
Shown in Fig. 1, Fig. 2 and Fig. 3 were common, chip mounter suction nozzle comprised nozzle section 1 and connecting portion 2; Connecting portion 2 has the gas path pipe 21 of a hollow; One end of connecting portion 2 is fixedly connected with nozzle section 1, and the other end is used for being connected with vaccum suction pipe, and gas path pipe 21 is communicated with vaccum suction pipe.
Nozzle section 1 is provided with the suction nozzle 11 that is used to adsorb chip; The end surface shape of suction nozzle 11 is square and four bights of suction nozzle 11 end faces are provided with outwards outstanding suction platform 111; Inhale and be respectively equipped with the vacuum suction hole 112 that is connected with gas path pipe 21 on the platform 111; When drawing chip, vacuum suction hole 112 holds four jiaos of chip.
For prevent that chip from being weighed wounded in absorption, nozzle section 1 is the nozzle section of the less bakelite material of hardness.
Also be provided with the limiting stand 22 of restriction suction nozzle installation site on the connecting portion 2.
When drawing the MEMS chip, the utility model is inhaled the hole owing to be provided with vacuum in four bights of suction nozzle, and suction nozzle only adsorbs four jiaos of chip; Avoided the position of chip upper diaphragm, avoided being adsorbed onto diaphragm and cause chip to damage, and the bight is provided with the structure of boss; Surrounded a umbilicate gap between four boss; The position of chip upper diaphragm is in four gaps between the boss, and diaphragm communicates with atmospheric pressure all the time, has avoided in adsorption process; Because negative pressure is too big, makes diaphragm impaired.
Because nozzle section is the nozzle section of bakelite material, the bakelite material have higher mechanical strength and hardness less, be easy to processing and fabricating, when drawing chip, bonding pads is weighed wounded, improved raw-material utilance.
Owing to be provided with the installation that limiting stand has made things convenient for suction nozzle on the connecting portion.
More than show and described basic principle of the utility model and the advantage of principal character and the utility model.The technical staff of the industry should understand; The utility model is not restricted to the described embodiments; Under the prerequisite that does not break away from the utility model spirit and scope, the utility model also has various changes and modifications, and these variations and improvement all fall in the utility model scope that requires protection.The utility model protection defined by the appended claims and their equivalents defined
.
Claims (3)
1. chip mounter suction nozzle; Comprise a connecting portion with gas path pipe of hollow; One end of said connecting portion is equipped with nozzle section; It is characterized in that: said nozzle section is provided with the suction nozzle that is used to adsorb chip, and the end surface shape of said suction nozzle is square and four bights of suction nozzle end face are provided with outwards outstanding suction platform, is respectively equipped with the vacuum that is connected with said gas path pipe on the said suction platform and inhales the hole.
2. chip mounter suction nozzle as claimed in claim 1 is characterized in that: said nozzle section is the nozzle section of bakelite material.
3. chip mounter suction nozzle as claimed in claim 1 is characterized in that: the limiting stand that also is provided with the said suction nozzle of restriction installation site on the said connecting portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204899579U CN202353951U (en) | 2011-11-30 | 2011-11-30 | Chip mounter suction nozzle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204899579U CN202353951U (en) | 2011-11-30 | 2011-11-30 | Chip mounter suction nozzle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202353951U true CN202353951U (en) | 2012-07-25 |
Family
ID=46542904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204899579U Expired - Lifetime CN202353951U (en) | 2011-11-30 | 2011-11-30 | Chip mounter suction nozzle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202353951U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102928283A (en) * | 2012-11-15 | 2013-02-13 | 苏州华碧微科检测技术有限公司 | Transfer method of unpacked microchip |
| CN102938983A (en) * | 2012-11-12 | 2013-02-20 | 中国电子科技集团公司第三十八研究所 | Suction nozzle, chip mounter with suction nozzle and mounting method of chip mounter |
| CN104485307A (en) * | 2014-09-30 | 2015-04-01 | 无锡市羊尖盛裕机械配件厂 | Material slice suction device |
| CN107979970A (en) * | 2017-11-13 | 2018-05-01 | 北京七星华创微电子有限责任公司 | A kind of chip chip mounter and chip pasting method |
| CN109494181A (en) * | 2018-11-12 | 2019-03-19 | 中国科学院长春光学精密机械与物理研究所 | A kind of microchip shifts the manufacturing process of suction nozzle and transfer suction nozzle |
| CN110391166A (en) * | 2018-04-19 | 2019-10-29 | 苏州固锝电子股份有限公司 | Chip transmitting device for integrated circuit |
| CN110394624A (en) * | 2019-08-19 | 2019-11-01 | 浙江舜宇光学有限公司 | Component suction nozzle |
-
2011
- 2011-11-30 CN CN2011204899579U patent/CN202353951U/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102938983A (en) * | 2012-11-12 | 2013-02-20 | 中国电子科技集团公司第三十八研究所 | Suction nozzle, chip mounter with suction nozzle and mounting method of chip mounter |
| CN102938983B (en) * | 2012-11-12 | 2015-05-06 | 中国电子科技集团公司第三十八研究所 | Suction nozzle, chip mounter with suction nozzle and mounting method of chip mounter |
| CN102928283A (en) * | 2012-11-15 | 2013-02-13 | 苏州华碧微科检测技术有限公司 | Transfer method of unpacked microchip |
| CN104485307A (en) * | 2014-09-30 | 2015-04-01 | 无锡市羊尖盛裕机械配件厂 | Material slice suction device |
| CN107979970A (en) * | 2017-11-13 | 2018-05-01 | 北京七星华创微电子有限责任公司 | A kind of chip chip mounter and chip pasting method |
| CN110391166A (en) * | 2018-04-19 | 2019-10-29 | 苏州固锝电子股份有限公司 | Chip transmitting device for integrated circuit |
| CN109494181A (en) * | 2018-11-12 | 2019-03-19 | 中国科学院长春光学精密机械与物理研究所 | A kind of microchip shifts the manufacturing process of suction nozzle and transfer suction nozzle |
| CN110394624A (en) * | 2019-08-19 | 2019-11-01 | 浙江舜宇光学有限公司 | Component suction nozzle |
| CN110394624B (en) * | 2019-08-19 | 2024-03-26 | 浙江舜宇光学有限公司 | Suction nozzle assembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200612 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120725 |