CN102928283A - Transfer method of unpacked microchip - Google Patents
Transfer method of unpacked microchip Download PDFInfo
- Publication number
- CN102928283A CN102928283A CN2012104589590A CN201210458959A CN102928283A CN 102928283 A CN102928283 A CN 102928283A CN 2012104589590 A CN2012104589590 A CN 2012104589590A CN 201210458959 A CN201210458959 A CN 201210458959A CN 102928283 A CN102928283 A CN 102928283A
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- China
- Prior art keywords
- microchip
- chip
- micro chip
- transfer method
- clean
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Abstract
The invention provides a transfer method of an unpacked microchip, which comprises the following steps: A, the unpacked microchip is put into a beaker containing a cleaning agent for ultrasonic cleaning; B, after the ultrasonic cleaning is accomplished, a suction tube is used to suck the microchip in the cleaning agent, and the microchip is put on a glass slide; and C, after the cleaning agent on the microchip is volatilized, metallographic observation can be performed. According to the transfer method, the chip and the cleaning agent are sucked by the suction tube, and the chip is fixed in the suction tube by the tension of liquid. With the adoption of the method, the microchip can be transferred to other places safely and completely, and the accuracy and the reliability of unpacking and metallographic analysis of components are improved effectively.
Description
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Technical field
The present invention relates to a kind of failure analysis method of chip, particularly a kind of transfer method of the rear micro chip that breaks a seal.
Background technology
Kaifeng is when carrying out failure analysis, open the common method that the capsulation material of plastic device carries out internal check, analysis, its principle is to use some acid to remove the capsulation material that covers chip surface, makes chip exposed out, thereby carries out follow-up detection, analysis.For mini component, usually break a seal fully, the surperficial capsulation material that is about to mini component all erodes, so that the inner structure of components and parts is fully exposed out, the components and parts behind the Kaifeng are referred to as chip.Micro chip behind the Kaifeng all needs to clean usually; common chip usually adopts the mode of tweezers gripping that chip is transferred in the beaker and cleans; but for micro chip; because itself is more crisp, cracked easily; therefore in using tweezers gripping process, often can produce damage, so; for the transfer of chip behind the mini component Kaifeng, inapplicable tweezers gripping.
Therefore, how splitting the micro chip of being honored as a queen shifts safely and effectively and becomes the problem that the failure analysis field need to solve.
Summary of the invention
In order to solve the problem of using tweezers gripping micro chip to shift easy defective chip, the present invention proposes following technical scheme:
A kind of transfer method of the rear micro chip that breaks a seal, the method may further comprise the steps:
A, the good micro chip that will break a seal place the beaker that is placed with clean-out system to carry out Ultrasonic Cleaning;
After B, Ultrasonic Cleaning are finished, use the micro chip in the suction pipe absorption clean-out system, place on the microslide;
C, after the clean-out system on micro chip volatilization, can carry out metallographic observation.
As a preferred embodiment of the present invention, the suction pipe among the described step B is plastic material.
The beneficial effect that the present invention brings is: the inventive method uses suction pipe that chip is drawn together with clean-out system, tension force by liquid is fixed on chip in the suction pipe, by the method can be with micro chip safety, intactly transfer to other places, Effective Raise accuracy and the reliability of components and parts Kaifeng, metallographic examination.
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Embodiment
The below is described in detail preferred embodiment of the present invention, thereby so that advantages and features of the invention can be easier to be it will be appreciated by those skilled in the art that protection scope of the present invention is made more explicit defining.
Present embodiment breaks a seal fully to a mini component, and the die size behind the Kaifeng is 3mm * 3mm, by the inventive method this micro chip is shifted, and step is as follows:
A, the good micro chip that will break a seal place the beaker that is placed with clean-out system to carry out Ultrasonic Cleaning;
After B, Ultrasonic Cleaning are finished, use the micro chip in the suction pipe absorption clean-out system, place on the microslide, suction pipe that this place uses is plastic material;
C, after the clean-out system on micro chip volatilization, can carry out metallographic observation.
Through the enforcement of present embodiment, the micro chip behind the Kaifeng has been transferred on the microslide in good condition, has avoided using the tweezers gripping situation that chip gripper is bad, has improved chip Kaifeng, has detected accuracy and the reliability analyzed.
The above; it only is the specific embodiment of the present invention; but protection scope of the present invention is not limited to this; any those of ordinary skill in the art are in the disclosed technical scope of the present invention; variation or the replacement that can expect without creative work all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain that claims were limited.
Claims (2)
1. the transfer method of micro chip behind Kaifeng, it is characterized in that: the method may further comprise the steps:
A, the good micro chip that will break a seal place the beaker that is placed with clean-out system to carry out Ultrasonic Cleaning;
After B, Ultrasonic Cleaning are finished, use the micro chip in the suction pipe absorption clean-out system, place on the microslide;
C, after the clean-out system on micro chip volatilization, can carry out metallographic observation.
2. the transfer method of a kind of rear micro chip that breaks a seal according to claim 1, it is characterized in that: the suction pipe among the described step B is plastic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104589590A CN102928283A (en) | 2012-11-15 | 2012-11-15 | Transfer method of unpacked microchip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104589590A CN102928283A (en) | 2012-11-15 | 2012-11-15 | Transfer method of unpacked microchip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102928283A true CN102928283A (en) | 2013-02-13 |
Family
ID=47643136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012104589590A Pending CN102928283A (en) | 2012-11-15 | 2012-11-15 | Transfer method of unpacked microchip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102928283A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108767092A (en) * | 2018-07-17 | 2018-11-06 | 佛山市国星半导体技术有限公司 | A kind of method and apparatus of batch transfer MicroLED chips |
| CN113252427A (en) * | 2021-04-30 | 2021-08-13 | 苏试宜特(深圳)检测技术有限公司 | Method for removing heat dissipation cover without introducing external hard force |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3662886A (en) * | 1970-02-05 | 1972-05-16 | Catalyst Services Inc | Handling apparatus for particulate dry product |
| JP2671209B2 (en) * | 1987-12-09 | 1997-10-29 | エーザイ株式会社 | Tablet pneumatic transport device |
| CN102419336A (en) * | 2011-08-16 | 2012-04-18 | 上海华碧检测技术有限公司 | Unpackaging method for tiny components |
| CN202353951U (en) * | 2011-11-30 | 2012-07-25 | 歌尔声学股份有限公司 | Chip mounter suction nozzle |
-
2012
- 2012-11-15 CN CN2012104589590A patent/CN102928283A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3662886A (en) * | 1970-02-05 | 1972-05-16 | Catalyst Services Inc | Handling apparatus for particulate dry product |
| JP2671209B2 (en) * | 1987-12-09 | 1997-10-29 | エーザイ株式会社 | Tablet pneumatic transport device |
| CN102419336A (en) * | 2011-08-16 | 2012-04-18 | 上海华碧检测技术有限公司 | Unpackaging method for tiny components |
| CN202353951U (en) * | 2011-11-30 | 2012-07-25 | 歌尔声学股份有限公司 | Chip mounter suction nozzle |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108767092A (en) * | 2018-07-17 | 2018-11-06 | 佛山市国星半导体技术有限公司 | A kind of method and apparatus of batch transfer MicroLED chips |
| CN113252427A (en) * | 2021-04-30 | 2021-08-13 | 苏试宜特(深圳)检测技术有限公司 | Method for removing heat dissipation cover without introducing external hard force |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| ASS | Succession or assignment of patent right |
Owner name: SHANGHAI FAILURE ANALYSIS LABORATORY CO., LTD. Free format text: FORMER OWNER: SUZHOU FALAB FAILURE ANALYSIS LAB CO., LTD. Effective date: 20131015 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 215024 SUZHOU, JIANGSU PROVINCE TO: 200433 YANGPU, SHANGHAI |
|
| TA01 | Transfer of patent application right |
Effective date of registration: 20131015 Address after: 200433, room 3, building 300, No. 105 East National Road, Shanghai, Yangpu District Applicant after: Shanghai Failure Analysis Laboratory Co., Ltd. Address before: Gangtian Road Industrial Park in Suzhou city of Jiangsu Province, No. 99 215024 Applicant before: Suzhou Falab Failure Analysis Laboratory Co., Ltd. |
|
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130213 |