CN102928281A - Unpacking method for components - Google Patents
Unpacking method for components Download PDFInfo
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- CN102928281A CN102928281A CN2012104594391A CN201210459439A CN102928281A CN 102928281 A CN102928281 A CN 102928281A CN 2012104594391 A CN2012104594391 A CN 2012104594391A CN 201210459439 A CN201210459439 A CN 201210459439A CN 102928281 A CN102928281 A CN 102928281A
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- components
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Abstract
The invention provides an unpacking method for components, which comprises the following steps that A, strip-shaped copper foil is manufactured; B, the components to be unpacked are welded on the surface of the copper foil; C, a prepared mixed solution of fuming nitric acid and concentrated sulfuric acid is heated to boil; D, the copper foil with the components is immerse into the boiling mixed solution of the fuming nitric acid and the concentrated sulfuric acid; and E, after the components are eroded, the components are put into a beaker containing an acetone solution, then the beaker is put into an ultrasonic cleaner for oscillation cleaning, and residues on the surfaces of the components are removed. The unpacking method solves the problems of lead rupture, shattering of chips and the like caused by removal of tin foil paper during the course of unpacking a tin foil paper parcel. With the adoption of the unpacking method, the unpacking is more complete. As no parcel with tin foil is adopted, the components can be better eroded by an acid solution, and the surfaces of the chips are cleaner. The method comprises simple steps, is convenient to operate, and can unpack the components simultaneously, and the working efficiency is improved greatly.
Description
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Technical field
The present invention relates to a kind of failure analysis method, particularly the method in a kind of components and parts Kaifeng.
Background technology
A kind of destructive detection method of commonly using when components and parts Kaifeng is failure analysis.Its principle is by using chemical method or physical method that the encapsulation on components and parts surface is removed, observing the lead-in wire connection of components and parts inside.At present, chemistry Kaifeng is as plastic packaging components and parts opening method commonly used, its method is to adopt masking foil that components and parts are wrapped up, components and parts after will wrapping up with tweezers place concentrated acid liquid to break a seal, but epoxy resin and some inner silica gel of components and parts itself of easily causing encapsulating the components and parts surface because of masking foil parcel components and parts stick on the masking foil in the process of Kaifeng, especially stick on the components and parts inner lead, be difficult to clean up; Behind masking foil parcel components and parts Kaifeng, the components and parts later stage takes pictures in the process, masking foil need to be removed, and removes and easily runs into lead-in wire and chip in the masking foil process, and it is caused certain damage, affects the judgement of test findings; In the process of Kaifeng, because the substrate that artificial technical reason is difficult to below the assurance component chip is not corroded, in case after the corrosion, when chip is more than two, and when on every components and parts the components and parts of very complicated routing being arranged all, remove masking foil after, components and parts are easy to fall apart, be difficult to guarantee the inner original appearance of components and parts, be not easy to failure cause and search; Components and parts Kaifeng with the masking foil parcel, need to open a fenestella at the routing of components and parts and the masking foil of chip area, allow components and parts routing the first solder joint, the second solder joint and chip expose fully, but because artificial technical reason, the size of windowing is difficult to control, and is too little if window is opened, required look-out station can not be fully exposed, otherwise too large if window is opened, components and parts fall apart when easily causing ultrasonic oscillation to clean.Because the Kaifeng that the chemical opening method of existing plastic packaging components and parts exists not exclusively, easily destroys the components and parts inner lead, the defect problem that easily causes that components and parts fall apart etc., therefore how to carry out quick, efficient, high-precision plastic packaging components and parts Kaifeng and becomes failure analysis field problem demanding prompt solution.
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Summary of the invention
Not exclusively, easily destroy the components and parts inner lead in order to solve Kaifeng that existing plastic packaging components and parts opening method exists, the defect problem that easily causes that components and parts fall apart etc., the present invention proposes following technical scheme:
A kind of components and parts opening method, the method may further comprise the steps:
A, making one strip Copper Foil;
B, the components and parts that needs are broken a seal are welded on copper foil surface;
C, fuming nitric aicd and the concentrated sulphuric acid mixed solution for preparing is heated to boiling;
D, immerse Copper Foil in the fuming nitric aicd and concentrated sulphuric acid mixed solution of boiling together with components and parts;
E, after components and parts etch, put into the beaker that fills acetone soln, again beaker is put into supersonic wave cleaning machine and shakes cleaning, the residue on components and parts surface is cleaned up.
As a preferred embodiment of the present invention, in components and parts when welding among the described step B, all pins of components and parts all are welded in copper foil surface.
As another kind of preferred version of the present invention, among the described step B, before components and parts welded, Copper Foil was put into first the weldability solder furnace and is carried out wetting.
As another preferred version of the present invention, the ratio of fuming nitric aicd and the concentrated sulphuric acid is 4:1 in the fuming nitric aicd for preparing among the described step C and the concentrated sulphuric acid mixed solution.
The beneficial effect that the present invention brings is:
1, the inventive method has effectively been avoided in the process of masking foil parcel Kaifeng, the wire breaking that the dismounting of masking foil causes and the chip problem such as fall apart;
2, the inventive method Kaifeng is more complete, owing to do not have the parcel of tinfoil paper, can be better by acid liquid corrosion, chip surface cleans more;
3, the inventive method step is simple, and convenient operation can carry out Kaifeng of a plurality of components and parts simultaneously, has greatly improved the efficient in components and parts Kaifeng.
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Embodiment
The below is described in detail preferred embodiment of the present invention, thereby so that advantages and features of the invention can be easier to be it will be appreciated by those skilled in the art that protection scope of the present invention is made more explicit defining.
A kind of components and parts opening method, the method may further comprise the steps:
A, making one strip Copper Foil, size is about 4cm*20cm;
B, Copper Foil is put into the weldability solder furnace first and carried out wettingly, 3 components and parts that again needs broken a seal are welded on copper foil surface;
The mixed liquor of C, preparation fuming nitric aicd and the concentrated sulphuric acid, the ratio preparation 500mL mixed solution according to fuming nitric aicd and concentrated sulphuric acid 4:1 is heated to boiling with the mixed solution for preparing;
D, clamp the edge of Copper Foil with tweezers, immerse Copper Foil in the fuming nitric aicd and concentrated sulphuric acid mixed solution of boiling together with components and parts;
E, after components and parts etch, put into the beaker that fills acetone soln, again beaker is put into supersonic wave cleaning machine and shakes cleaning, the residue on components and parts surface is cleaned up.
Through above step, the Kaifeng of having finished components and parts, through observing, the chip surface cleaning is clean, and noresidue breaks a seal effective, and 3 components and parts that broken a seal simultaneously, has greatly improved the efficient in Kaifeng, has further reduced the failure analysis cost.
The above; it only is the specific embodiment of the present invention; but protection scope of the present invention is not limited to this; any those of ordinary skill in the art are in the disclosed technical scope of the present invention; variation or the replacement that can expect without creative work all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain that claims were limited.
Claims (4)
1. components and parts opening method, it is characterized in that: the method may further comprise the steps:
A, making one strip Copper Foil;
B, the components and parts that needs are broken a seal are welded on copper foil surface;
C, fuming nitric aicd and the concentrated sulphuric acid mixed solution for preparing is heated to boiling;
D, immerse Copper Foil in the fuming nitric aicd and concentrated sulphuric acid mixed solution of boiling together with components and parts;
E, after components and parts etch, put into the beaker that fills acetone soln, again beaker is put into supersonic wave cleaning machine and shakes cleaning, the residue on components and parts surface is cleaned up.
2. a kind of components and parts opening method according to claim 1 is characterized in that: among the described step B during components and parts welding, all pins of components and parts all are welded in copper foil surface.
3. a kind of components and parts opening method according to claim 1, it is characterized in that: among the described step B, before components and parts welded, Copper Foil was put into first the weldability solder furnace and is carried out wetting.
4. a kind of components and parts opening method according to claim 1, it is characterized in that: the ratio of fuming nitric aicd and the concentrated sulphuric acid is 4:1 in the fuming nitric aicd for preparing among the described step C and the concentrated sulphuric acid mixed solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104594391A CN102928281A (en) | 2012-11-15 | 2012-11-15 | Unpacking method for components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104594391A CN102928281A (en) | 2012-11-15 | 2012-11-15 | Unpacking method for components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102928281A true CN102928281A (en) | 2013-02-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012104594391A Pending CN102928281A (en) | 2012-11-15 | 2012-11-15 | Unpacking method for components |
Country Status (1)
| Country | Link |
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| CN (1) | CN102928281A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104931513A (en) * | 2015-07-16 | 2015-09-23 | 四川蓝彩电子科技有限公司 | Method for checking internal circuit structure of encapsulated circuit components |
| CN105092326A (en) * | 2015-07-21 | 2015-11-25 | 中国工程物理研究院计量测试中心 | Unsealing method for flip-chip packaging device |
| CN105575764A (en) * | 2014-10-16 | 2016-05-11 | 北大方正集团有限公司 | Semiconductor device deblocking method |
| CN106644638A (en) * | 2016-12-16 | 2017-05-10 | 贵州航天计量测试技术研究所 | Unsealing method of small-sized molding wrapper |
| CN108275330A (en) * | 2017-01-05 | 2018-07-13 | 富士康(昆山)电脑接插件有限公司 | A kind of method of ceramic package component rapid open |
| CN113237726A (en) * | 2021-05-18 | 2021-08-10 | 青岛泰睿思微电子有限公司 | Method for observing semiconductor device unsealing sample |
| CN114476276A (en) * | 2021-12-29 | 2022-05-13 | 中国空间技术研究院 | Nondestructive unsealing method for axial lead diode chip |
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| CN102339732A (en) * | 2011-08-11 | 2012-02-01 | 上海华碧检测技术有限公司 | Method for quickly unsealing small component |
| CN102386055A (en) * | 2011-10-19 | 2012-03-21 | 广东步步高电子工业有限公司 | Chemical de-packaging method of plastic-packaged electronic component by using copper wire as connecting wire and preparation method of corrosive liquid used in chemical de-packaging method |
| CN102419336A (en) * | 2011-08-16 | 2012-04-18 | 上海华碧检测技术有限公司 | Unpackaging method for tiny components |
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2012
- 2012-11-15 CN CN2012104594391A patent/CN102928281A/en active Pending
Patent Citations (3)
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| CN102339732A (en) * | 2011-08-11 | 2012-02-01 | 上海华碧检测技术有限公司 | Method for quickly unsealing small component |
| CN102419336A (en) * | 2011-08-16 | 2012-04-18 | 上海华碧检测技术有限公司 | Unpackaging method for tiny components |
| CN102386055A (en) * | 2011-10-19 | 2012-03-21 | 广东步步高电子工业有限公司 | Chemical de-packaging method of plastic-packaged electronic component by using copper wire as connecting wire and preparation method of corrosive liquid used in chemical de-packaging method |
Non-Patent Citations (1)
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| 张素娟，李海岸: "新型塑封器件开封方法以及封装缺陷", 《半导体技术》 * |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105575764A (en) * | 2014-10-16 | 2016-05-11 | 北大方正集团有限公司 | Semiconductor device deblocking method |
| CN104931513A (en) * | 2015-07-16 | 2015-09-23 | 四川蓝彩电子科技有限公司 | Method for checking internal circuit structure of encapsulated circuit components |
| CN105092326A (en) * | 2015-07-21 | 2015-11-25 | 中国工程物理研究院计量测试中心 | Unsealing method for flip-chip packaging device |
| CN106644638A (en) * | 2016-12-16 | 2017-05-10 | 贵州航天计量测试技术研究所 | Unsealing method of small-sized molding wrapper |
| CN108275330A (en) * | 2017-01-05 | 2018-07-13 | 富士康(昆山)电脑接插件有限公司 | A kind of method of ceramic package component rapid open |
| CN113237726A (en) * | 2021-05-18 | 2021-08-10 | 青岛泰睿思微电子有限公司 | Method for observing semiconductor device unsealing sample |
| CN114476276A (en) * | 2021-12-29 | 2022-05-13 | 中国空间技术研究院 | Nondestructive unsealing method for axial lead diode chip |
| CN114476276B (en) * | 2021-12-29 | 2023-08-29 | 中国空间技术研究院 | Nondestructive unsealing method for axial lead diode chip |
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Owner name: SHANGHAI FAILURE ANALYSIS LABORATORY CO., LTD. Free format text: FORMER OWNER: SUZHOU FALAB FAILURE ANALYSIS LAB CO., LTD. Effective date: 20131015 |
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Free format text: CORRECT: ADDRESS; FROM: 215024 SUZHOU, JIANGSU PROVINCE TO: 200433 YANGPU, SHANGHAI |
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Effective date of registration: 20131015 Address after: 200433, room 3, building 300, No. 105 East National Road, Shanghai, Yangpu District Applicant after: Shanghai Failure Analysis Laboratory Co., Ltd. Address before: Tian Road, Suzhou City Industrial Park in Jiangsu province 215024 99 Building No. 16 falab test Applicant before: Suzhou Falab Failure Analysis Laboratory Co., Ltd. |
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Application publication date: 20130213 |